CN108254972B

CN108254972B - Backlight module, electronic device and installation method of backlight module

Info

Publication number: CN108254972B
Application number: CN201810105975.9A
Authority: CN
Inventors: 欧阳志斌
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2018-01-31
Filing date: 2018-01-31
Publication date: 2020-07-03
Anticipated expiration: 2038-01-31
Also published as: CN108254972A

Abstract

The application discloses a backlight module, an electronic device and a mounting method of the backlight module. The backlight module includes: the upper back frame and the lower back frame are detachably connected, and an accommodating space is formed between the upper back frame and the lower back frame; light source and the flexible circuit board of setting in the accommodation space to and set up light guide plate and the even light rete on back of the body frame down, wherein: the flexible circuit board and the light homogenizing film layer are respectively arranged on two opposite sides of the light source, the flexible circuit board is arranged between the light source and the lower back frame, and the flexible circuit board is electrically connected with the light source; the light guide plate comprises a light incident surface and a light emergent surface, the light source is arranged on one side of the light incident surface, and the light homogenizing film layer is arranged on the light emergent surface. Therefore, when other elements of the backlight module are assembled, the upper back frame and the lower back frame can be disassembled firstly, the other elements of the backlight module are assembled on the lower back frame, and then the upper back frame and the lower back frame are assembled, so that the situation that the upper back frame obstructs the installation can be avoided, and the installation of the backlight module is facilitated.

Description

Backlight module, electronic device and installation method of backlight module

Technical Field

The present disclosure relates to a backlight module, and more particularly, to a backlight module, an electronic device and a method for mounting the backlight module.

Background

At present, with the development of science and technology, electronic devices such as smart phones and the like are gradually becoming necessities of life of people.

The backlight module is an important component of an electronic device, and currently, the backlight module of a portable electronic device such as a smart phone generally forms an accommodating space by a back frame, or an iron frame, and then assembles other optical elements of the backlight module into the accommodating space. The back frame of the prior art is usually a fixed integral structure, and the shape and size of the optical elements such as the light source, the diffusion film, the light guide plate, etc. of the backlight module are different, and need to be installed at a plurality of different positions, which causes inconvenience in installation.

Disclosure of Invention

In one aspect, an embodiment of the present application provides a backlight module, which includes:

the upper back frame and the lower back frame are detachably connected, and an accommodating space is formed between the upper back frame and the lower back frame;

the setting is in light source and flexible circuit board in the accommodation space, and set up and be in light guide plate and even light rete on the back of the body frame down, wherein:

the flexible circuit board and the light uniformizing film layer are respectively arranged on two opposite sides of the light source, the flexible circuit board is arranged between the light source and the lower back frame, and the flexible circuit board is electrically connected with the light source;

the light guide plate includes income plain noodles and play plain noodles, the light source sets up income plain noodles one side, even light rete sets up on going out the plain noodles.

On the other hand, an embodiment of the present application further provides an electronic device, where the electronic device includes a display panel and a backlight module, the backlight module provides backlight to the display panel, and the backlight module includes the backlight module described above.

In another aspect, an embodiment of the present application further provides an installation method of a backlight module, where the backlight module includes the backlight module described above, and the installation method includes:

disposing a reflection sheet and a flexible circuit board on the base plate from a direction of the top plate, and disposing the flexible circuit board and the reflection sheet at an interval;

assembling the light source on the flexible circuit board, and sequentially assembling the light guide plate and the light uniformizing film layer on the reflecting sheet;

transferring the buffer member to the light source;

and the upper back frame and the lower back frame are detachably assembled.

The back frame is arranged to be of the structure of the upper back frame and the lower back frame which are detachably connected, so that the upper back frame and the lower back frame can be detached firstly when other elements of the backlight module are assembled, the other elements of the backlight module are assembled on the lower back frame, and then the upper back frame and the lower back frame are assembled, so that the situation that the upper back frame hinders installation can be avoided, and the installation of the backlight module is facilitated.

