CN104698230A - Manual probe bench for semiconductor chip testing - Google Patents
Manual probe bench for semiconductor chip testing Download PDFInfo
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- CN104698230A CN104698230A CN201310648251.6A CN201310648251A CN104698230A CN 104698230 A CN104698230 A CN 104698230A CN 201310648251 A CN201310648251 A CN 201310648251A CN 104698230 A CN104698230 A CN 104698230A
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- vacuum cup
- vacuum
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- Testing Of Individual Semiconductor Devices (AREA)
Abstract
A manual probe bench for semiconductor chip testing belongs to the technical field of probe benches. The manual probe bench comprises a probe bench base, a chip supporting stage, a chip supporting stage seat, a rapid addressing mechanism, a locking mechanism, and a fine tuning mechanism. The manual probe bench is characterized in that the locking mechanism is composed of a vacuum chuck; the fining tuning mechanism is composed of a connecting rod, a fine tuning guide plate, a fine tuning handle, a joint bearing, and an aligning bearing; the rapid addressing mechanism is fixed and locked when the vacuum chuck is locked with the top surface of the probe bench base in a vacuum state; the bottom end of the fine tuning handle is connected with the joint bearing, the middle of the fine tuning handle is connected with one end of the connecting rod via the aligning bearing, and the other end of the connecting rod is connected with the chip supporting stage seat; and when the fine tuning handle is poked, the aligning bearing can swing 360 degrees in the horizontal plane and drive the connecting rod to move in any direction in the horizontal plane to realize fine tuning of the chip supporting stage seat. In the chip testing and aligning process, the manual probe bench can lock the rapid addressing mechanism after completion of rapid coarse alignment to realize fine tuning and accurate aligning.
Description
Technical field
The present invention relates to a kind of semiconductor die testing manual probe platform, especially the vacuum of semiconductor die testing manual probe platform is locked and micro-adjusting mechanism, belongs to probe station technical field.
Background technology
In the production and development process of semi-conductor chip, need to carry out procedural test and terminal test to the parameters of chip, complete the test aligning equipment mainly probe station needed for test.The kind of probe station comprises full-automatic probe station, semi-automatic probe station and manual probe platform.Full-automatic probe station and semi-automatic probe station are mainly used in the batch testing of chip finished product.Efficiency high can be taken a sample test at random because manual probe platform has, so in semi-conductor chip production testing process, need to chip parameter randomly draw a small amount of discontinuous test point carry out sample testing time, substantially all use manual probe platform.Manual probe platform quickly, accurately and conveniently can find required test point on the chip that is placed on wafer-supporting platform, the base, launch site etc. of such as triode, by the probe on manual probe platform and test point reliable contacts, the test condition that supporting testing tool is arranged is added on tested tube core by probe, realizes the object to core parameter testing.Due to a slice diameter be 100mm chip on have several thousand to several ten thousand tube cores, maximum (diode) has more than 100,000, the size of each tube core is less, the size of base and launch site is all less than 0.1mm, adopt manual operation, realize finding a tube core arbitrarily on chip, probe is aimed at accurately the test zone of this tube core, higher accuracy requirement is designed with to equipment, this is mainly reflected in can lock coarse adjustment action after coarse adjustment action completes, realize fine adjustment function, probe is accurately aimed at test zone.
Manual probe platform major part does not all have fine adjustment function to arrange in the market, and little die testing is aimed at extremely inconvenient.Some is provided with the probe station of micromatic setting, usually all adopts mechanical cam to lock and electromagnet locking realizes this function, but complex structure, and greatly, have offset phenomena to occur in locking process, precision is lower in vibration, and low precision when testing little tube core, efficiency are low.
Summary of the invention
The object of the invention is for above-mentioned the deficiencies in the prior art, a kind of semiconductor die testing manual probe platform be provided, chip to be measured is completed in test process after immediate addressing aims at, can fast, convenient, accurately aim at accurately.
