CN104752278A - Apparatus for irradiating light - Google Patents
Apparatus for irradiating light Download PDFInfo
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- CN104752278A CN104752278A CN201410831829.6A CN201410831829A CN104752278A CN 104752278 A CN104752278 A CN 104752278A CN 201410831829 A CN201410831829 A CN 201410831829A CN 104752278 A CN104752278 A CN 104752278A
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- transmissive window
- gatherer
- substrate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/703—Cooling arrangements
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- Optics & Photonics (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
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- Recrystallisation Techniques (AREA)
Abstract
The present invention provides a method for irradiating light on the substrate to process the substrate, the light irradiation apparatus. The light irradiation apparatus comprising: (1) a transmissive window through which light is transmitted through said transmissive window; (2) a collector, which is disposed above the transmission window and inclined upwardly to the External transmissive window, allows collection in the reflection from the substrate after the reflection of light transmitted through the transmissive window offset; and (3) a cooling block, the block in the cooling cycle of the refrigerant and the cooling block is provided in the collector to cool the collector. Therefore, according to the embodiment, since the collector is disposed above the transmission window and transmissive window upwardly inclined to the outside and on the bottom surface of the collector of the projecting portion is formed, so the diffuse reflectance can be suppressed or minimized reflected light. Also, the collector can be reflected light transmissive window toward the external guide to prevent reflection from the substrate S reflected light is incident to the transmission window. Therefore, suppressed by the transmissive window temperature imbalances and uneven temperature and light generated shift caused.
Description
Technical field
The present invention relates to light irradiating device, and more particularly relate to the light irradiating device that transmissive window temperature can be suppressed to raise, described temperature rising is caused by the transmissive window temperature imbalance owing to causing from the light of substrate reflection.
Background technology
In the manufacture of liquid crystal display and photovoltaic devices, relate to the Technology for Heating Processing for making amorphous polycrystal film (such as, amorphous polysilicon membrane) crystallization.Herein, if use glass as substrate, so by using laser to make the crystallization of amorphous polycrystal film.But, as amorphous polycrystal film and oxygen (O
2) reaction time, amorphous polycrystal film may be oxidized and produce sull and be easily polluted by the external foreign matters or cause character to change.
Laser substrate-treating apparatus according to prior art comprises: process chamber 10, has the inner space processed substrate 1; Platform 2, is arranged in process chamber 10 with along technique travel direction to move substrate placed on it; Transmissive window 40, to allow laser 8 to be transmitted through on the upper section being arranged on process chamber 10; Light source 30, sentences Output of laser 8 in the outer setting of process chamber 10 at the upper section of transmissive window 40; And gatherer 50, to reflect from substrate 1 and to be transmitted through the reverberation (see Fig. 7) of transmissive window 40 to absorb in the outer setting of process chamber 10 above transmissive window 40.
From light source 30 output, also the laser 61 be then irradiated to substrate 1 can along the rightabout of the direction symmetry with laser 61 incidence (namely, in upward direction (laser 62)) reflection is also transmitted through transmissive window 40 again, and then incides in the gatherer 50 be arranged on above transmissive window 40.Herein, laser by gatherer 50 and partial offset, but can not may dissipate completely.Laser may be reflected by gatherer 50 again and then incide in transmissive window 40.The temperature of transmissive window 40 is constantly raised, so transmissive window 40 may have uneven temperature because reverberation repeatedly incides in transmissive window 40.Therefore, when laser-transmitting when to be then irradiated on substrate 1 to carry out crystallization processes, may produce inequality (Mura) through transmissive window 40.
Further, because laser is repeatedly absorbed on the upper and lower surfaces in gatherer 50, so gatherer 50 may temperature raise.Therefore, gatherer 50 peripheral part may temperature raise and may thermal deformation.This may be the factor making the laser beam displacement be irradiated on substrate 1.
(patent document 1) 2011-0071591 Korean Patent is open
Summary of the invention
The invention provides a kind of light irradiating device that transmissive window temperature can be suppressed to raise, described temperature rising is caused by the transmissive window temperature imbalance owing to causing through the light of substrate reflection.
The present invention also provides a kind of and to reflex to transmissive window from the light of substrate reflection again for preventing and prevent the temperature imbalance of gatherer and temperature from raising the light irradiating device occurred.