Drawings

Fig. 1 is a schematic structural diagram of a backlight module according to a first embodiment of the present application;

fig. 2 is a schematic structural diagram of a backlight module according to a first embodiment of the present application;

FIG. 3 is a schematic structural diagram of a flexible circuit board and a back frame assembly;

fig. 4 is a schematic structural view of the second double-sided adhesive tape 134;

fig. 5 is a schematic structural diagram of a backlight module according to a third embodiment of the present application;

fig. 6 is a schematic structural diagram of a backlight module according to a fourth embodiment of the disclosure;

fig. 7 is a schematic structural diagram of a backlight module according to a fifth embodiment of the present application;

fig. 8 is a flowchart of an installation method of a backlight module according to an embodiment of the present application;

FIG. 9 is a schematic process flow diagram corresponding to the installation method shown in FIG. 8;

fig. 10 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

fig. 11 is an exploded schematic view of another electronic device according to an embodiment of the present disclosure.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the specific embodiments described herein are merely illustrative of the application and are not limiting of the application. It should be further noted that, for the convenience of description, only some of the structures related to the present application are shown in the drawings, not all of the structures. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms "first", "second", etc. in this application are used to distinguish between different objects and not to describe a particular order. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

Referring to fig. 1, fig. 1 is a schematic structural diagram of a backlight module according to a first embodiment of the present application. In this embodiment, the backlight module 10 includes a back frame assembly 11, a light source 12, a Flexible Printed Circuit 13 (FPC), a light guide plate 14, a light uniformizing film layer 15, and a reflector 16.

The back frame assembly 11 includes an upper back frame 110 and a lower back frame 111. The upper back frame 110 and the lower back frame 111 are detachably connected to form a receiving space for accommodating other components of the backlight module 10, such as the light source 12 and the flexible circuit board 13.

Specifically, the lower back frame 111 includes a bottom plate 1110 and a lower sidewall 1111 connected to the bottom plate 1110 in a bent manner. The lower sidewall 111 is bent toward the upper back frame 110. The upper back frame 110 includes a top plate 1101 and an upper sidewall 1102 bent and connected to the top plate 1101. The bottom plate 1110 and the top plate 1101 are parallel to each other. The top plate 1101 can prevent the force of the display panel on the backlight module from being transmitted to the light source 12, thereby avoiding the problems of lamp explosion, dark shadow, unevenness and the like of the backlight.

The upper sidewall 1102 is bent toward the lower back frame 111. The upper sidewall 1102 and the lower sidewall 1111 are detachably connected.

Specifically, the upper sidewall 1102 and the lower sidewall 1111 are detachably connected in a snap-fit manner. The upper sidewall 1102 is provided with an engaging hole 1103, and the lower sidewall 1111 is provided with an engaging block 1112. The upper and

lower walls

1102, 1111 are engaged by the engagement holes 1103 and the engagement blocks 1112 to form a snap-fit connection.

In other embodiments, in order to better achieve the engagement between the lower sidewall 1111 and the upper sidewall 1102, a guide portion may be provided on the lower sidewall 1102. Referring to fig. 2, a guide portion 1104 is disposed on a side surface of the upper sidewall 1102 facing the lower sidewall 1111, and the guide portion 1104 may be parallel to the inclined edge of the engaging block 1112. The guide portion 1104 is used to guide the upper wall 1102 to slide downward along the engaging block 1112 of the lower wall 1111 when the upper wall 1102 is engaged with the lower wall 1111, thereby facilitating the engagement of the engaging block 1112 with the engaging hole 1103.

Referring to fig. 1 again, in the present embodiment, the base plate 1110 includes a first bearing portion 1113 and a second bearing portion 1114. The first bearing portion 1113 is connected to the lower sidewall 1111 in a bending manner, and the second bearing portion 1114 is connected to an end of the first bearing portion 1113 away from the lower sidewall 1111. The distance H1 between first carrier 1113 and the plane of top plate 1101 is greater than the distance H2 between second carrier 1114 and the plane of top plate 1101.

