CN104766932A - Biodegradable baseplate used for soft light electron device and manufacturing method thereof - Google Patents

Biodegradable baseplate used for soft light electron device and manufacturing method thereof Download PDF

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Publication number
CN104766932A
CN104766932A CN201510194972.3A CN201510194972A CN104766932A CN 104766932 A CN104766932 A CN 104766932A CN 201510194972 A CN201510194972 A CN 201510194972A CN 104766932 A CN104766932 A CN 104766932A
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China
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wire
nano
ultraviolet light
curing
heterojunction
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于军胜
范惠东
王煦
施薇
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University of Electronic Science and Technology of China
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University of Electronic Science and Technology of China
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

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Abstract

The invention discloses a biodegradable baseplate used for a soft light electron device and a manufacturing method thereof. The baseplate comprises a flexible substrate and a conducting layer, the conducting layer is located on the flexible substrate, the flexible substrate is made of lac mixed with dual curing glue, the mass ratio of the dual curing glue in the lac is 0.3 - 4%, the dual curing glue is composed of a dual curing system, and the dual curing system is an ultraviolet curing-thermocuring system, an ultraviolet curing-micro curing system, an ultraviolet curing-anaerobic curing system or an ultraviolet curing-electron beam curing system. According to the substrate, after the dual curing treatment, the molecules are crosslinked with one another, the resin molecules in the lac are prevented from crystallization, the light scattering is reduced, the light transmittance of the flexible substrate is improved, the performance of the soft light electron device is improved, and meanwhile the problem that the flexibility of the substrate is not high is solved, the obstructing capacity to water radon of the flexible substrate and the smoothness of the surface of the substrate are promoted, and the affinity between a conductive film and the substrate is improved.

Description

Biodegradable base board for flexible optoelectronic part and manufacture method thereof
Technical field
The invention belongs to organic optoelectronic technical field, be specifically related to a kind of degradable base board for flexible optoelectronic part and manufacture method thereof.
Background technology
Along with photoelectron technology is in the extensive use of the O-E Products such as solar cell, optical image sensor, electricity slurry flat-panel screens, electroluminescent display, thin-film transistor and display panels, optoelectronic information industry is more and more subject to the attention of every country, become one of important development field, the competition in optoelectronic information field also increasingly sharpens., although have excellent device performance, anti-vibration, impact capacity are more weak for traditional rigid substrate (as on glass or silicon chip), and weight is relatively heavier, not portable, and application is subject to great restriction.Over nearly 10 years, flexible electronic and flexible optoelectronic technology become the research direction that electronic information field enlivens the most, are also the important directions of Electronic Development of Information Industry simultaneously.
Relative conventional rigid foundation light electronic device, flexible substrate opto-electronic device gentlier, thinner, flexible, rollable and be easy to carry about with one.At present, flexible liquid crystal display, flexible organic electro-luminescence display, flexible organic solar batteries etc. have developed into the high-tech industry of most prospect gradually.But, although flexible substrate has these advantages, still have many underlying issues urgently to be resolved hurrily: 1, flexible substrate profile pattern is far away from glass substrate, simultaneously, the film tack that relatively will deposit is poor, and organic material, easily by water, oxygen attack, causes the reduction of device efficiency.2, increasing flexible electronic and flexible optoelectronic product cause a large amount of solid pollutions due to its non-biodegradable.Therefore, degradable base board for flexible optoelectronic part is studied significant to the range of application and environmental protection of widening flexible optoelectronic/electronic technology.
At present, still there are some difficult problems in the research of biodegradable substrate: 1, pliability is poor, is applied in flexible optoelectronic part and can not gets a desired effect; 2, transmitance is low, directly affects the efficiency of device; 3, poor to water oxygen obstructing capacity, cause performance in proper device operation process significantly to decay.In sum, the existence of these problems, constrains fast development and the application of flexible optoelectronic part to a certain extent.
Summary of the invention
The present invention is in order to solve the problems of the technologies described above, and a kind of biodegradable base board for flexible optoelectronic part and manufacture method thereof are provided, solve the problem that flexible substrate surface smoothness is poor, improve the obstructing capacity of flexible substrate to water oxygen, improve the adhesive ability of flexible substrate to conductive layer, improve the light transmittance of flexible substrate simultaneously, and then improve photoelectricity or the electro-optical efficiency of flexible optoelectronic part; Preparation method is simple, efficient, can effectively reduce production cost and technology difficulty.
For solving the problems of the technologies described above, the technical solution adopted in the present invention is:
A kind of biodegradable base board for flexible optoelectronic part, comprise flexible substrate and conductive layer, conductive layer is positioned at the top of flexible substrate, it is characterized in that, described flexible substrate is the shellac being mixed with dual cure glue, the mass ratio of described dual cure glue in shellac is 0.3-4%, described dual cure glue is made up of dual UV curable paint, described dual UV curable paint is ultraviolet light polymerization-heat cured system, ultraviolet light polymerization-microwave curing system, one or more in ultraviolet light polymerization-anaerobic curing system or ultraviolet light polymerization-electronic beam curing system, described dual UV curable paint by two independently cure stage complete, one of them cure stage is reacted by ultraviolet light polymerization, another cure stage is dark reaction.
Described dual UV curable paint is following system:
1. free radical type ultraviolet light polymerization-heat cured system, weight forms:
Solidification process is: first carry out ultraviolet light polymerization, be then heating and curing, then carries out ultraviolet light polymerization; Or be first heating and curing, then carry out ultraviolet light polymerization, then be heating and curing;
2. free radical type ultraviolet light polymerization-microwave curing system, weight forms:
Solidification process is: first carry out ultraviolet light polymerization, then carries out microwave curing, then carries out ultraviolet light polymerization; Or first carry out microwave curing, then carry out ultraviolet light polymerization, then heat or microwave curing;
3. free radical type ultraviolet light polymerization-anaerobic curing system, weight forms:
Solidification process is: first carry out ultraviolet light polymerization, is not then subject to illumination and substrate under being in anoxia condition can carry out anaerobic curing reaction automatically, then carries out ultraviolet light polymerization;
4. free radical type ultraviolet light polymerization-electronic beam curing system, weight forms:
Solidification process is: first carry out ultraviolet light polymerization, then carries out electronic beam curing under vacuo, then carries out ultraviolet light polymerization;
5. cation type ultraviolet photo-curing-heat cured system, weight forms:
Solidification process is: first carry out ultraviolet light polymerization, be then heating and curing, then carries out ultraviolet light polymerization; Or be first heating and curing, then carry out ultraviolet light polymerization, then be heating and curing;
6. cation type ultraviolet photo-curing-microwave curing system, weight forms:
Solidification process is: first carry out ultraviolet light polymerization, then carries out microwave curing, then carries out ultraviolet light polymerization; Or first carry out microwave curing, then carry out ultraviolet light polymerization, then heat or microwave curing;
7. cation type ultraviolet photo-curing-anaerobic curing system, weight forms:
Solidification process is: first carry out ultraviolet light polymerization, is not then subject to illumination and substrate under being in anoxia condition can carry out anaerobic curing reaction automatically, then carries out ultraviolet light polymerization;
Or 8. cation type ultraviolet photo-curing-electronic beam curing system, weight forms:
Solidification process is: first carry out ultraviolet light polymerization, then carries out electronic beam curing under vacuo, then carries out ultraviolet light polymerization.
Described free radical thermal curing agents is ethylenediamine, hexamethylene diamine, triethylene tetramine, ethoxy diethylenetriamine, hydroxyl isopropyl diethylenetriamine, poly-ethanedioic acid adipamide, diformazan ammonia propylamine, 4-methyl-diaminopropane, dicyandiamide, two amido diphenyl sulfones, two aminodiphenylmethane, m-phenylene diamine (MPD), diethyl toluene diamine, N-(aminopropyl)-toluenediamine, dimethylethanolamine, dimethyl Bian amine, triethylbenzyl ammonium chloride, benzyl-dimethylamine, N-benzyl dimethylamine, 2,4,6 ,-three-(dimethylamino methyl)-phenol, phenol formaldehyde (PF) hexamethylene diamine, N, N-dimethyl benzylamine, 2-ethyl imidazol(e), 2-phenylimidazole, glyoxal ethyline, 2-ethyl imidazol(e), 2-ethyl-4-methylimidazole, 1-(2-amino-ethyl)-glyoxal ethyline, maleic anhydride, oxydiphthalic, phthalic anhydride, trimellitic anhydride, tetrabromo-benzene dicarboxylic acid anhydride, gather acetic anhydride in the ninth of the ten Heavenly Stems, sebacic dihydrazide, adipic dihydrazide, carbon acid dihydrazide, grass acid dihydrazide, succinic acid hydrazide ii, adipic dihydrazide, the amino polyacrylamide of N-, decanedioic acid hydrazides, M-phthalic acid hydrazides, to Para Hydroxy Benzoic Acid hydrazides, azelaic acid two hydrazides, isophthalic dihydrazide, ferrocene tetrafluoroborate, triallyl cyanurate, toluene di-isocyanate(TDI), '-diphenylmethane diisocyanate, hexamethylene diisocyanate, trimethyl hexamethylene diisocyanate, dicyclohexyl methyl hydride diisocyanate, XDI, tetramethylxylylene diisocyanate, methyl styrene isocyanates, hexahydrotoluene vulcabond, triphenyl first-4,4', 4'-triisocyanate, diaminodiphenyl-methane, N-is to chlorophenyl-N-N-dimethyl urea, 3-phenyl-1,1-dimethyl urea, 3-rubigan-1,1-dimethyl urea, 4,4 '-diamino-diphenyl bis-phenol, polyurethanes, Lauxite, epoxy-ethylenediamine carbamate, 2,4,6-tri-(dimethylamino methyl) phenol, 2,4-diaminotoluene, polyurethane, methyl-etherified Lauxite, three (3-aminopropyl) amine, 2-amino-ethyl-two (3-aminopropyl) amine, 4,4 '-MDA, 4,4 '-diamino-diphenyl bis-phenol, 4,4 '-diamino-diphenyl sulfone, three (3-aminopropyl) amine, melmac, benzoguanamine resin, hexamethylol melamine resin, hexamethoxymethyl melamine resin, urea-melamine resin, polyester melamine, TCCA ester, aminotriazine resins, urethane acrylate, 4-aminopyridine resin, N-β-aminoethyl amino mylar, α-aminopyridine resin, aminodiphenylether resin, phosphoramidic-resin, hydroxyethylamino mylar, described microwave curing agent and thermal curing agents use same material or different materials, described anaerobic curing agent comprises: methacrylate tetraethylene-glycol ester, methacrylate multicondensed ethylene glycol ester, triethylene Glycol double methyl methacrylate, ethyleneglycol dimethyacrylate, hydroxyethyl methacrylate or hydroxypropyl acrylate, methoxylated polyethylene glycol methacrylate, phthalic acid Triethylene Glycol, β-hydroxyethyl methacry-late, triethylene Glycol double methyl methacrylate, Dimethacryloylethylthioether, phthalic acid two (diethylene glycol (DEG) acrylate), Ethoxylated bisphenol A dimethylacrylate, dimethacrylate bisphenol-A ethylene glycol fat, second diester methacrylate, triethylene-glycol dimethylacrylate, triethlene glycol bismethylacrylate, glycol methacrylate, one diethyl acetal double methyl methacrylate, epoxy resin methacrylate, methacrylate diglycol ester, described electronic beam curing agent comprises: triphenol methylmethane tetraglycidel ether epoxy resin, bicyclopentadiene bisphenol-type epoxy resin, bisphenol A-type vinyl ester resin, epoxy vinyl ester resin, Epocryl, maleimide resin, 4, 4 '-diphenyl methane dimaleimide, bisphenol-A-Diphenyl Ether Bismaleimide, bisphenol-A maleic acid vinylite, ethylene bromide base ester resin, phenol formaldehyde epoxy vinyl ester resin, methylolation bisphenol A type epoxy resin, bisphenol A acrylates, urethane acrylate, bisphenol-A epoxide vinylester resin, bisphenol A benzoxazine-epoxy resin, bisphenol fluorene epoxy resin, bisphenol-a epoxy acrylate resin, bisphenol A diglycidyl ether or bisphenol-A epoxy chloropropene acid ester resin,
Light trigger is for being styrax or Benzoin derivative, and described Benzoin derivative is benzoin methyl ether, benzoin ethyl ether, acetophenone derivative or benzoin isopropyl ether; Cation light initiator is aromatic sulfonium salts, salt compounded of iodine or luxuriant molysite class; Sensitising agent is benzophenone, thia anthraquinone or Michler's keton; Auxiliary agent comprises plasticizer, thixotropic agent and filler;
Plasticizer is dioctyl phthalate, dibutyl phthalate, three vinyl butyl ether base phosphates, polyvinyl butyral resin, tributyl 2-acetylcitrate, repefral, diethyl phthalate, hexanedioic acid two (Butoxyethoxy) ethyl ester, isopropyl titanate, tetrabutyl titanate, citrate, trimellitic acid (2-ethyl) own ester, phthalic acid two (2-ethyl) own ester, decanedioic acid two (2-ethyl) own ester, Diethylene Glycol Dibenzoate, phthalic anhydride, dipropylene glycol dibenzoate and chlorosulfonated polyethylene, described coupling agent comprises methylvinyldichlorosilane, methyl hydrogen dichlorosilane, dimethyldichlorosilane, chlorodimethyl silane, vinyl trichlorosilane, γ-aminopropyltrimethoxysilane, dimethyl silicone polymer, poly-hydrogen methylsiloxane, poly-methyl methoxy radical siloxane, γ-methacrylic acid third vinegar base trimethoxy silane, gamma-aminopropyl-triethoxy-silane, γ-glycidol ether propyl trimethoxy silicane, aminopropyl silsesquioxane, γ-methacryloxypropyl trimethoxy silane, chain alkyl trimethoxy silane, vinyltriethoxysilane, vinyltrimethoxy silane, γ-chloropropyl triethoxysilane, two-(the silica-based propyl group of γ-triethoxy), anilinomethyl triethoxysilane, N-β (aminoethyl)-γ-aminopropyltrimethoxysilane, N-(β-aminoethyl)-gamma-aminopropyl-triethoxy-silane, N-β (aminoethyl)-γ-aminopropyltriethoxy dimethoxysilane, γ-(2,3-epoxy third oxygen) propyl trimethoxy silicane, γ-(methacryloxypropyl) oxypropyl trimethyl silane, γ mercaptopropyitrimethoxy silane or γ-Mercaptopropyltriethoxysilane.
