CN104716027B - 一种半导体激光器Zn杂质源扩散的装置及其应用 - Google Patents
一种半导体激光器Zn杂质源扩散的装置及其应用 Download PDFInfo
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- CN104716027B CN104716027B CN201310682698.5A CN201310682698A CN104716027B CN 104716027 B CN104716027 B CN 104716027B CN 201310682698 A CN201310682698 A CN 201310682698A CN 104716027 B CN104716027 B CN 104716027B
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- diffusion
- quartz ampoule
- heating furnace
- quartz
- thermocouple
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- 238000009792 diffusion process Methods 0.000 title claims abstract description 159
- 239000004065 semiconductor Substances 0.000 title claims abstract description 26
- 239000012535 impurity Substances 0.000 title claims abstract description 24
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 158
- 239000010453 quartz Substances 0.000 claims abstract description 134
- 239000003708 ampul Substances 0.000 claims abstract description 98
- 238000010438 heat treatment Methods 0.000 claims abstract description 54
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 24
- 239000000498 cooling water Substances 0.000 claims description 20
- 229910052757 nitrogen Inorganic materials 0.000 claims description 12
- 239000000377 silicon dioxide Substances 0.000 claims description 12
- 238000005086 pumping Methods 0.000 claims description 8
- 238000013461 design Methods 0.000 claims description 3
- JEGUKCSWCFPDGT-UHFFFAOYSA-N h2o hydrate Chemical compound O.O JEGUKCSWCFPDGT-UHFFFAOYSA-N 0.000 claims description 3
- 238000003780 insertion Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 3
- 238000012856 packing Methods 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 2
- 239000004575 stone Substances 0.000 claims 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 abstract description 8
- 230000009977 dual effect Effects 0.000 abstract description 6
- 230000006641 stabilisation Effects 0.000 abstract description 5
- 238000011105 stabilization Methods 0.000 abstract description 5
- 238000005282 brightening Methods 0.000 abstract description 4
- 238000009826 distribution Methods 0.000 abstract description 4
- 235000012239 silicon dioxide Nutrition 0.000 description 99
- 239000011701 zinc Substances 0.000 description 47
- 238000000034 method Methods 0.000 description 24
- 238000005354 coacervation Methods 0.000 description 9
- 239000007789 gas Substances 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000004411 aluminium Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 230000012010 growth Effects 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000407 epitaxy Methods 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 239000004816 latex Substances 0.000 description 2
- 229920000126 latex Polymers 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000010926 purge Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000011982 device technology Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000009421 internal insulation Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000007648 laser printing Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000004153 renaturation Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
- H01L21/223—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a gaseous phase
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201310682698.5A CN104716027B (zh) | 2013-12-13 | 2013-12-13 | 一种半导体激光器Zn杂质源扩散的装置及其应用 |
Applications Claiming Priority (1)
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---|---|---|---|
CN201310682698.5A CN104716027B (zh) | 2013-12-13 | 2013-12-13 | 一种半导体激光器Zn杂质源扩散的装置及其应用 |
Publications (2)
Publication Number | Publication Date |
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CN104716027A CN104716027A (zh) | 2015-06-17 |
CN104716027B true CN104716027B (zh) | 2017-08-01 |
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CN201310682698.5A Active CN104716027B (zh) | 2013-12-13 | 2013-12-13 | 一种半导体激光器Zn杂质源扩散的装置及其应用 |
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Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN107887263B (zh) * | 2016-09-30 | 2020-06-23 | 中国科学院苏州纳米技术与纳米仿生研究所 | 用于锌扩散的装置及其锌扩散方法 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62143421A (ja) * | 1985-12-18 | 1987-06-26 | Hitachi Ltd | 不純物拡散方法および拡散装置 |
CN1065158A (zh) * | 1992-04-02 | 1992-10-07 | 山东师范大学 | 一种高压晶闸管制造方法及装置 |
JP2751516B2 (ja) * | 1990-01-18 | 1998-05-18 | 富士通株式会社 | 化合物半導体基板の熱処理装置 |
TW432495B (en) * | 1998-07-29 | 2001-05-01 | Sumitomo Electric Industries | Method and apparatus for diffusing zinc into groups III-V compound semiconductor crystals |
CN1409379A (zh) * | 2002-09-18 | 2003-04-09 | 中国电子科技集团公司第十三研究所 | 铟镓砷光电探测器制造的开管锌扩散方法 |
JP4172184B2 (ja) * | 2002-02-26 | 2008-10-29 | 住友電気工業株式会社 | 半導体基板への亜鉛拡散方法、半導体基板の加熱方法。 |
JP4305682B2 (ja) * | 1997-11-14 | 2009-07-29 | 株式会社ケミトロニクス | 拡散装置とこれを用いた半導体結晶への不純物拡散法 |
CN103151248A (zh) * | 2013-03-07 | 2013-06-12 | 武汉电信器件有限公司 | 一种光电探测器制作中锌的扩散装置及其扩散方法 |
-
2013
- 2013-12-13 CN CN201310682698.5A patent/CN104716027B/zh active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62143421A (ja) * | 1985-12-18 | 1987-06-26 | Hitachi Ltd | 不純物拡散方法および拡散装置 |
JP2751516B2 (ja) * | 1990-01-18 | 1998-05-18 | 富士通株式会社 | 化合物半導体基板の熱処理装置 |
CN1065158A (zh) * | 1992-04-02 | 1992-10-07 | 山东师范大学 | 一种高压晶闸管制造方法及装置 |
JP4305682B2 (ja) * | 1997-11-14 | 2009-07-29 | 株式会社ケミトロニクス | 拡散装置とこれを用いた半導体結晶への不純物拡散法 |
TW432495B (en) * | 1998-07-29 | 2001-05-01 | Sumitomo Electric Industries | Method and apparatus for diffusing zinc into groups III-V compound semiconductor crystals |
JP4172184B2 (ja) * | 2002-02-26 | 2008-10-29 | 住友電気工業株式会社 | 半導体基板への亜鉛拡散方法、半導体基板の加熱方法。 |
CN1409379A (zh) * | 2002-09-18 | 2003-04-09 | 中国电子科技集团公司第十三研究所 | 铟镓砷光电探测器制造的开管锌扩散方法 |
CN103151248A (zh) * | 2013-03-07 | 2013-06-12 | 武汉电信器件有限公司 | 一种光电探测器制作中锌的扩散装置及其扩散方法 |
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Address after: Tianchen Avenue high tech Zone of Ji'nan City, Shandong Province, No. 1835 250101 Applicant after: SHANDONG HUAGUANG OPTOELECTRONICS CO., LTD. Address before: 250101 Shandong city of Ji'nan province high tech Zone (Lixia) Tianchen Street No. 1835 Applicant before: Shandong Huaguang Photoelectronic Co., Ltd. |
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Inventor after: Feng Xinglian Inventor after: Xiao Chengfeng Inventor after: Zheng Zhaohe Inventor after: Shen Yan Inventor after: Su Jian Inventor after: Zhu Zhen Inventor before: Feng Xinglian Inventor before: Shen Yan Inventor before: Su Jian Inventor before: Zhu Zhen |
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