CN104752278B - Light irradiating device - Google Patents
Light irradiating device Download PDFInfo
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- CN104752278B CN104752278B CN201410831829.6A CN201410831829A CN104752278B CN 104752278 B CN104752278 B CN 104752278B CN 201410831829 A CN201410831829 A CN 201410831829A CN 104752278 B CN104752278 B CN 104752278B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/703—Cooling arrangements
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- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
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- Recrystallisation Techniques (AREA)
Abstract
The present invention provides a kind of for light shining on substrate to handle the light irradiating device of the substrate.The light irradiating device is included：Transmissive window, light transmission passes through the transmissive window；Collector, is arranged on above transmissive window and ramps upwardly into the outside of transmissive window, and collector makes be transmitted through the reflection light shift of transmissive window after the substrate reflection；And cooling block, refrigerant is circulated wherein in cooling block, and cooling block is arranged in collector to cool down the collector.Therefore, according to embodiment, because collector is arranged on above transmissive window and ramps upwardly into the outside of transmissive window, and protuberance is formd on the basal surface of collector, so can suppress or minimize the diffusing reflection of reflected light.Also, collector can prevent reflected light towards the exterior guiding of the transmissive window from the reflected light that substrate S reflects is again incident on transmissive window.Therefore, the generation of the inequality and light displacement caused by temperature imbalance and the temperature rise of the transmissive window can be suppressed.
Description
Technical field
The present invention relates to light irradiating device, and more particularly to the elevated light irradiation of transmissive window temperature can be suppressed
Equipment, caused by temperature rise is due to the transmissive window temperature imbalance caused from the light of substrate reflection.
Background technology
In the manufacture of liquid crystal display and photovoltaic devices, it is related to for making amorphous polycrystal film (for example, amorphous polycrystalline
Silicon thin film) crystallization Technology for Heating Processing.Herein, if using glass as substrate, then amorphous can be made by using laser
Polycrystal film is crystallized.However, when amorphous polycrystal film and oxygen (O2) reaction when, amorphous polycrystal film may be oxidized and produce
Give birth to sull and be also easily polluted by the external foreign matters or cause property to change.
Included according to the laser substrate-treating apparatus of prior art：Process chamber 10, with the inside handled substrate 1
Space；Platform 2, is arranged in process chamber 10 to move substrate placed on it along technique travel direction；Transmissive window 40, is arranged on
To allow laser 8 to be transmitted through on the upper section of process chamber 10；Light source 30, transmissive window 40 is arranged in the outside of process chamber 10
Upper section sentence output laser 8；And collector 50, the top of transmissive window 40 is arranged in the outside of process chamber 10 to absorb
The reflected light of transmissive window 40 is reflected and is transmitted through from substrate 1 (see Fig. 7).
The laser 61 for exporting and being then irradiated in substrate 1 from light source 30 can be along the direction symmetrical phase incident with laser 61
Opposite direction ((laser 62) i.e., in upward direction) reflects simultaneously is transmitted through transmissive window 40 again, and then incident on being arranged on
In the collector 50 for penetrating the top of window 40.Herein, laser may by collector 50 partial offset, but will not consume completely
Dissipate.Laser may be reflected and then incident in transmissive window 40 again by collector 50.Because reflected light is repeatedly incided
Penetrate in window 40 and the temperature of transmissive window 40 is constantly raised, so transmissive window 40 there may be uneven temperature.Therefore, when
Laser is transmitted through transmissive window 40 and is then irradiated on substrate 1 to carry out during crystallization processes, may produce uneven (Mura).
Also, because laser is repeatedly absorbed on the upper and lower surfaces in collector 50, collector 50 may temperature rise.Cause
This, the peripheral part of collector 50 may temperature rise and may thermal deformation.This is probably to make to be irradiated on substrate 1
The factor of laser beam displacement.
(patent document 1) 2011-0071591 Korean Patent Publication
The content of the invention
The present invention, which provides one kind, can suppress the elevated light irradiating device of transmissive window temperature, the temperature rise be due to through
Caused by the transmissive window temperature imbalance that the light of substrate reflection is caused.
The present invention also provide it is a kind of be used to preventing from the light of substrate reflection be re-reflected into transmissive window in and prevent collector
Temperature imbalance and temperature rise occur light irradiating device.
