CN104700093A - Fingerprint imaging module and mobile terminal - Google Patents
Fingerprint imaging module and mobile terminal Download PDFInfo
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- CN104700093A CN104700093A CN201510144363.7A CN201510144363A CN104700093A CN 104700093 A CN104700093 A CN 104700093A CN 201510144363 A CN201510144363 A CN 201510144363A CN 104700093 A CN104700093 A CN 104700093A
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- optical surface
- array sensor
- imaging module
- fingerprint imaging
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Abstract
Provided are a fingerprint imaging module and a mobile terminal. The fingerprint imaging module comprises an optical surface array sensor and a light guide plate, wherein the optical surface array sensor is clamped on the light guide plate. The optical surface array sensor in the fingerprint imaging module of the mobile terminal can be clamped on the light guide plate. Compared with a bonding mode, the connection between the optical surface array sensor and the light guide plate can be more stable in the clamping-connection mode.
Description
Technical field
The present invention relates to fingerprint identification technology field, be specifically related to a kind of fingerprint imaging module and mobile terminal.
Background technology
Fingerprint imaging recognition technology is the fingerprint image being collected human body by fingerprint sensor, then compares with the existing fingerprint imaging information in system, whether carrys out correct judgment, and then realize the technology of identification.
Due to the convenience that it uses, and the uniqueness of somatic fingerprint, fingerprint identification technology is widely used in every field.The such as field of safety check such as public security bureau, customs, the gate control system of building, and the consumer product area such as PC and mobile phone etc.
The implementation of fingerprint imaging technique has the multiple technologies such as optical imagery, capacitance imaging, ultrasonic imaging.Comparatively speaking, optical image technology, its imaging effect is relatively better, and equipment cost is relatively low.、
With reference to figure 1 and Fig. 2, the current handset structure with fingerprint identification function generally all comprises front shroud 200, mesochite 300, back cover 400.Front shroud 200 has viewing area A and button area B, and display module 310 and fingerprint imaging module 100 are assemblied in the side of mesochite 300 towards front shroud 200, and display module 310 is positioned at viewing area A, and fingerprint imaging module 100 is positioned at button area B; Pcb board (Printed CircuitBoard, Chinese is printed circuit board) 420 is assemblied in the side of mesochite 300 front shroud 200 dorsad, then front shroud 200 and back cover 400 be assemblied in respectively mesochite 300 above and below.
With reference to figure 3, wherein fingerprint imaging module 100 comprises cover sheet 101, optical surface array sensor 102, light guide plate 103; Wherein cover sheet 101 is bonded on optical surface array sensor 102, optical surface array sensor 102 is provided with IC chip 105 (integrated chip), optical surface array sensor 102 is connected with pcb board 420 by FPC104 (Flexible Printed Circuit, Chinese is flexible circuit board); Light guide plate 103 is also provided with and holds the LED holding tank of LED106, FPC104 is bent to the side of light guide plate 103 optical surface array sensor 102 dorsad after being connected to optical surface array sensor 102, and covers LED106 after FPC104 bending; Meanwhile, light guide plate 103 and optical surface array sensor 102 are fixed by double faced adhesive tape or glue, and such fixed form can cause light guide plate 103 to be connected instability with optical surface array sensor 102.
In addition, fingerprint imaging module 100 is protected housing parcel also, and protective housing comprises upper shell 107 and lower house 108, and upper shell 107 wraps up outside the part of protected cover plate 101 covering of optical surface array sensor 102; Lower house 108 wraps up outside the part that light guide plate 103 covered by optical surface array sensor 102; Leave the hole passed for FPC104 between upper shell 107 and lower house 108, upper shell 107 is connected with the mode of lower house 108 by double faced adhesive tape or laser electric welding or ultra-sonic welded; Adopt double faced adhesive tape to connect the problem existing and connect instability, adopt laser electric welding or ultra-sonic welded to need to buy special equipment, complex process, efficiency is low.
Summary of the invention
The problem that the present invention solves is that in prior art fingerprint imaging module, light guide plate is connected instability with optical surface array sensor.
The another one problem that the present invention solves is that the upper shell of protective housing in prior art is connected instability with lower house, and Joining Technology is complicated, and efficiency is low.
For solving the problem, the invention provides a kind of fingerprint imaging module, comprising:
Optical surface array sensor;
Light guide plate, described optical surface array sensor is arranged in described light guide plate.