According to one exemplary embodiment, a kind ofly to comprise with the light irradiating device processing described substrate for light shining on substrate: transmissive window, described Transmission light is through described transmissive window; Gatherer, is arranged on above described transmissive window and the outside of the described transmissive window that is inclined upwardly, and described gatherer makes after described substrate reflection, be transmitted through the reverberation skew of described transmissive window; And cooling block, in described cooling block, cold-producing medium circulates wherein, and described cooling block is arranged in described gatherer to cool described gatherer.
Described gatherer can have at least one basal surface of the outside of the described transmissive window that is inclined upwardly.
Described gatherer can comprise: main body, has at least one basal surface of the outside of the described transmissive window that is inclined upwardly, and described main body is arranged on above described transmissive window with the described reverberation dissipated by being transmitted through described transmissive window from described substrate reflection; And multiple protuberance, be arranged on the described basal surface of described main body.
The inclination angle of described gatherer can be acute angle.
Each in described multiple protuberance can have the diameter of about 3 microns to about 4 microns.
Described gatherer can have the inclination angle of about 10 ° to about 20 °.
Described main body can comprise radiator.
Described gatherer can comprise: lid, and cover the described basal surface of described main body to define inner space, described lid allows described Transmission light to pass; And flue, through arranging to be communicated with the described space between described main body with described lid, described flue supplies a gas in the described space between described main body and described lid or by evacuate air.
Described gatherer is extensible to make a part for the described basal surface of described gatherer corresponding with the upside of the top surface with described transmissive window through arranging, and the remainder of the described basal surface of described gatherer is corresponding with the upside of the outside with described transmissive window through arranging.
Described cooling block can comprise: cooling component, and described cooling component is arranged on the upper section of described gatherer; And refrigerant circulation pipe, described refrigerant circulation pipe is arranged in described cooling component to allow cold-producing medium to circulate wherein.
Accompanying drawing explanation
One exemplary embodiment can be understood in more detail by reference to the accompanying drawings from following description.
Fig. 1 is the sectional view of the substrate-treating apparatus according to embodiment.
Fig. 2 is the three-dimensional exploded chart of the light irradiation module of the substrate-treating apparatus according to embodiment when watching from front.
Fig. 3 is the elevational sectional view of the substrate-treating apparatus according to embodiment.
Fig. 4 is the 3-D view of the first and second gatherers according to embodiment when watching from top.
Fig. 5 is along the A '-A " sectional view of the first and second gatherers that line intercepts in Fig. 4.
Fig. 6 is the 3-D view of a part for the gatherer according to embodiment when watching from downside.
Fig. 7 is the block diagram of general substrate-treating apparatus.
Embodiment
Hereinafter, specific embodiment will be described in detail referring to accompanying drawing.But the present invention should be able to be considered as being limited to the embodiment set forth herein by multi-form embodiment and not.But, provide these embodiments to make the present invention by for detailed and complete, and scope of the present invention will be passed on all sidedly to those skilled in the art.
Fig. 1 is the sectional view of the substrate-treating apparatus according to embodiment, Fig. 2 is the three-dimensional exploded chart of the light irradiation module of the substrate-treating apparatus according to embodiment when watching from front, Fig. 3 is the elevational sectional view of the substrate-treating apparatus according to embodiment, Fig. 4 is the 3-D view of the first and second gatherers according to embodiment when watching from top, Fig. 5 is the A '-A along in Fig. 4 " sectional view of the first and second gatherers that line intercepts, and Fig. 6 is the 3-D view of a part for the gatherer according to embodiment when watching from downside.
Substrate-treating apparatus can be for light shining in substrate S to heat-treat substrate S and to make equipment for Heating Processing or the light irradiating device of film 11 crystallization be formed in substrate S thus according to an embodiment of the invention.
Referring to Fig. 1 to Fig. 3, the substrate-treating apparatus according to embodiment comprises: process chamber 100, has wherein to the inner space that substrate S processes; Platform 200, be arranged on substrate S to be placed on it in process chamber 100, platform 200 carrys out flatly translate substrate S along technique travel direction; Light source, is arranged on the outside of process chamber 100 to export the light for the treatment of substrate S, such as, and laser; And light irradiation module 5000, comprise transmissive window 5120 in a part for the top wall being arranged on process chamber 100 to pass to allow the Transmission light sent from light source 300, wherein the light being transmitted through transmissive window 5120 is directed in the substrate S that to be mapped to illumination in substrate S and by inert gas injection on it by light irradiation module 5000.