The material of described conductive layer is one or more in Graphene, carbon nano-tube, metal simple-substance nano wire, metal alloy nanowires, metal hetero-junction nano wire, zinc oxide, titanium oxide, tin indium oxide or polymer electrode material.
One or more in described metal simple-substance nano wire or Fe nanowire, copper nano-wire, nano silver wire, nanowires of gold, aluminium nano wire, nickel nano wire, cobalt nanowire, manganese nano wire, cadmium nano wire, indium nano wire, stannum nanowire, tungsten nanowires or Pt nanowires.
Described metal alloy nanowires is copper-iron alloy nano wire, silver ferroalloy nano wire, bule gold nano wire, alfer nano wire, dilval nano wire, ferro-cobalt nano wire, manganeisen nano wire, cadmium ferroalloy nano wire, indium ferroalloy nano wire, tin ferroalloy nano wire, ferro-tungsten nano wire, pt-fe alloy nano wire, yellow gold nano wire, gold copper nano wire, aluminium copper nano wire, monel nano wire, cobalt-copper alloy nano wire, manganin nano wire, cadmium copper alloy nano wire, gun-metal nano wire, tungsten-copper alloy nano wire, Mock gold nano wire, electrum nano wire, aluminium silver alloy nanowires, bazar metal nano wire, cobalt silver alloy nanowires, manganese silver alloy nanowires, cadmium silver nano wire, indium silver alloy nanowires, sn-ag alloy nano wire, tungsten silver alloy nanowires, platinum-silver alloys nano wire, aluminium gold alloy nano-wire, nickel billon nano wire, cobalt billon nano wire, manganese billon nano wire, cadmium billon nano wire, indium billon nano wire, Sillim's alloy nano-wire, tungsten billon nano wire, cobalt-nickel alloy nano wire, manganese-nickel nano wire, cadmium-nickel alloy nano wire, indium nickel alloy nano wire, tin-nickel alloy nano wire, tungsten nickel nano wire, platinum-nickel alloy nano wire, cadmium manganese alloy nano wire, indium manganese alloy nano wire, tin manganese alloy nano wire, tungsten manganese alloy nano wire, platinum manganese alloy nano wire, indium cadmium alloy nano wire, tin cadmium alloy nano wire, tungsten cadmium alloy nano wire, platinum cadmium alloy nano wire, tin-indium alloy nano wire, tungsten indium alloy nano wire, platinum indium alloy nano wire, tungsten ashbury metal nano wire, one or more in platinum ashbury metal nano wire or platinum-tungsten alloys nano wire.
Described metal hetero-junction nano wire is copper iron heterojunction nano-wire, silver iron heterojunction nano-wire, gold iron heterojunction nano-wire, ferro-aluminum heterojunction nano-wire, ferronickel heterojunction nano-wire, ferro-cobalt heterojunction nano-wire, ferromanganese heterojunction nano-wire, cadmium iron heterojunction nano-wire, indium iron heterojunction nano-wire, tin iron heterojunction nano-wire, ferrotungsten heterojunction nano-wire, platinum iron heterojunction nano-wire, silver-bearing copper heterojunction nano-wire, gold copper heterojunction nano-wire, aluminum copper dissimilar junction nanowire, ambrose alloy heterojunction nano-wire, cobalt copper heterojunction nano-wire, copper-manganese heterojunction nano-wire, cadmium copper heterojunction nano-wire, tin copper heterojunction nano-wire, tungsten copper heterojunction nano-wire, platinoid heterojunction nano-wire, gold and silver heterojunction nano-wire, aluminium silver heterojunction nano-wire, nickeline heterojunction nano-wire, cobalt silver heterojunction nano-wire, manganese silver heterojunction nano-wire, cadmium silver heterojunction nano-wire, indium silver heterojunction nano-wire, tin silver heterojunction nano-wire, tungsten silver heterojunction nano-wire, platinum silver heterojunction nano-wire, aluminium gold heterojunction nano-wire, nickel gold heterojunction nano-wire, cobalt gold heterojunction nano-wire, manganese gold heterojunction nano-wire, cadmium gold heterojunction nano-wire, indium gold heterojunction nano-wire, Sillim's heterojunction nano-wire, tungsten gold heterojunction nano-wire, cobalt nickel heterojunction nano-wire, manganese nickel heterojunction nano-wire, cadmium nickel heterojunction nano-wire, indium nickel heterojunction nano-wire, tin nickel heterojunction nano-wire, tungsten nickel heterojunction nano-wire, platinum nickel heterojunction nano-wire, cadmium manganese heterojunction nano-wire, indium manganese heterojunction nano-wire, tin manganese heterojunction nano-wire, tungsten manganese heterojunction nano-wire, platinum manganese heterojunction nano-wire, indium cadmium heterojunction nano-wire, tin cadmium heterojunction nano-wire, tungsten cadmium heterojunction nano-wire, platinum cadmium heterojunction nano-wire, tin indium heterojunction nano-wire, tungsten indium heterojunction nano-wire, platinum indium heterojunction nano-wire, tungsten tin heterojunction nano-wire, one or more in platinum tin heterojunction nano-wire or platinum tungsten heterojunction nano-wire.
Described polymer electrode material is poly-(3,4-Ethylenedioxy Thiophene)-poly-(styrene sulfonic acid) or 3,4-polyethylene dioxythiophenes.
A manufacture method for biodegradable base board for flexible optoelectronic part, comprises the following steps:
1. the rigid substrates that effects on surface roughness is less than 1nm cleans, and dries up after cleaning with drying nitrogen;
2. roller coat, LB embrane method, blade coating, spin coating, a painting, spraying, czochralski method, the tape casting, dip-coating, inkjet printing, self assembly or silk screen printing is adopted to prepare flexible substrate on the rigid substrate, described flexible substrate is shellac, the dual cure glue that mass ratio is 0.3-4% is mixed with in described shellac, described dual cure glue is made up of dual UV curable paint, and described dual UV curable paint is one or more of ultraviolet light polymerization-heat cured system, ultraviolet light polymerization-microwave curing system, ultraviolet light polymerization-anaerobic curing system and ultraviolet light polymerization-electronic beam curing system.
3. treatment with ultraviolet light is carried out to the flexible substrate that 2. step obtains, carry out photocuring;
4. flexible substrate is put into heating furnace to carry out hot curing or put into microwave oven carrying out microwave curing;
Meanwhile, 3. and 4. step can exchange, and namely first carries out being heating and curing or microwave curing, then carries out ultraviolet light polymerization;
5. roller coat, LB embrane method, a painting, spraying, czochralski method, inkjet printing or silk screen print method is adopted to prepare conductive layer on flexible substrate surface;
6. again treatment with ultraviolet light is carried out to the flexible substrate that 5. step obtains, carry out photocuring;
7. flexible substrate is peeled off from rigid substrates, form base board for flexible optoelectronic part;
Further, the degradation characteristic of base board for flexible optoelectronic part, sheet resistance, surface topography, water oxygen permeability and light transmission rate is tested after completing.
A manufacture method for biodegradable base board for flexible optoelectronic part, is characterized in that, comprises the following steps:
1. the rigid substrates that surface roughness is less than 1nm cleans, and dries up after cleaning with drying nitrogen;
2. roller coat, LB embrane method, blade coating, spin coating, a painting, spraying, czochralski method, the tape casting, dip-coating, inkjet printing, self assembly or silk screen printing is adopted to prepare flexible substrate on the rigid substrate, described flexible substrate is shellac, the dual cure glue that mass ratio is 0.3-4% is mixed with in described shellac, described dual cure glue is made up of dual UV curable paint, and described dual UV curable paint is one or more of ultraviolet light polymerization-heat cured system, ultraviolet light polymerization-microwave curing system, ultraviolet light polymerization-anaerobic curing system and ultraviolet light polymerization-electronic beam curing system.
3. treatment with ultraviolet light is carried out to the flexible substrate that 2. step obtains, carry out photocuring;
4. flexible substrate is placed under vacuum conditions, carry out anaerobic curing or electronic beam curing process;
5. roller coat, LB embrane method, a painting, spraying, czochralski method, inkjet printing or silk screen print method is adopted to prepare conductive layer on flexible substrate surface;
6. again treatment with ultraviolet light is carried out to the flexible substrate that 5. step obtains, carry out photocuring;
7. flexible substrate is peeled off from rigid substrates, form base board for flexible optoelectronic part;
Further, the degradation characteristic of base board for flexible optoelectronic part, sheet resistance, surface topography, water oxygen permeability and light transmission rate is tested after completing.
Compared with prior art, beneficial effect of the present invention is:
(1) in shellac, appropriate dual cure glue is mixed, by being cross-linked with each other between molecule after dual cure process, preventing molecular resin crystallization in shellac, thus light scattering is reduced, improve the light transmittance of flexible substrate, thus flexible optoelectronic part performance is had greatly improved.
(2) in shellac, mixing appropriate dual cure glue, by being cross-linked with each other between molecule after dual cure process, thus adding the pliability of shellac.
(3) shellac being mixed with appropriate dual cure glue after dual cure process, molecules align is more tight, effectively improves water oxygen obstructing capacity.
(4) effectively increase the adhesive ability between flexible substrate and conductive film, improve the performance of device.(5) preparation method provided in the present invention is adopted greatly can to reduce production cost and the technology difficulty of substrate.
Accompanying drawing explanation
Fig. 1 is the structural representation of biodegradable base board for flexible optoelectronic part of the present invention;
Mark in figure: 1, conductive layer, 2, flexible substrate.
Embodiment
Below in conjunction with embodiment, the invention will be further described, and described embodiment is only the present invention's part embodiment, is not whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making other embodiments used obtained under creative work prerequisite, belongs to protection scope of the present invention.
By reference to the accompanying drawings, biodegradable base board for flexible optoelectronic part of the present invention, comprise flexible substrate and conductive layer, conductive layer is positioned at the top of flexible substrate, it is characterized in that, described flexible substrate is the shellac being mixed with dual cure glue, the mass ratio of described dual cure glue in shellac is 0.3-4%, described dual cure glue is made up of dual UV curable paint, described dual UV curable paint is ultraviolet light polymerization-heat cured system, ultraviolet light polymerization-microwave curing system, one or more in ultraviolet light polymerization-anaerobic curing system or ultraviolet light polymerization-electronic beam curing system, described dual UV curable paint by two independently cure stage complete, one of them cure stage is reacted by ultraviolet light polymerization, another cure stage is dark reaction.
Flexible substrate 2 in the present invention is the support of conductive layer, and it has certain bending performance, has the ability of certain anti-steam and oxygen infiltration, has good planarization, have good light transmission.
In the present invention, conductive layer 1 requires to have good filming performance, good conductivity, usually adopt in Graphene, carbon nano-tube, metal simple-substance nano wire, metal alloy nanowires, metal hetero-junction nano wire, zinc oxide, titanium oxide, tin indium oxide or polymer electrode material one or more.
Described dual UV curable paint is following system:
1. free radical type ultraviolet light polymerization-heat cured system, weight forms:
Solidification process is: first carry out ultraviolet light polymerization, be then heating and curing, then carries out ultraviolet light polymerization; Or be first heating and curing, then carry out ultraviolet light polymerization, then be heating and curing;
2. free radical type ultraviolet light polymerization-microwave curing system, weight forms:
Solidification process is: first carry out ultraviolet light polymerization, then carries out microwave curing, then carries out ultraviolet light polymerization; Or first carry out microwave curing, then carry out ultraviolet light polymerization, then heat or microwave curing;
3. free radical type ultraviolet light polymerization-anaerobic curing system, weight forms:
Solidification process is: first carry out ultraviolet light polymerization, is not then subject to illumination and substrate under being in anoxia condition can carry out anaerobic curing reaction automatically, then carries out ultraviolet light polymerization;
4. free radical type ultraviolet light polymerization-electronic beam curing system, weight forms:
Solidification process is: first carry out ultraviolet light polymerization, then carries out electronic beam curing under vacuo, then carries out ultraviolet light polymerization;
5. cation type ultraviolet photo-curing-heat cured system, weight forms:
Solidification process is: first carry out ultraviolet light polymerization, be then heating and curing, then carries out ultraviolet light polymerization; Or be first heating and curing, then carry out ultraviolet light polymerization, then be heating and curing;
6. cation type ultraviolet photo-curing-microwave curing system, weight forms:
Solidification process is: first carry out ultraviolet light polymerization, then carries out microwave curing, then carries out ultraviolet light polymerization; Or first carry out microwave curing, then carry out ultraviolet light polymerization, then heat or microwave curing;
7. cation type ultraviolet photo-curing-anaerobic curing system, weight forms:
Solidification process is: first carry out ultraviolet light polymerization, is not then subject to illumination and substrate under being in anoxia condition can carry out anaerobic curing reaction automatically, then carries out ultraviolet light polymerization;
Or 8. cation type ultraviolet photo-curing-electronic beam curing system, weight forms:
Solidification process is: first carry out ultraviolet light polymerization, then carries out electronic beam curing under vacuo, then carries out ultraviolet light polymerization.