It is a kind of to be used to light shine on substrate to handle the light irradiating device bag of the substrate according to one exemplary embodiment
Contain：Transmissive window, the light transmission passes through the transmissive window；Collector, is arranged on above the transmissive window and ramps upwardly into
The outside of the transmissive window, the collector makes inclined in the reflected light that the transmissive window is transmitted through after the substrate reflection
Move；And cooling block, refrigerant is circulated wherein in the cooling block, and the cooling block is arranged in the collector with cold
The collector.
The collector can have an at least basal surface for the outside for ramping upwardly into the transmissive window.
The collector can be included：Main body, at least basal surface with the outside for ramping upwardly into the transmissive window, institute
Main body is stated to be arranged on above the transmissive window to dissipate by being transmitted through described in the transmissive window from the substrate reflection
Reflected light；And multiple protruding portion, it is arranged on the basal surface of the main body.
The inclination angle of the collector can be acute angle.
Each in the multiple protuberance can be with about 3 microns to about 4 microns of diameter.
The collector can have about 10 ° to about 20 ° of inclination angle.
The main body can include radiator.
The collector can be included：Lid, covers the basal surface of the main body to define inner space, the lid allows
The light transmission is passed through；And flue, the space being arranged between the main body and the lid connects, the gas
Body pipe supplies a gas in the space between the main body and the lid or empties gas.
The collector may be extended so that a part for the basal surface of the collector be arranged to it is described
The upside correspondence of the top surface of window is penetrated, and the remainder of the basal surface of the collector is arranged to and the transmission
The upside correspondence of the outside of window.
The cooling block can be included：Cooling component, the cooling component is arranged on the upper section of the collector；With
And refrigerant circulation pipe, the refrigerant circulation pipe is arranged in the cooling component to allow refrigerant to circulate wherein.
Brief description of the drawings
It can describe to understand one exemplary embodiment in more detail from following with reference to accompanying drawing.
Fig. 1 is the sectional view of the substrate-treating apparatus according to embodiment.
Fig. 2 is the three-dimensional exploded chart of the light irradiation module from the substrate-treating apparatus according to embodiment during the viewing of front.
Fig. 3 is the elevational sectional view of the substrate-treating apparatus according to embodiment.
The 3-D view of the first and second collectors according to embodiment when Fig. 4 is viewed from above.
Fig. 5 is the sectional view of the first and second collectors along A'-A " the lines interception in Fig. 4.
Fig. 6 is the 3-D view of a part for the collector according to embodiment when being watched from downside.
Fig. 7 is the block diagram of general substrate-treating apparatus.
Embodiment
Hereinafter, specific embodiment will be described in detail referring to accompanying drawing.However, the present invention can be embodied by multi-form and should not
It is considered limited to embodiment set forth herein.And be to provide these embodiments to cause the present invention by be detailed and complete, and
The scope of the present invention will be comprehensively passed on to those skilled in the art.
Fig. 1 is the sectional view of the substrate-treating apparatus according to embodiment, and Fig. 2 is according to embodiment when being watched from front
The three-dimensional exploded chart of the light irradiation module of substrate-treating apparatus, Fig. 3 is to face section according to the substrate-treating apparatus of embodiment
Figure, the 3-D view of the first and second collectors according to embodiment when Fig. 4 is viewed from above, Fig. 5 is along along Fig. 4
The sectional view of first and second collectors of A'-A " lines interception, and Fig. 6 is the collection according to embodiment when being watched from downside
The 3-D view of a part for device.
Substrate-treating apparatus can be that substrate S is entered for light shining in substrate S according to an embodiment of the invention
Row heat treatment and the Equipment for Heating Processing or light irradiating device for thus making to be formed the crystallization of the film 11 in substrate S.
Referring to Fig. 1 to Fig. 3, included according to the substrate-treating apparatus of embodiment：Process chamber 100, with wherein to substrate S
The inner space handled；Platform 200, is arranged in process chamber 100 so that substrate S to be placed on it, and platform 200 is carried out along technique
Substrate S is flatly shifted in direction；Light source, is arranged on the outside of process chamber 100 to export the light for handling substrate S, for example,
Laser；And light irradiation module 5000, transmissive window 5120 in the part comprising the top wall for being arranged on process chamber 100 is to permit
Perhaps the light transmission sent from light source 300 is passed through, and wherein the light for being transmitted through transmissive window 5120 is directed to by light irradiation module 5000
It is mapped in substrate S and by inert gas injection to illumination in substrate S thereon.