Although can have according to the process chamber 100 of embodiment the box shape that cross section is rectangle, the present invention is not limited thereto.For example, process chamber 100 can change into the various shapes corresponding with the shape of substrate S.For example, the transmissive window 5120 formed by quartz can be arranged in the top wall of process chamber 100.Transmissive window 5120 can be arranged in a part for the top wall of process chamber to cover the upper section of light irradiation module 5000.Certainly, although transmissive window 5120 to be arranged in the top wall of process chamber 100 to cover the upper section of light irradiation module 5000, the present invention is not limited thereto.For example, transmissive window 5120 can be arranged on the light sent from light source 300 and be directed into any position light irradiation module 5000.
Although process chamber 100 has hermetically-sealed construction, oxygen (O
2) or impurity may be present in process chamber 100.Herein, oxygen (O
2) film 11 be formed in substrate S is oxidized.Further, impurity may be the particle powder or gaseous by-product or other pollutant that produce during processing.Impurity may reduce the quality of film 11 or change the character of film 11, and becomes the principal element of defect.
In order to solve due to oxygen (O
2) and dopants penetration to the upper section of substrate S in caused restriction, light irradiation module 5000 can by inert gas injection to the upside of substrate S to produce atmosphere of inert gases in the upside being irradiated to the region of the substrate S on it at laser.Light irradiation module 5000 can be referred to as " part deoxidation module (OPDM) ".
Light irradiation module 5000 can comprise: light irradiation unit 5100, to be arranged in process chamber 100 and to have the inner space that the laser that exports from light source 300 extends there through; And gas injection unit 5200, to be arranged under light irradiation unit 5100 and between light irradiation unit 5100 and substrate S with by inert gas injection in substrate S.
Light irradiation unit 5100 comprises: main body 5100a, has the inner space that light is therefrom transmitted through; Second main body 5100b, the inferior portion being connected to or being arranged on main body 5100a has the inner space be vertically communicated with the inner space of main body 5100a; Transmissive window 5120, is arranged in the upper section of main body 5100a to allow the Transmission light sent from light source 300 to pass; Cutter 5130, is obliquely installed to cut off or the part of shading light, that is, from the laser beam that light source 300 sends towards transmissive window 5120 in the outer setting of process chamber 100 between light source 300 and transmissive window 5120 and relative to the direction of illumination of light; Gatherer 5140, is obliquely installed upwardly and outwardly to make the reverberation (or reflected beam) by being transmitted through transmissive window 5120 from substrate S reflection occur once to offset in the outer setting of process chamber 100 above transmissive window 5120 and from the central shaft of transmissive window 5120; And cooling block, be arranged on gatherer 5140 with cooling collector 5140.
Herein, the inner space defined in each in the first main body 5100a and the second main body 5100b can extend along of a substrate S direction.For example, the direction that described inner space can intersect along the shift direction with substrate S extends.Transmissive window 5120 can be arranged in the upper section of main body 5100a corresponding with the upside of the inner space with main body 5100a, to seal or the unlimited upside of closed main body 5100a.
Further, the direction that cutter 5130 can intersect along the direction with translate substrate S extends.The outside that cutter 5130 can be arranged on process chamber 100 is between gatherer 5140 and transmissive window 5120 and towards the downward-sloping setting of transmissive window 5120.
In light irradiation unit 5100, the light exported from light source 300 can through transmissive window 5120 and then through the inner space of each the first main body 5100a and the second main body 5100b to move in gas injection unit 5200.Therefore, hereinafter, for ease of describing, the inner space defined in light irradiation unit 5100 can be referred to as " space 5110 is penetrated in illumination ", it corresponds to the district between transmissive window 5120 and substrate S, that is, the inner space defined in each in the first main body 5100a and the second main body 5100b.As mentioned above, space 5110 is penetrated in illumination can through defining to extend perpendicularly through the part of each in the first main body 5100a and the second main body 5100b, and described part corresponds to the district between transmissive window 5120 and substrate S.Further, illumination is penetrated space 5110 and can be extended along of substrate S direction.Penetrate space 5110 according to the illumination of embodiment and can have the vertical length (or height) larger than horizontal width.