Described free radical thermal curing agents is ethylenediamine, hexamethylene diamine, triethylene tetramine, ethoxy diethylenetriamine, hydroxyl isopropyl diethylenetriamine, poly-ethanedioic acid adipamide, diformazan ammonia propylamine, 4-methyl-diaminopropane, dicyandiamide, two amido diphenyl sulfones, two aminodiphenylmethane, m-phenylene diamine (MPD), diethyl toluene diamine, N-(aminopropyl)-toluenediamine, dimethylethanolamine, dimethyl Bian amine, triethylbenzyl ammonium chloride, benzyl-dimethylamine, N-benzyl dimethylamine, 2,4,6 ,-three-(dimethylamino methyl)-phenol, phenol formaldehyde (PF) hexamethylene diamine, N, N-dimethyl benzylamine, 2-ethyl imidazol(e), 2-phenylimidazole, glyoxal ethyline, 2-ethyl imidazol(e), 2-ethyl-4-methylimidazole, 1-(2-amino-ethyl)-glyoxal ethyline, maleic anhydride, oxydiphthalic, phthalic anhydride, trimellitic anhydride, tetrabromo-benzene dicarboxylic acid anhydride, gather acetic anhydride in the ninth of the ten Heavenly Stems, sebacic dihydrazide, adipic dihydrazide, carbon acid dihydrazide, grass acid dihydrazide, succinic acid hydrazide ii, adipic dihydrazide, the amino polyacrylamide of N-, decanedioic acid hydrazides, M-phthalic acid hydrazides, to Para Hydroxy Benzoic Acid hydrazides, azelaic acid two hydrazides, isophthalic dihydrazide, ferrocene tetrafluoroborate, triallyl cyanurate, toluene di-isocyanate(TDI), '-diphenylmethane diisocyanate, hexamethylene diisocyanate, trimethyl hexamethylene diisocyanate, dicyclohexyl methyl hydride diisocyanate, XDI, tetramethylxylylene diisocyanate, methyl styrene isocyanates, hexahydrotoluene vulcabond, triphenyl first-4,4', 4'-triisocyanate, diaminodiphenyl-methane, N-is to chlorophenyl-N-N-dimethyl urea, 3-phenyl-1,1-dimethyl urea, 3-rubigan-1,1-dimethyl urea, 4,4 '-diamino-diphenyl bis-phenol, polyurethanes, Lauxite, epoxy-ethylenediamine carbamate, 2,4,6-tri-(dimethylamino methyl) phenol, 2,4-diaminotoluene, polyurethane, methyl-etherified Lauxite, three (3-aminopropyl) amine, 2-amino-ethyl-two (3-aminopropyl) amine, 4,4 '-MDA, 4,4 '-diamino-diphenyl bis-phenol, 4,4 '-diamino-diphenyl sulfone, three (3-aminopropyl) amine, melmac, benzoguanamine resin, hexamethylol melamine resin, hexamethoxymethyl melamine resin, urea-melamine resin, polyester melamine, TCCA ester, aminotriazine resins, urethane acrylate, 4-aminopyridine resin, N-β-aminoethyl amino mylar, α-aminopyridine resin, aminodiphenylether resin, phosphoramidic-resin, hydroxyethylamino mylar, described microwave curing agent and thermal curing agents use same material or different materials, described anaerobic curing agent comprises: methacrylate tetraethylene-glycol ester, methacrylate multicondensed ethylene glycol ester, triethylene Glycol double methyl methacrylate, ethyleneglycol dimethyacrylate, hydroxyethyl methacrylate or hydroxypropyl acrylate, methoxylated polyethylene glycol methacrylate, phthalic acid Triethylene Glycol, β-hydroxyethyl methacry-late, triethylene Glycol double methyl methacrylate, Dimethacryloylethylthioether, phthalic acid two (diethylene glycol (DEG) acrylate), Ethoxylated bisphenol A dimethylacrylate, dimethacrylate bisphenol-A ethylene glycol fat, second diester methacrylate, triethylene-glycol dimethylacrylate, triethlene glycol bismethylacrylate, glycol methacrylate, one diethyl acetal double methyl methacrylate, epoxy resin methacrylate, methacrylate diglycol ester, described electronic beam curing agent comprises: triphenol methylmethane tetraglycidel ether epoxy resin, bicyclopentadiene bisphenol-type epoxy resin, bisphenol A-type vinyl ester resin, epoxy vinyl ester resin, Epocryl, maleimide resin, 4, 4 '-diphenyl methane dimaleimide, bisphenol-A-Diphenyl Ether Bismaleimide, bisphenol-A maleic acid vinylite, ethylene bromide base ester resin, phenol formaldehyde epoxy vinyl ester resin, methylolation bisphenol A type epoxy resin, bisphenol A acrylates, urethane acrylate, bisphenol-A epoxide vinylester resin, bisphenol A benzoxazine-epoxy resin, bisphenol fluorene epoxy resin, bisphenol-a epoxy acrylate resin, bisphenol A diglycidyl ether or bisphenol-A epoxy chloropropene acid ester resin,
Light trigger is for being styrax or Benzoin derivative, and described Benzoin derivative is benzoin methyl ether, benzoin ethyl ether, acetophenone derivative or benzoin isopropyl ether; Cation light initiator is aromatic sulfonium salts, salt compounded of iodine or luxuriant molysite class; Sensitising agent is benzophenone, thia anthraquinone or Michler's keton; Auxiliary agent comprises plasticizer, thixotropic agent and filler;
Plasticizer is dioctyl phthalate, dibutyl phthalate, three vinyl butyl ether base phosphates, polyvinyl butyral resin, tributyl 2-acetylcitrate, repefral, diethyl phthalate, hexanedioic acid two (Butoxyethoxy) ethyl ester, isopropyl titanate, tetrabutyl titanate, citrate, trimellitic acid (2-ethyl) own ester, phthalic acid two (2-ethyl) own ester, decanedioic acid two (2-ethyl) own ester, Diethylene Glycol Dibenzoate, phthalic anhydride, dipropylene glycol dibenzoate and chlorosulfonated polyethylene, described coupling agent comprises methylvinyldichlorosilane, methyl hydrogen dichlorosilane, dimethyldichlorosilane, chlorodimethyl silane, vinyl trichlorosilane, γ-aminopropyltrimethoxysilane, dimethyl silicone polymer, poly-hydrogen methylsiloxane, poly-methyl methoxy radical siloxane, γ-methacrylic acid third vinegar base trimethoxy silane, gamma-aminopropyl-triethoxy-silane, γ-glycidol ether propyl trimethoxy silicane, aminopropyl silsesquioxane, γ-methacryloxypropyl trimethoxy silane, chain alkyl trimethoxy silane, vinyltriethoxysilane, vinyltrimethoxy silane, γ-chloropropyl triethoxysilane, two-(the silica-based propyl group of γ-triethoxy), anilinomethyl triethoxysilane, N-β (aminoethyl)-γ-aminopropyltrimethoxysilane, N-(β-aminoethyl)-gamma-aminopropyl-triethoxy-silane, N-β (aminoethyl)-γ-aminopropyltriethoxy dimethoxysilane, γ-(2,3-epoxy third oxygen) propyl trimethoxy silicane, γ-(methacryloxypropyl) oxypropyl trimethyl silane, γ mercaptopropyitrimethoxy silane or γ-Mercaptopropyltriethoxysilane.
The material of described conductive layer is one or more in Graphene, carbon nano-tube, metal simple-substance nano wire, metal alloy nanowires, metal hetero-junction nano wire, zinc oxide, titanium oxide, tin indium oxide or polymer electrode material.
One or more in described metal simple-substance nano wire or Fe nanowire, copper nano-wire, nano silver wire, nanowires of gold, aluminium nano wire, nickel nano wire, cobalt nanowire, manganese nano wire, cadmium nano wire, indium nano wire, stannum nanowire, tungsten nanowires or Pt nanowires.
Described metal alloy nanowires is copper-iron alloy nano wire, silver ferroalloy nano wire, bule gold nano wire, alfer nano wire, dilval nano wire, ferro-cobalt nano wire, manganeisen nano wire, cadmium ferroalloy nano wire, indium ferroalloy nano wire, tin ferroalloy nano wire, ferro-tungsten nano wire, pt-fe alloy nano wire, yellow gold nano wire, gold copper nano wire, aluminium copper nano wire, monel nano wire, cobalt-copper alloy nano wire, manganin nano wire, cadmium copper alloy nano wire, gun-metal nano wire, tungsten-copper alloy nano wire, Mock gold nano wire, electrum nano wire, aluminium silver alloy nanowires, bazar metal nano wire, cobalt silver alloy nanowires, manganese silver alloy nanowires, cadmium silver nano wire, indium silver alloy nanowires, sn-ag alloy nano wire, tungsten silver alloy nanowires, platinum-silver alloys nano wire, aluminium gold alloy nano-wire, nickel billon nano wire, cobalt billon nano wire, manganese billon nano wire, cadmium billon nano wire, indium billon nano wire, Sillim's alloy nano-wire, tungsten billon nano wire, cobalt-nickel alloy nano wire, manganese-nickel nano wire, cadmium-nickel alloy nano wire, indium nickel alloy nano wire, tin-nickel alloy nano wire, tungsten nickel nano wire, platinum-nickel alloy nano wire, cadmium manganese alloy nano wire, indium manganese alloy nano wire, tin manganese alloy nano wire, tungsten manganese alloy nano wire, platinum manganese alloy nano wire, indium cadmium alloy nano wire, tin cadmium alloy nano wire, tungsten cadmium alloy nano wire, platinum cadmium alloy nano wire, tin-indium alloy nano wire, tungsten indium alloy nano wire, platinum indium alloy nano wire, tungsten ashbury metal nano wire, one or more in platinum ashbury metal nano wire or platinum-tungsten alloys nano wire.
Described metal hetero-junction nano wire is copper iron heterojunction nano-wire, silver iron heterojunction nano-wire, gold iron heterojunction nano-wire, ferro-aluminum heterojunction nano-wire, ferronickel heterojunction nano-wire, ferro-cobalt heterojunction nano-wire, ferromanganese heterojunction nano-wire, cadmium iron heterojunction nano-wire, indium iron heterojunction nano-wire, tin iron heterojunction nano-wire, ferrotungsten heterojunction nano-wire, platinum iron heterojunction nano-wire, silver-bearing copper heterojunction nano-wire, gold copper heterojunction nano-wire, aluminum copper dissimilar junction nanowire, ambrose alloy heterojunction nano-wire, cobalt copper heterojunction nano-wire, copper-manganese heterojunction nano-wire, cadmium copper heterojunction nano-wire, tin copper heterojunction nano-wire, tungsten copper heterojunction nano-wire, platinoid heterojunction nano-wire, gold and silver heterojunction nano-wire, aluminium silver heterojunction nano-wire, nickeline heterojunction nano-wire, cobalt silver heterojunction nano-wire, manganese silver heterojunction nano-wire, cadmium silver heterojunction nano-wire, indium silver heterojunction nano-wire, tin silver heterojunction nano-wire, tungsten silver heterojunction nano-wire, platinum silver heterojunction nano-wire, aluminium gold heterojunction nano-wire, nickel gold heterojunction nano-wire, cobalt gold heterojunction nano-wire, manganese gold heterojunction nano-wire, cadmium gold heterojunction nano-wire, indium gold heterojunction nano-wire, Sillim's heterojunction nano-wire, tungsten gold heterojunction nano-wire, cobalt nickel heterojunction nano-wire, manganese nickel heterojunction nano-wire, cadmium nickel heterojunction nano-wire, indium nickel heterojunction nano-wire, tin nickel heterojunction nano-wire, tungsten nickel heterojunction nano-wire, platinum nickel heterojunction nano-wire, cadmium manganese heterojunction nano-wire, indium manganese heterojunction nano-wire, tin manganese heterojunction nano-wire, tungsten manganese heterojunction nano-wire, platinum manganese heterojunction nano-wire, indium cadmium heterojunction nano-wire, tin cadmium heterojunction nano-wire, tungsten cadmium heterojunction nano-wire, platinum cadmium heterojunction nano-wire, tin indium heterojunction nano-wire, tungsten indium heterojunction nano-wire, platinum indium heterojunction nano-wire, tungsten tin heterojunction nano-wire, one or more in platinum tin heterojunction nano-wire or platinum tungsten heterojunction nano-wire.
Described polymer electrode material is poly-(3,4-Ethylenedioxy Thiophene)-poly-(styrene sulfonic acid) or 3,4-polyethylene dioxythiophenes.