Although can have the box shape that section is rectangle according to the process chamber 100 of embodiment, the invention is not restricted to this.
For example, process chamber 100 can be changed into corresponding with the shape of substrate S variously-shaped.For example, by quartz formed it is saturating
Window 5120 is penetrated to may be provided in the top wall of process chamber 100.Transmissive window 5120 may be provided at a part for the top wall of process chamber
In to cover the upper section of light irradiation module 5000.Certainly, although transmissive window 5120 is arranged in the top wall of process chamber 100
To cover the upper section of light irradiation module 5000, but the invention is not restricted to this.For example, transmissive window 5120 may be provided at
The light sent from light source 300 is directed at any position in light irradiation module 5000.
Although process chamber 100 has sealing structure, oxygen (O2) or impurity be likely to be present in process chamber 100.This
Place, oxygen (O2) film 11 that makes to be formed in substrate S aoxidizes.Also, impurity is probably the granular powder produced during processing
End or gaseous by-product or other pollutants.Impurity may reduce the quality of film 11 or change the property of film 11, and
Principal element as defect.
In order to solve due to oxygen (O2) and the dopants penetration limitation caused into the upper section of substrate S, light irradiation mould
Block 5000 can by the upside of inert gas injection to substrate S with the upside that laser is irradiated to the region of substrate S thereon
Produce atmosphere of inert gases.Light irradiation module 5000 can be referred to as " part deoxidation module (OPDM) ".
Light irradiation module 5000 can be included：Light irradiation unit 5100, is arranged in process chamber 100 and has from light source
The inner space that the laser of 300 outputs is extended there through；And gas injection unit 5200, under light irradiation unit 5100
And with by inert gas injection to substrate S between light irradiation unit 5100 and substrate S.
Light irradiation unit 5100 is included：Main body 5100a, the inner space being therefrom transmitted through with light；Second main body
5100b, be connected to or in main body 5100a section below and with main body 5100a inner space vertically
The inner space of connection；Transmissive window 5120, is arranged in main body 5100a upper section to allow the light sent from light source 300
It is transmitted through；Cutter 5130, be arranged in the outside of process chamber 100 between light source 300 and transmissive window 5120 and relative to
The direction of illumination of light is obliquely installed to cut off or block a part for light, i.e. the laser sent from light source 300 towards transmissive window 5120
Beam；Collector 5140, the top of transmissive window 5120 is arranged in the outside of process chamber 100 and from the central axial of transmissive window 5120
Upper and outward-dipping setting by the reflected light (or reflected beam) for being reflected from substrate S and being transmitted through transmissive window 5120 so as to be sent out
Life is once offset；And cooling block, it is arranged on collector 5140 with cooling collector 5140.
Herein, the inner space defined in each in the first main body 5100a and the second main body 5100b can be along substrate
S direction extension.For example, the direction extension that the inner space can intersect along the shift direction with substrate S.Transmission
Window 5120 may be provided in main body 5100a upper section with corresponding with the upside of main body 5100a inner space, to seal or
Close main body 5100a unlimited upside.
Also, cutter 5130 can extend along the direction intersected with shifting the direction of substrate S.Cutter 5130 may be provided at
The outside of process chamber 100 between collector 5140 and transmissive window 5120 and tilts down setting towards transmissive window 5120.
In light irradiation unit 5100, the light exported from light source 300 may pass through transmissive window 5120 and be subsequently passed through first
The inner space of each in main body 5100a and the second main body 5100b is to be moved in gas injection unit 5200.Therefore,
Hereinafter, for ease of description, the inner space defined in light irradiation unit 5100 can be referred to as " light irradiation space 5110 ",
It corresponds to area between transmissive window 5120 and substrate S, i.e. each in the first main body 5100a and the second main body 5100b
In the inner space defined.As described above, light irradiation space 5110 can be defined to extend perpendicularly through the first main body 5100a and
The part of each in two main body 5100b, the part corresponds to the area between transmissive window 5120 and substrate S.Also, light
Irradiating space 5110 can extend along a direction of substrate S.Can be had according to the light irradiation space 5110 of embodiment wider than level
The big vertical length of degree (or height).