The upper back frame 110 and the lower back frame 111 may be made of the same material, and may be made of metal, such as iron, aluminum, or plastic.

The flexible circuit board 13 is disposed between the light source 12 and the lower back frame 111, and more specifically, the flexible circuit board 13 is disposed between the light source 12 and the first bearing portion 1113 of the bottom plate 112, and a first double-sided tape 113 is disposed between the flexible circuit board 13 and the first bearing portion 1113, and the flexible circuit board 13 is connected to the first bearing portion 1113 of the bottom plate 112 through the first double-sided tape 113.

In conjunction with the foregoing, the distance H1 between the first carrier 1113 and the plane of the top plate 1101 is greater than the distance H2 between the second carrier 1114 and the plane of the top plate 1101, wherein the difference between H1 and H2 may be equal to the thickness of the flexible circuit board 13, such that the flexible circuit board 13 may be flush with the second carrier 1114 of the bottom plate 112.

Referring to fig. 3, fig. 3 is a schematic structural diagram of the flexible circuit board and the back frame assembly. At least one of the upper back frame 110 and the lower back frame 111 is provided with an opening 1105 communicating with the accommodating space, and in the embodiment shown in fig. 3, the opening 1105 is provided on both the upper back frame 110 and the lower back frame 111. The flexible circuit board 13 extends to a side of the upper back frame 110 and the lower back frame 111 far away from the accommodating space through the opening 1105

Referring to fig. 1 again, in the present embodiment, the light source 12 is disposed on the flexible circuit board 13. The flexible circuit board 13 is electrically connected to the light source 12.

The Light source 12 may be a plurality of LED (Light Emitting Diode) lamps arranged at intervals.

The reflective sheet 16 is disposed on the bottom plate 1110 of the lower back frame 111 and located inside the accommodating space. The reflective sheet 16 may reflect incident light. The reflective sheet 16 is disposed spaced apart from the flexible circuit board 13.

The light guide plate 14 is disposed on the lower back frame 111, specifically, on the reflective sheet 16. The light guide plate 14 includes a light incident surface 141 and a light emitting surface 142. The light source 12 is disposed on one side of the light incident surface, and the light homogenizing film layer 15 is disposed on the light emitting surface 142. The light incident surface 141 and the light emitting surface 142 are two surfaces of the light guide plate 14 perpendicular to each other, and the flexible circuit board 13 and the reflective sheet 16 are disposed on a side of the light guide plate 14 facing away from the light emitting surface 142.

The flexible circuit board 13 further extends from the light source 12 toward the light guide plate 14 and is further located between the light guide plate 14 and the first carrier part 1113 of the chassis 1110. That is, the flexible circuit board 13 and the light uniformizing film layer 15 are respectively disposed on two opposite sides of the light guide plate 14, and similarly, the flexible circuit board 13 and the light uniformizing film layer 15 are respectively disposed on two opposite sides of the light source 12, so that a carrying element for carrying the flexible circuit board 12 when the flexible circuit board 13 and the light uniformizing film layer 15 are on the same side can be saved, thereby saving the cost and saving the space where the carrying element is located.

The flexible circuit board 13 is further connected to the light guide plate 14 by a double-sided adhesive tape 124. A second double-sided tape 134 is further disposed between the flexible circuit board 13 and the light guide plate 14. The flexible circuit board 13 is further connected to the light guide plate 14 by a second double-sided adhesive tape 134.

Referring to fig. 4, fig. 4 is a schematic structural view of the second double-sided tape 134. As shown in fig. 4, the second double-sided adhesive tape 134 includes an adhesive tape main body 1341 and an adhesive tape extension 1342. The adhesive tape body 1341 is disposed between the light guide plate 14 and the flexible circuit board 13. The tape extensions 1342 are provided in plurality at intervals. A plurality of tape extensions 1342 extend from the direction of the tape main body 1341 in the direction of the light source 12, and the tape extensions 1342 are disposed between the spaced LED lamps. The provision of the tape extension 1342 can increase the adhering area of the double-sided adhesive tape 134, thereby improving the adhesion stability.

