CN104718621A - 具有电容耦合的led封装 - Google Patents

具有电容耦合的led封装 Download PDF

Info

Publication number
CN104718621A
CN104718621A CN201380053588.0A CN201380053588A CN104718621A CN 104718621 A CN104718621 A CN 104718621A CN 201380053588 A CN201380053588 A CN 201380053588A CN 104718621 A CN104718621 A CN 104718621A
Authority
CN
China
Prior art keywords
led
terminal
power supply
led package
diode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201380053588.0A
Other languages
English (en)
Chinese (zh)
Inventor
E·R·加克布斯
M·A·德桑贝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Publication of CN104718621A publication Critical patent/CN104718621A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • H05B45/42—Antiparallel configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Led Devices (AREA)
  • Led Device Packages (AREA)
CN201380053588.0A 2012-10-15 2013-10-11 具有电容耦合的led封装 Pending CN104718621A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261713733P 2012-10-15 2012-10-15
US61/713,733 2012-10-15
PCT/IB2013/059312 WO2014060921A1 (en) 2012-10-15 2013-10-11 Led package with capacitive couplings

Publications (1)

Publication Number Publication Date
CN104718621A true CN104718621A (zh) 2015-06-17

Family

ID=49911751

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380053588.0A Pending CN104718621A (zh) 2012-10-15 2013-10-11 具有电容耦合的led封装

Country Status (7)

Country Link
US (1) US9386640B2 (https=)
EP (1) EP2907162A1 (https=)
JP (1) JP2015537374A (https=)
KR (1) KR20150066594A (https=)
CN (1) CN104718621A (https=)
RU (1) RU2637402C2 (https=)
WO (1) WO2014060921A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108430655A (zh) * 2015-12-23 2018-08-21 皇家飞利浦有限公司 海用结构

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6461603B2 (ja) * 2012-11-02 2019-01-30 ローム株式会社 チップコンデンサ、回路アセンブリ、および電子機器
JP2017506415A (ja) 2014-02-12 2017-03-02 フィリップス ライティング ホールディング ビー ヴィ Ｌｅｄのアレイを備える照光システム
CA3009270C (en) * 2015-12-23 2024-06-11 Koninklijke Philips N.V. Load arrangement and electrical power arrangement for powering a load
TR201910536T4 (tr) * 2015-12-23 2019-08-21 Koninklijke Philips Nv Bir yüke güç sağlanmasına yönelik yük düzenlemesi ve elektrik gücü düzenlemesi.
WO2019007843A1 (en) * 2017-07-04 2019-01-10 Philips Lighting Holding B.V. LIGHTING ARRANGEMENT WITH NON-GALVANIC INTERCONNECTED DEVICES
EP3599796B1 (de) * 2018-07-26 2021-02-24 Bilton International GmbH Led-lichtband und leuchtsystem
DE102018121451B3 (de) * 2018-07-26 2020-01-30 BILTON International GmbH LED-Lichtband und Leuchtsystem
EP3599797A1 (de) * 2018-07-26 2020-01-29 Bilton International GmbH Leuchtsystem und verfahren zum betreiben eines leuchtsystems
AU2019343484B2 (en) 2018-09-20 2025-06-26 Koninklijke Philips N.V. A light emitting unit configured to be applied to a surface area of a marine object

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002031406A1 (en) * 2000-10-13 2002-04-18 Flat White Lighting Pty Ltd Lighting system
CN101189736A (zh) * 2005-06-02 2008-05-28 皇家飞利浦电子股份有限公司 Led组件和模块
US20090159677A1 (en) * 2007-12-20 2009-06-25 General Electric Company Contactless power and data transfer system and method
JP2009296857A (ja) * 2008-06-09 2009-12-17 Sony Corp 伝送システム、給電装置、受電装置、及び伝送方法