The object of the invention is to be achieved through the following technical solutions: semiconductor die testing manual probe platform, comprise probe station base, the microscope be arranged in probe station pedestal upright post, lifting table, be fixed on lifting table for the probe carriage of installation testing probe, for place chip to be tested wafer-supporting platform, the wafer-supporting platform seat of wafer-supporting platform, immediate addressing mechanism, latch mechanism and micro-adjusting mechanism are installed, electrical appliance kit is provided with below described probe station base, described wafer-supporting platform seat is placed on the guide rail of immediate addressing mechanism, it is characterized in that
Described latch mechanism is made up of vacuum cup, and described micro-adjusting mechanism is made up of connecting rod, fine setting guide plate, trimming handle, oscillating bearing, self-aligning bearing,
The table top of described vacuum cup and probe station base is fitted, described micro-adjusting mechanism is arranged on vacuum cup, vacuum cup is connected with immediate addressing mechanism by fine setting guide plate, and when the table top of vacuum cup and probe station base is vacuum locking state, immediate addressing mechanism is fixed locking;
Described trimming handle bottom is connected with oscillating bearing, connecting rod one end is connected by the self-aligning bearing be embedded in connecting rod in the middle part of trimming handle, the described connecting rod other end is connected with wafer-supporting platform seat, stir trimming handle top, by the point action of oscillating bearing, self-aligning bearing can do 360 ° of swings in surface level, and in surface level, done the movement in any direction by self-aligning bearing drivening rod, realizes the fine setting of wafer-supporting platform seat.
Described fine setting guide plate is between immediate addressing mechanism X-axis guide rail and vacuum cup, the radial ball bearing that two Y-direction gathering sills arranging and four drift angles are arranged fine setting guide plate, the X-direction gathering sill arranged with four radial ball bearings arranging on vacuum cup and immediate addressing mechanism X-axis rail back respectively forms to slide respectively to be paid, and forms the connection of vacuum cup and immediate addressing mechanism and controls the relative movement guiding of vacuum cup and wafer-supporting platform seat in trim process;
Trimming handle is in trim process, the X-direction gathering sill that vacuum cup and wafer-supporting platform seat are arranged by four radial ball bearings of finely tuning on guide plate and immediate addressing mechanism X-axis rail back at the mobile guide of X-direction has coordinated, and mobile guide has in the Y direction been coordinated by four radial ball bearings on two Y-direction gathering sills of finely tuning on guide plate and vacuum cup.
Described vacuum cup lower surface is provided with vacuum chamber, and vacuum chamber is arranged between vacuum cup and probe station base, and fits with the table top of probe station base, and the diameter of vacuum chamber is 95mm.
Electrical equipment, Pneumatic component is provided with in described electrical appliance kit, electrical equipment, Pneumatic component are connected and composed by direct current 24 volts of power supplys, solenoid valve, locking button circuit, locking button is in normally open, now vacuum cup imports vacuum, the table top of vacuum cup and probe station base is vacuum locking state, immediate addressing mechanism is fixed locking, is finely tuned wafer-supporting platform seat by micro-adjusting mechanism; When locking button closes, vacuum release in vacuum cup, the table top of vacuum cup and probe station base is antivacuum locking state.
Described solenoid valve is 23 three-way electromagnetic valves.
Described vacuum cup is being coated with the thick teflon coatings of 0.3mm with probe station base table top binding face place.
In chip testing process, after immediate addressing mechanism completes coarse adjustment aligning, need the accurate contraposition being realized tested pilot on test probe and chip by fine setting alignment actions, complete test.Vacuum cup in the present invention and micro-adjusting mechanism can easily realize the accurate contraposition after chip coarse adjustment to be measured, and compact conformation, accurately reliably.Fine alignment is implemented by micro-adjusting mechanism after immediate addressing mechanism is locked, its feature is vacuum suction function, vacuum cup is adsorbed on the base table top of probe station, by fine setting guide plate, immediate addressing mechanism action is locked, because micro-adjusting mechanism is arranged on vacuum cup, after vacuum cup is fixing, the position of micro-adjusting mechanism is also fixed, now adjust the trimming handle on micro-adjusting mechanism, can wafer-supporting platform be driven to do trimming movement by the connecting rod be connected with trimming handle, realize fine setting to aim at, the size of adjustable range is determined by the drift angle size of trimming handle.Control sucking and loosening of vacuum cup, be control whether vacuum cup imports vacuum in vacuum chamber by operation locking button, the break-make switching vacuum in vacuum cup can control the sorption of sucker and loosen.
