CN108241237B

CN108241237B - Backlight module, electronic device and installation method of backlight module

Info

Publication number: CN108241237B
Application number: CN201810106234.2A
Authority: CN
Inventors: 欧阳志斌
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2018-01-31
Filing date: 2018-01-31
Publication date: 2020-10-02
Anticipated expiration: 2038-01-31
Also published as: CN108241237A

Abstract

The application discloses a backlight module, an electronic device and a mounting method of the backlight module. The backlight module includes: the back frame comprises a bottom plate and a side wall, wherein the side wall is bent relative to the bottom plate, and a hollow area is arranged on the bottom plate; the connecting piece is arranged at the hollow area to cover the hollow area; set up light source, flexible circuit board, light guide plate and even light rete on the bottom plate, wherein: the light guide plate comprises a light incident surface and a light emergent surface, the light source is arranged on one side of the light incident surface, and the light homogenizing film layer is arranged on the light emergent surface; the flexible circuit board is arranged on one side of the light source, back to the light incident surface, and the flexible circuit board is electrically connected with the light source. Therefore, when other elements of the backlight module are assembled, the front surface (the light-emitting direction of the backlight module) of the back frame and the bottom surface (the direction opposite to the light-emitting direction) of the back frame are selected to be assembled according to actual conditions, and the combination of forward assembly and reverse assembly is formed, so that the assembly of the backlight module is facilitated.

Description

Backlight module, electronic device and installation method of backlight module

Technical Field

The present disclosure relates to a backlight module, and more particularly, to a backlight module, an electronic device and a method for mounting the backlight module.

Background

At present, with the development of science and technology, electronic devices such as smart phones and the like are gradually becoming necessities of life of people.

The backlight module is an important component of an electronic device, and currently, the backlight module of a portable electronic device such as a smart phone generally forms an accommodating space by a back frame, or an iron frame, and then assembles other optical elements of the backlight module into the accommodating space. The back frame of the prior art is usually a fixed integral structure, and the shape and size of the optical elements such as the light source, the diffusion film, the light guide plate, etc. of the backlight module are different, and need to be installed at a plurality of different positions, which causes inconvenience in installation.

Disclosure of Invention

In one aspect, an embodiment of the present application provides a backlight module, which includes:

the back frame comprises a bottom plate, a side wall and a top plate, wherein the side wall is bent relative to the bottom plate, a hollow area is arranged on the bottom plate, and the bottom plate and the side wall jointly enclose an accommodating space; the top plate is bent from one end, away from the bottom plate, of the side wall to one side provided with the bottom plate, and the bending direction is parallel to the bottom plate;

the connecting piece is arranged at the hollow area to cover the hollow area; one end of the connecting piece is hinged or pivoted with the side wall, and the other end of the connecting piece is clamped and connected with the bottom plate;

set up light source, flexible circuit board, light guide plate and even light rete on the bottom plate, wherein:

the light guide plate comprises a light incident surface and a light emergent surface, the light source is arranged on one side of the light incident surface, and the light homogenizing film layer is arranged on the light emergent surface;

the flexible circuit board is arranged on one side of the light source, which is back to the light incident surface, and the flexible circuit board is electrically connected with the light source; and a buffer piece is arranged between the top plate and the light source.

On the other hand, an embodiment of the present application further provides an electronic device, where the electronic device includes a display panel and a backlight module, and the backlight module provides backlight to the display panel, where the backlight module includes the backlight module described above.

In another aspect, an embodiment of the present application further provides an installation method of a backlight module, where the backlight module includes the backlight module described above, and the installation method includes:

adhering the buffer piece to one side surface of the top plate facing the bottom plate;

assembling a reflecting sheet, a light guide plate and a light homogenizing film layer on the bottom plate in sequence from the direction of the top plate;

assembling the flexible circuit board to one side of the side wall, which is positioned in the accommodating space, from the hollow area, and further assembling the light source between the flexible circuit board and the light incident surface of the light guide plate;

and coating the hollow area through the connecting piece.

The back frame is provided with the bottom plate, the bottom plate is provided with the back frame, the bottom plate.