Gas injection unit 5200 can be by inert gas injection to substrate S.Therefore, gas injection unit 5200 can be use
In producing atmosphere of inert gases to prevent the region of substrate S being at least irradiated with a laser to be exposed to the unit under oxygen and impurity.
Gas injection unit 5200 can be arranged in the section below of light irradiation unit 5100.Gas injection unit 5200 is included：It is internal
Space (hereinafter, referred to as " gas injection space 5410), is connected with light irradiation space 5110；Gas injection block 5400,
The slit with the wire shaped extended along a direction of substrate S is wherein defined (hereinafter, referred to as " the first slit
5400a”)；Gas supply unit 5300, is arranged in gas injection block 5400 and at the side in gas injection space 5410
So that inert gas is fed in gas injection space 5410；Feed tube (not shown), is connected to gas supply unit
5300 two ends are with supplying inert gas；And plate 5500, in the section below of gas injection block 5400 and set
Above substrate S, plate 5500 has plate shape.
Gas supply unit 5300 can be the unit for being fed to inert gas in gas injection space 5410.According to
The gas supply unit 5300 of embodiment may be provided in gas injection block 5400 with the lateral side with gas injection space 5410
To connection.That is, gas supply unit 5300 can extend in gas injection block 5400 and one end is connected to gas note
The lateral part and the other end of penetrating space 5410 are connected to the gas storage element (not shown) of storage inert gas.Gas is supplied
Unit 5300 can have a certain structure, and in the structure, pipe is inserted into gas injection block 5400 to connect its one end
To the lateral part in gas injection space 5410, or gas injection block 5400 interior section through handling with empty with gas injection
Between 5410 lateral part connect.Also, gas supply unit 5300 can have the double pipe structure being made up of outermost tubes, i.e. outer
Manage and be arranged on the inner tube of outer tube.Herein, when one end of gas supply unit 5300 is defined as discharge slots, institute
The wire shaped tilted down as shown in Figure 3 can be had by stating discharge slots, wherein described one end is connected to gas injection space
5410 so that inert gas is discharged into gas injection space 5410.Also, at least one of the area of gas supply section 5300
Point there can be the channel shape of curved (that is, bending several times) several times, wherein described at least a portion corresponds to before discharge slots
End.
Certainly, gas supply section 5300 can be not limited to above-mentioned shape.For example, feed tube part 5300 is variable
It is variously-shaped in gas injection space 5410 to be enough inert gas being fed to.
Plate 5500 is connected to the section below of gas injection block 5400 and is arranged on above substrate S.According to embodiment
Plate 5500 can have the plate shape for the first slit 5400a extensions defined along both direction from gas injection block 5400.Plate
5500 can have the slit 5500a that laser beam and inert gas are extended there through (hereinafter, referred to as the second slit 5500a).
Second slit 5500a can be arranged to corresponding with the first slit 5400a downside.Therefore, via the of gas injection block 5400
One slit 5400a is discharged into the inert gas in the second slit 5500a of plate 5500 can be by between plate 5500 and substrate S
Gap is diffused.
The reflected light (or reflected beam) that collector 5140 can be prevented from being irradiated in substrate S and reflected again by substrate S exists
Reflected light (or reflected beam) is reflected towards transmissive window 5120 and light irradiation module 5000 again after being transmitted through transmissive window 5120.Receive
Storage 5140 may be provided above the upper outer of transmissive window 5120 and process chamber 100.In more detail, collector 5140 can be set
Put collector 5140 be arranged on the top of cutter 5130 with the upper left side and upper right side of transmissive window 5120 towards or back to
At the position of cutter 5130.
Collector 5140 can make to reflect from substrate S and be transmitted through the reflection light shift of transmissive window 5120 and dissipate.Receive
Storage 5140 may be provided at the top of transmissive window 5120 at the outer upside of process chamber 100 and can be from the upper lateral of transmissive window 5120
Outer incline.That is, collector 5140 can be inclined upwardly along the outside direction of transmissive window 5120, to cause collector 5140 to make
Thus incident reflection light shift makes again reflected light towards the outer transmissive of transmissive window 5120, rather than court with reflection migrating light again
Transmissive window 5120 is transmitted.