A manufacture method for biodegradable base board for flexible optoelectronic part, comprises the following steps:
1. the rigid substrates that effects on surface roughness is less than 1nm cleans, and dries up after cleaning with drying nitrogen;
2. roller coat, LB embrane method, blade coating, spin coating, a painting, spraying, czochralski method, the tape casting, dip-coating, inkjet printing, self assembly or silk screen printing is adopted to prepare flexible substrate on the rigid substrate, described flexible substrate is shellac, the dual cure glue that mass ratio is 0.3-4% is mixed with in described shellac, described dual cure glue is made up of dual UV curable paint, and described dual UV curable paint is one or more of ultraviolet light polymerization-heat cured system, ultraviolet light polymerization-microwave curing system, ultraviolet light polymerization-anaerobic curing system and ultraviolet light polymerization-electronic beam curing system.
3. treatment with ultraviolet light is carried out to the flexible substrate that 2. step obtains, carry out photocuring;
4. flexible substrate is put into heating furnace to carry out hot curing or put into microwave oven carrying out microwave curing;
Meanwhile, 3. and 4. step can exchange, and namely first carries out being heating and curing or microwave curing, then carries out ultraviolet light polymerization;
5. roller coat, LB embrane method, a painting, spraying, czochralski method, inkjet printing or silk screen print method is adopted to prepare conductive layer on flexible substrate surface;
6. again treatment with ultraviolet light is carried out to the flexible substrate that 5. step obtains, carry out photocuring;
7. flexible substrate is peeled off from rigid substrates, form base board for flexible optoelectronic part.
The degradation characteristic of base board for flexible optoelectronic part, sheet resistance, surface topography, water oxygen permeability and light transmission rate is tested after completing.
A manufacture method for biodegradable base board for flexible optoelectronic part, is characterized in that, comprises the following steps:
1. the rigid substrates that surface roughness is less than 1nm cleans, and dries up after cleaning with drying nitrogen;
2. roller coat, LB embrane method, blade coating, spin coating, a painting, spraying, czochralski method, the tape casting, dip-coating, inkjet printing, self assembly or silk screen printing is adopted to prepare flexible substrate on the rigid substrate, described flexible substrate is shellac, the dual cure glue that mass ratio is 0.3-4% is mixed with in described shellac, described dual cure glue is made up of dual UV curable paint, and described dual UV curable paint is one or more of ultraviolet light polymerization-heat cured system, ultraviolet light polymerization-microwave curing system, ultraviolet light polymerization-anaerobic curing system and ultraviolet light polymerization-electronic beam curing system.
3. treatment with ultraviolet light is carried out to the flexible substrate that 2. step obtains, carry out photocuring;
4. flexible substrate is placed under vacuum conditions, carry out anaerobic curing or electronic beam curing process;
5. roller coat, LB embrane method, a painting, spraying, czochralski method, inkjet printing or silk screen print method is adopted to prepare conductive layer on flexible substrate surface;
6. again treatment with ultraviolet light is carried out to the flexible substrate that 5. step obtains, carry out photocuring;
7. flexible substrate is peeled off from rigid substrates, form base board for flexible optoelectronic part.
After completing, test the degradation characteristic of base board for flexible optoelectronic part, sheet resistance, surface topography, water oxygen permeability and light transmission rate.
Shellac is a kind of natural resin, has unique good characteristic, be widely used in food, medicine, plastics, military affairs, electrically, the industry such as rubber, ink, leather, coating, dyestuff and adhesive.Shellac is nontoxic, is mainly used in the capsule etc. of nutrients that the moistureproof sugar-coat of pill tablet, medication containment, glazing, enteric cartridge bag clothing and developed recently get up and cosmetics at present in medical industry.Shellac coating can be used for a lot of aspects of food industry equally, can be absorbed by the body, can natural degradation, such as, after candy and cake have been coated with shellac coating, can become very attractive in appearance, bright, can protection against the tide, anti-caking, anti-metamorphic and prolongation period of storage etc.Fruit, with after shellac coating film, can suppress moisture to evaporate over a period to come, keep fresh, reduces and rots, improve outward appearance, produces the effect of increasing economic efficiency.Shellac product has good tensile strength, resistance to wear, resilience and hardness, has desirable mechanical performance.Electric property aspect, the dielectric strength of shellac is high, and after arranging by electric arc, without conductivity, adds that it has good adherence and thermoplasticity, electrical apparatus insulation has special purposes.In addition, the film that the film that the shellac be hydrolyzed is formed is formed than natural shellac is more soft, and this is relevant with the increase of barras in shellac.But the steam impregnability of hydrolysis shellac film is than lower with natural shellac film, so need to carry out the water oxygen obstructing capacity that some process ensure shellac.
UV-curing technology is owing to have employed ultraviolet light as the solidification energy, determine the limitation that there is self, be mainly manifested in: have certain restriction to application substrate shapes, low to band color system curing rate, deep layer and object shadow region are difficult to solidification, and after solidification, volume contraction causes more greatly the problems such as poor adhesive force and light trigger remain.These deficiencies have impact on further developing of UV-curing technology and apply, and the shortcoming that after solidification, volume contraction is larger has also had a strong impact on the range of application of ultraviolet photocureable material.Dual cure (dual mono-curing) technology is the combination of photocuring and other curing.
In dual UV curable paint, the crosslinked or polymerization reaction of system is completed by two stages independently with differential responses principle, and one of them stage is by photocuring reaction, and another stage is undertaken by dark reaction.Wherein, photocuring can be free radical ultraviolet light polymerization, also can be cationic UV cure; Dark curing can be hot curing, electronic beam curing, anaerobic curing and Microwave Emulsifier-Free Polymerization etc.Photocuring so just can be utilized to make system fast shaping or reach surface drying, and utilize dark reaction to make dash area or floor portions completion of cure.
Stage of photocuring and dark curing can for free radical type and cationic ultra-violet curing agent, so there is free radical type and cationic hot curing etc.
Here is some typical system of lifting, and some concrete operating parameters.
Described base board for flexible optoelectronic part, free radical type ultraviolet curable agent is the material of polyester-acrylate, epoxy-acrylate, urethane acrylates, polyethers-acrylate or following molecular structure;
HS (CH 2cH 2o) ncH 2cH 2sH or
Cation type ultraviolet photo-curing agent comprises: epoxy resin or modified epoxy.
Plasticizer is dioctyl phthalate, dibutyl phthalate, three vinyl butyl ether base phosphates, polyvinyl butyral resin, tributyl 2-acetylcitrate, repefral, diethyl phthalate, hexanedioic acid two (Butoxyethoxy) ethyl ester, isopropyl titanate, tetrabutyl titanate, citrate, trimellitic acid (2-ethyl) own ester, phthalic acid two (2-ethyl) own ester, decanedioic acid two (2-ethyl) own ester, Diethylene Glycol Dibenzoate, phthalic anhydride, dipropylene glycol dibenzoate and chlorosulfonated polyethylene, described coupling agent comprises methylvinyldichlorosilane, methyl hydrogen dichlorosilane, dimethyldichlorosilane, chlorodimethyl silane, vinyl trichlorosilane, γ-aminopropyltrimethoxysilane, dimethyl silicone polymer, poly-hydrogen methylsiloxane, poly-methyl methoxy radical siloxane, γ-methacrylic acid third vinegar base trimethoxy silane, gamma-aminopropyl-triethoxy-silane, γ-glycidol ether propyl trimethoxy silicane, aminopropyl silsesquioxane, γ-methacryloxypropyl trimethoxy silane, chain alkyl trimethoxy silane, vinyltriethoxysilane, vinyltrimethoxy silane, γ-chloropropyl triethoxysilane, two-(the silica-based propyl group of γ-triethoxy), anilinomethyl triethoxysilane, N-β (aminoethyl)-γ-aminopropyltrimethoxysilane, N-(β-aminoethyl)-gamma-aminopropyl-triethoxy-silane, N-β (aminoethyl)-γ-aminopropyltriethoxy dimethoxysilane, γ-(2,3-epoxy third oxygen) propyl trimethoxy silicane, γ-(methacryloxypropyl) oxypropyl trimethyl silane, one or more in γ mercaptopropyitrimethoxy silane or γ-Mercaptopropyltriethoxysilane.
Free radical activity diluent is divided into exploitation first generation polyfunctional acrylate monomer comparatively early, the second generation polyfunctional acrylate monomer of recent development and more excellent third generation acrylic monomers.
Monofunctional reactive diluent has: styrene, NVP, Isooctyl acrylate monomer, hydroxy-ethyl acrylate and isobornyl acrylate, methacrylate phosphate and isobornyl methacrylate, and latter two is the good toughness reinforcing monomer of plasticising.
Difunctional reactive diluents has: triethylene glycol diacrylate, tripropylene glycol diacrylate, glycol diacrylate, polyethylene glycol diacrylate alcohol ester, neopentylglycol diacrylate and propoxyl group neopentylglycol diacrylate, acrylate functional monomers mainly contains 1,6-hexanediyl ester (HDDA), BDO diacrylate (BDDA), propylene glycol diacrylate (DPGDA), glycerol diacrylate (TPGDA), the trihydroxy methyl propane triacrylate (TMPTA) of trifunctional, pentaerythritol triacrylate (PETA), trihydroxy methyl propane triol triacrylate (TMPTMA), trimethylolpropane triacrylate, propoxylation trihydroxy is through propane tri, pentaerythrite three propylene alcohol ester, pentaerythritol propoxylate propylene alcohol ester, N, N-dihydroxy ethyl-3 amido methyl propionate, triethylene glycolbismethyl-acrylate, long-chain fat hydrocarbon glycidol ether acrylic acid, resorcinol bisglycidyl ether, double pentaerythritol C5 methacrylate, tri (propylene glycol) diacrylate, phthalic acid diethanol diacrylate (PDDA).They instead of active little first generation acrylic acid monofunctional monomer.But along with the develop rapidly of UV curing technology, their shortcomings large to the excitant of skin reveal.
Second generation polyfunctional acrylate monomer mainly introduces ethyoxyl or propoxyl group in the molecule, overcomes the shortcoming that excitant is large, also should have higher activity and state of cure.As ethoxylation trihydroxy methyl propane triol triacrylate (TMP (EO) TMA), propoxylation trihydroxy methyl propane triol triacrylate (TMP (PO) TMA), propoxylated glycerine triacrylate (G (PO) TA).Third generation acrylic monomers is mainly the acrylate containing methoxyl group, preferably resolves the contradiction of high curing rate and shrinkage, low state of cure.This kind of material has 1,6-hexylene glycol methoxyl group mono acrylic ester (HDOMEMA), ethoxylation neopentyl glycol methoxyl group mono acrylic ester (TMP (PO) MEDA).After introducing alkoxyl in molecule, the viscosity of monomer can be reduced, reduce the excitant of monomer simultaneously.
The compatibility of introducing to diluent monomer of alkoxyl also improves a lot, and vinyltriethoxysilane (A15I), gamma-methyl allyl acyloxypropyl trimethoxysilane (A174) can be used as monomer.
Cruel in various reactive epoxies diluent and various cyclic ethers, ring, vinyl ether monomers etc. can as the diluent of cation photocuring resin.Wherein fast, the modest viscosity of vinyl ethers compound and oligomer curing rate, tasteless, nontoxic, can with epoxy resin with the use of.Vinyl ether monomers has: 1, 2, 3-propanetriol-diglycidyl-ether (EPON-812), triethyleneglycol divinylether (DVE-3), 1, 4-butanediol vinyl ethers (HBVE), cyclohexyl vinyl ether (CHVE), perfluoro methyl vinyl ether (PMVE), perfluoropropylvinylether, IVE, hydroxy butyl vinyl ether, vinyl ethyl ether, ethyl vinyl ether, ethyl vinyl ether propylene, ethylene glycol monoallyl ether, hydroxy butyl vinyl ether, butyl vinyl ether, chlorotrifluoroethylene (CTFE), triethylene glycol divinyl ether, methoxy ethylene, vinyl butyl ether, dodecyl vinyl (DDVE), cyclohexyl vinyl ether, tribenzyl-benzene phenol polyethenoxy base ether, tetrafluoroethylene-perfluoro propyl vinyl ether, tetrafluoroethylene-perfluoro propyl vinyl ether, tert-Butyl vinyl ether:
Epoxy compounds monomer has: 3,4-expoxycyclohexyl formic acid-3 ', 4 '-expoxycyclohexyl methyl esters (ERL-4221), bisphenol A type epoxy resin (EP), epoxy acrylate, epoxy vinyl ester, acrylic acid epoxy ester, epoxymethacrylate, water-soluble itaconic acid epoxy ester resin:
The effect of light trigger is after it absorbs UV energy, produces free radical through decomposing, thus the unsaturated bond polymerization in initiator system, crosslinking curing becomes an entirety.Conventional radical photoinitiator has cracking type and puies forward the large class of Hydrogen two.
Crack type photoinitiator: crack type photoinitiator mainly contains benzoin ethers (styrax ethers), benzil ketals and acetophenone etc.Crack type photoinitiator is chapped after absorption ultraviolet light, produces two free radicals, and free radical causes unsaturated group polymerization.Benzoin ethers (styrax ethers) comprising: styrax (Benzoin), benzoin methyl ether, benzoin ethyl ether (Benzoinethyl ether), benzoin isobutyl ether (Benzoin butyl ether), styrax lose (Benzoin oxime), benzoin isopropyl ether, acylphosphine oxide comprises: 2, 4, 6 trimethylbenzoyl diphenyl phosphine oxides (TPO) and (2, 4, 6-trimethylbenzoyl) phenyl phosphine oxide (BAPO phenyl bis (2, 4, 6-trimethyl benzoyl) phosphine oxide), phenyl two (2, 4, 6-trimethylbenzoyl) phosphine oxide (819), tetramethylpiperidone oxide (TMPO), triethyl phosphate (TEPO), they are more satisfactory light triggers, there is very high space charge force, absorption is had to long wave near ultraviolet ray, be applicable to whitewash and the thicker situation of film, and there is good stability, can not variable color or fade.