Gas injection unit 5200 can by inert gas injection in substrate S.Therefore, gas injection unit 5200 can be and is exposed to unit under oxygen and impurity for generation of atmosphere of inert gases to prevent the region of the substrate S be at least irradiated with a laser.Gas injection unit 5200 can be arranged on the inferior portion of light irradiation unit 5100.Gas injection unit 5200 comprises: inner space (hereinafter, be referred to as " gas injection space 5410), penetrate space 5110 with illumination and be communicated with; Gas injection block 5400, defines the nemaline slit (hereinafter, being referred to as " the first slit 5400a ") of the direction extension had along substrate S wherein; Gas supply unit 5300, is arranged on to sentence in gas injection block 5400 and in the side in gas injection space 5410 and is fed in gas injection space 5410 by inert gas; Feed tube (not shown), is connected to the two ends of gas supply unit 5300 with supplying inert gas; And plate 5500, the inferior portion being arranged on gas injection block 5400 is arranged on above substrate S, and plate 5500 has plate shape.
Gas supply unit 5300 can be the unit for being fed to by inert gas in gas injection space 5410.Can be arranged in gas injection block 5400 according to the gas supply unit 5300 of embodiment to be communicated with the lateral in gas injection space 5410.That is, gas supply unit 5300 can spray in block 5400 at gas and to extend and one end is connected to the side direction part in gas injection space 5410 and the other end is connected to the gas storage unit (not shown) storing inert gas.Gas supply unit 5300 can have a certain structure, in described structure, pipe is inserted into its one end to be connected to the side direction part in gas injection space 5410 in gas injection block 5400, or the interior section of gas injection block 5400 is treated to be communicated with the side direction part in gas injection space 5410.Further, gas supply unit 5300 can have the double pipe structure be made up of outermost tubes, that is, outer tube and be arranged on the interior pipe of outer tube.Herein, when one end of gas supply unit 5300 is defined as discharge slots, described discharge slots can have wire shaped downward-sloping as shown in Figure 3, and wherein said one end is connected to gas injection space 5410 to be discharged in gas injection space 5410 by inert gas.Further, the district of gas supply section 5300 can have several times the channel shape of (that is, bending several times) at least partially curved, the wherein said front end corresponding to discharge slots at least partially.
Certainly, gas supply section 5300 can be not limited to above-mentioned shape.For example, feed tube part 5300 can be changed into the various shapes being enough to be fed to by inert gas in gas injection space 5410.
Plate 5500 is connected to the inferior portion of gas injection block 5400 and is arranged on above substrate S.The plate shape extended from the first slit 5400a defined gas injection block 5400 along both direction can be had according to the plate 5500 of embodiment.Plate 5500 can have the slit 5500a (hereinafter, being referred to as the second slit 5500a) that laser beam and inert gas extend there through.Second slit 5500a can through arranging with corresponding with the downside of the first slit 5400a.Therefore, the inert gas be discharged in the second slit 5500a of plate 5500 via the first slit 5400a of gas injection block 5400 spreads by the gap between plate 5500 and substrate S.
Gatherer 5140 can prevent from being irradiated to the reverberation (or reflected beam) reflected again in substrate S and by substrate S and reflect to transmissive window 5120 and light irradiation module 5000 after reverberation (or reflected beam) is transmitted through transmissive window 5120 again.Gatherer 5140 can be arranged on above the upper outer of transmissive window 5120 and process chamber 100.In more detail, gatherer 5140 can be arranged on gatherer 5140 be arranged on above cutter 5130 with at the upper left side of transmissive window 5120 and upper right side place towards or back to the position of cutter 5130.
Gatherer 5140 can make from substrate S reflection and the reverberation being transmitted through transmissive window 5120 offsets and dissipates.Gatherer 5140 can be arranged on above transmissive window 5120 at the outer upside place of process chamber 100 and can be outward-dipping from the upside of transmissive window 5120.That is, gatherer 5140 can be inclined upwardly along the outside direction of transmissive window 5120, to make gatherer 5140 make incident reverberation skew with reflection migrating light again, make again reverberation towards the outside transmission of transmissive window 5120 thus, instead of towards transmissive window 5120 transmission.