Drawings

Fig. 1 is a schematic structural diagram of a backlight module provided in the first embodiment of the present application, which is cut along the AA direction of the flexible circuit board and the light source shown in fig. 3;

fig. 2 is a schematic structural diagram of a backlight module provided in the first embodiment of the present application, which is cut along the BB direction of the flexible circuit board and the light source shown in fig. 3;

FIG. 3 is a schematic structural diagram of a flexible circuit board and a light source of a backlight module according to a first embodiment of the present application;

FIG. 4 is a schematic structural diagram of a back frame and a flexible circuit board of the backlight module shown in FIG. 1;

fig. 5 is a schematic structural diagram of a backlight module according to a second embodiment of the present application;

FIG. 6 is a schematic structural diagram of a conventional flexible printed circuit board and a light source combined together;

FIG. 7 is a schematic structural diagram of a combined flexible circuit board and a light source according to an embodiment of the present application;

fig. 8 is a schematic structural diagram of a backlight module according to a third embodiment of the present application;

fig. 9 is a schematic structural diagram of a backlight module according to a fourth embodiment of the disclosure;

fig. 10 is a flowchart of an installation method of a backlight module according to an embodiment of the present application;

FIG. 11 is a schematic process flow diagram corresponding to the installation method shown in FIG. 10;

fig. 12 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

fig. 13 is an exploded schematic view of another electronic device according to an embodiment of the present disclosure.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the specific embodiments described herein are merely illustrative of the application and are not limiting of the application. It should be further noted that, for the convenience of description, only some of the structures related to the present application are shown in the drawings, not all of the structures. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms "first", "second", etc. in this application are used to distinguish between different objects and not to describe a particular order. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

Referring to fig. 1 to 3, fig. 1 is a schematic structural diagram of a backlight module according to a first embodiment of the present application, cut along an AA direction of a flexible circuit board and a light source shown in fig. 3; fig. 2 is a schematic structural diagram of a backlight module provided in the first embodiment of the present application, which is cut along the BB direction of the flexible circuit board and the light source shown in fig. 3; fig. 3 is a schematic structural diagram of a flexible circuit board and a light source of a backlight module according to a first embodiment of the present application. In this embodiment, the backlight module 10 includes a back frame 11, a light source 12, a Flexible Printed Circuit 13 (FPC), a light guide plate 14, a light uniformizing film layer 15, a reflective sheet 16, and a connecting member 111.

The back frame 11 is a box-shaped structure with an opening on one side, the back frame 11 includes a bottom plate 112 and a side wall 113, the side wall 113 is bent relative to the bottom plate 112, and the bottom plate 112 and the side wall 113 enclose an accommodating space for arranging other elements of the backlight module 10, such as the light source 12. The back frame 11 may be made of metal, such as iron or aluminum, or plastic.

As shown in fig. 1, the hollow area 100 is disposed at one end of the bottom plate 112 close to the side wall 113, the bottom plate 112 and the side wall 113 of the embodiment are not directly connected, that is, the bottom plate 112 and the side wall 113 are disposed at an interval, and the hollow area 100 extends to the side wall 113. It should be understood that in other embodiments, the hollow-out area 100 may also be disposed at an end of the bottom plate 112 close to the side wall 113, but does not extend to the side wall 113, and the bottom plate 112 and the side wall 113 may be directly connected by bending.

The connection member 111 is disposed at the hollow area 100 to cover the hollow area 100. More specifically, the connecting member 111 covers the hollow area 100 and then covers the bottom plate 112 and the side wall 113, so that the connecting member 111 is recessed downward with respect to the bottom plate 112 as shown in fig. 1.

The attachment member 111 may be an adhesive tape 1110 having adhesive on both sides. It covers around the hollow area 100, and extends to the side wall 113, and extends to the direction of the end of the side wall 113 far away from the bottom plate 112, for increasing the stability between the bottom plate 112 and the side wall 113.

The adhesive tape 1110 can cover the hollow area 100 after assembling other components of the backlight module 10, so as to prevent water vapor from entering the accommodating space formed by the back frame 110, thereby effectively protecting other components of the backlight module 10. Further, the adhesive tape 1110 may be black PET (Polyethylene terephthalate) adhesive tape, and the black PET may also prevent light leakage of the backlight module 10 in the hollow area.

The reflective sheet 16 is disposed on the bottom plate 112 of the back frame 11 and located inside the accommodating space. The reflective sheet 16 may reflect incident light.