Referring to fig. 1 again, the light equalizing film layer 15 includes a diffusion film 151, a first antireflection film 152 and a second antireflection film 153 disposed on the light emitting surface 142 in a manner of sequentially separating from each other.

Diffusion film 151, first antireflection film 152, and second antireflection film 153 may be non-composite films, i.e., film layers that are independent of each other. In addition, the diffusion film 151, the first antireflection film 152, and the second antireflection film 153 may also be composite films. The method specifically comprises two conditions:

in the first case, the first antireflection film 152 and the second antireflection film 153 are composite films, that is, the first antireflection film 152 and the second antireflection film 153 are integrated films, and the integrated films and the diffusion film 151 are independent films.

In the second case, diffusion film 151, first antireflection film 152, and second antireflection film 153 are composite films, that is, diffusion film 151, first antireflection film 152, and second antireflection film 153 are integrated into one film layer.

First antireflective film 152 may be referred to as a lower antireflective film and second antireflective film 153 may be referred to as an upper antireflective film.

A buffer 18 is further disposed between the light source 12 and the top plate 1101, and the buffer 18 is spaced from the light uniformizing film layer 15. The buffer 18 provides cushioning protection to the light source 12 and serves to support components above the light source 12. The buffer 18 may be foam adhesive with adhesive on both sides to secure the light source 12.

A light-shielding tape 17 is further provided on the top plate 1101, and the light-shielding tape 17 has adhesiveness on both sides. One end of the light shielding tape 17 is further extended from the top plate 1101 toward the uniform light film layer 15 and then disposed on the second antireflection film 153.

The other end of the masking tape 17 may be attached to the upper side wall 1103.

In other embodiments, the other end of masking tape 17 can extend from the upper end of upper sidewall 1103 down the sidewall of upper sidewall 1103 to the lower end of lower sidewall 1111. Whereby the upper side wall 1103 and the lower side wall 1111 are covered with the adhesive tape having adhesiveness, thereby increasing the adhesion area.

The region where the light-shielding tape 17 is disposed is a non-display region, and the region outside the light-shielding tape 17 is a display region. In this embodiment, the flexible circuit board 13 and the light uniformizing film layer 15 are arranged in a staggered manner, so that a bearing element for supporting the flexible circuit board 13 is saved, the space of a non-display area is saved, and the screen occupation ratio is improved.

Referring to fig. 5, fig. 5 is a schematic structural diagram of a backlight module according to a third embodiment of the present application. As shown in fig. 5, the backlight module 30 still includes a back frame assembly 31, a light source 32, a flexible circuit board 33, a light guide plate 34, a light uniformizing film layer 35 and a reflective sheet 36.

The structures and the connection relations of the light source 32, the flexible circuit board 33, the light guide plate 34, the light uniformizing film layer 35 and the reflective sheet 36 are respectively the same as those of the light source 12, the flexible circuit board 13, the light guide plate 14, the light uniformizing film layer 15 and the reflective sheet 16, and are not described again here.

In this embodiment, the back frame assembly 31 still includes an upper back frame 310 and a lower back frame 311. Upper back frame 310 still includes top plate 3101 and upper side wall 3102, and lower back frame 311 still includes bottom plate 3110 and lower side wall 3111. Unlike the previous embodiments, the back frame assembly 31 of the present embodiment further includes a screw 311.

The upper wall 3102 and the lower wall 3111 are provided with screw holes 3103 and 3112, respectively, at corresponding positions. The upper wall 3102 and the lower wall 3111 are connected by screwing the screw 311 and the screw holes 3103 and 3112.

The connection between the upper wall 3102 and the top plate 3101 is as described above, and the connection between the lower wall 3111 and the bottom plate 3110 is as described above, which is not described herein again.