In other words, when the horizontal center section of transmissive window 5120 is defined as central shaft, collector 5140 can be set
It is inclined upwardly in the top of transmissive window 5120 and towards the outside of transmissive window 5120 from the central shaft of transmissive window 5120.Herein, thoroughly
The outside direction for penetrating window 5120 is represented in the outside of the upward transmissive window 5120 of left right.That is, collector 5140 can be from
The direction of central axial upper and outward-dipping or along remote transmissive window 5120 the central shaft of transmissive window 5120 is inclined upwardly.Receive
Storage 5140 is arranged on the top of transmissive window 5120.
Also, in other words, when the line quilt being at the horizontal plane identical horizontal plane with the top surface of transmissive window 5120
When being defined as horizontal line, the tiltable of collector 5140, to have between the basal surface of collector 5140 and the horizontal line
The interval gradually increased towards the outside of transmissive window 5120 or distance.
Collector 5140 may be provided at the top of transmissive window 5120.Collector 5140 can be from the upper of the top surface of transmissive window 5120
Side partly extends to the outside of transmissive window 5120.That is, because collector 5140 is set along left right to (or width)
Put in the top of transmissive window 5120, so a part for collector 5140 can be overlapping with transmissive window 5120, and collector 5140
Remainder can be overlapping with the upside of the outside of transmissive window 5120.In other words, a part for the basal surface of collector 5140 can
It is arranged to corresponding with the upside of the top surface of transmissive window 5120, and the remainder of the basal surface of collector 5140 can be through setting
Put with outside corresponding with the top surface of transmissive window 5120.That is, collector 5140 is extensible, to cause in left right
Upwards, one end in the two ends of collector 5140 is arranged on the top of transmissive window 5120, and the other end is arranged on transmissive window
At upper outer.
Collector 5140 can be included：Main body 5141, towards the outside of transmissive window 5120 from transmissive window 5120 it is upper on the side
Tilt；Lid 5142, through installing to cover the basal surface of main body 5141, the lid 5142 allows light to be therefrom transmitted through；And it is cold
But block 5150, are arranged in main body 5141 so that refrigerant is circulated wherein.
Main body 5141 can be for making the unit of reflection light shift.Main body 5141 can be towards the outside of transmissive window 5120 from saturating
The upside for penetrating window 5120 is inclined upwardly.That is, main body 5141 can be inclined upwardly along the direction of setting transmissive window 5120, so that
Obtain outer transmissive of the incident reflected light towards transmissive window 5120.Herein, main body 5141 itself can be along the outside of transmissive window 5120
Direction is inclined upwardly.Or, the basal surface of main body 5141 can be inclined upwardly setting along the outside direction of transmissive window 5120.Also,
The reflected light that multiple protruding portion 5141a each with several microns to tens microns of diameter may be formed at main body 5141 is incided
On one of surface, i.e. formed on the basal surface of main body 5141.Herein, multiple protrusions in main body 5141 are formed
Portion 5141a can be formed by blasting craft and it can each have diameter, for example, about 3 microns to about 4 microns of diameter.
Like this, because multiple protruding portion 5141a formation is transmitted through transmissive window on the basal surface of main body 5141
5120 reflected light can be by multiple protruding portion 5141a reflections several times.Therefore, reflected light is not absorbed into directly in main body 5141
But shifted by multiple protruding portion 5141a.Because reflected light is reflected several times by multiple protruding portion 5141a, instead
Penetrate that the energy of light can reduce and therefore the temperature of light can be reduced.
When reflected light is incided in main body 5141, the heat of reflected light can be absorbed into main body 5141 and make collector
5140 temperature rise, thus causes thermal deformation.Also, as described in this disclosure, when shape on the basal surface in main body 5141
During into multiple protruding portion 5141a, the surface area of basal surface is compared with the basal surface of main body 5141 is situation about glossily being formed
When can increase.Therefore, the reflection path of light can increase to reduce the temperature of light.Therefore, when shape on the basal surface in main body 5141
During into multiple protruding portion 5141a, light can be moved or reflected several times, so that consumed energy due to multiple protruding portion 5141a.Cause
This, the temperature of the heat for the light being absorbed into collector 5140 can be reduced, and reflected and reentered again from collector 5140
The temperature for the light being mapped in the outside of transmissive window 5120 is when compared with the basal surface of main body 5141 is situation about glossily being formed
It can reduce.