Optionally, described light guide plate is provided with draw-in groove towards the surface of described optical surface array sensor, and the sidewall of described draw-in groove is provided with snap fit;
Described optical surface array sensor is located in described draw-in groove, and is limited in described draw-in groove by described snap fit.
Optionally, described light guide plate is provided with snap fit towards the surface of described optical surface array sensor;
Described optical surface array sensor is arranged in described snap fit.
Optionally, also comprise the cover sheet be located on described optical surface array sensor, for providing the surface of contact placing object.
Optionally, described optical surface array sensor is connected with PCB mainboard by the first flexible circuit board;
Described first flexible circuit board is bent to the side of described light guide plate described optical surface array sensor dorsad after being connected with described optical surface array sensor.
Optionally, described light guide plate is also provided with LED holding tank, the described LED holding tank of parcel after described first flexible circuit board bending.
Optionally, described fingerprint imaging module is wrapped up by housing;
Described housing comprises upper shell and lower house;
Described lower house is connected with described upper shell after wrapping up described light guide plate, described first flexible circuit board and described optical surface array sensor.
Optionally, described upper shell is connected by double faced adhesive tape or welding manner with described lower house.
Optionally, described upper shell is provided with hole, and described lower house is provided with projection, and described projection is arranged in described hole; Or,
Described upper shell is provided with projection, and described lower house is provided with hole, and described projection is arranged in described hole.
Optionally, the exterior domain of part that described optical surface array sensor is covered by described cover sheet is provided with silica gel or UV glue or AB glue or adhesive tape.
Optionally, described light guide plate material is PMMA or PC, and described draw-in groove material is PMMA or PC.
The present invention also provides a kind of mobile terminal, comprising:
Mobile terminal shell, the mesochite comprising front shroud and be arranged in parallel with front shroud;
Described front shroud has button area, and the button area of described front shroud is provided with through hole;
Described through hole is for installing the fingerprint imaging module described in any one, and described fingerprint imaging module is installed on the side of described mesochite towards described front shroud, and described through hole exposes described fingerprint imaging module.
Optionally, described cover sheet is arranged with containment vessel, the contacted inner surfaces of described containment vessel and described through hole, and described containment vessel is adhered on described optical surface array sensor.
Optionally, the outer peripheral face of described containment vessel near one end of described optical surface array sensor is provided with shirt rim, and described shirt rim is adhered on described optical surface array sensor.
Optionally, described front shroud also has viewing area;
Described mesochite is provided with display module towards the side of described front shroud, and described display module is relative with described viewing area;
Described display module is connected with PCB mainboard by the second flexible circuit board.
Optionally, also comprise:
Back shroud;
Described mesochite is between described front shroud and described back shroud.
Optionally, described mobile terminal is mobile phone or panel computer.
Compared with prior art, technical scheme of the present invention has the following advantages:
Optical surface array sensor in the fingerprint imaging module of mobile terminal of the present invention is arranged in light guide plate, compared to bonding mode, is connected more stable between optical surface array sensor and light guide plate by snap fit.
Further, the housing of fingerprint imaging module is protected to comprise upper shell and lower house; Upper shell is provided with hole, and lower house is provided with projection, and projection is arranged in hole; Or upper shell is provided with projection, lower house is provided with hole, and projection is arranged in hole; Be connected with the mode of lower house by double faced adhesive tape or laser electric welding or ultra-sonic welded compared to prior art upper shell, passing hole of the present invention and protruding connection, assembling is simple, and efficiency of assembling improves.
Accompanying drawing explanation
Fig. 1 is the vertical view of prior art mobile terminal;
Fig. 2 is the cut-open view along A-A direction in Fig. 1;
Fig. 3 is the cut-open view of fingerprint imaging modules in prior art mobile terminal;
Fig. 4 is the stereographic map of light guide plate in first embodiment of the invention fingerprint imaging module;
Fig. 5 is the stereographic map of first embodiment of the invention fingerprint imaging module;
Fig. 6 is the vertical view of first embodiment of the invention fingerprint imaging module;
Fig. 7 is the cut-open view along B-B direction in Fig. 6;
Fig. 8 is the three-dimensional exploded view of Fig. 5;
Fig. 9 is the three-dimensional exploded view of the sheathed containment vessel of cover sheet in first embodiment of the invention fingerprint imaging module;
Figure 10 is the three-dimensional exploded view of second embodiment of the invention fingerprint imaging module;
Figure 11 is the vertical view of second embodiment of the invention fingerprint imaging module;
Figure 12 is the cut-open view along C-C direction in Figure 11;
Figure 13 is the enlarged drawing of D part in Figure 12;
Figure 14 is the cut-open view of third embodiment of the invention fingerprint imaging module;
Figure 15 is the enlarged drawing of E part in Figure 14;
Figure 16 is the vertical view of fourth embodiment of the invention mobile terminal;
Figure 17 is the cut-open view along F-F direction in Figure 16.