The light guide plate 14 includes a light incident surface 141 and a light emitting surface 142. The light source 12 is disposed on the light incident surface 141, the light uniformizing film layer 15 is disposed on the light emitting surface 142, and the reflector 16 is disposed on a side of the light guide plate 14 opposite to the light emitting surface 142. The light incident surface 141 and the light emitting surface 142 are two surfaces perpendicular to each other of the light guide plate 14.

The light source 12 includes a PCB (Printed Circuit Board) Circuit Board 121 and a light emitting Chip 122, the light emitting Chip 122 may be packaged On the PCB Circuit Board 121 by a GOB (Chip On Board) packaging technique, wherein the light emitting Chip 122 is a bare Chip.

The bare chip using COB packaging technology is that the chip main body and the I/O terminal are arranged above the crystal, the bare chip is bonded on the PCB 121 by conductive adhesive or heat-conducting adhesive during welding, after solidification, a Bonder (chip bonding) machine is used to connect metal wires (aluminum or copper) on the I/O terminal welding area of the bare chip and the corresponding bonding pad of the PCB 121 under the action of ultrasonic and hot pressing, and after test is qualified, resin adhesive is sealed.

Specifically, as shown in fig. 3, a package hole 1210 is disposed on the PCB 121, and the light emitting chip 122 is packaged in the package hole 1210. And further filling a material such as a resin paste 123 into the package hole 1210, as shown in fig. 1. The opening of the package hole 1210 is disposed opposite to the light incident surface 141 of the light guide plate 14.

The flexible circuit board 13 is disposed on a side of the light source 12 opposite to the light incident surface 141. The flexible circuit board 13 is electrically connected to the light source 12. Specifically, the flexible circuit board 13 is disposed between the PCB circuit board 121 and the sidewall 113, and the flexible circuit board 13 is parallel to and electrically connected to a side surface of the PCB circuit board 121 close to the sidewall 113. An external control signal is transmitted to the light emitting chip 122 through the flexible circuit board 13 and the PCB 121 to control the light emission of the light emitting chip 122.

Further, the flexible circuit board 13 is bonded to the side wall 113. Specifically, a double-sided tape 114 is further provided between the side wall 113 and the flexible circuit board 13, and the flexible circuit board 13 is bonded to the side wall 113 by the double-sided tape 114.

Further, the flexible circuit board 13 may be disposed on the connecting member 111 and be in contact with the connecting member 111, so that the flexible circuit board 13 is adhered to the connecting member 111 as the adhesive tape 1110.

Referring to fig. 4, fig. 4 is a schematic structural diagram of a back frame and a flexible circuit board of the backlight module shown in fig. 1. At least one of the side wall 113 and the bottom plate 112 is provided with an opening communicated with the accommodating space. In the embodiment shown, the side wall 113 and the bottom plate 112 are commonly provided with the opening 1130. The flexible circuit board 13 extends to a side of the back frame 11 away from the accommodating space through the opening 1130.

Referring to fig. 1 and 2, the light uniformizing film layer 15 includes a diffusion film 151, a first antireflection film 152 and a second antireflection film 153 disposed on the light emergent surface 142 in a manner of sequentially separating from each other.

Diffusion film 151, first antireflection film 152, and second antireflection film 153 may be non-composite films, i.e., film layers that are independent of each other. In addition, the diffusion film 151, the first antireflection film 152, and the second antireflection film 153 may also be composite films. The method specifically comprises two conditions:

in the first case, the first antireflection film 152 and the second antireflection film 153 are composite films, that is, the first antireflection film 152 and the second antireflection film 153 are integrated films, and the integrated films and the diffusion film 151 are independent films.

In the second case, diffusion film 151, first antireflection film 152, and second antireflection film 153 are composite films, that is, diffusion film 151, first antireflection film 152, and second antireflection film 153 are integrated into one film layer.

First antireflective film 152 may be referred to as a lower antireflective film and second antireflective film 153 may be referred to as an upper antireflective film.

The light source 12 is further provided with a buffer member 18, and the buffer member 18 can buffer and protect the light source 12 and can support the elements above the light source 12. The buffer 18 may be foam adhesive with adhesive on both sides to secure the light source 12.

The buffer member 18 is further provided with a light-shielding tape 17, and the light-shielding tape 17 is a light-shielding tape having adhesiveness on both sides. One end of the light-shielding tape 17 is further extended from the buffer member 18 toward the uniform light film layer 15 and then disposed above the second antireflection film 153, so as to bond and fix the second antireflection film 153.

The other end of the light-shielding tape 17 may be attached to the side wall 113.