The inclination angle of the basal surface of main body 5141 itself or main body 5141 can be acute angle, for example, about 10 ° to about 20 ° of angle,
In detail, about 12 ° of angle.Above-mentioned angle, institute because outside direction of the collector 5140 along transmissive window 5120 has been inclined upwardly
It can shift and dissipate by collector 5140 with the reflected light incided in collector 5140, and the remainder of light can
Do not transmitted towards transmissive window 5120 or towards light source 300, but towards the outer transmissive of transmissive window 5120.It is therefore possible to prevent by reflected light
The temperature imbalance of caused transmissive window 5120 and the uneven generation caused by the temperature rise of transmissive window 5120.
It can be radiator according to the main body 5141 of embodiment itself or can have radiator wherein.
Lid 5142 can be by light transmissive material, i.e. quartz is formed.Lid 5142 can cover the basal surface of main body 5141 with boundary therebetween
Determine inner space.Although it is not shown, the space that still flue may be connected between main body 5141 and lid 5142 is with communication.
Can be by flue 5144 by inert gas, for example, nitrogen (N2), it is filled into the space between main body 5141 and lid 5142,
And the inert gas can be emptied by flue 5144.In the filling and discharge process of inert gas, can be removed by
The smog that temperature in collector 5140 is raised and produced.
Cooling block 5150 may be provided in main body 5141 with cooling collector 5140, thus prevent the temperature of collector 5140
Rise.Cooling block 5150 includes the cooling component 5151 being arranged in main body 5141 and is arranged in cooling component 5151 to permit
Perhaps the refrigerant circulation pipe 5152 that refrigerant (for example, cooling agent) is circulated wherein.Herein, one end of refrigerant circulation pipe 5152
It is connected to cold-producing medium supply part.
Therefore, skew and the consumption of reflected light are carried out in collector 5140 afterwards in reflected light incides collector 5140
, can be by refrigerant circulation pipe 5152 although collector 5140 is heated because of the heat of reflected light during the process of dissipating
The refrigerant of circulation is cooled down to cooling component 5151.Therefore, the collector 5140 for being connected to cooling component 5151 is cooled,
And collector 5140 can be prevented according to due to the thermal deformation reflected photogenic temperature rise and temperature imbalance and occurred.
Hereinafter, thin film crystallization will be made according to the substrate-treating apparatus of embodiment to describe to use referring to Fig. 1 to Fig. 6
Method.
First, amorphous polycrystal film 11 can be formed on glass substrate S, for example, amorphous polysilicon membrane.Then, can be by
The substrate S for foring amorphous polysilicon membrane is loaded into the process chamber 100 of substrate-treating apparatus and is then shelved on platform 200
On.
When substrate S is shelved on platform 200, the same of substrate S can flatly shifted along technique travel direction by platform 200
When laser is irradiated to be formed on the film 11 in substrate S.That is, light source 300 is operable to be exported from light source 300
Light, i.e. laser.Then, the laser exported is passing through the light irradiation space of light irradiation unit 5100 through transmissive window 5120
5110 and gas injecting unit 5200 gas injection space 5410 after can be via the first slit 5400a and the second slit
5500a is irradiated to be formed on the film 11 in substrate S.Therefore, the amorphous polysilicon membrane formed in substrate S can be with laser
React to form crystal silicon thin film.
As described above, when laser beam is irradiated in substrate S, can be by nitrogen N2It is expelled to upside or the film 11 of substrate S
On.Therefore, working as nitrogen (N2) when being fed in the gas supply unit 5300 being arranged in gas injection block 5400, pass through gas
The discharge slots of body feeding unit 5300 are by nitrogen (N2) be fed in gas injection space 5410.Then, it is fed to gas note
Nitrogen (the N penetrated in space 54102) can be expelled to by the first slit 5410a and the second slit 5500a on the upside of substrate S.
Nitrogen (the N discharged to the upside of substrate S2) can be spread relative to the second slit 5400a along both direction.Herein, it is present in plate
Oxygen and impurity between 5500 and substrate S can be pushed to two laterals.In other words, arranged by the second slit 5400a
The inert gas put can spread to fill the space between plate 5400 and substrate S.Herein, it is present between plate 5500 and substrate S
Oxygen and impurity can be by nitrogen (N2) shift onto outside light irradiation module 5000 and substrate S.
Consequently, because substrate S and the silicon thin film 11 being formed on the top surface of substrate S are not exposed to oxygen and impurity
Under, so unlike the prior art, substrate S and film 11 can not be aoxidized.In more detail, because substrate S or at least by laser
The film 11 of irradiation is not exposed under oxygen and impurity, so the silicon thin film being irradiated with a laser can not be aoxidized, so as to form crystalline substance
Body silicon thin film.