Embodiment
There is following problem in prior art fingerprint imaging module:
In fingerprint imaging module, light guide plate and optical surface array sensor are fixed by double faced adhesive tape or glue, and such connected mode exists the problem connecting instability.
In addition, in prior art, the upper shell of protective housing is connected with the mode of lower house by double faced adhesive tape or laser electric welding or ultra-sonic welded; Adopt double faced adhesive tape to connect the problem existing and connect instability, adopt laser electric welding or ultra-sonic welded to need to buy special equipment, complex process, efficiency is low.
For enabling above-mentioned purpose of the present invention, feature and advantage more become apparent, and are described in detail specific embodiments of the invention below in conjunction with accompanying drawing.
First embodiment
Be connected unstable problem for light guide plate in the fingerprint imaging module that prior art exists with optical surface array sensor, the invention provides a kind of fingerprint imaging module, comprising: optical surface array sensor and light guide plate, optical surface array sensor is arranged in light guide plate.Compared to bonding mode, connected more stable between optical surface array sensor and light guide plate by snap fit.
In the present embodiment, light guide plate redesigns, with reference to figure 4 and Fig. 5, light guide plate 10 is provided with draw-in groove 11 towards the surface of optical surface array sensor 20, draw-in groove 11 is around being located on the surface of light guide plate 10, in the present embodiment, draw-in groove 11 has three sidewalls, and each sidewall of draw-in groove 11 is equipped with a snap fit 12; In the present embodiment, snap fit 12 is a projection parallel with light guide plate 10 surface, and snap fit 12 also can be not parallel to the surface of light guide plate 10 in other embodiments, can be towards the projection on light guide plate 10 surface; In addition, the quantity of snap fit 12 does not limit, and snap fit 12 quantity that sidewall is arranged is more, and clamping is more firm; Optical surface array sensor 20 is limited in draw-in groove 11 by snap fit 12, and snap fit 12 blocks optical surface array sensor 20, and like this, optical surface array sensor 20 is just firmly arranged in draw-in groove 11.
In the present embodiment, the material of light guide plate 10 is transparent PMMA (polymethylmethacrylate) or PC (polycarbonate), and the material of draw-in groove 11 is also PMMA or PC; The color of draw-in groove can be transparent or other color, the preferred black of the present embodiment, and the draw-in groove 11 of black can absorb the light that light guide plate 10 is overflowed, and prevents light leak.
Light guide plate 10 and draw-in groove 11 can be obtained by single injection-molded, and namely light guide plate 10 and draw-in groove 11 are identical material, are put in the mould designed by PMMA or PC, are injection molded into light guide plate 10 and draw-in groove 11; Light guide plate 10 and draw-in groove 11 also can be obtained by secondary injection molding, that is, first injection mo(u)lding light guide plate 10, and then injection mo(u)lding draw-in groove 11, and both combine again, this process, and light guide plate 10 can be the same with the material of draw-in groove 11, also can be different.
In other embodiments, light guide plate only can be provided with snap fit on the surface of optical surface array sensor, and snap fit is one parallel with light guide plate surface or towards the projection of light guide plate surface; Optical surface array sensor is arranged in snap fit.
With reference to figure 6 and Fig. 7 and Fig. 8, and shown in composition graphs 4 and Fig. 5, the light guide plate 10 of redesign is applied in fingerprint imaging module 109, fingerprint imaging module 109 comprises: light guide plate 10, light guide plate 10 is provided with LED holding tank 14, in LED holding tank 14, install LED15 (with reference to figure 8); Optical surface array sensor 20, optical surface array sensor 20 is provided with IC (IntegratedCircuit integrated circuit) chip 13 (with reference to figure 8) for the treatment of electric signal, IC chip 13 adheres on optical surface array sensor 20 by conducting resinl, and optical surface array sensor 20 is arranged in light guide plate 10 by snap fit 12; Optical surface array sensor 20 is connected with the first flexible circuit board 30 by conducting resinl, and the first flexible circuit board 30 is connected with PCB mainboard (scheming not shown) again; Be bent to the side of light guide plate 10 optical surface array sensor 20 dorsad after first flexible circuit board 30 is connected with optical surface array sensor 20, the first flexible circuit board 30 bends rear parcel LED holding tank 14; After first flexible circuit board 30 bends, save the internal placement space of fingerprint imaging module on the one hand; On the other hand, first flexible circuit board 30 is bent to a rear flank of light guide plate 10 optical surface array sensor 20 dorsad, one deck ink can be sprayed in the first flexible circuit board 30, spraying ink after the first flexible circuit board 30 can to a certain extent reflection side light source launch light in light guide plate 10, improve the utilization ratio of light.