Carry Hydrogen initator: carry Hydrogen initator and mainly contain benzophenone and thioxanthones etc.Wherein thioxanthone photoinitiator is at the maximum absorption wavelength in black light district at 380-420nm, and absorbability and hydrogen-taking capacity are strong, have higher efficiency of initiation.Carry Hydrogen initator and must have hydrogen donor as collaborative composition, otherwise efficiency of initiation is too low, so that application can not be put to.Triplet state carbonyl free radical more likely extracts hydrogen than on secondary carbon or on methyl from the tertiary carbon of hydrogen donor molecule, and the hydrogen be connected on the hetero-atom such as oxygen or nitrogen more easily extracts than the hydrogen on carbon atom.This kind of hydrogen donor has amine, hydramine (triethanolamine, methyl diethanolamine, triisopropanolamine etc.), mercaptan, N, N-diethyl-and to dimethylamino benzamide.
Benzophenone light initiation system, benzophenone needs with alcohol, ether or amine also with vinyl monomer just can be made to carry out photopolymerization.Mainly comprise: benzophenone, thia anthraquinone, Michler's keton, dimethoxy benezene phenyl ketone (DMPA), alpha-hydroxy-2, 2 dimethyl acetophenones (1173), Alpha-hydroxy cyclohexyl-phenyl ketone (184), α-amine alkyl phenones, 2-methyl isophthalic acid (4-first coloured glaze base phenyl)-2-morpholinopropanone (MMMP), 2, 2 '-dibenzamidodiphenyl disulfide (DBMD), (4-dimethylamino phenyl)-(1-piperidyl)-ketone, isopropyl thioxanthone (ITX), (4-dimethylamino phenyl)-(4-morpholinyl)-ketone, 2-hydroxy-2-methyl-1-phenyl-1-phenyl-1-acetone, two phenoxy group benzophenone, hydroxy-2-methyl phenyl-propane-1-ketone.And mixed system, as the oxygen in glued membrane can be eliminated initiator system is coordinated to the benzophenone of the inhibition of Raolical polymerizable and tertiary ammonia; Michler's keton and benzophenone with the use of, more cheap and effectively initiator system can be obtained.
Cationic photoinitiator: aromatic sulfonium salts and salt compounded of iodine class initator have excellent high-temperature stability, also have stability, so be widely used in Cationic curing systems with epoxy resin after coordinating.This type of initator comprises: xylyl iodine hexafluorophosphate (PI810), hydroxy phenyl salt compounded of iodine (HTIB), the two detergent alkylate iodine hexafluoro antimonate of 4,4-, xylyl salt compounded of iodine, diphenyl hexafluoroarsenate salt compounded of iodine, [4-(2-hydroxyl-3-butoxy-1-propoxyl group) phenyl] iodo-hexafluoro antimonate of benzene, [4-(to benzoylphenylsulfanyl) benzene] phenyl-iodide hexafluorophosphate, [4-(4-benzoyl phenoxy group) benzene] phenyl-iodide hexafluorophosphate, 4-(to benzoylphenylsulfanyl) benzene] phenyl-iodide hexafluorophosphate, 4,4 '-dimethyl diphenyl salt compounded of iodine hexafluorophosphate (IHT-PI 820), 4,4'-diacetylamino diphenyl iodine hexafluorophosphate, 37-dinitro dibenzo ring-type salt compounded of iodine and 3,7 one dinitro dibenzo ring-type bromine salt, tetrafluoro boric acid diaryl group iodized salt, 3,3'-dinitro diphenyl salt compounded of iodine, 3,3'-dinitro diphenyl salt compounded of iodine and several 2,2'-bis-replaces (iodine, bromine, chlorine)-5,5'-dinitrophenyl salt compounded of iodine, iodate 2-[2-(3-indolizine) vinyl]-1-methylquinoline salt, iodate 4-(2-benzoxazole)-N-picoline salt, 3-nitrobenzophenone diphenyl sulphur hexafluorophosphate, triaryl phosphine glyoxalidine salt, triaryl phosphine 1,1'-dinaphthalene glyoxalidine ring salt, 3,7-dinitro dibenzo bromine five rings salt, p-methyl benzenesulfonic acid triphenyl sulfosalt, bromination triphenyl sulfosalt, (4-Phenylsulfanyl-phenyl) diphenyl sulphur hexafluorophosphate, 4-(thiophenyl) triphenyl sulphur hexafluorophosphate, 3,3 '-dinitro diphenyl iodine hexafluorophosphate, 3-nitrobenzophenone diphenyl sulphur hexafluorophosphate, triphenyl sulfosalt, 4-chlorphenyl diphenyl sulphur hexafluorophosphate, 3-nitrobenzophenone diphenyl sulphur hexafluorophosphate, 4-acetamidophenyl diphenyl sulphur hexafluorophosphate, 3-benzoylphenyl diphenyl sulphur hexafluorophosphate, triphenyl sulphur borofluoride, triphenyl sulphur hexafluorophosphate, triphenyl sulphur hexafluoro antimonate, 4-tolyl diphenyl sulphur hexafluorophosphate, phosphorus hexafluoride triaryl sulfonium salts, antimony hexafluoride triaryl sulfonium salts, [4-(to benzoylphenylsulfanyl) benzene] phenyl-iodide hexafluorophosphate, 1-(the bromo-2'-luorobenzyl of 4'-) pyridiniujm, [4-(to benzoylphenylsulfanyl) benzene] phenyl-iodide hexafluorophosphate, { 4-[4-(p-nitrophenyl formoxyl) thiophenyl] benzene } phenyl-iodide hexafluorophosphate, { 4-[4-(to methyl benzoyl) thiophenyl] benzene } phenyl-iodide hexafluorophosphate, { 4-[4-(to methyl benzoyl) phenoxy group] benzene } phenyl-iodide hexafluorophosphate, [4-(to benzoyl phenoxy group) benzene] phenyl-iodide hexafluorophosphate, the two detergent alkylate iodine hexafluoro antimonate of 4,4-.
Luxuriant molysite class: luxuriant molysite class light initiation system is the new cation light initiator of one developed after two aromatic iodonium salt and three aromatic sulfonium salts, mainly comprises: cyclopentadienyl group-iron-benzene salt, cyclopentadienyl group-iron-toluene salt, cyclopentadienyl group-iron-paraxylene salt, cyclopentadienyl group-iron-naphthalene salts, cyclopentadienyl group-iron-biphenyl salt, cyclopentadienyl group-iron-2,4-dimethyl acetophenone salt, acetyl group-cyclopentadienyl group-iron-paraxylene salt, cyclopentadienyl group-iron-methyl phenyl ethers anisole salt, cyclopentadienyl group-iron-diphenyl ether salt, cyclopentadienyl group-iron-2,4-diethoxybenzene salt, ferrocene tetrafluoroborate, the luxuriant iron tetrafluoroborate of toluene, cyclopentadienyl group-iron-methyl phenyl ethers anisole salt, cyclopentadienyl group-iron-diphenyl ether salt, cyclopentadienyl group-iron-Isosorbide-5-Nitrae-diethoxybenzene salt, cyclopentadienyl group-iron-chlorobenzene salt, cyclopentadienyl group-iron-(Isosorbide-5-Nitrae-diethoxybenzene) hexafluorophosphate, cyclopentadienyl group-iron-diphenyl ether hexafluorophosphate, 1,10-phenanthrolene ferrous perchlorate salt, 1,10-phenanthrolene ferrous sulfate cyclopentadienyl group-iron-methyl phenyl ethers anisole salt, cyclopentadienyl group-iron-diphenyl ether salt, [two (diphenylphosphine) ferrocene of 1,1'-] Nickel Chloride, vinyl ferrocene, N, N'-di-ferrocene methylene butanediamine quaternary ammonium salt, ferrocene formamide, ferrocene acyl propionic acid, ferrocenyl methyl ketone, ethyl dicyclopentadienyl iron, Butyrylferrocene, butyl ferrocene, N, N-dimethyl-amine methyl ferrocene, 1,1'-dibenzoyl ferrocene, (3-carboxyl propionyl group) ferrocene, 1,1'-dibromof errocene, Aminoferrocene.
Ultraviolet light polymerization-heat cured system: find that the mechanical performance of heat treatment Post RDBMS product is significantly improved, and along with the increase of epoxy component, hybrid systems has good adhesion property on the grounds such as metal, this is owing to shrinking little cause when epoxy compounds solidifies on the one hand, is the internal stress owing to producing when eliminating radical UV curing during hot curing on the other hand.According to base board for flexible optoelectronic part provided by the present invention, it is characterized in that, the thermal curing agents in described hot curing mode comprises: epoxy resin, isocyanates, amino resins class and free radical thermal curing agents.
Epoxy resin comprises: aliphat amine, aromatic amine, dicyandiamide class, imidazoles, organic acid anhydride class, organic hydrazides class, lewis acid amine and microcapsules class.
Aliphat amine comprises: ethylenediamine, hexamethylene diamine, diethylenetriamine, triethylene tetramine, ethoxy diethylenetriamine, hydroxyl isopropyl diethylenetriamine, poly-ethanedioic acid adipamide, diethanol amine, tetramethylethylenediamine, Diammonium Glycyrrhizinate, N-(2-ethoxy) ethylenediamine, two (4-amido phenoxy group)-phenylphosphine oxide, two (3-aminocarbonyl phenyl) phenylphosphine oxide, tetrapropyleneglycol diamines, N-hydroxyethyl-ethylenediamine, methyl ring pentanediamine, polyetheramine, pnenolic aldehyde amine hardener (T-31), AEEA, IPD, the Meng alkane diamines, diformazan ammonia propylamine, two (4-amino-3-methylcyclohexyl) methane, 4-methyl-diaminopropane, amine epoxy curing agent modified (593), fatty amines epoxy hardener (3380, TG-03, LX-502, D230), fatty amine modification addition product (HB-206, HB-205, HB-2512, HB-9305, HB-9409).
Dicyandiamide class comprises: dicyandiamide, 3, the cyanoguanidine derivative (HT 2833, HT 2844) of 5 disubstituted benzenes amine modifications, dicyandiamide (MD 02 reacts obtained by expoxy propane and dicyandiamide), modified dicyandiamine derivative (AEHD-610, AEHD-210) and the derivative containing following molecular formula.
Aromatic amine comprises: two amido diphenyl sulfones (DDS), two aminodiphenylmethane (DDM), m-phenylene diamine (MPD) (m PDA), 8 naphthylenediamines, diethyl toluene diamine, o-phenylenediamine, p-phenylenediamine (PPD), pi-allyl aromatic diamines, N-(aminopropyl)-toluenediamine, IPD, dimethylethanolamine, dimethyl Bian amine, triethylbenzyl ammonium chloride, benzyl-dimethylamine, N-benzyl dimethylamine, 2, 4, 6,-three-(dimethylamino methyl)-phenol, phenol formaldehyde (PF) hexamethylene diamine, N, N-dimethyl benzylamine (BDMA), N-is to carboxyl phenyl succinimide (p-CPMD).
Imidazoles comprises: 1-methylimidazole, 2-ethyl imidazol(e), 2-phenylimidazole, glyoxal ethyline, 1-8-amino-ethyl-glyoxal ethyline (AMz), 2-undecyl imidazole hexanedioic acid disalt, 2-ethyl imidazol(e), 2-ethyl-4-methylimidazole (2E4Mz), 1-(2-amino-ethyl)-glyoxal ethyline, 1-cyano group-2-ethyl-4-methylimidazole, 2-heptadecyl imidazole, 2-ethyl-4-methylimidazole-carboxyl, 3-dihydroxymethyl substituted ramification of imidazole, 1, the chloride of 3-diphenyl-glyoxal ethyline, 1-decyl-2-ethyl imidazol(e), modified imidazole (JH-0511, JH-0512, JH-0521).
Organic acid anhydride class comprises: epoxidized polybutadiene/acid anhydrides, maleic anhydride, 70# acid anhydrides (being synthesized by butadiene and maleic anhydride), 647# acid anhydrides (being synthesized by dicyclopentadiene and maleic anhydride), 308 tung oil acid anhydrides are (by tung oil-modified maleic anhydride, MNA (MNA) synthesizes), pyromellitic acid anhydride (PMTA) (pyromellitic acid anhydride mixes with maleic anhydride), methyl hexahydrophthalic anhydride (MeHHPA), oxydiphthalic, phthalic anhydride (PA), hexahydrophthalic anhydride (HHPA), tetrahydrochysene phthalate anhydride (THPA), methyl tetrahydrochysene phthalate anhydride, epoxidized polybutadiene/acid anhydrides, trimellitic anhydride (TMA), tetrabromo-benzene dicarboxylic acid anhydride, poly-acetic anhydride in the ninth of the ten Heavenly Stems (PAPA).
Organic hydrazides class comprises: the amino polyacrylamide of sebacic dihydrazide (SDH), adipic dihydrazide, carbon acid dihydrazide, careless acid dihydrazide, succinic acid hydrazide ii, adipic dihydrazide, N-, N (CH2CH2CONHNH2) 3, (H2NHNCOCH2CH2) 2NCH2CH2N (CHCHCONHNH2) 2, butanedioic acid hydrazides, decanedioic acid hydrazides, M-phthalic acid hydrazides, to Para Hydroxy Benzoic Acid hydrazides (POBH), azelaic acid two hydrazides, isophthalic dihydrazide.