Referring to fig. 6, fig. 6 is a schematic structural diagram of a backlight module according to a fourth embodiment of the present disclosure. As shown in fig. 6, the backlight module 40 still includes a back frame assembly 41, a light source 42, a flexible circuit board 43, a light guide plate 44, a light uniformizing film 45 and a reflector 46.

The structure and connection relationship of the back frame assembly 41, the light source 42, the flexible circuit board 43, the light guide plate 44 and the reflective sheet 46 are respectively the same as those of the back frame assembly 11, the light source 12, the flexible circuit board 13, the light guide plate 14 and the reflective sheet 16, and are not described herein again.

The backlight module 40 of the present embodiment is different from the backlight module 10 described above in that the diffusion film 451 of the light uniformizing film layer 45 of the present embodiment includes a diffusion body 4511 stacked with the first antireflection film 452 and the second antireflection film 453, and a positioning portion 4512 extending from the diffusion body 4511 to the light source 42, and a height of the positioning portion 4512 is higher than a height of the diffusion body 4511.

A buffer member 48 is provided between the top plate 4101 and the light source 42, and the buffer member 48 is provided at a distance from the positioning portion 4512 of the diffusion film 451. The buffer 48 may be a foam adhesive with adhesive on both sides to secure the light source 42.

A light shielding tape 47 is provided on the top plate 4101. One end of the light shielding tape 47 extends from the top plate 4101 in the direction of the light uniformizing film layer 45 and is disposed on the positioning portion 4512. Thereby increasing the bonding area by the positioning parts 4512 of the diffusion film 451, thereby effectively fixing the diffusion film 451. Further, one end of the light shielding tape 47 further extends to the upper side of the second antireflection film 453 to bond and fix the second antireflection film 453.

The other end of the light shielding tape 47 may be joined to the upper side wall 4102. That is, one end of the light-shielding tape 47 away from the uniform light film layer 45 can be connected to the upper side wall 4102. And may extend to the bottom of the lower sidewall.

Referring to fig. 7, fig. 7 is a schematic structural diagram of a backlight module according to a fifth embodiment of the present application. As shown in fig. 7, the backlight module 50 still includes a back frame assembly 51, a light source 52, a flexible circuit board 53, a light guide plate 54, a light uniformizing film layer 55 and a reflector 56.

The structures and the connection relations of the light source 52, the flexible circuit board 53, the light guide plate 54, the light-equalizing film layer 55 and the reflective sheet 56 are respectively the same as those of the light source 42, the flexible circuit board 43, the light guide plate 44, the light-equalizing film layer 45 and the reflective sheet 46, and are not described herein again.

Unlike the previous embodiments, the top plate 5101 of the back frame assembly of the present embodiment extends from the upper side wall 5102 to the positioning portion 5512 of the diffusion film 551, and the positioning portion 5512 abuts against the top plate 5101, thereby fixing the diffusion film 551.

A light-shielding tape 57 is further provided on the top plate 5101, and the light-shielding tape 57 has adhesiveness on both sides. One end of the light shielding tape 57 is further extended in the direction of the light uniformizing film layer 55 and then disposed above the second antireflection film 553, and the second antireflection film 553 is bonded and fixed.

Referring to fig. 8 and 9 together, fig. 8 is a flowchart illustrating an installation method of a backlight module according to an embodiment of the present application, and fig. 9 is a schematic process flow diagram corresponding to the installation method illustrated in fig. 8. It should be understood that the backlight module can be the backlight module of any of the embodiments described above. For convenience of description, the present embodiment is described by taking the backlight module 10 shown in fig. 1 as an example. As shown in fig. 8, the mounting method of the present embodiment includes the steps of:

step S1: the reflection sheet 16 and the flexible circuit board 13 are disposed on the bottom plate 1110 from the direction of the top plate, and the flexible circuit board 13 and the reflection sheet 16 are disposed at an interval.