In addition, with reference to figure 9, fingerprint imaging module 109 also comprises the cover sheet 40 be located on optical surface array sensor 20, and cover sheet 40 places the surface of contact of object for providing, and cover sheet 40 is by UV glue or double faced adhesive tape or AB is gluing is attached on optical surface array sensor 20; Complete after installation is combined into fingerprint imaging module 109 until each element, one deck glue can be sealed up uniformly in the region that on optical surface array sensor 20, not protected cover plate 40 covers, glue plays the effect of protection optical surface array sensor 20, and the glue of employing can be silica gel or UV glue or AB glue; Or the region covered at the not protected cover plate 40 of optical surface array sensor 20 adheres to one layer tape, can play the effect of dust and moisture and anti-ESD (Electro-Staticdischarge, Electro-static Driven Comb).
Continue with reference to figure 9, when fingerprint imaging module 109 is installed on mobile terminal, containment vessel 50 can be arranged with on cover sheet 40, containment vessel 50 and mobile terminal offset for the through-hole inner surface installing fingerprint imaging module, and containment vessel 50 be adhered on optical surface array sensor 20; In order to increase the fixing fastness of containment vessel 50; shirt rim 51 can be provided with at the outer peripheral face of containment vessel 50 near one end of optical surface array sensor 20; shirt rim 51 is adhered on optical surface array sensor 20; more than shirt rim 51; the sealing area of containment vessel 50 on optical surface array sensor 20 is larger, and it is more firm that containment vessel 50 is fixed.
In addition, in the present embodiment, for strengthening the protection to fingerprint imaging module 109, by protective housing (scheming not shown) parcel fingerprint imaging module 109, fender housing comprises upper shell (scheming not shown) and lower house (scheming not shown), the first flexible circuit board 30, light guide plate 10 and optical surface array sensor 20 in fingerprint imaging module 109 are wrapped up by lower house, and then lower house and upper shell are connected by double faced adhesive tape or welding manner again; Protective housing plays the effect of protection fingerprint imaging module 109.
Second embodiment
Upper shell for protective housing in prior art is connected with the mode of lower house by double faced adhesive tape or laser electric welding or ultra-sonic welded; Adopt double faced adhesive tape to connect the problem existing and connect instability, adopt laser electric welding or ultra-sonic welded to need to buy special equipment, complex process, inefficient problem.The present embodiment adopts following scheme to solve the problem.
With reference to Figure 10, Figure 11, Figure 12 and Figure 13, in the present embodiment, the light guide plate 10 in fingerprint imaging module 109 and optical surface array sensor 20 are fixed by double faced adhesive tape or glue, and fingerprint imaging module 109 is wrapped up by housing; Housing comprises upper shell 60 and lower house 61, and lower house 61 is connected with upper shell 60 after wrapping up the first flexible circuit board 30, light guide plate 10 and optical surface array sensor 20; Wherein, the opposing side in light guide plate 10 of the first flexible circuit board 30, the sidewall of light guide plate 10, the sidewall of optical surface array sensor 20 are wrapped up by lower house 61; Upper shell 60 covers lower house 61, and the surface of optical surface array sensor 20 face away from light guide 10 is relative with upper shell 60.
Continue with reference to Figure 12 and Figure 13, upper shell 60 and lower house 61 adopt sheet metal component material, upper shell 60 and lower house 61 are obtained by stamping forming mode, upper shell 60 and lower house 61 clamping, be specially and be provided with hole 60a on upper shell 60, lower house 61 is provided with protruding 61a, and protruding 61a is arranged in the 60a of hole, achieves the connection of upper shell 60 and lower house 61; Like this, upper shell 60 and lower house 61, by the connected mode of clamping, not by welding technology, improve production efficiency, reduce production cost.
In addition, also can a sheathed containment vessel on the cover sheet of the fingerprint imaging module of the present embodiment, play the effect of protection cover sheet.