Lewis acid amine forms complex compound by the lewis acids such as BF3, AlCl3, ZnCl2, PF5 and primary amine or secondary amine and forms, comprising: cyclopentadienyl group isopropylbenzene iron hexafluorophosphate (Irgacure 261), boron trifluoride, ferrocene tetrafluoroborate.
Microcapsules class comprises: cellulose, gelatin, polyvinyl alcohol, polyester, polysulfones.
Isocyanates comprises: triallyl cyanurate, toluene di-isocyanate(TDI) (TDI), '-diphenylmethane diisocyanate (MDI), poly methylene poly phenyl poly isocyanate (PAPI), hexamethylene diisocyanate (HDI), IPDI (IPDI), trimethyl hexamethylene diisocyanate (TMDI), dicyclohexyl methyl hydride diisocyanate (HMDI), XDI (XDI), tetramethylxylylene diisocyanate (TMXDI), methyl styrene isocyanates (TMI), hexahydrotoluene vulcabond (HTDI), acrylonitrile-butadiene rubber, Heptad isocyanate, triphenyl first-4, 4', 4'-triisocyanate, tri o cresyl thiophosphate (4-NCO phenyl ester), tetraisocyanate, Heptad isocyanate, biuret polyisocyanate, tetrahydrofuran polyether polyalcohol-epoxy resin-isocyanates, trihydroxy polyoxypropylene polyol-isocyanates.
Amino resins comprises: diaminodiphenyl-methane (DDM), N-is to chlorophenyl-N-N-dimethyl urea, 3-phenyl-1, 1-dimethyl urea, 3-rubigan-1, 1-dimethyl urea, 4, 4 '-diamino-diphenyl bis-phenol, polyurethanes, Lauxite, epoxy-ethylenediamine carbamate, N, N, N', N'-tetra-propargyl-4, 4'-diaminourea-diphenyl-methane (TPDDM), 2, 4, 6-tri-(dimethylamino methyl) phenol, 2, 4-diaminotoluene, 4, 6-tri-(dimethylamino methyl) phenol, polyurethane, methyl-etherified Lauxite, three (3-aminopropyl) amine, 2-amino-ethyl-two (3-aminopropyl) amine, N, N, N ', N '-four (3-aminopropyl) ethylenediamine, 1-[two (3-aminopropyl) is amino]-2-propyl alcohol, N-(2-amino-ethyl)-N-(3-aminopropyl) amine, 1-[(2-amino-ethyl)-(3-aminopropyl) is amino]-1-ethanol, 1-[(2-amino-ethyl)-(3-aminopropyl) is amino]-2-propyl alcohol, 3-dimethylaminopropylamine, 4,4 '-MDA (DDM), 4,4 '-diamino-diphenyl bis-phenol, 4,4 '-diamino-diphenyl sulfone (DDS), three (3-aminopropyl) amine, melmac, benzoguanamine resin, hexamethylol melamine resin, methyl-etherified melmac, methyl-etherified benzoguanamine resin, methyl-etherified urea melamine condensation copolymerization resin, hexamethoxymethyl melamine resin (TMMM), carbinol-modified trimethylol melamine, urea-melamine resin, polyester melamine, 2-secondary butyl phenenyl-N-methylamino acid esters, DCCA ester, TCCA ester, aminotriazine resins, urethane acrylate, 4-aminopyridine resin, N-β-aminoethyl amino mylar, α-aminopyridine resin, aminodiphenylether resin, amino silicones, phosphoramidic-resin, maleopimaric acid polyester amino resin, piperazine aminodithioformic acid type chelating resin, hydroxyethylamino mylar.
Free radical thermal curing agents comprises: cumyl peroxide, acrylic acid epoxy monoesters, the tertiary fourth fat of benzoic acid, urethane acrylate, polyurethane diol, polyester triol, two (hexafluorophosphoric acid ester), polymethyl methacrylate (PMMA), cinnamic acrylic ester, polybutadiene type crylic acid hydroxy ester, polyester urethane acrylate, acrylic acid epoxy monoesters, butadiene-methyl methacrylate-benzene diene copolymers, butadiene-methyl methacrylate, ethylene-acrylate, polyacrylate, chlorination polypropylene-acrylate, polymethyl methacrylate, polyethyl methacrylate, cyanoacrylate, 2-acrylic acid-1,2-PD monoesters, methyl methacrylate, EMA, butyl methacrylate, hydroxyethyl methacrylate, isobutyl methacrylate, isobutyl methacrylate, EHMA, methacrylic acid 2 methylamino ethyl ester, methyl acrylate, ethyl acrylate, butyl acrylate, acrylic acid 2 hydroxy propyl ester, hydroxy-ethyl acrylate, Isooctyl acrylate monomer, vinyl acetate-acrylic butyl ester, polymethyl methacrylate.
Ultraviolet light polymerization-microwave curing system: the microwave curing agent in microwave curing mode is identical with the thermal curing agents in hot curing mode.Its technical characterstic uses the mode of microwave curing that thermal curing agents is solidified.Microwave is because of " in molecule " uniform heating pattern of uniqueness, make that resin solidification is even, speed is fast, be easy to control, save the energy, equipment investment is few, microwave replaces the research of hot curing in thermosetting resin and composite material solidification thereof more and more to come into one's own in recent years.
Ultraviolet light polymerization-anaerobic curing system: the anaerobic curing agent in anaerobic curing system comprises: methacrylate tetraethylene-glycol ester, methacrylate multicondensed ethylene glycol ester (as the U.S. happy safe 290 and mix with fumaric acid bisphenol-A unsaturated polyester (UP) happy safe 271, happy safe 277 etc.), triethylene Glycol double methyl methacrylate, ethyleneglycol dimethyacrylate, hydroxyethyl methacrylate or hydroxypropyl acrylate are (as domestic anchor 302, the triple bond 1030 of Japan), bisphenol-A epoxy ester is (as domestic Y-150, GY-340 etc. are the mixtures of epoxy-ester and multicondensed ethylene glycol ester), the product of hydroxyethyl methacrylate alkyl phenol and polyalcohol is (as happy safe 372 of the U.S., domestic GY-168, anchor 352 and BN-601), polyurethane, the different hydrogen acid ether (hydrogen acid ester) of polyurethane, hydroxy propyl methacrylate, hydroxy propyl methacrylate-polyethers, hydroxy polybutadiene type polyurethane, polyurethane-acrylate, hydroxypropyl acrylate (HPA), glycol methacrylate, cumyl hydroperoxide, acrylic acid o-cresol formaldehyde epoxy-ester, methoxylated polyethylene glycol methacrylate, phthalic acid Triethylene Glycol, β-hydroxyethyl methacry-late, trimethylol-propane trimethacrylate, triethylene Glycol double methyl methacrylate, multicondensed ethylene glycol double methyl methacrylate, Dimethacryloylethylthioether, phthalic acid two (diethylene glycol (DEG) acrylate), Ethoxylated bisphenol A dimethylacrylate, dimethacrylate bisphenol-A ethylene glycol fat, second diester methacrylate, triethlene glycol bismethylacrylate, glycol methacrylate, one diethyl acetal double methyl methacrylate, phthalic anhydride diglycol ethylene double methyl methacrylate, epoxy resin (methyl) acrylate, methacrylate diglycol ester, double methyl methacrylate triethylene glycol ester, propenoic methyl carbamate, a-Methyl 2-cyanoacrylate, a-cyanacrylate, glycidyl methacrylate, polyethylene glycol dimethacrylate, TEGDMA, methacrylic acid dicyclopentadiene-oxygen-ethyl ester, methyl-prop dimethylaminoethyl acrylate.
Ultraviolet light polymerization-electronic beam curing system: the electronic beam curing agent in electronic beam curing mode comprises: triphenol methylmethane tetraglycidel ether epoxy resin, bicyclopentadiene bisphenol-type epoxy resin, bisphenol A-type vinyl ester resin (V-411), epoxy vinyl ester resin (V-901), Epocryl (BRT2000), maleimide resin, 4,4 '-diphenyl methane dimaleimide, bisphenol-A-Diphenyl Ether Bismaleimide, bisphenol-A maleic acid vinylite, vinyl ester resin, ethylene bromide base ester resin, fumaric acid mixed ethylene base ester resin, acrylic acid mixed ethylene base ester resin, carbamate mixed ethylene base ester resin, rubber mix vinyl ester resin, phenol formaldehyde epoxy vinyl ester resin, the hybrid epoxidized acrylate of isocyanates, toluene di-isocyanate(TDI) mixing acrylic acid-hydroxyl ethyl ester, methylolation bisphenol-type epoxy resin, bisphenol A acrylates, urethane acrylate, bisphenol-A epoxide vinylester resin, bisphenol A benzoxazine-epoxy resin, bisphenol fluorene epoxy resin, bisphenol-a epoxy acrylate resin, bisphenol A diglycidyl ether, bisphenol-A epoxy chloropropene acid ester resin.
Below specific embodiments of the invention:
Embodiment 1
Board structure as shown in Figure 1, flexible substrate 2 is for being mixed with the shellac of dual cure glue, and dual cure glue adopts free radical type ultra-violet curing agent-thermal curing agents dual UV curable paint, and conductive layer 1 is ito thin film.
Preparation method is as follows:
1. utilize washing agent, acetone soln, ethanolic solution and deionized water to carry out ultrasonic cleaning to glass substrate, dry up with drying nitrogen after cleaning;
2., after shellac-dual cure glue (it is 0.3% that dual cure glue the accounts for mass ratio) mixed solution same ethanol being carried out 1:10 dilution stirs 20 hours, be spin-coated on glass substrate surface, thickness is about 100 microns;
Wherein dual cure glue material component proportioning is:
3. ultra-violet curing process is carried out 30 seconds to substrate surface;
4. substrate is put into baking box, temperature 110 DEG C, hot curing process 20 minutes; (3. and 4. step can exchange mutually)
5. substrate is put into vacuum chamber, at ambient temperature, by the means of DC magnetron sputtering, under 100 watts of power condition, sputter the ITO transparent conductive film of 100 nanometer thickness at glass substrate surface;
6. the flexible substrate being coated with conductive film is carried out ultra-violet curing process 30 seconds again;
7. flexible substrate is peeled off from glass substrate, form base board for flexible optoelectronic part;
8. the degradation characteristic of base board for flexible optoelectronic part, sheet resistance, surface topography, water oxygen permeability and light transmission rate is tested.
Embodiment 2
Board structure as shown in Figure 1, flexible substrate 2 is for being mixed with the shellac of dual cure glue, and dual cure glue adopts free radical type ultra-violet curing agent-microwave curing agent dual UV curable paint, and conductive layer 1 is carbon nano-tube.
Preparation method is as follows:
1. utilize washing agent, acetone soln, ethanolic solution and deionized water to carry out ultrasonic cleaning to glass substrate, dry up with drying nitrogen after cleaning;
2., after shellac-dual cure glue (it is 0.4% that dual cure glue the accounts for mass ratio) mixed solution same ethanol being carried out 1:10 dilution stirs 20 hours, be spin-coated on glass substrate surface, thickness is about 300 microns;
Wherein dual cure glue material component proportioning is:
3. treatment with ultraviolet light is carried out to the substrate that 2. step obtains, processing time 30s;
4. substrate is put into microwave oven, microwave curing process 15 minutes; (3. and 4. step can be intercoursed)
5. in 2. surface spraying method, carbon nano-tube aqueous dispersions is prepared conductive layer, height 20cm, spraying air pressure 0.3MPa, spray rate 0.3mL/min, conductive layer thickness is 77nm;
6. the flexible substrate being coated with conductive film is carried out ultra-violet curing process 30 seconds again;
7. flexible substrate is peeled off from glass substrate, form base board for flexible optoelectronic part;
8. the degradation characteristic of base board for flexible optoelectronic part, sheet resistance, surface topography, water oxygen permeability and light transmission rate is tested.
Embodiment 3
Board structure as shown in Figure 1, flexible substrate 2 is for being mixed with the shellac of dual cure glue, and dual cure glue adopts free radical type ultraviolet curable agent-anaerobic curing agent dual UV curable paint, and conductive layer 1 is nano silver wire.
Preparation method is as follows:
1. the glass substrate that first effects on surface roughness is less than 1nm is cleaned, and utilizes washing agent, acetone, deionized water, isopropyl alcohol to carry out ultrasonic cleaning respectively, dries up after cleaning with drying nitrogen;
2., after shellac-dual cure glue (it is 0.5% that dual cure glue the accounts for mass ratio) mixed solution same ethanol being carried out 1:10 dilution stirs 20 hours, be spin-coated on glass substrate surface, thickness is about 500 microns;
Wherein dual cure glue material component proportioning is:
3. the substrate 2. obtained step carries out ultra-violet curing process 40 seconds;
4. substrate is put into vacuum chamber, carry out anaerobic curing under vacuum environment 20 minutes;
5. the flexible substrate surface 4. obtained in step uses spraying process that nano silver wire isopropyl alcohol dispersion liquid is prepared conductive layer, height 20cm, spraying air pressure 0.3MPa, spray rate 0.3mL/min, and conductive layer thickness is 60nm;
6. the flexible substrate being coated with conductive film is carried out ultra-violet curing process 60 seconds again;
7. flexible substrate is peeled off from rigid substrates, form base board for flexible optoelectronic part;
8. the degradation characteristic of base board for flexible optoelectronic part, sheet resistance, surface topography, water oxygen permeability and light transmission rate is tested.