In other embodiments, the other end of the light shielding tape 17 may extend downward from the upper end of the sidewall 113 along the sidewall. As shown in fig. 5 in particular, the other end of the light-shielding tape 17 may extend downward to be in contact with the adhesive tape 1110, whereby the side wall 113 is covered with the adhesive tape, thereby increasing the adhesive area.

The region where the light-shielding tape 17 is disposed is a non-display region, and the region outside the light-shielding tape 17 is a display region. In this embodiment, the flexible circuit board 13 is disposed between the PCB circuit board 121 and the sidewall 113, and is parallel to the side surface of the PCB circuit board 121 close to the sidewall 113. Therefore, compared with the existing scheme that the flexible circuit board 13 and the side face of the PCB 121 close to the side wall 113 are vertically arranged, the space of a non-display area can be saved, and the screen occupation ratio is improved.

Fig. 6 and 7 are combined, wherein fig. 6 is a schematic structural diagram of a conventional flexible circuit board and a light source combined together, and fig. 7 is a schematic structural diagram of a flexible circuit board and a light source combined together according to an embodiment of the present disclosure. First, as shown in fig. 6, in the conventional solution, the flexible circuit board 13 is perpendicular to the side surface of the PCB 121 close to the side wall 113, and since there is a pad between the flexible circuit board 13 and the PCB 121, the width is required to be about 0.6mm, and thus the occupied non-display area space is relatively large.

As shown in fig. 7, in the embodiment of the present application, since the flexible circuit board 13 is disposed between the PCB 121 and the sidewall 113 and is parallel to the side surface of the PCB 121 close to the sidewall 113, a width of 0.6mm required by the pad in the prior art can be saved, and only a thickness of the flexible circuit board 13 is about 0.12mm, so that a space occupied by the non-display area is relatively small.

Referring to fig. 8, fig. 8 is a schematic structural diagram of a backlight module according to a third embodiment of the present application. As shown in fig. 8, the backlight module 30 still includes a back frame 31, a light source 32, a flexible circuit board 33, a light guide plate 34, a light uniformizing film layer 35, a reflective sheet 36 and a connecting member 311.

The structures and the connection relations of the light source 32, the flexible circuit board 33, the light guide plate 34, the light uniformizing film layer 35, the reflective sheet 36 and the connection piece 311 are respectively the same as those of the light source 12, the flexible circuit board 13, the light guide plate 14, the light uniformizing film layer 15, the reflective sheet 16 and the connection piece 111, and are not described again here.

In this embodiment, the back frame 31 is different from the back frame 11 of the previous embodiments in that the back frame 31 of this embodiment includes a bottom plate 312, a side wall 313 and a top plate 314.

The side walls 313 are bent with respect to the bottom plate 312. The side wall 313 and the bottom plate 312 are the same as the side wall 113 and the bottom plate 112, respectively, and are not described herein again.

The top plate 314 is bent from one end of the side wall 313 away from the bottom plate 312 to a side where the bottom plate 312 is disposed, and the bent direction is parallel to the bottom plate 312.

The top plate 314 can prevent the force of the display panel on the backlight module from being transmitted to the light source 32, thereby avoiding the problems of lamp explosion, shadow, unevenness and the like of the backlight. In this embodiment, the opening for extending the flexible circuit board 33 to the side of the back frame 31 away from the accommodating space may be formed by the bottom plate 312, the side wall 313 and the top plate 314.

A buffer 38 is disposed between the top plate 314 and the light source 32, and the buffer 38 can be a foam adhesive with adhesive on both sides to fix the light source 32. In other embodiments, the dampener 38 may be omitted.

The top plate 314 is further provided with a light-shielding tape 37, and the light-shielding tape 37 has adhesiveness on both sides. One end of the light shielding tape 37 further extends from the top plate 314 toward the light uniformizing film layer 35 and is disposed above the second antireflection film 353, so as to bond and fix the second antireflection film 353.

The other end of the light-shielding tape 37, i.e., the end away from the second antireflection film 353, may extend from the top plate 314 to the side wall 313, and be joined to the side wall 313.

In other embodiments, similar to the embodiment shown in fig. 5, the other end of the light shielding tape 37 may extend downward from the upper end of the side wall 313 along the side wall 313 and may extend downward to meet the adhesive tape 3110, whereby the side wall 313 is covered with the adhesive tape, thereby increasing the adhesive area.