As described above, the crystallization of film 11 can be made and then from lining by being exported from light source 300 and being irradiated to the laser beam in substrate S
Bottom S reflects again.Herein, laser beam can upwards reflect along the symmetrical direction in direction with laser light incident into substrate S, and therefore
Transmissive window 5120 is transmitted through again.The laser transmitted from transmissive window 5120 can be by being arranged on the collector of the top of transmissive window 5120
5140 shift and are then reflected towards again the outside of transmissive window 5120, rather than are reflected towards transmissive window 5120.Because
The outside of transmissive window can be ramped upwardly into by constituting at least basal surface of the main body 5141 of collector 5140.
Also, during reflected light incides collector 5140 and when then offseting and dissipate in collector 5140, use up
Pipe collector 5140 is heated because of the heat of reflected light, but collector 5140 is cooled down by cooling block 5150.
Like this, in the present invention, because collector 5140 is arranged on the top of transmissive window 5120 and ramped upwardly into
The outside of window 5120 is penetrated, so can suppress or minimize the diffusing reflection of reflected light.Therefore, collector 5140 can be prevented from substrate S
Reflect and be again incident on transmitted through the reflected light of transmissive window 5120 in transmissive window 5120 and can be by reflected light towards transmissive window 5120
Exterior guiding.Also, because the second collector is arranged under collector 5140, once offset from collector 5140
By the second collector double offset can occur for reflected light with the reflected light that dissipates.It is therefore possible to prevent reflected light is reflected towards transmission again
Window 5120 is to suppress the temperature rise of transmissive window 5120 and the temperature imbalance caused by temperature is raised, wherein the temperature liter
Height is caused by reflected light.Therefore, uneven and light displacement generation can be suppressed.
Also, because cooling block is arranged on cooling collector 5140 in collector 5140, collector can be prevented
The 5140 temperature rise and temperature imbalance caused by the heat of reflected light, so as to prevent the thermal deformation of collector 5140 from occurring.
Also, because being cooled down by cooling block 5150 to collector 5140, the collector as prior art can be prevented
Temperature around 5140 due to the collector heat and elevated phenomenon.
According to the embodiment, because collector is arranged on above transmissive window and ramps upwardly into the outside of transmissive window, and
And protuberance is formd on the basal surface of collector, so can suppress or minimize the diffusing reflection of reflected light.Also, it is described to receive
Storage can prevent from the reflected light towards the exterior guiding of the transmissive window to be again incident on from the reflected light that substrate S reflects
In the transmissive window.Therefore, the generation of the inequality and light displacement caused by temperature imbalance and the temperature rise of transmissive window can be suppressed.
Also, because cooling block is arranged on cooling collector in collector, collector can be prevented due to reflected light
Heat caused by temperature rise and temperature imbalance, so as to prevent the thermal deformation of collector from occurring.Also, because pass through cooling block
Collector is cooled down, so temperature as prior art around collector can be prevented due to the heat of the collector
And elevated phenomenon.
Although describing the light irradiating device, the light irradiating device not limited to this with reference to specific embodiment.Cause
This, those skilled in the art, which should be readily appreciated that, is not departing from the spirit of the invention defined by appended claims and model
In the case of enclosing various modifications and changes can be carried out to it.
Claims (8)
1. a kind of be used to light shine on substrate to handle the light irradiating device of the substrate, it is characterised in that the light irradiation
Equipment includes：
Transmissive window, the light transmission passes through the transmissive window；
Collector, is arranged on above the transmissive window and ramps upwardly into the outside of the transmissive window, and the collector makes
The reflection light shift of the transmissive window is transmitted through after the substrate reflection；And cooling block, made in the cooling block
Cryogen is circulated wherein, and the cooling block is arranged on to cool down the collector in the collector,
The collector includes：
Main body, at least basal surface with the outside for ramping upwardly into the transmissive window, the main body is arranged on the transmission
To dissipate by the reflected light that the transmissive window is transmitted through from the substrate reflection above window；
Multiple protruding portion, is arranged on the basal surface of the main body；
Lid, covers the basal surface of the main body to define inner space, the lid allows the light transmission to pass through；And
Flue, the space being arranged between the main body and the lid is connected, and the flue supplies gas
Emptied into the space between the main body and the lid or by gas.