Further, light guide plate in the present embodiment also can adopt the structure of light guide plate in the first embodiment, namely, on the basis of the first embodiment, after in fingerprint imaging module, optical surface array sensor is arranged in light guide plate, fingerprint imaging module is wrapped up by lower house, upper shell again with lower house passing hole and protruding clamping, snap fit is identical with the snap fit of lower house with upper shell in the present embodiment, optical surface array sensor is connected more firm with light guide plate.
3rd embodiment
The present embodiment, the structure of fingerprint imaging module is identical with the structure of fingerprint imaging modules in the second embodiment, with reference to Figure 14 and Figure 15, difference is: on upper shell 60, be provided with protruding 61a, lower house 61 is provided with hole 60a, protruding 61a is arranged in the 60a of hole, achieves the connection of upper shell 60 and lower house 61.
4th embodiment
With reference to Figure 16 and Figure 17, the present invention also provides a kind of mobile terminal, comprising: front shroud 70, mesochite 72 and back shroud 74; Front shroud 70, mesochite 71 and back shroud 74 are parallel to each other; The outline of front shroud 70, mesochite 71 and back shroud 74 is quadrilateral substantially, and mesochite 72 is between front shroud 70 and back shroud 74.
Front shroud 70 has viewing area G and button area H, on front shroud 70, button area H is provided with the through hole for installing fingerprint imaging module 109, through hole exposes fingerprint imaging module 109, with reference to figure 9, cover sheet 40 in fingerprint imaging module 109 is arranged with containment vessel 50, the contacted inner surfaces of containment vessel 50 and through hole; Mesochite 72 is provided with display module 71 towards the side of front shroud 70, and display module 71 is relative with viewing area G, and display module 71 is connected with PCB mainboard 73 by the second flexible circuit board (scheming not shown); Fingerprint imaging module 109 is installed on the side of mesochite 72 towards front shroud 70; Front shroud 70 and back cover 74 be assemblied in respectively mesochite 72 above and below.
The mobile terminal of the present embodiment is mobile phone or panel computer.
Although the present invention discloses as above, the present invention is not defined in this.Any those skilled in the art, without departing from the spirit and scope of the present invention, all can make various changes or modifications, and therefore protection scope of the present invention should be as the criterion with claim limited range.
Claims (17)
1. a fingerprint imaging module, is characterized in that, comprising:
Optical surface array sensor;
Light guide plate, described optical surface array sensor is arranged in described light guide plate.
2. fingerprint imaging module as claimed in claim 1, it is characterized in that, described light guide plate is provided with draw-in groove towards the surface of described optical surface array sensor, and the sidewall of described draw-in groove is provided with snap fit;
Described optical surface array sensor is located in described draw-in groove, and is limited in described draw-in groove by described snap fit.
3. fingerprint imaging module as claimed in claim 1, it is characterized in that, described light guide plate is provided with snap fit towards the surface of described optical surface array sensor;
Described optical surface array sensor is arranged in described snap fit.
4. fingerprint imaging module as claimed in claim 1, is characterized in that, also comprise the cover sheet be located on described optical surface array sensor, for providing the surface of contact placing object.
5. fingerprint imaging module as claimed in claim 4, is characterized in that,
Described optical surface array sensor is connected with PCB mainboard by the first flexible circuit board;
Described first flexible circuit board is bent to the side of described light guide plate described optical surface array sensor dorsad after being connected with described optical surface array sensor.
6. fingerprint imaging module as claimed in claim 5, is characterized in that, described light guide plate is also provided with LED holding tank, the described LED holding tank of parcel after described first flexible circuit board bending.
7. fingerprint imaging module as claimed in claim 5, it is characterized in that, described fingerprint imaging module is wrapped up by housing;
Described housing comprises upper shell and lower house;
Described lower house is connected with described upper shell after wrapping up described light guide plate, described first flexible circuit board and described optical surface array sensor.
8. fingerprint imaging module as claimed in claim 7, it is characterized in that, described upper shell is connected by double faced adhesive tape or welding manner with described lower house.
9. fingerprint imaging module as claimed in claim 7, it is characterized in that, described upper shell is provided with hole, and described lower house is provided with projection, and described projection is arranged in described hole; Or,
Described upper shell is provided with projection, and described lower house is provided with hole, and described projection is arranged in described hole.
10. fingerprint imaging module as claimed in claim 4, is characterized in that, the exterior domain of the part that described optical surface array sensor is covered by described cover sheet is provided with silica gel or UV glue or AB glue or adhesive tape.
