CN116387234A - Wafer bearing device - Google Patents
Wafer bearing device Download PDFInfo
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- CN116387234A CN116387234A CN202310379220.9A CN202310379220A CN116387234A CN 116387234 A CN116387234 A CN 116387234A CN 202310379220 A CN202310379220 A CN 202310379220A CN 116387234 A CN116387234 A CN 116387234A
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- 230000033001 locomotion Effects 0.000 claims abstract description 30
- 238000012546 transfer Methods 0.000 claims description 14
- 238000009434 installation Methods 0.000 claims description 5
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 4
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 claims description 4
- 229920002530 polyetherether ketone Polymers 0.000 claims description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 11
- 235000012431 wafers Nutrition 0.000 description 48
- 238000001259 photo etching Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000001960 triggered effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000008093 supporting effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000010438 granite Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention discloses a wafer bearing device which comprises a first driving piece, a first load plate, a second driving piece, a second load plate, a vacuum chuck, at least two vertical splicing columns and a plurality of vertical splicing columns, wherein the first driving piece, the first load plate, the second driving piece, the second load plate and the vacuum chuck are sequentially arranged from bottom to top; a third driving member disposed on the first load plate and below the second driving member; the second driving piece, the second load plate and the vacuum chuck are all provided with coaxial through holes with the same diameter so as to form a channel corresponding to the splicing column, the third driving piece drives the top of the splicing column to synchronously reciprocate in and out of the top of the channel in the vertical direction, and the channel enables the splicing column to adapt to the second load plate to perform six-degree-of-freedom micro motion. The invention has the beneficial effects that by utilizing the device, the wafer is lifted upwards from the vacuum chuck only by driving the splicing column to move upwards, so that the manipulator is convenient to take away, the matching adjustment of the original vertical lifting motion platform and the micro-motion platform is avoided, and the operation is simple and quick.
Description
Technical Field
The invention relates to the field of equipment for processing wafers. More particularly, the present invention relates to a wafer carrier.
Background
When the wafer is subjected to photoetching exposure, the wafer is placed on the wafer carrying device, a photoetching machine is arranged above the wafer, and the photoetching machine performs photoetching processing on the wafer. In order to ensure that the pattern on the mask is transferred to the wafer, it is necessary to ensure that the plane of the wafer coincides with the plane of the pattern projected by diffraction of the mask, and therefore, the position of the wafer needs to be adjusted so as to be completely parallel to the mask, and the wafer carrying device is an adjusting structure providing such a function. The existing wafer bearing device generally comprises a support column, a vacuum chuck, a micro-motion platform, a driving mechanism and a driving mechanism, wherein the vacuum chuck is sequentially arranged from top to bottom, the micro-motion platform is used for driving the vacuum chuck to conduct micro-motion in six degrees of freedom, the driving mechanism is used for driving the micro-motion platform to conduct large-stroke linear motion in the directions of three axes of XYZ, the structure of the micro-motion platform is as disclosed in the patent with the application number of 202122053282.X, the micro-motion platform comprises a load plate and a driving piece for driving the load plate to conduct micro-motion in six degrees of freedom, the vacuum chuck is arranged on the load plate, and a through hole for the support column to pass through when the micro-motion platform in six degrees of freedom descends is formed in the micro-motion platform in the six degrees of freedom. In this structure, after the wafer lithography is completed, the driving mechanism needs to be started to enable the whole six-degree-of-freedom micro-motion platform to descend until the wafer falls on the support column, and then the mechanical arm takes away the vacated wafer. In this way, the distance between the wafer and the mask is adjusted by the large-stroke lifting provided by the driving mechanism, and the micro-motion stage is adjusted to enable the wafer and the mask to be completely parallel, and nano-scale adjustment is performed, so that the time is long, the large-stroke lifting is difficult to be guaranteed to be consistent with the original position within the nano-scale range when the large-stroke lifting is lifted and returned to the original position, and the six-degree-of-freedom micro-motion stage is required to be adjusted again to enable the distance between the wafer and the mask to be completely parallel.