In other words, when the horizontal center section of transmissive window 5120 is defined as central shaft, gatherer 5140 can be arranged on above transmissive window 5120 and towards the outside of transmissive window 5120 and be inclined upwardly from the central shaft of transmissive window 5120.Herein, the outside direction of transmissive window 5120 represents the outside of the transmissive window 5120 on left/right direction.That is, gatherer 5140 can from the central shaft of transmissive window 5120 upwards and outward-dipping or be inclined upwardly along away from the direction of the central shaft of transmissive window 5120.Gatherer 5140 is arranged on above transmissive window 5120.
And, in other words, when the line being in the horizontal plane place identical with the horizontal plane of the top surface of transmissive window 5120 is defined as horizontal line, gatherer 5140 tiltable, to make to have between the basal surface of gatherer 5140 and described horizontal line the interval or distance that increase gradually towards the outside of transmissive window 5120.
Gatherer 5140 can be arranged on above transmissive window 5120.Gatherer 5140 can extend to the outside of transmissive window 5120 from the upper section of the top surface of transmissive window 5120.That is, because gatherer 5140 is arranged on above transmissive window 5120 along left/right direction (or Width), so a part for gatherer 5140 can be overlapping with transmissive window 5120, and the remainder of gatherer 5140 can be overlapping with the upside of the outside of transmissive window 5120.In other words, a part for the basal surface of gatherer 5140 can be corresponding with the upside of the top surface with transmissive window 5120 through arranging, and the remainder of the basal surface of gatherer 5140 can be corresponding with the outside of the top surface with transmissive window 5120 through arranging.That is, gatherer 5140 is extensible, and to make on left/right direction, the one end in the two ends of gatherer 5140 is arranged on above transmissive window 5120, and the other end is arranged on the upper outer place of transmissive window.
Gatherer 5140 can comprise: main body 5141, and the outside towards transmissive window 5120 is inclined upwardly from the upside of transmissive window 5120; Lid 5142, through installing the basal surface with main body covered 5141, described lid 5142 allows light to be therefrom transmitted through; And cooling block 5150, be arranged in main body 5141 to make cold-producing medium circulate wherein.
Main body 5141 can be the unit for making reverberation offset.Main body 5141 can be inclined upwardly the upside towards the outside of transmissive window 5120 from transmissive window 5120.That is, main body 5141 can be inclined upwardly along the direction arranging transmissive window 5120, to make incident reverberation towards the outside transmission of transmissive window 5120.Herein, main body 5141 self can be inclined upwardly along the outside direction of transmissive window 5120.Or the basal surface of main body 5141 can be inclined upwardly setting along the outside direction of transmissive window 5120.Further, the reverberation that multiple protuberance 5141a separately with the diameter of several microns to tens microns can be formed in main body 5141 incides one of them on the surface, that is, be formed on the basal surface of main body 5141.Herein, the multiple protuberance 5141a be formed in main body 5141 are formed by blasting craft and it can have diameter separately, such as, and the diameter of about 3 microns to about 4 microns.
Like this, because multiple protuberance 5141a is formed on the basal surface of main body 5141, so the reverberation being transmitted through transmissive window 5120 can be reflected several times by multiple protuberance 5141a.Therefore, reverberation not directly to be absorbed in main body 5141 but to be offset by multiple protuberance 5141a.Because reverberation is reflected several times by multiple protuberance 5141a, so the energy of reverberation can reduce and therefore the temperature of light can reduce.
When reverberation incides in main body 5141, the heat of reverberation can be absorbed in main body 5141 and the temperature of gatherer 5140 is raised, and causes thermal deformation thus.Further, as described in this disclosure, when the basal surface in main body 5141 being formed multiple protuberance 5141a, can increase when the surface area of basal surface is compared with being situation about being formed glossily with the basal surface of main body 5141.Therefore, the reflection path of light can increase the temperature reducing light.Therefore, when the basal surface in main body 5141 being formed multiple protuberance 5141a, light can move due to multiple protuberance 5141a or reflect several times, thus consumed energy.Therefore, the temperature being absorbed into the heat of the light in gatherer 5140 can reduce, and from gatherer 5140 reflect again and the temperature of light reentering the outside being mapped to transmissive window 5120 compared with being situation about being formed glossily with the basal surface of gatherer 5141 time can reduce.