The lower surface of this novel middle vacuum cup is provided with the vacuum chamber that a diameter is 95mm, the work top laminating of vacuum chamber and probe station, devise a vacuum passage, as required vacuum or release vacuum are imported to vacuum chamber, when the indoor importing vacuum of vacuum, vacuum cup can be adsorbed on probe station work top firmly, and when the vacuum of the indoor importing of vacuum is cut off, the suction of vacuum cup can disappear automatically due to releasing of vacuum.When vacuum chamber vacuum is-0.04MPa, the suction of vacuum cup and work top can reach more than 15Kgf, meets reacting force when wafer-supporting platform moves when finely tuning far away.Wherein:
Vacuum chamber diameter=φ 95mm;
Vacuum chamber area=3.14 × (95 ÷ 2) 2=7084mm2=70.84 cm2;
Import vacuum chamber vacuum pressure=-0.04MPa=-4.08 × 10
-1kgf/cm2;
Lead after pouring vacuum into, theory calculate sucker and work top suction:
4.08×10
-1Kgf/ cm2×70.84cm
22＝28.9Kgf；
Locking efficiency is by 60% design;
After importing vacuum, sucker and work top suction=28.9 Kgf × 0.6=17.34 Kgf.
In the present invention on vacuum cup and the one side of deck contact of probe station base, have employed Teflon surface coated treatment technology, both ensure that leakage efficiency, reduce friction factor when vacuum cup moves on probe station working surface simultaneously.
In the present invention during micro-adjusting mechanism adjustment, the guiding in plane X direction has been coordinated by the X-direction gathering sill below the X-axis seat of 4 radial ball bearings of finely tuning on guide plate angle and immediate addressing mechanism; Coordinated by 2 Y-direction gathering sills of finely tuning on guide plate and 4 radial ball bearings be fixed on vacuum cup in the guiding of plane Y-direction.
The present invention is simple and reasonable, easily realize, vacuum cup, connecting rod, trimming handle, fine setting guide plate and control electrical equipment, the Pneumatic component of vacuum, can in chip testing alignment procedures, immediate addressing mechanism is locked completing after Fast Coarse is aimed at, implement trimming movement, realize fine alignment.Wafer-supporting platform both realized coarse alignment action with immediate addressing mechanism, when immediate addressing mechanism is locked, can controls, realize fine alignment by micro-adjusting mechanism again.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention;
Fig. 2 is the structural representation of micro-adjusting mechanism in the present invention;
Fig. 3 is the structural representation of finely tuning guide plate in the present invention;
Fig. 4 be in Fig. 3 A-A to sectional structure schematic diagram;
Fig. 5 is electrical equipment in the present invention, Pneumatic component control principle drawing
In figure: 1 electrical appliance kit, 2 probe station bases, 3 immediate addressing mechanisms, 4 micro-adjusting mechanisms, 5 wafer-supporting platform seats, 6 wafer-supporting platforms, 7 lifting tables, 8 probe carriages, 9 microscopes, 10 vacuum cups, 11 connecting rods, 12 fine setting guide plates, 13 trimming handles, 14 oscillating bearings, 15 self-aligning bearings, 16 X-direction gathering sills, 17 Y-direction gathering sills, 18 radial ball bearings, 19 radial ball bearings, 20 vacuum chambers, 21 power supplys, 22 solenoid valves, 23 locking buttons.
Embodiment
Semiconductor die testing manual probe platform, comprise probe station base 2, be arranged in probe station pedestal upright post for observe standby survey chip microscope 9, lifting table 7, to be fixed on lifting table for the probe carriage 8 of installation testing probe, for placing the wafer-supporting platform 6 of chip to be tested, the wafer-supporting platform seat 5 installing wafer-supporting platform, immediate addressing mechanism 3, latch mechanism and micro-adjusting mechanism 4, be provided with electrical appliance kit 1 below probe station base, wafer-supporting platform seat is placed on the guide rail of immediate addressing mechanism.