2. light irradiating device according to claim 1, it is characterised in that the collection utensil ramps upwardly into described
Penetrate an at least basal surface for the outside of window.
3. light irradiating device according to claim 1, it is characterised in that the inclination angle of the collector is acute angle.
4. light irradiating device according to claim 1, it is characterised in that each in the multiple protuberance is micro- with 3
Rice is to 4 microns of diameter.
5. light irradiating device according to claim 3, it is characterised in that the collector has 10 ° to 20 ° of inclination angle.
6. light irradiating device according to claim 1, it is characterised in that the main body includes radiator.
7. light irradiating device according to claim 3, it is characterised in that the collector extends to cause the collector
The part of the basal surface be arranged to, and the institute of the collector corresponding with the upside of the top surface of the transmissive window
State basal surface remainder be arranged to it is corresponding with the upside of the outside of the transmissive window.
8. light irradiating device according to claim 1, it is characterised in that the cooling block includes：
On cooling component, the upper section for being arranged on the collector；And
Refrigerant circulation pipe, is arranged in the cooling component to allow refrigerant to circulate wherein.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2013-0165586 | 2013-12-27 | ||
| KR1020130165586A KR101560377B1 (en) | 2013-12-27 | 2013-12-27 | Apparatus for irradiating light |
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| Publication Number | Publication Date |
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| CN104752278A CN104752278A (en) | 2015-07-01 |
| CN104752278B true CN104752278B (en) | 2017-10-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410831829.6A Active CN104752278B (en) | 2013-12-27 | 2014-12-26 | Light irradiating device |
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| KR (1) | KR101560377B1 (en) |
| CN (1) | CN104752278B (en) |
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| KR101693511B1 (en) * | 2016-01-22 | 2017-01-06 | 주식회사 포스코 | Method and apparatus for refining magnetic domains grain-oriented electrical steel |
| KR101739866B1 (en) | 2016-01-22 | 2017-05-25 | 주식회사 포스코 | Method and apparatus for refining magnetic domains grain-oriented electrical steel |
| KR102069613B1 (en) * | 2017-02-21 | 2020-02-11 | 에이피시스템 주식회사 | Apparatus for irradiating light |
| KR102038459B1 (en) * | 2019-03-22 | 2019-11-27 | 한국우시오 (주) | Ashing apparatus |
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| JPH06324203A (en) * | 1993-05-13 | 1994-11-25 | Tachibana Seisakusho:Kk | Laser beam absorbing device |
| CN101928932A (en) * | 2009-06-25 | 2010-12-29 | Ap系统股份有限公司 | The laser process equipment of may command laser beam length and intensity |
| CN101999161A (en) * | 2008-04-09 | 2011-03-30 | 应用材料股份有限公司 | Apparatus including heating source reflective filter for pyrometry |
| KR20110120708A (en) * | 2010-04-29 | 2011-11-04 | 신상교 | Laser beam dump |
| KR20120119101A (en) * | 2011-04-20 | 2012-10-30 | 삼성디스플레이 주식회사 | Beam dump |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101024846B1 (en) * | 2010-08-31 | 2011-03-28 | 레이져라이팅(주) | Apparatus for processing light guide plate with laser having means for blocking laser beam |
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2013
- 2013-12-27 KR KR1020130165586A patent/KR101560377B1/en active IP Right Grant
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- 2014-12-26 CN CN201410831829.6A patent/CN104752278B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06324203A (en) * | 1993-05-13 | 1994-11-25 | Tachibana Seisakusho:Kk | Laser beam absorbing device |
| CN101999161A (en) * | 2008-04-09 | 2011-03-30 | 应用材料股份有限公司 | Apparatus including heating source reflective filter for pyrometry |
| CN101928932A (en) * | 2009-06-25 | 2010-12-29 | Ap系统股份有限公司 | The laser process equipment of may command laser beam length and intensity |
| KR20110120708A (en) * | 2010-04-29 | 2011-11-04 | 신상교 | Laser beam dump |
| KR20120119101A (en) * | 2011-04-20 | 2012-10-30 | 삼성디스플레이 주식회사 | Beam dump |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101560377B1 (en) | 2015-11-25 |
| KR20150076894A (en) | 2015-07-07 |
| CN104752278A (en) | 2015-07-01 |
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