Embodiment 4
Board structure as shown in Figure 1, flexible substrate 2 is for being mixed with the shellac of dual cure glue, and dual cure glue adopts free radical type ultraviolet light polymerization-electronic beam curing system, and conductive layer 1 is gold copper nano wire.
Preparation method is as follows:
1. the glass substrate that first effects on surface roughness is less than 1nm is cleaned, and utilizes washing agent, acetone, deionized water, isopropyl alcohol to carry out ultrasonic cleaning respectively, dries up after cleaning with drying nitrogen;
2. adopt spin coating to prepare shellac and dual cure glue mixed film (mass ratio shared by dual cure glue is 0.8%) on a glass substrate, described dual cure collagen material comprises following composition:
3. the flexible substrate 2. obtained step carries out ultra-violet curing process 60 seconds;
4. substrate is put into vacuum chamber, carry out electronic beam curing under vacuum environment 60 minutes;
5. gold copper nano wire aqueous dispersions is prepared conductive layer by surface spraying method, height 20cm, spraying air pressure 0.3MPa, spray rate 0.3mL/min, and conductive layer thickness is 50nm;
6. the flexible substrate being coated with conductive film is carried out ultra-violet curing process 60 seconds again;
7. flexible substrate is peeled off from glass substrate, form base board for flexible optoelectronic part;
8. the degradation characteristic of base board for flexible optoelectronic part, sheet resistance, surface topography, water oxygen permeability and light transmission rate is tested.
Embodiment 5
Board structure as shown in Figure 1, flexible substrate 2 is for being mixed with the shellac of dual cure glue, and dual cure glue adopts cation type ultraviolet photo-curing-heat cured system, and conductive layer 1 is ITO.
Preparation method is as follows:
1. the rigid substrates that first effects on surface roughness is less than 1nm cleans, and utilizes washing agent, acetone, deionized water, isopropyl alcohol to carry out ultrasonic cleaning respectively, dries up after cleaning with drying nitrogen;
2. adopt spin coating to prepare shellac and dual cure glue mixed film (mass ratio shared by dual cure glue is 2%) on the rigid substrate, described dual cure collagen material comprises following composition:
3. ultra-violet curing process is carried out 60 seconds to substrate surface;
4. substrate is put into baking box, temperature 110 DEG C, hot curing process 20 minutes; (3. and 4. step can exchange mutually)
5. 4. surface screen-printed legal system is for conductive indium-tin oxide layer, conductive layer thickness is 80nm;
6. the flexible substrate being coated with conductive film is carried out ultra-violet curing process 60 seconds again;
7. flexible substrate is peeled off from rigid substrates, form base board for flexible optoelectronic part;
8. the degradation characteristic of base board for flexible optoelectronic part, sheet resistance, surface topography, water oxygen permeability and light transmission rate is tested.
Embodiment 6
Board structure as shown in Figure 1, flexible substrate 2 is for being mixed with the shellac of dual cure glue, dual cure glue adopts cationic ultra-violet curing agent-microwave curing agent dual UV curable paint, conductive layer 1 is poly-(3,4-Ethylenedioxy Thiophene)-poly-(styrene sulfonic acid) (PEDOT:PSS).
Preparation method is as follows:
1. the rigid substrates that first effects on surface roughness is less than 1nm cleans, and utilizes washing agent, acetone, deionized water, isopropyl alcohol to carry out ultrasonic cleaning respectively, dries up after cleaning with drying nitrogen;
2. adopt spin coating to prepare shellac and dual cure glue mixed film (mass ratio shared by dual cure glue is 2.5%) on the rigid substrate, described dual cure collagen material comprises following composition:
3. ultra-violet curing process is carried out 60 seconds to substrate surface;
4. substrate is put into microwave oven, microwave curing process 15 minutes; (3. and 4. step can be intercoursed)
5. prepare PEDOT:PSS conductive layer at 3. surperficial ink-jet printing process, conductive layer thickness is 40nm;
6. UV-irradiation is carried out 60 seconds to flexible substrate surface;
7. the flexible substrate after the step 6. process of medium ultraviolet light is peeled off from rigid substrates, form base board for flexible optoelectronic part;
8. the degradation characteristic of base board for flexible optoelectronic part, sheet resistance, surface topography, water oxygen permeability and light transmission rate is tested.
Embodiment 7
Board structure as shown in Figure 1, flexible substrate 2 is for being mixed with the shellac of dual cure glue, and dual cure glue adopts cationic ultra-violet curing agent-anaerobic curing agent dual UV curable paint, and conductive layer 1 is ferronickel heterojunction nano-wire.
Preparation method is as follows:
1. the rigid substrates that first effects on surface roughness is less than 1nm cleans, and utilizes washing agent, acetone, deionized water, isopropyl alcohol to carry out ultrasonic cleaning respectively, dries up after cleaning with drying nitrogen;
2. adopt spin coating to prepare shellac and dual cure glue mixed film (mass ratio shared by dual cure glue is 3%) on the rigid substrate, described dual cure collagen material comprises following composition:
3. ultra-violet curing process is carried out 60 seconds to substrate surface;
4. substrate is put into vacuum chamber, carry out anaerobic curing under vacuum environment 20 minutes;
5. prepare ferronickel heterojunction nano-wire conductive layer at surperficial ink-jet printing process, conductive layer thickness is 70nm;
6. UV-irradiation is carried out 60 seconds to the flexible substrate surface being coated with conductive film;
7. the flexible substrate after the step 6. process of medium ultraviolet light is peeled off from rigid substrates, form base board for flexible optoelectronic part;
8. the degradation characteristic of base board for flexible optoelectronic part, sheet resistance, surface topography, water oxygen permeability and light transmission rate is tested.
Embodiment 8
Board structure as shown in Figure 1, flexible substrate 2 is for being mixed with the shellac of dual cure glue, and dual cure glue adopts cation type ultraviolet photo-curing-electronic beam curing system, and conductive layer 1 is gold copper nano wire.
Preparation method is as follows:
1. the glass substrate that first effects on surface roughness is less than 1nm is cleaned, and utilizes washing agent, acetone, deionized water, isopropyl alcohol to carry out ultrasonic cleaning respectively, dries up after cleaning with drying nitrogen;
2. adopt spin coating to prepare shellac and dual cure glue mixed film (mass ratio shared by dual cure glue is 4%) on a glass substrate, described dual cure collagen material comprises following composition:
3. the flexible substrate 2. obtained step carries out ultra-violet curing process 60 seconds;
4. substrate is put into vacuum chamber, carry out electronic beam curing under vacuum environment 60 minutes;
5. gold copper nano wire aqueous dispersions is prepared conductive layer by surface spraying method, height 20cm, spraying air pressure 0.3MPa, spray rate 0.3mL/min, and conductive layer thickness is 50nm;
6. the flexible substrate being coated with conductive film is carried out ultra-violet curing process 60 seconds again;
7. flexible substrate is peeled off from glass substrate, form base board for flexible optoelectronic part;
8. the degradation characteristic of base board for flexible optoelectronic part, sheet resistance, surface topography, water oxygen permeability and light transmission rate is tested.
Table 1 is the light transmission rate test result of embodiment 1-8 flexible substrate, and a kind of is the shellac being mixed with a certain amount of dual cure glue, and another kind is the shellac not mixing dual cure glue.
Embodiment Mix the light transmittance after dual cure glue Do not mix the light transmittance of dual cure glue
1 81％ 68％
2 78％ 69％
3 81％ 68％
4 82％ 67％
5 76％ 71％
6 77％ 72％
7 71％ 68％
8 77％ 67％

Claims (10)

1. biodegradable base board for flexible optoelectronic part, comprise flexible substrate and conductive layer, conductive layer is positioned at the top of flexible substrate, it is characterized in that, described flexible substrate is the shellac being mixed with dual cure glue, the mass ratio of described dual cure glue in shellac is 0.3-4%, described dual cure glue is made up of dual UV curable paint, described dual UV curable paint is ultraviolet light polymerization-heat cured system, ultraviolet light polymerization-microwave curing system, one or more in ultraviolet light polymerization-anaerobic curing system or ultraviolet light polymerization-electronic beam curing system, described dual UV curable paint by two independently cure stage complete, one of them cure stage is reacted by ultraviolet light polymerization, another cure stage is dark reaction.
2. biodegradable base board for flexible optoelectronic part according to claim 1, is characterized in that, described dual UV curable paint is following system:
1. free radical type ultraviolet light polymerization-heat cured system, weight forms:
Solidification process is: first carry out ultraviolet light polymerization, be then heating and curing, then carries out ultraviolet light polymerization; Or be first heating and curing, then carry out ultraviolet light polymerization, then be heating and curing;
2. free radical type ultraviolet light polymerization-microwave curing system, weight forms:
Solidification process is: first carry out ultraviolet light polymerization, then carries out microwave curing, then carries out ultraviolet light polymerization; Or first carry out microwave curing, then carry out ultraviolet light polymerization, then heat or microwave curing;
3. free radical type ultraviolet light polymerization-anaerobic curing system, weight forms:
Solidification process is: first carry out ultraviolet light polymerization, is not then subject to illumination and substrate under being in anoxia condition can carry out anaerobic curing reaction automatically, then carries out ultraviolet light polymerization;
4. free radical type ultraviolet light polymerization-electronic beam curing system, weight forms:
Solidification process is: first carry out ultraviolet light polymerization, then carries out electronic beam curing under vacuo, then carries out ultraviolet light polymerization;
5. cation type ultraviolet photo-curing-heat cured system, weight forms:
Solidification process is: first carry out ultraviolet light polymerization, be then heating and curing, then carries out ultraviolet light polymerization; Or be first heating and curing, then carry out ultraviolet light polymerization, then be heating and curing;
6. cation type ultraviolet photo-curing-microwave curing system, weight forms:
Solidification process is: first carry out ultraviolet light polymerization, then carries out microwave curing, then carries out ultraviolet light polymerization; Or first carry out microwave curing, then carry out ultraviolet light polymerization, then heat or microwave curing;
7. cation type ultraviolet photo-curing-anaerobic curing system, weight forms:
Solidification process is: first carry out ultraviolet light polymerization, is not then subject to illumination and substrate under being in anoxia condition can carry out anaerobic curing reaction automatically, then carries out ultraviolet light polymerization;
Or 8. cation type ultraviolet photo-curing-electronic beam curing system, weight forms:
Solidification process is: first carry out ultraviolet light polymerization, then carries out electronic beam curing under vacuo, then carries out ultraviolet light polymerization.