Latch mechanism is made up of vacuum cup 10, and micro-adjusting mechanism 4 is made up of connecting rod 11, fine setting guide plate 12, trimming handle 13, oscillating bearing 14, self-aligning bearing 15.The table top of vacuum cup and probe station base is fitted, and micro-adjusting mechanism 4 is arranged on vacuum cup, and vacuum cup is connected with immediate addressing mechanism by fine setting guide plate.Vacuum cup lower surface is provided with vacuum chamber 20, and vacuum chamber is arranged between vacuum cup and probe station base, and fits with the table top of probe station base, and the diameter of vacuum chamber is 95mm.Be provided with electrical equipment, Pneumatic component in electrical appliance kit 1, electrical equipment, Pneumatic component are connected and composed by direct current 24 volts of power supplys 21,23 three-way electromagnetic valves 22, locking button 23 circuit.Locking button is in normally open, and now vacuum cup imports vacuum, and the table top of vacuum cup and probe station base is vacuum locking state, and immediate addressing mechanism is fixed locking, is finely tuned wafer-supporting platform seat by micro-adjusting mechanism; Locking button closes, and vacuum release in vacuum cup, the table top of vacuum cup and probe station base is antivacuum locking state.
Be connected with oscillating bearing bottom trimming handle, connecting rod one end is connected by the self-aligning bearing be embedded in connecting rod in the middle part of trimming handle, the connecting rod other end is connected with wafer-supporting platform seat 5, stir trimming handle, by the point action of oscillating bearing, can make self-aligning bearing in surface level, do 360 ° of swings, and in surface level, be done the movement in any direction by self-aligning bearing drivening rod, realize the fine setting of wafer-supporting platform seat.
Fine setting guide plate is provided with two Y-direction gathering sills 17, and its four drift angles are respectively equipped with radial ball bearing 18, and vacuum cup is provided with four radial ball bearings 19, and immediate addressing mechanism is provided with two X-direction gathering sills 16.
The radial ball bearing that two Y-direction gathering sills arranging and four drift angles are arranged fine setting guide plate respectively, the X-direction gathering sill arranged with four radial ball bearings arranging on vacuum cup and immediate addressing mechanism X-axis rail back respectively forms to slide respectively to be paid, and forms the connection of vacuum cup and immediate addressing mechanism and controls the relative movement guiding of vacuum cup and wafer-supporting platform seat in trim process.
Trimming handle is in trim process, the X-direction gathering sill that vacuum cup and wafer-supporting platform seat are arranged by four radial ball bearings of finely tuning on guide plate and immediate addressing mechanism X-axis rail back at the mobile guide of X-direction has coordinated, and mobile guide has in the Y direction been coordinated by four radial ball bearings on two Y-direction gathering sills of finely tuning on guide plate and vacuum cup.
Vacuum cup is being coated with the thick teflon coatings of 0.3mm with probe station base table top binding face place.
The switching that in the present invention, vacuum cup vacuum imports is realized by following action, as shown in Figure 5, K1(locks button 22) be control vacuum cup often open without self-locking button switch, when K switch 1 is not pressed, vacuum pressure is delivered in vacuum chamber by solenoid valve D1 by vacuum source, and sucker is locked.This kind of state is applicable to fine setting, test and idle period.When needs coarse adjustment, press K switch 1, solenoid valve D1 action, cut off the vacuum source in vacuum chamber, residual vacuum simultaneously in vacuum chamber is outwards discharged by solenoid valve,, chuck surface and susceptor surface are in free state, and locking action disappears, now can carry out the coarse adjustment alignment function of immediate addressing, reset after release button K1 after coarse adjustment has been aimed at, solenoid valve D1 dead electricity, vacuum cup recovers locking action.In practical operation, if operator do immediate addressing coarse adjustment alignment function time, press K1 switch, just can easily realize coarse adjustment alignment function; At the end of coarse adjustment is aimed at, decontrol K1 switch, just can realize fine setting and test function.