11. fingerprint imaging modules as claimed in claim 2, it is characterized in that, described light guide plate material is PMMA or PC, and described draw-in groove material is PMMA or PC.
12. 1 kinds of mobile terminals, is characterized in that, comprising:
Mobile terminal shell, the mesochite comprising front shroud and be arranged in parallel with front shroud;
Described front shroud has button area, and the button area of described front shroud is provided with through hole;
Described through hole is for installing the fingerprint imaging module described in any one of claim 1-11, and described fingerprint imaging module is installed on the side of described mesochite towards described front shroud, and described through hole exposes described fingerprint imaging module.
13. mobile terminals as claimed in claim 12, it is characterized in that, described cover sheet is arranged with containment vessel, the contacted inner surfaces of described containment vessel and described through hole, and described containment vessel is adhered on described optical surface array sensor.
14. mobile terminals as claimed in claim 13, is characterized in that, the outer peripheral face of described containment vessel near one end of described optical surface array sensor is provided with shirt rim, and described shirt rim is adhered on described optical surface array sensor.
15. mobile terminals as claimed in claim 12, it is characterized in that, described front shroud also has viewing area;
Described mesochite is provided with display module towards the side of described front shroud, and described display module is relative with described viewing area;
Described display module is connected with PCB mainboard by the second flexible circuit board.
16. mobile terminals as claimed in claim 12, is characterized in that, also comprise:
Back shroud;
Described mesochite is between described front shroud and described back shroud.
17. mobile terminals as claimed in claim 12, it is characterized in that, described mobile terminal is mobile phone or panel computer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201510144363.7A CN104700093A (en) | 2015-03-30 | 2015-03-30 | Fingerprint imaging module and mobile terminal |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510144363.7A CN104700093A (en) | 2015-03-30 | 2015-03-30 | Fingerprint imaging module and mobile terminal |
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| CN201510144363.7A Pending CN104700093A (en) | 2015-03-30 | 2015-03-30 | Fingerprint imaging module and mobile terminal |
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| CN108040494A (en) * | 2015-06-23 | 2018-05-15 | 艾戴克斯公司 | Two-sided fingerprint sensor |
| CN108040494B (en) * | 2015-06-23 | 2022-01-21 | 傲迪司威生物识别公司 | Double-sided fingerprint sensor |
| WO2017024437A1 (en) * | 2015-08-07 | 2017-02-16 | Shanghai Oxi Technology Co., Ltd | Optical fingerprint imaging system and optical assembly thereof |
| US9892307B2 (en) | 2015-08-07 | 2018-02-13 | Shanghai Oxi Technology Co., Ltd | Optical fingerprint imaging system and optical assembly thereof |
| CN106446755B (en) * | 2015-08-12 | 2019-07-16 | 康而富控股股份有限公司 | Identification of fingerprint plate light guide structure |
| CN106446755A (en) * | 2015-08-12 | 2017-02-22 | 康而富控股股份有限公司 | Fingerprint identification plate light guide structure |
| WO2017070863A1 (en) * | 2015-10-28 | 2017-05-04 | Shanghai Oxi Technology Co., Ltd | Fingerprint imaging system and method for forming the same |
| CN107526998A (en) * | 2016-06-21 | 2017-12-29 | 安帝司股份有限公司 | Optical fingerprint sensor and its prism module |
| CN106547309A (en) * | 2016-10-06 | 2017-03-29 | 南昌与德通讯技术有限公司 | Terminal unit and its operational approach |
| CN106249344A (en) * | 2016-10-20 | 2016-12-21 | 武汉华星光电技术有限公司 | Display device, backlight module and light guide plate thereof |
| CN108388826B (en) * | 2017-02-03 | 2020-06-02 | 上海箩箕技术有限公司 | Electronic device |
| CN108388826A (en) * | 2017-02-03 | 2018-08-10 | 上海箩箕技术有限公司 | Electronic equipment |
| CN109145682A (en) * | 2017-06-16 | 2019-01-04 | 固安翌光科技有限公司 | A kind of optical fingerprint identification device and preparation method thereof |
| CN109145682B (en) * | 2017-06-16 | 2022-02-22 | 固安翌光科技有限公司 | Optical fingerprint identification device and preparation method thereof |
| CN108038477A (en) * | 2018-01-05 | 2018-05-15 | 敦捷光电股份有限公司 | The protective shell of optical sensing |
| CN108038477B (en) * | 2018-01-05 | 2022-03-22 | 敦泰电子有限公司 | Protective housing for optical sensing |
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