Referring to fig. 9, fig. 9 is a schematic structural diagram of a backlight module according to a fourth embodiment of the present disclosure. As shown in fig. 9, the backlight module 40 still includes a back frame 41, a light source 42, a flexible circuit board 43, a light guide plate 44, a light uniformizing film 45, a reflective sheet 46 and a connecting member 411.

The structures and the connection relations of the light source 42, the flexible circuit board 43, the light guide plate 44, the light-equalizing film 45 and the reflective sheet 46 are respectively the same as those of the light source 32, the flexible circuit board 33, the light guide plate 34, the light-equalizing film 35 and the reflective sheet 36, and are not described herein again.

In this embodiment, the back frame 41 still includes a bottom plate 412, a side wall 413 and a top plate 414. The side walls 413 are bent with respect to the bottom plate 412. Unlike the back frame 31 of the previous embodiment, the connecting member 411 of this embodiment has one end pivotally connected to the side wall 413 and the other end detachably connected to the bottom plate 412. Specifically, the connection member 411 and the sidewall 413 may be connected by a rotation shaft, and thus the connection member 411 may rotate around the rotation shaft. When it is necessary to assemble the light source 42 and the flexible circuit board 43, the connecting member 411 rotates around the rotation axis in a direction away from the bottom plate 412 to leak the hollow area, so as to assemble the light source 42 and the flexible circuit board 43 into the accommodating space formed by the back frame from the hollow area, and then the connecting member 411 rotates around the rotation axis in a direction close to the bottom plate 412 and is detachably connected to the bottom plate 412.

The detachable connection between the connecting member 411 and the bottom plate 412 may be a mutual engaging manner of two fasteners, or an engaging manner of a fastener and a fastening hole, and the structure of the connection is not specifically limited in this embodiment.

In other embodiments, one end of the connecting member 411 may be hinged to the sidewall 413.

A buffer 48 is also disposed between the top plate 414 and the light source 42. The buffer 48 may be a foam adhesive with adhesive on both sides to secure the light source 42.

The top plate 414 is further provided with a light-shielding tape 47, and the light-shielding tape 47 is a light-shielding tape having adhesiveness on both sides. One end of the light shielding tape 47 is further extended from the top plate 414 and then disposed above the second antireflection film 453 to bond and fix the second antireflection film 453.

The other end of the light shielding tape 47, i.e. the end away from the light uniformizing film layer 45, may extend from the top plate 414 to the side wall 413, and is connected to the side wall 413.

In other embodiments, similar to the embodiment shown in fig. 5, the other end of the light shielding tape 47 can extend from the upper end of the sidewall 413 to the bottom of the sidewall 413 along the sidewall 413, so that the sidewall 413 is covered by the adhesive tape, thereby increasing the adhesive area.

Referring to fig. 10 and 11 together, fig. 10 is a flowchart illustrating an installation method of a backlight module according to an embodiment of the present application, and fig. 11 is a schematic process flow diagram corresponding to the installation method illustrated in fig. 10. It should be understood that the backlight module can be the backlight module of any of the embodiments described above. For convenience of description, the present embodiment is described by taking the backlight module 30 shown in fig. 8 as an example. As shown in fig. 10, the mounting method of the present embodiment includes the steps of:

step S1: the bumper 38 is affixed to a side of the top plate 314 facing the bottom plate 312.

As shown in step S1 of fig. 11, the buffer 38 can be assembled from the direction of the top plate 314 or the hollow area 300 of the bottom plate 312.

Step S2: the reflective sheet 36, the light guide plate 34, and the light uniformizing film layer 35 are mounted on the bottom plate 312 in this order from the direction of the top plate 314.

This step may be a forward mounting step of sequentially mounting the reflection sheet 36, the light guide plate 34, the diffusion film 351 of the light uniformizing film layer 35, the first antireflection film 352, and the second antireflection film 353 on the base plate 312 in a forward mounting direction as shown in fig. 11.

Step S3: the flexible circuit board 33 is assembled to one side of the side wall 313 in the accommodating space from the hollow area 300, and the light source 32 is further assembled between the flexible circuit board 33 and the light incident surface 341 of the light guide plate 34. Wherein, before assembling the flexible circuit board 33, an adhesive tape 315 may be further pasted on the side surface of the side wall 313 in the accommodating space.