Probe carriage 8 is for installation testing probe, there is three-dimensional regulation function, magnetic bases can easily be fixed on lifting table 7, wafer-supporting platform 6 is for placing chip to be tested, be arranged on the guide rail of immediate addressing mechanism 3 together with after fixing with wafer-supporting platform seat 5, the adjustment function in θ direction on surface level can be realized.After immediate addressing mechanism locks by vacuum cup 10, micro-adjusting mechanism drives wafer-supporting platform to realize the fine adjustment function of chip movement by connecting rod; The effect of probe station base 2, except the skeleton as whole equipment, devises higher requirement, with the durability degree of the efficiency and use that ensure vacuum cup to the smooth finish of work top and wearing quality.Electrical appliance kit below base 2 is used for erecting equipment power supply and control apparatus and pneumatic element, realizes controlling functions, and complete machine structure is coordinated, one integrated mass.
Operation steps of the present invention is as follows: be 1. placed on wafer-supporting platform by chip to be measured; 2. press locking button, utilize immediate addressing mechanism wafer-supporting platform to be placed in release locking button after under microscope, adjust microscope focus and enlargement ratio as required; 3. according to test request, one or two test probes are adjusted to the correspondence position of test point; 4. on testing tool, suitable test condition is chosen; 5. press locking button, utilize immediate addressing mechanism to find and take a sample test tube core, and under being moved to probe; 6. release locking button, realizes locking function, and the test zone of tube core is aimed at probe by operation micro-adjusting mechanism; 7. operational testing handle, wafer-supporting platform along Z-direction upwards, can make test probe engaged test region, tests; 8. record test data; 9. operational testing handle, makes wafer-supporting platform reset in Z-direction; Repeat 5. 6. 7. 8. to test the next test point on same chip; 10. repeat 1. 5. 6. 7. 8. to test next sheet chip.
In chip testing alignment procedures, as long as operating personnel need to handle trimming handle according to aligning, just fast and accurately by the test point of tested chip and probe alignment, test jobs can be implemented.Micro-adjusting mechanism is arranged on vacuum cup, and after immediate addressing mechanism is locked, operating personnel can quickly and accurately by probe alignment test zone by adjustment trimming handle.There is an oscillating bearing bottom trimming handle, can make trimming handle in certain angular range, do 360 degree of swings as a fulcrum.A self-aligning bearing is had in the middle part of regulating rod, connect one end of trimming handle and connecting rod, the other end of connecting rod is connected with wafer-supporting platform, when trimming handle swings, wafer-supporting platform can be driven to do the movement in any direction in the horizontal plane by connecting rod, play effect test chip being done to fine setting aligning.
As shown in Figure 5, there is one to be input as AC 220 V, export power supply for direct current 24 volts and direct current 6 volts.Direct current 24 volts is used for Controlling solenoid valve, and direct current 6 volts is used for microscope built-in light source lighting bulb.D1 is 23 three-way electromagnetic valves, for controlling vacuum cup.D1 controls by K switch 1, and K1 breaks, and pouring vacuum in vacuum cup, is vacuum locking state.K1 closes, and in vacuum cup, vacuum release, is antivacuum locking state.D2 is 23 three-way electromagnetic valves, and for controlling wafer-supporting platform vacuum, effect is according to test needs, and by suction-operated by the chip sorption on wafer-supporting platform or loosen, ensure that test parameter is accurate, test fluctuating plate is smooth.
Claims (6)
1. a semiconductor die testing manual probe platform, comprise probe station base, the microscope be arranged in probe station pedestal upright post, lifting table, be fixed on lifting table for the probe carriage of installation testing probe, for place chip to be tested wafer-supporting platform, the wafer-supporting platform seat of wafer-supporting platform, immediate addressing mechanism, latch mechanism and micro-adjusting mechanism are installed, electrical appliance kit is provided with below described probe station base, described wafer-supporting platform seat is placed on the guide rail of immediate addressing mechanism, it is characterized in that
Described latch mechanism is made up of vacuum cup, and described micro-adjusting mechanism is made up of connecting rod, fine setting guide plate, trimming handle, oscillating bearing, self-aligning bearing,
The table top of described vacuum cup and probe station base is fitted, described micro-adjusting mechanism is arranged on vacuum cup, vacuum cup is connected with immediate addressing mechanism by fine setting guide plate, and when the table top of vacuum cup and probe station base is vacuum locking state, immediate addressing mechanism is fixed locking;
Described trimming handle bottom is connected with oscillating bearing, connecting rod one end is connected by the self-aligning bearing be embedded in connecting rod in the middle part of trimming handle, the described connecting rod other end is connected with wafer-supporting platform seat, stir trimming handle top, by the point action of oscillating bearing, self-aligning bearing can do 360 ° of swings in surface level, and in surface level, done the movement in any direction by self-aligning bearing drivening rod, realizes the fine setting of wafer-supporting platform seat.