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2606267Y2 (ja) * 1992-10-22 2000-10-10 日本航空電子工業株式会社 表面実装用チップ発光ダイオード及びそれを用いたメンブレンシートスィッチ
TW346916U (en) 1998-03-16 1998-12-01 Jun-Teng Bai Improved structure for disk box
US6636027B1 (en) 2000-10-24 2003-10-21 General Electric Company LED power source
US6411045B1 (en) * 2000-12-14 2002-06-25 General Electric Company Light emitting diode power supply
JP3928384B2 (ja) * 2001-08-17 2007-06-13 松下電工株式会社 Ｌｅｄ照明器具
US7009199B2 (en) * 2002-10-22 2006-03-07 Cree, Inc. Electronic devices having a header and antiparallel connected light emitting diodes for producing light from AC current
BRPI0507223A (pt) * 2004-02-25 2007-06-19 Michael Miskin diodo emissor de luz ac e métodos e aparelho de direcionamento de led ac
US7553051B2 (en) * 2004-03-18 2009-06-30 Brasscorp Limited LED work light
US7294961B2 (en) * 2004-03-29 2007-11-13 Articulated Technologies, Llc Photo-radiation source provided with emissive particles dispersed in a charge-transport matrix
EP2280430B1 (en) * 2005-03-11 2020-01-01 Seoul Semiconductor Co., Ltd. LED package having an array of light emitting cells coupled in series
US8704241B2 (en) 2005-05-13 2014-04-22 Epistar Corporation Light-emitting systems
EP1898676A1 (en) * 2006-09-06 2008-03-12 THOMSON Licensing Display apparatus
JP2008198457A (ja) * 2007-02-13 2008-08-28 Seiko Epson Corp 発光装置の製造方法
US7791285B2 (en) * 2007-04-13 2010-09-07 Cree, Inc. High efficiency AC LED driver circuit
US8004070B1 (en) 2008-04-29 2011-08-23 Wei Chen Wire-free chip module and method
DE102008024779A1 (de) * 2008-05-23 2009-11-26 Osram Gesellschaft mit beschränkter Haftung Drahtlos speisbares Leuchtmodul
CN102067724B (zh) * 2008-06-17 2013-11-06 皇家飞利浦电子股份有限公司 适合于交流驱动的发光器件
US8269408B2 (en) * 2008-08-12 2012-09-18 Helio Optoelectronics Corporation LED base structure with embedded capacitor
KR101618583B1 (ko) * 2008-10-02 2016-05-09 코닌클리케 필립스 엔.브이. 플리커 성능이 개선된 ｌｅｄ 회로 장치
WO2010067274A1 (en) * 2008-12-12 2010-06-17 Koninklijke Philips Electronics N.V. Led light source and lamp comprising such a led light source
US20100176735A1 (en) * 2009-01-15 2010-07-15 Chen-Sheng Yang LED light string assembly with constant current circuit
KR20100095826A (ko) 2009-02-23 2010-09-01 주식회사 마블덱스 Ｌｅｄ 전등 및 그 ｌｅｄ 전등을 포함한 전기전자시스템
TWM375821U (en) * 2009-06-06 2010-03-11 Iovision Photoelectric Co Ltd LED lamp strip with replaceable power source
WO2010146500A1 (en) * 2009-06-17 2010-12-23 Koninklijke Philips Electronics N.V. Dimmable light source with light temperature shift
TWM382449U (en) * 2010-01-08 2010-06-11 Ying-Chia Chen Package of constant-current chip and light-emitting diode lamp drived by alternating current
US20110291573A1 (en) * 2010-05-27 2011-12-01 Inergy Technology Inc. Resonant power supply for light-emitting devices
US20120062147A1 (en) * 2010-09-13 2012-03-15 Suntec Enterprises High efficiency drive method for driving LED devices
RU101867U1 (ru) * 2010-09-16 2011-01-27 Ооо "Нпп "Волсон" Светодиодная лампа
US9022608B2 (en) * 2010-11-23 2015-05-05 Q Technology, Inc. Unlit LED circuit bypass element with system and method therefor
CN103430314B (zh) * 2011-03-07 2017-03-22 皇家飞利浦有限公司 电致发光器件
US8653748B2 (en) * 2011-05-11 2014-02-18 General Electric Company Isolated capacitor drive circuit for thin-film solid-state lighting
US8835945B2 (en) * 2013-01-11 2014-09-16 Lighting Science Group Corporation Serially-connected light emitting diodes, methods of forming same, and luminaires containing same
JP2013084557A (ja) * 2011-07-21 2013-05-09 Rohm Co Ltd 照明装置
BR112014019160A8 (pt) * 2012-02-07 2017-07-11 Koninklijke Philips Nv Sistema de iluminação e método de operação de um sistema de iluminação
CN102606944B (zh) * 2012-02-27 2014-01-15 中山伟强科技有限公司 一种可更换led路灯模组
KR102075991B1 (ko) * 2012-09-07 2020-02-11 삼성전자주식회사 광원장치 및 발광다이오드 패키지