The inclination angle of the basal surface of main body 5141 self or main body 5141 can be acute angle, such as, and the angle of about 10 ° to about 20 °, in detail, the angle of about 12 °.Because gatherer 5140 to be inclined upwardly above-mentioned angle along the outside direction of transmissive window 5120, so the reverberation incided in gatherer 5140 occurs offset and dissipate by gatherer 5140, and the remainder of light can not towards transmissive window 5120 or towards light source 300 transmission, but towards the outside transmission of transmissive window 5120.Therefore, the generation of the temperature imbalance by the photogenic transmissive window 5120 of reflection and the inequality caused by temperature rising due to transmissive window 5120 can be prevented.
Itself can be radiator according to the main body 5141 of embodiment or radiator can be had wherein.
Lid 5142 can by light transmissive material, that is, quartz is formed.Lid 5142 can main body covered 5141 basal surface to define inner space betwixt.Although not shown, flue can be connected to main body 5141 with the space covered between 5142 to be communicated with it.By flue 5144 by inert gas, such as, nitrogen (N
2), be filled in the space between main body 5141 and lid 5142, and by flue 5144 by emptying for described inert gas.In the filling and discharge process of inert gas, the removable smog produced because the temperature in gatherer 5140 raises.
Cooling block 5150 can be arranged on cooling collector 5140 in main body 5141, prevents the temperature of gatherer 5140 from raising thus.Cooling block 5150 comprises the cooling component 5151 that is arranged in main body 5141 and is arranged in cooling component 5151 with the refrigerant circulation pipe 5152 allowing cold-producing medium (such as, cooling agent) to circulate wherein.Herein, one end of refrigerant circulation pipe 5152 is connected to cold-producing medium supply section.
Therefore, when carrying out skew and the dissipation process of reverberation in gatherer 5140 after reverberation incides in gatherer 5140, although gatherer 5140 is heated because of the heat of reverberation, the cold-producing medium by circulation in refrigerant circulation pipe 5152 cools cooling component 5151.Therefore, the gatherer 5140 being connected to cooling component 5151 is cooled, and can prevent gatherer 5140 from raising and temperature imbalance and the thermal deformation that occurs according to owing to reflecting photogenic temperature.
Hereinafter, will the method using and make thin film crystallization according to the substrate-treating apparatus of embodiment be described referring to Fig. 1 to Fig. 6.
First, amorphous polycrystal film 11 can be formed on glass substrate S, such as, amorphous polysilicon membrane.Then, the substrate S defining amorphous polysilicon membrane can be loaded in the process chamber 100 of substrate-treating apparatus and also then be shelved on platform 200.
When substrate S is shelved on platform 200, can by platform 200 along laser being irradiated to while technique travel direction flatly translate substrate S on the film 11 that is formed in substrate S.That is, light source 300 can operate to export light from light source 300, that is, laser.Then, the laser exported can be irradiated to via the first slit 5400a and the second slit 5500a on the film 11 that is formed in substrate S after penetrating the gas injection space 5410 of space 5110 and gas injecting unit 5200 through transmissive window 5120 through the illumination of light irradiation unit 5100.Therefore, the amorphous polysilicon membrane be formed in substrate S can with laser reactive to form crystal silicon thin film.
As mentioned above, time on laser beam irradiation to substrate S, can by nitrogen N
2on the upside being expelled to substrate S or film 11.For this reason, when by nitrogen (N
2) when being fed in the gas supply unit 5300 be arranged in gas injection block 5400, by the discharge slots of gas supply unit 5300 by nitrogen (N
2) be fed in gas injection space 5410.Then, the nitrogen (N in gas injection space 5410 is fed to
2) be expelled on the upside of substrate S by the first slit 5410a and the second slit 5500a.To the nitrogen (N that the upside of substrate S is discharged
2) can spread along both direction relative to the second slit 5400a.Herein, oxygen between plate 5500 and substrate S is present in and impurity can be pushed to two laterals.In other words, the inert gas discharged by the second slit 5400a can be spread with the space between infill panel 5400 and substrate S.Herein, oxygen between plate 5500 and substrate S is present in and impurity can by nitrogen (N
2) shift light irradiation module 5000 and substrate S outside onto.
Therefore, because under substrate S and the silicon thin film 11 be formed on the top surface of substrate S be not exposed to oxygen and impurity, so unlike the prior art, substrate S and film 11 can not be oxidized.In more detail, because under substrate S or the film 11 that is at least irradiated with a laser be not exposed to oxygen and impurity, so the silicon thin film be irradiated with a laser can not be oxidized, thus form crystal silicon thin film.