3. biodegradable base board for flexible optoelectronic part according to claim 2, is characterized in that, described free radical thermal curing agents is ethylenediamine, hexamethylene diamine, triethylene tetramine, ethoxy diethylenetriamine, hydroxyl isopropyl diethylenetriamine, poly-ethanedioic acid adipamide, diformazan ammonia propylamine, 4-methyl-diaminopropane, dicyandiamide, two amido diphenyl sulfones, two aminodiphenylmethane, m-phenylene diamine (MPD), diethyl toluene diamine, N-(aminopropyl)-toluenediamine, dimethylethanolamine, dimethyl Bian amine, triethylbenzyl ammonium chloride, benzyl-dimethylamine, N-benzyl dimethylamine, 2,4,6 ,-three-(dimethylamino methyl)-phenol, phenol formaldehyde (PF) hexamethylene diamine, N, N-dimethyl benzylamine, 2-ethyl imidazol(e), 2-phenylimidazole, glyoxal ethyline, 2-ethyl imidazol(e), 2-ethyl-4-methylimidazole, 1-(2-amino-ethyl)-glyoxal ethyline, maleic anhydride, oxydiphthalic, phthalic anhydride, trimellitic anhydride, tetrabromo-benzene dicarboxylic acid anhydride, gather acetic anhydride in the ninth of the ten Heavenly Stems, sebacic dihydrazide, adipic dihydrazide, carbon acid dihydrazide, grass acid dihydrazide, succinic acid hydrazide ii, adipic dihydrazide, the amino polyacrylamide of N-, decanedioic acid hydrazides, M-phthalic acid hydrazides, to Para Hydroxy Benzoic Acid hydrazides, azelaic acid two hydrazides, isophthalic dihydrazide, ferrocene tetrafluoroborate, triallyl cyanurate, toluene di-isocyanate(TDI), '-diphenylmethane diisocyanate, hexamethylene diisocyanate, trimethyl hexamethylene diisocyanate, dicyclohexyl methyl hydride diisocyanate, XDI, tetramethylxylylene diisocyanate, methyl styrene isocyanates, hexahydrotoluene vulcabond, triphenyl first-4,4', 4'-triisocyanate, diaminodiphenyl-methane, N-is to chlorophenyl-N-N-dimethyl urea, 3-phenyl-1,1-dimethyl urea, 3-rubigan-1,1-dimethyl urea, 4,4 '-diamino-diphenyl bis-phenol, polyurethanes, Lauxite, epoxy-ethylenediamine carbamate, 2,4,6-tri-(dimethylamino methyl) phenol, 2,4-diaminotoluene, polyurethane, methyl-etherified Lauxite, three (3-aminopropyl) amine, 2-amino-ethyl-two (3-aminopropyl) amine, 4,4 '-MDA, 4,4 '-diamino-diphenyl bis-phenol, 4,4 '-diamino-diphenyl sulfone, three (3-aminopropyl) amine, melmac, benzoguanamine resin, hexamethylol melamine resin, hexamethoxymethyl melamine resin, urea-melamine resin, polyester melamine, TCCA ester, aminotriazine resins, urethane acrylate, 4-aminopyridine resin, N-β-aminoethyl amino mylar, α-aminopyridine resin, aminodiphenylether resin, phosphoramidic-resin, hydroxyethylamino mylar, described microwave curing agent and thermal curing agents use same material or different materials, described anaerobic curing agent comprises: methacrylate tetraethylene-glycol ester, methacrylate multicondensed ethylene glycol ester, triethylene Glycol double methyl methacrylate, ethyleneglycol dimethyacrylate, hydroxyethyl methacrylate or hydroxypropyl acrylate, methoxylated polyethylene glycol methacrylate, phthalic acid Triethylene Glycol, β-hydroxyethyl methacry-late, triethylene Glycol double methyl methacrylate, Dimethacryloylethylthioether, phthalic acid two (diethylene glycol (DEG) acrylate), Ethoxylated bisphenol A dimethylacrylate, dimethacrylate bisphenol-A ethylene glycol fat, second diester methacrylate, triethylene-glycol dimethylacrylate, triethlene glycol bismethylacrylate, glycol methacrylate, one diethyl acetal double methyl methacrylate, epoxy resin methacrylate, methacrylate diglycol ester, described electronic beam curing agent comprises: triphenol methylmethane tetraglycidel ether epoxy resin, bicyclopentadiene bisphenol-type epoxy resin, bisphenol A-type vinyl ester resin, epoxy vinyl ester resin, Epocryl, maleimide resin, 4, 4 '-diphenyl methane dimaleimide, bisphenol-A-Diphenyl Ether Bismaleimide, bisphenol-A maleic acid vinylite, ethylene bromide base ester resin, phenol formaldehyde epoxy vinyl ester resin, methylolation bisphenol A type epoxy resin, bisphenol A acrylates, urethane acrylate, bisphenol-A epoxide vinylester resin, bisphenol A benzoxazine-epoxy resin, bisphenol fluorene epoxy resin, bisphenol-a epoxy acrylate resin, one or more in bisphenol A diglycidyl ether or bisphenol-A epoxy chloropropene acid ester resin,
Light trigger is styrax or Benzoin derivative, and described Benzoin derivative is benzoin methyl ether, benzoin ethyl ether, acetophenone derivative or benzoin isopropyl ether; Cation light initiator is one or more in aromatic sulfonium salts, salt compounded of iodine or luxuriant molysite; Sensitising agent be benzophenone, thia anthraquinone or Michler's keton one or more; Auxiliary agent comprises plasticizer, thixotropic agent and filler;
Plasticizer is dioctyl phthalate, dibutyl phthalate, three vinyl butyl ether base phosphates, polyvinyl butyral resin, tributyl 2-acetylcitrate, repefral, diethyl phthalate, hexanedioic acid two (Butoxyethoxy) ethyl ester, isopropyl titanate, tetrabutyl titanate, citrate, trimellitic acid (2-ethyl) own ester, phthalic acid two (2-ethyl) own ester, decanedioic acid two (2-ethyl) own ester, Diethylene Glycol Dibenzoate, phthalic anhydride, dipropylene glycol dibenzoate and chlorosulfonated polyethylene, described coupling agent comprises methylvinyldichlorosilane, methyl hydrogen dichlorosilane, dimethyldichlorosilane, chlorodimethyl silane, vinyl trichlorosilane, γ-aminopropyltrimethoxysilane, dimethyl silicone polymer, poly-hydrogen methylsiloxane, poly-methyl methoxy radical siloxane, γ-methacrylic acid third vinegar base trimethoxy silane, gamma-aminopropyl-triethoxy-silane, γ-glycidol ether propyl trimethoxy silicane, aminopropyl silsesquioxane, γ-methacryloxypropyl trimethoxy silane, chain alkyl trimethoxy silane, vinyltriethoxysilane, vinyltrimethoxy silane, γ-chloropropyl triethoxysilane, two-(the silica-based propyl group of γ-triethoxy), anilinomethyl triethoxysilane, N-β (aminoethyl)-γ-aminopropyltrimethoxysilane, N-(β-aminoethyl)-gamma-aminopropyl-triethoxy-silane, N-β (aminoethyl)-γ-aminopropyltriethoxy dimethoxysilane, γ-(2,3-epoxy third oxygen) propyl trimethoxy silicane, γ-(methacryloxypropyl) oxypropyl trimethyl silane, one or more in γ mercaptopropyitrimethoxy silane or γ-Mercaptopropyltriethoxysilane.
4. biodegradable base board for flexible optoelectronic part according to claim 1, it is characterized in that, the material of described conductive layer is one or more in Graphene, carbon nano-tube, metal simple-substance nano wire, metal alloy nanowires, metal hetero-junction nano wire, zinc oxide, titanium oxide, tin indium oxide or polymer electrode material.
5. biodegradable base board for flexible optoelectronic part according to claim 4, it is characterized in that, one or more in described metal simple-substance nano wire or Fe nanowire, copper nano-wire, nano silver wire, nanowires of gold, aluminium nano wire, nickel nano wire, cobalt nanowire, manganese nano wire, cadmium nano wire, indium nano wire, stannum nanowire, tungsten nanowires or Pt nanowires.
6. biodegradable base board for flexible optoelectronic part according to claim 4, is characterized in that, described metal alloy nanowires is copper-iron alloy nano wire, silver ferroalloy nano wire, bule gold nano wire, alfer nano wire, dilval nano wire, ferro-cobalt nano wire, manganeisen nano wire, cadmium ferroalloy nano wire, indium ferroalloy nano wire, tin ferroalloy nano wire, ferro-tungsten nano wire, pt-fe alloy nano wire, yellow gold nano wire, gold copper nano wire, aluminium copper nano wire, monel nano wire, cobalt-copper alloy nano wire, manganin nano wire, cadmium copper alloy nano wire, gun-metal nano wire, tungsten-copper alloy nano wire, Mock gold nano wire, electrum nano wire, aluminium silver alloy nanowires, bazar metal nano wire, cobalt silver alloy nanowires, manganese silver alloy nanowires, cadmium silver nano wire, indium silver alloy nanowires, sn-ag alloy nano wire, tungsten silver alloy nanowires, platinum-silver alloys nano wire, aluminium gold alloy nano-wire, nickel billon nano wire, cobalt billon nano wire, manganese billon nano wire, cadmium billon nano wire, indium billon nano wire, Sillim's alloy nano-wire, tungsten billon nano wire, cobalt-nickel alloy nano wire, manganese-nickel nano wire, cadmium-nickel alloy nano wire, indium nickel alloy nano wire, tin-nickel alloy nano wire, tungsten nickel nano wire, platinum-nickel alloy nano wire, cadmium manganese alloy nano wire, indium manganese alloy nano wire, tin manganese alloy nano wire, tungsten manganese alloy nano wire, platinum manganese alloy nano wire, indium cadmium alloy nano wire, tin cadmium alloy nano wire, tungsten cadmium alloy nano wire, platinum cadmium alloy nano wire, tin-indium alloy nano wire, tungsten indium alloy nano wire, platinum indium alloy nano wire, tungsten ashbury metal nano wire, one or more in platinum ashbury metal nano wire or platinum-tungsten alloys nano wire.
7. biodegradable base board for flexible optoelectronic part according to claim 4, is characterized in that, described metal hetero-junction nano wire is copper iron heterojunction nano-wire, silver iron heterojunction nano-wire, gold iron heterojunction nano-wire, ferro-aluminum heterojunction nano-wire, ferronickel heterojunction nano-wire, ferro-cobalt heterojunction nano-wire, ferromanganese heterojunction nano-wire, cadmium iron heterojunction nano-wire, indium iron heterojunction nano-wire, tin iron heterojunction nano-wire, ferrotungsten heterojunction nano-wire, platinum iron heterojunction nano-wire, silver-bearing copper heterojunction nano-wire, gold copper heterojunction nano-wire, aluminum copper dissimilar junction nanowire, ambrose alloy heterojunction nano-wire, cobalt copper heterojunction nano-wire, copper-manganese heterojunction nano-wire, cadmium copper heterojunction nano-wire, tin copper heterojunction nano-wire, tungsten copper heterojunction nano-wire, platinoid heterojunction nano-wire, gold and silver heterojunction nano-wire, aluminium silver heterojunction nano-wire, nickeline heterojunction nano-wire, cobalt silver heterojunction nano-wire, manganese silver heterojunction nano-wire, cadmium silver heterojunction nano-wire, indium silver heterojunction nano-wire, tin silver heterojunction nano-wire, tungsten silver heterojunction nano-wire, platinum silver heterojunction nano-wire, aluminium gold heterojunction nano-wire, nickel gold heterojunction nano-wire, cobalt gold heterojunction nano-wire, manganese gold heterojunction nano-wire, cadmium gold heterojunction nano-wire, indium gold heterojunction nano-wire, Sillim's heterojunction nano-wire, tungsten gold heterojunction nano-wire, cobalt nickel heterojunction nano-wire, manganese nickel heterojunction nano-wire, cadmium nickel heterojunction nano-wire, indium nickel heterojunction nano-wire, tin nickel heterojunction nano-wire, tungsten nickel heterojunction nano-wire, platinum nickel heterojunction nano-wire, cadmium manganese heterojunction nano-wire, indium manganese heterojunction nano-wire, tin manganese heterojunction nano-wire, tungsten manganese heterojunction nano-wire, platinum manganese heterojunction nano-wire, indium cadmium heterojunction nano-wire, tin cadmium heterojunction nano-wire, tungsten cadmium heterojunction nano-wire, platinum cadmium heterojunction nano-wire, tin indium heterojunction nano-wire, tungsten indium heterojunction nano-wire, platinum indium heterojunction nano-wire, tungsten tin heterojunction nano-wire, one or more in platinum tin heterojunction nano-wire or platinum tungsten heterojunction nano-wire.
8. biodegradable base board for flexible optoelectronic part according to claim 4, it is characterized in that, described polymer electrode material is poly-(3,4-Ethylenedioxy Thiophene)-poly-(styrene sulfonic acid) or 3,4-polyethylene dioxythiophenes.
9., according to the manufacture method of the arbitrary described biodegradable base board for flexible optoelectronic part of claim 1-8, it is characterized in that, comprise the following steps:
1. the rigid substrates that effects on surface roughness is less than 1nm cleans, and dries up after cleaning with drying nitrogen;
2. roller coat, LB embrane method, blade coating, spin coating, a painting, spraying, czochralski method, the tape casting, dip-coating, inkjet printing, self assembly or silk screen printing is adopted to prepare flexible substrate on the rigid substrate, described flexible substrate is shellac, the dual cure glue that mass ratio is 0.3-4% is mixed with in described shellac, described dual cure glue is made up of dual UV curable paint, and described dual UV curable paint is one or more of ultraviolet light polymerization-heat cured system, ultraviolet light polymerization-microwave curing system, ultraviolet light polymerization-anaerobic curing system and ultraviolet light polymerization-electronic beam curing system.
3. treatment with ultraviolet light is carried out to the flexible substrate that 2. step obtains, carry out photocuring;
4. flexible substrate is put into heating furnace to carry out hot curing or put into microwave oven carrying out microwave curing;
Wherein, 3. and 4. step can exchange, and namely first carries out being heating and curing or microwave curing, then carries out ultraviolet light polymerization;
5. roller coat, LB embrane method, a painting, spraying, czochralski method, inkjet printing or silk screen print method is adopted to prepare conductive layer on flexible substrate surface;
6. again treatment with ultraviolet light is carried out to the flexible substrate that 5. step obtains, carry out photocuring;
7. flexible substrate is peeled off from rigid substrates, form base board for flexible optoelectronic part.
10., according to the manufacture method of the arbitrary described biodegradable base board for flexible optoelectronic part of claim 1-8, it is characterized in that, comprise the following steps:
1. the rigid substrates that surface roughness is less than 1nm cleans, and dries up after cleaning with drying nitrogen;
2. roller coat, LB embrane method, blade coating, spin coating, a painting, spraying, czochralski method, the tape casting, dip-coating, inkjet printing, self assembly or silk screen printing is adopted to prepare flexible substrate on the rigid substrate, described flexible substrate is shellac, the dual cure glue that mass ratio is 0.3-4% is mixed with in described shellac, described dual cure glue is made up of dual UV curable paint, and described dual UV curable paint is one or more of ultraviolet light polymerization-heat cured system, ultraviolet light polymerization-microwave curing system, ultraviolet light polymerization-anaerobic curing system and ultraviolet light polymerization-electronic beam curing system.
3. treatment with ultraviolet light is carried out to the flexible substrate that 2. step obtains, carry out photocuring;
4. flexible substrate is placed under vacuum conditions, carry out anaerobic curing or electronic beam curing process;
5. roller coat, LB embrane method, a painting, spraying, czochralski method, inkjet printing or silk screen print method is adopted to prepare conductive layer on flexible substrate surface;
6. again treatment with ultraviolet light is carried out to the flexible substrate that 5. step obtains, carry out photocuring;
7. flexible substrate is peeled off from rigid substrates, form base board for flexible optoelectronic part.
CN201510194972.3A 2015-04-22 2015-04-22 Biodegradable baseplate used for soft light electron device and manufacturing method thereof Pending CN104766932A (en)

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