Before this step, a light shielding tape 37 may be further pasted on the top plate 314.

This step may be a reverse mounting, i.e., a reverse mounting direction as shown in fig. 11, in which the flexible circuit board 33 and the light source 32 are sequentially mounted.

Step S4: the hollow area 300 is covered by a connecting member 311. The connecting member 311 may be an adhesive tape 3110.

Therefore, the backlight module can be conveniently installed by combining the forward installation and the reverse installation, and the installation efficiency is improved.

Referring to fig. 12, fig. 12 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure. As shown in fig. 12, the electronic device 70 of the present embodiment includes a backlight module 71 and a display panel 72. The backlight module 71 provides backlight to the display panel 72, wherein the backlight module 71 is the aforementioned backlight module.

The display panel 72 includes a lower polarizer 711, an array substrate 712, a color filter substrate 713, and an upper polarizer 714 sequentially disposed in a light emitting direction of the backlight module 71 in a direction away from the backlight module 71. A liquid crystal layer (not shown) is further disposed between the array substrate 712 and the color filter substrate 713. The array substrate 712 and the lower polarizer 711 are respectively bonded to two ends of a light-shielding tape 717 of the backlight module 71.

The electronic device can be a smart phone, a tablet computer, a palm computer, a smart watch and the like.

Referring to fig. 13, fig. 13 is an exploded schematic view of another electronic device according to an embodiment of the present disclosure. In this embodiment, the electronic device 80 may be a smart phone, and in other embodiments, the electronic device may also be a tablet computer, a palm computer, a smart watch, and the like.

In the present embodiment, the electronic device 80 includes a rear housing 81, a middle frame 82, a backlight module 83, a display panel 84, and a cover plate 85.

The middle frame 82 is fixedly connected with the rear case 81.

The display panel 84 is stacked on the backlight module 83, and both the display panel 84 and the backlight module 83 are fixed on the middle frame 82.

The backlight module 83 is used for providing backlight for the display panel 84, and may be the backlight module described above.

The display panel 84 may be a liquid crystal display panel or other display panel.

The cover plate 85 covers the display panel 84. The cover 85 may be a transparent glass cover, and in the non-display area, the cover 85 may be opaque. For example, the cover plate 85 is coated with a light shielding ink in the non-display area.

It is to be understood that other structures of the electronic device, such as a circuit board, etc., may be provided between the rear case 81 and the middle frame 82, and will not be specifically described herein since the present application is not directed to improvements of these components.

In other embodiments, the electronic device 80 may have other structures, and the description of the structure of the electronic device 80 is not intended to limit the scope of the present application.

The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.

Claims

1. A method for mounting a backlight module, the backlight module comprising:

the connecting piece is arranged at the hollow area to cover the hollow area;

the flexible circuit board is arranged on one side of the light source, which is back to the light incident surface, and the flexible circuit board is electrically connected with the light source;

the installation method comprises the following steps:

adhering a buffer piece to one side surface of the top plate facing the bottom plate;

and coating the hollow area through the connecting piece.

2. The method of mounting of claim 1, wherein the hollowed-out area is disposed at an end of the base plate proximate to the side wall.

3. The mounting method according to claim 1, wherein the light source comprises a PCB circuit board and a light emitting chip disposed on the PCB circuit board, wherein the PCB circuit board is electrically connected to the flexible circuit board.

4. The mounting method according to claim 3, wherein the flexible circuit board is disposed between the PCB circuit board and the side wall, and the flexible circuit board is disposed in parallel with a side surface of the PCB circuit board close to the side wall, and further bonded to the side wall and/or the connector.

5. The mounting method according to claim 1, wherein the light uniformizing film layer comprises a diffusion film, a first antireflection film and a second antireflection film which are arranged on the light emergent surface in a sequentially distant manner;

the backlight module further comprises a reflector plate, and the reflector plate is arranged on one side, back to the light emergent surface, of the light guide plate.

6. The mounting method according to claim 5, wherein a light-shielding tape is further disposed on the top plate, and the light-shielding tape is further disposed on the second antireflection film after extending from the top plate to the direction of the uniform light film layer.

7. The mounting method according to claim 6, wherein an end of the light shielding tape remote from the second antireflection film extends from the top plate to the side wall.

8. An electronic device, comprising a display panel and a backlight module providing backlight to the display panel, wherein the backlight module is formed by the installation method according to any one of claims 1 to 7.