As mentioned above, to export and the laser beam be irradiated to substrate S can make film 11 crystallization then reflecting again from substrate S from light source 300.Herein, laser beam upwards can reflect along the direction of the direction symmetry incided in substrate S with laser, and is therefore transmitted through transmissive window 5120 again.Skew occurs and the outside then reflected again to transmissive window 5120 from the laser of transmissive window 5120 transmission by the gatherer 5140 be arranged on above transmissive window 5120, instead of reflection is to transmissive window 5120.The outside of transmissive window this is because at least basal surface forming the main body 5141 of gatherer 5140 can be inclined upwardly.
Further, when reverberation to incide in gatherer 5140 and then offsets in gatherer 5140 and dissipate, although gatherer 5140 is heated because of the heat of reverberation, cooled by cooling block 5150 pairs of gatherers 5140.
Like this, in the present invention, because gatherer 5140 is arranged on above the transmissive window 5120 and outside of the transmissive window 5120 that is inclined upwardly, so can suppress or the diffuse reflection of minimum reflected light.Therefore, gatherer 5140 can prevent from from substrate S reflection and reenter transmitted through the reverberation of transmissive window 5120 being mapped to transmissive window 5120 and can by the exterior guiding of reverberation towards transmissive window 5120.Further, because the second gatherer 5150 is arranged under gatherer 5140, so there is double offset with dissipation reverberation by the second gatherer 5150 in the reverberation once offset from gatherer 5140.Therefore, can prevent reverberation from reflecting to transmissive window 5120 with the temperature imbalance suppressing the temperature of transmissive window 5120 to raise and caused by temperature raises, wherein said temperature raises and is caused by reverberation again.Therefore, the generation of inequality and light displacement can be suppressed.
Further, because cooling block is arranged on cooling collector 5140 in gatherer 5140, thus can prevent gatherer 5140 due to reverberation heat caused by temperature raise and temperature imbalance, thus prevent the thermal deformation of gatherer 5140 from occurring.Further, because cooled, so the phenomenon that the temperature as prior art around gatherer 5140 raises due to the heat of described gatherer can be prevented by cooling block 5150 pairs of gatherers 5140.
According to described embodiment, because gatherer is arranged on above transmissive window and the outside of the transmissive window that is inclined upwardly, and define protuberance on the basal surface of gatherer, so can suppress or the diffuse reflection of minimum reflected light.Further, the exterior guiding of described reverberation towards described transmissive window can be mapped to described transmissive window to prevent from reentering from the described reverberation of substrate S reflection by described gatherer.Therefore, the generation being raised inequality and the light displacement caused by the temperature imbalance of transmissive window and temperature can be suppressed.
Further, because cooling block is arranged on cooling collector in gatherer, thus can prevent gatherer due to reverberation heat caused by temperature raise and temperature imbalance, thus prevent the thermal deformation of gatherer from occurring.Further, because cooled gatherer by cooling block, so the phenomenon that the temperature as prior art around gatherer raises due to the heat of described gatherer can be prevented.
Although describe described light irradiating device with reference to specific embodiment, described light irradiating device is not limited thereto.Therefore, those skilled in the art should be readily appreciated that and can carry out various amendment and change to it when not departing from the spirit and scope of the present invention defined by claim of enclosing.
Claims (10)
1., for light shining on substrate to process a light irradiating device for described substrate, it is characterized in that described light irradiating device comprises:
Transmissive window, described Transmission light is through described transmissive window;
Gatherer, is arranged on above described transmissive window and the outside of the described transmissive window that is inclined upwardly, and described gatherer makes after described substrate reflection, be transmitted through the reverberation skew of described transmissive window; And
Cooling block, in described cooling block, cold-producing medium circulates wherein, and described cooling block is arranged in described gatherer to cool described gatherer.
2. light irradiating device according to claim 1, is characterized in that described gatherer has at least one basal surface of the outside of the described transmissive window that is inclined upwardly.
3. light irradiating device according to claim 1, is characterized in that described gatherer comprises:
Main body, has at least one basal surface of the outside of the described transmissive window that is inclined upwardly, and described main body is arranged on above described transmissive window with the described reverberation dissipated by being transmitted through described transmissive window from described substrate reflection; And
Multiple protuberance, is arranged on the described basal surface of described main body.