2. semiconductor die testing manual probe platform according to claim 1, it is characterized in that, described fine setting guide plate is between immediate addressing mechanism X-axis guide rail and vacuum cup, the radial ball bearing that two Y-direction gathering sills arranging and four drift angles are arranged fine setting guide plate, the X-direction gathering sill arranged with four radial ball bearings arranging on vacuum cup and immediate addressing mechanism X-axis rail back respectively forms to slide respectively to be paid, form the connection of vacuum cup and immediate addressing mechanism and control the relative movement guiding of vacuum cup and wafer-supporting platform seat in trim process,
Trimming handle is in trim process, the X-direction gathering sill that vacuum cup and wafer-supporting platform seat are arranged by four radial ball bearings of finely tuning on guide plate and immediate addressing mechanism X-axis rail back at the mobile guide of X-direction has coordinated, and mobile guide has in the Y direction been coordinated by four radial ball bearings on two Y-direction gathering sills of finely tuning on guide plate and vacuum cup.
3. semiconductor die testing manual probe platform according to claim 1, it is characterized in that, described vacuum cup lower surface is provided with vacuum chamber, and vacuum chamber is arranged between vacuum cup and probe station base, and fit with the table top of probe station base, the diameter of vacuum chamber is 95mm.
4. semiconductor die testing manual probe platform according to claim 1, it is characterized in that, electrical equipment, Pneumatic component is provided with in described electrical appliance kit, electrical equipment, Pneumatic component are connected and composed by direct current 24 volts of power supplys, solenoid valve, locking button circuit, locking button is in normally open, and now vacuum cup imports vacuum, and the table top of vacuum cup and probe station base is vacuum locking state, immediate addressing mechanism is fixed locking, is finely tuned wafer-supporting platform seat by micro-adjusting mechanism; When locking button closes, vacuum release in vacuum cup, the table top of vacuum cup and probe station base is antivacuum locking state.
5. semiconductor die testing manual probe platform according to claim 4, is characterized in that, described solenoid valve is 23 three-way electromagnetic valves.
6. semiconductor die testing manual probe platform according to claim 1, is characterized in that, described vacuum cup is being coated with the thick teflon coatings of 0.3mm with probe station base table top binding face place.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310648251.6A CN104698230A (en) | 2013-12-06 | 2013-12-06 | Manual probe bench for semiconductor chip testing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310648251.6A CN104698230A (en) | 2013-12-06 | 2013-12-06 | Manual probe bench for semiconductor chip testing |
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| Publication Number | Publication Date |
|---|---|
| CN104698230A true CN104698230A (en) | 2015-06-10 |
Family
ID=53345564
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310648251.6A Pending CN104698230A (en) | 2013-12-06 | 2013-12-06 | Manual probe bench for semiconductor chip testing |
Country Status (1)
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| CN (1) | CN104698230A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107796961A (en) * | 2017-09-27 | 2018-03-13 | 上海旻艾信息科技有限公司 | A kind of trimming rack for semiconductor die testing |
| CN109521230A (en) * | 2018-11-16 | 2019-03-26 | 深圳市矽电半导体设备有限公司 | A kind of wafer-supporting platform and semiconductor probe platform |
-
2013
- 2013-12-06 CN CN201310648251.6A patent/CN104698230A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107796961A (en) * | 2017-09-27 | 2018-03-13 | 上海旻艾信息科技有限公司 | A kind of trimming rack for semiconductor die testing |
| CN109521230A (en) * | 2018-11-16 | 2019-03-26 | 深圳市矽电半导体设备有限公司 | A kind of wafer-supporting platform and semiconductor probe platform |
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Application publication date: 20150610 |