In this step, specifically, the flexible circuit board 13 is disposed on the first carrier part 1113 of the bottom plate 1110, and before the flexible circuit board 13 is disposed on the first carrier part 1113, the first double-sided tape 113 is further disposed on the first carrier part 1113 for fixing the flexible circuit board 13 on the first carrier part 1113. The reflective sheet 16 is disposed on the second carrier part 1114.

Step S2: the light source 12 is mounted on the flexible circuit board 13, and the light guide plate 14 and the light uniformizing film layer 15 are mounted on the reflective sheet 16 in sequence.

As shown in fig. 9, the light guide plate 14, the diffusion film 151 of the light uniformizing film layer 15, the first antireflection film 152, and the second antireflection film 153 are sequentially assembled on the bottom plate reflection sheet 16.

And a second double-sided tape 134 may be disposed at a position of the flexible circuit board 13 corresponding to the light guide plate 14 before the light guide plate 14 is assembled, so that the light guide plate 14 may be fixed with the flexible circuit board 13 by the second double-sided tape 134.

Step S3: the buffer 18 is assembled to the light source 12. And the buffer member 18 is spaced apart from the light uniformizing film layer 15.

Step S4: the upper back frame 110 and the lower back frame 111 are detachably assembled.

A light shielding tape 17 may be further pasted on the top plate 1101.

Therefore, when assembling other components of the backlight module, the upper back frame 110 and the lower back frame 111 can be disassembled first, so that the lower back frame 111 forms an opening without any shielding, the other components of the backlight module are assembled on the lower back frame 111, and then the upper back frame 110 and the lower back frame 111 are assembled, thereby avoiding the situation that the shielding of the upper back frame 110 hinders the installation, and facilitating the installation of the backlight module.

Referring to fig. 10, fig. 10 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure. As shown in fig. 10, the electronic device 70 of the present embodiment includes a backlight module 71 and a display panel 72. The backlight module 71 provides backlight to the display panel 72, wherein the backlight module 71 is the aforementioned backlight module.

The display panel 72 includes a lower polarizer 711, an array substrate 712, a color filter substrate 713, and an upper polarizer 714 sequentially disposed in a light emitting direction of the backlight module 71 in a direction away from the backlight module 71. A liquid crystal layer (not shown) is further disposed between the array substrate 712 and the color filter substrate 713. The array substrate 712 and the lower polarizer 711 are respectively bonded to two ends of a light-shielding tape 717 of the backlight module 71.

The electronic device can be a smart phone, a tablet computer, a palm computer, a smart watch and the like.

Referring to fig. 11, fig. 11 is an exploded schematic view of another electronic device according to an embodiment of the present disclosure. In this embodiment, the electronic device 80 may be a smart phone, and in other embodiments, the electronic device may also be a tablet computer, a palm computer, a smart watch, and the like.

In the present embodiment, the electronic device 80 includes a rear housing 81, a middle frame 82, a backlight module 83, a display panel 84, and a cover plate 85.

The middle frame 82 is fixedly connected with the rear case 81.

The display panel 84 is stacked on the backlight module 83, and both the display panel 84 and the backlight module 83 are fixed on the middle frame 82.

The backlight module 83 is used for providing backlight for the display panel 84, and may be the backlight module described above.

The display panel 84 may be a liquid crystal display panel or other display panel.

The cover plate 85 covers the display panel 84. The cover 85 may be a transparent glass cover, and in the non-display area, the cover 85 may be opaque. For example, the cover plate 85 is coated with a light shielding ink in the non-display area.

It is to be understood that other structures of the electronic device, such as a circuit board, etc., may be provided between the rear case 81 and the middle frame 82, and will not be specifically described herein since the present application is not directed to improvements of these components.

In other embodiments, the electronic device 80 may have other structures, and the description of the structure of the electronic device 80 is not intended to limit the scope of the present application.

The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.