4. light irradiating device according to claim 3, is characterized in that the inclination angle of described gatherer is acute angle.
5. light irradiating device according to claim 3, it is characterized in that in described multiple protuberance each there is the diameter of 3 microns to 4 microns.
6. light irradiating device according to claim 4, is characterized in that described gatherer has the inclination angle of 10 ° to 20 °.
7. light irradiating device according to claim 3, is characterized in that described main body comprises radiator.
8. light irradiating device according to claim 3, is characterized in that described gatherer comprises:
Lid, cover the described basal surface of described main body to define inner space, described lid allows described Transmission light to pass; And
Flue, through arranging to be communicated with the described space between described main body with described lid, described flue supplies a gas in the described space between described main body and described lid or by evacuate air.
9. light irradiating device according to claim 4, it is characterized in that described gatherer extends to make a part for the described basal surface of described gatherer corresponding with the upside of the top surface with described transmissive window through arranging, and the remainder of the described basal surface of described gatherer is corresponding with the upside of the outside with described transmissive window through arranging.
10. light irradiating device according to claim 1, is characterized in that described cooling block comprises:
Cooling component, is arranged on the upper section of described gatherer; And
Refrigerant circulation pipe, is arranged in described cooling component to allow cold-producing medium to circulate wherein.
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| KR10-2013-0165586 | 2013-12-27 | ||
| KR1020130165586A KR101560377B1 (en) | 2013-12-27 | 2013-12-27 | Apparatus for irradiating light |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108699617A (en) * | 2016-01-22 | 2018-10-23 | Posco公司 | The magnetic domain thinning method and its device of oriented electrical steel |
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| KR101693511B1 (en) * | 2016-01-22 | 2017-01-06 | 주식회사 포스코 | Method and apparatus for refining magnetic domains grain-oriented electrical steel |
| KR102069613B1 (en) * | 2017-02-21 | 2020-02-11 | 에이피시스템 주식회사 | Apparatus for irradiating light |
| KR102038459B1 (en) * | 2019-03-22 | 2019-11-27 | 한국우시오 (주) | Ashing apparatus |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06324203A (en) * | 1993-05-13 | 1994-11-25 | Tachibana Seisakusho:Kk | Laser beam absorbing device |
| CN101928932A (en) * | 2009-06-25 | 2010-12-29 | Ap系统股份有限公司 | The laser process equipment of may command laser beam length and intensity |
| CN101999161A (en) * | 2008-04-09 | 2011-03-30 | 应用材料股份有限公司 | Apparatus including heating source reflective filter for pyrometry |
| KR20110120708A (en) * | 2010-04-29 | 2011-11-04 | 신상교 | Laser beam dump |
| KR20120119101A (en) * | 2011-04-20 | 2012-10-30 | 삼성디스플레이 주식회사 | Beam dump |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101024846B1 (en) * | 2010-08-31 | 2011-03-28 | 레이져라이팅(주) | Apparatus for processing light guide plate with laser having means for blocking laser beam |
-
2013
- 2013-12-27 KR KR1020130165586A patent/KR101560377B1/en active IP Right Grant
-
2014
- 2014-12-26 CN CN201410831829.6A patent/CN104752278B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06324203A (en) * | 1993-05-13 | 1994-11-25 | Tachibana Seisakusho:Kk | Laser beam absorbing device |
| CN101999161A (en) * | 2008-04-09 | 2011-03-30 | 应用材料股份有限公司 | Apparatus including heating source reflective filter for pyrometry |
| CN101928932A (en) * | 2009-06-25 | 2010-12-29 | Ap系统股份有限公司 | The laser process equipment of may command laser beam length and intensity |
| KR20110120708A (en) * | 2010-04-29 | 2011-11-04 | 신상교 | Laser beam dump |
| KR20120119101A (en) * | 2011-04-20 | 2012-10-30 | 삼성디스플레이 주식회사 | Beam dump |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108699617A (en) * | 2016-01-22 | 2018-10-23 | Posco公司 | The magnetic domain thinning method and its device of oriented electrical steel |
| US11072838B2 (en) | 2016-01-22 | 2021-07-27 | Posco | Method and device for magnetic domain refinement of oriented electrical steel plate |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20150076894A (en) | 2015-07-07 |
| CN104752278B (en) | 2017-10-03 |
| KR101560377B1 (en) | 2015-11-25 |
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