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002031406A1 (en) * 2000-10-13 2002-04-18 Flat White Lighting Pty Ltd Lighting system
CN101189736A (zh) * 2005-06-02 2008-05-28 皇家飞利浦电子股份有限公司 Led组件和模块
US20090159677A1 (en) * 2007-12-20 2009-06-25 General Electric Company Contactless power and data transfer system and method
JP2009296857A (ja) * 2008-06-09 2009-12-17 Sony Corp 伝送システム、給電装置、受電装置、及び伝送方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108430655A (zh) * 2015-12-23 2018-08-21 皇家飞利浦有限公司 海用结构

Also Published As

Publication number Publication date
WO2014060921A1 (en) 2014-04-24
KR20150066594A (ko) 2015-06-16
RU2015118136A (ru) 2016-12-10
RU2637402C2 (ru) 2017-12-04
US9386640B2 (en) 2016-07-05
US20150289326A1 (en) 2015-10-08
EP2907162A1 (en) 2015-08-19
JP2015537374A (ja) 2015-12-24

Similar Documents

Publication Publication Date Title
CN104718621A (zh) 具有电容耦合的led封装
CN102237485B (zh) 引线框架、芯片封装、封装模块以及照明装置
CN103426989B (zh) 半导体发光器件及其制造方法、发光模块和照明设备
CN106373952A (zh) 功率模块封装结构
CN103348177B (zh) Led模块及照明组件
US20140313711A1 (en) Light emitting diode (led) light tube
KR20060098229A (ko) 발광 장치 및 이의 제조 방법
KR101622399B1 (ko) Ｌｅｄ 장치
JP7105001B2 (ja) 発電機能付照明装置
US9743521B2 (en) Light-source module and light-emitting device
JP6297838B2 (ja) 発光デバイス及びその製造方法
KR101321812B1 (ko) 구동회로 및 전원회로 일체형 광 디바이스 및 이에 사용되는 광 디바이스 기판 제조 방법과 그 기판
CN102478175B (zh) 发光二极管灯条及发光二极管灯条组件
TW201144670A (en) Light source module
CN108112284B (zh) Led照明装置
CN100420049C (zh) 发光二极管模块的基板结构
US20140321109A1 (en) Light emitting diode (led) light tube
CN106465537B (zh) 印刷电路板和包括该印刷电路板的光发射器件
KR20200114402A (ko) 엘이디 패키지 및 그 제조방법
KR101764344B1 (ko) 구동회로 및 전원회로 일체형 광 디바이스 기판
KR101394478B1 (ko) 광 디바이스용 기판과 광 디바이스
JP5785997B2 (ja) 有機発光装置
CN205584535U (zh) 一种灯
KR20140140672A (ko) 전기적으로 절연 고립된 방열 통로를 가진 방열기판의 제조 방법
CN102454878A (zh) 发光二极管模组

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
TA01 Transfer of patent application right

Effective date of registration: 20170315

Address after: The city of Eindhoven in Holland

Applicant after: KONINKL PHILIPS NV

Address before: The city of Eindhoven in Holland

Applicant before: Koninkl Philips Electronics NV

TA01 Transfer of patent application right
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20150617

WD01 Invention patent application deemed withdrawn after publication