Claims

1. A backlight module is characterized in that the backlight module comprises:

the upper back frame and the lower back frame are detachably connected, an accommodating space is formed between the upper back frame and the lower back frame, the lower back frame comprises a bottom plate and a lower side wall connected with the bottom plate in a bent mode, and the upper back frame comprises a top plate and an upper side wall connected with the top plate in a bent mode;

the flexible circuit board and the uniform light film layer are respectively arranged on two opposite sides of the light source, and the flexible circuit board is electrically connected with the light source;

the light guide plate comprises a light incident surface and a light emergent surface, the light source is arranged on one side of the light incident surface, and the light homogenizing film layer is arranged on the light emergent surface;

the bottom plate comprises a first bearing part and a second bearing part, the first bearing part is connected with the lower side wall in a bending mode, and the distance from the first bearing part to the plane where the top plate is located is larger than the distance from the second bearing part to the plane where the top plate is located; the flexible circuit board is arranged between the light source and the first bearing part, and the flexible circuit board is flush with the second bearing part; a first double-sided adhesive tape is further arranged between the flexible circuit board and the first bearing part, and the flexible circuit board is connected with the first bearing part through the first double-sided adhesive tape;

the flexible circuit board extends from the light source to the direction of the light guide plate and is further positioned between the light guide plate and the first bearing part, a second double-sided adhesive tape is further arranged between the flexible circuit board and the light guide plate, the second double-sided adhesive tape comprises an adhesive tape main body and an adhesive tape extending part, the adhesive tape main body is arranged between the light guide plate and the flexible circuit board, and the adhesive tape extending part extends from the direction of the adhesive tape main body to the direction of the light source;

a buffer piece is arranged between the light source and the top plate and used for fixing the light source;

the backlight module further comprises a reflector plate, and the reflector plate is arranged on the second bearing part.

2. A backlight module according to claim 1, wherein the upper and lower sidewalls are detachably connected, and the bottom plate and the top plate are parallel to each other.

3. The backlight module as claimed in claim 2, wherein the upper sidewall has a hole and the lower sidewall has a block, and the upper sidewall and the lower sidewall are engaged with each other via the hole and the block to form a snap connection.

4. The backlight module according to claim 2, further comprising screws, wherein the upper sidewall and the lower sidewall are respectively provided with threaded holes at corresponding positions, and the upper sidewall and the lower sidewall are connected by screwing the screws into the threaded holes.

5. The backlight module as claimed in claim 1, wherein the reflector plate is disposed on a side of the light guide plate opposite to the light exit surface, and the reflector plate is spaced apart from the flexible circuit board.

6. The backlight module as claimed in claim 1, wherein the light uniformizing film layer comprises a diffusion film, a first antireflection film and a second antireflection film disposed on the light emergent surface in a manner of sequentially separating from each other.

7. The backlight module as claimed in claim 6, wherein the diffusion film comprises a diffusion main body stacked with the first antireflection film and the second antireflection film, and a positioning portion extending from the diffusion main body to a light source, and the height of the positioning portion is higher than that of the diffusion main body.

8. The backlight module as claimed in claim 7, wherein a light-shielding tape is further disposed on the top plate, and the light-shielding tape is further disposed on the positioning portion after extending from the top plate to the direction of the light-uniformizing film layer, or the top plate is disposed between the positioning portion and the light-shielding tape.

9. The backlight module according to claim 7, wherein the buffer member is spaced apart from the positioning portion.

10. An electronic device comprising a display panel and a backlight module providing backlight to the display panel, wherein the backlight module comprises the backlight module according to any one of claims 1-9.

11. A method of mounting a backlight module, wherein the backlight module comprises the backlight module according to any one of claims 1-9, the method comprising:

disposing the flexible circuit board on the first carrying part and the reflective sheet on the second carrying part from the direction of the top plate, and disposing the flexible circuit board and the reflective sheet at an interval;

assembling the buffer to the light source;

and the upper back frame and the lower back frame are detachably assembled.