Disclosure of Invention
The invention aims to solve at least the problems and provide a wafer carrying device which only needs to drive the splicing column to move upwards after the photoetching of the wafer is finished, so that the wafer is lifted upwards from the vacuum chuck, a manipulator in a later link is convenient to take away, the matching adjustment of the original vertical lifting motion platform and the micro-motion platform is avoided, and the operation is simple and quick.
To achieve these objects and other advantages and in accordance with the purpose of the invention, there is provided a wafer carrier including a first driving member, a first load plate, a second driving member, a second load plate, and a vacuum chuck sequentially disposed from bottom to top, the first driving member driving the first load plate to make a large stroke linear motion on XYZ three axes, the second driving member being disposed on the first load plate and driving the second load plate to make a six degree of freedom micro motion, the vacuum chuck being disposed on the second load plate, and a lifting assembly including:
at least two vertical tab posts;
a third driving member disposed on the first load plate and below the second driving member;
the second driving piece, the second load plate and the vacuum chuck are all provided with coaxial through holes with the same diameter so as to form a channel corresponding to the splicing column, the third driving piece drives the top of the splicing column to synchronously reciprocate in and out of the top of the channel in the vertical direction, and the channel enables the splicing column to adapt to the second load plate to perform six-degree-of-freedom micro motion.
Preferably, the third driving member includes:
the horizontal base is arranged on the first load plate, a vertical plate is arranged on the base, a pair of parallel and vertically arranged sliding rails are arranged on the vertical plate, and a sliding block is arranged on each sliding rail;
a vertical third load plate fixedly connected with the pair of sliding blocks;
the mounting block is fixedly connected with the top of the third load board, and the tab column is arranged on the mounting block;
the grating ruler is arranged on the third load board, and a reading head matched with the grating ruler is arranged on the base;
and the linear motor drives the third load plate to slide.
Preferably, a horizontal plate is arranged at the top of the vertical plate; the linear motor is a voice coil motor, a rotor of the voice coil motor is arranged on the horizontal plate, and the rotor of the voice coil motor is fixedly connected with the mounting block so as to drive the mounting block to move when the rotor moves.
Preferably, the number of the tab posts is three; the installation piece includes horizontal circular piece, follows circular piece circumference wall interval is even and three connecting rods that the level set up, and three connecting rods correspond with three piece posts one-to-one, the bottom of piece post is established on corresponding connecting rod top surface.
Preferably, the device further comprises a transfer block, the transfer block is arranged between the first load plate and the first driving piece, the bottom of the transfer block is fixedly connected with the first load plate, the top of the transfer block is fixedly connected with the first driving piece, the middle of the transfer block is provided with a mounting hole in a penetrating mode, and the bottom of the base penetrates through the mounting hole and is fixedly connected with the first load plate.
Preferably, a pair of photoelectric switches are arranged on one side wall of the vertical plate in a height mode, a pair of limiting poking pieces are arranged on one side wall of the third load plate in a height mode, the pair of limiting poking pieces correspond to the pair of photoelectric switches, and the pair of limiting poking pieces move between the pair of photoelectric switches, so that when the limiting poking pieces move to the corresponding photoelectric switches, the photoelectric switches are triggered to form electric limiting.
Preferably, the third load board is provided with a horizontal anti-collision nail, the base is provided with a vertical limiting board, the limiting board is provided with a slot along the vertical direction, and the anti-collision nail extends into the slot and moves up and down in the slot to form mechanical limiting.
Preferably, the mounting block, the connecting rod and the connecting piece column are internally provided with air passages which are sequentially communicated, the air passages of the connecting piece column penetrate through the top of the connecting piece column, and the air passages are communicated with the vacuumizing device.
Preferably, the top of the connecting piece column is stuck with a connecting piece head, and the connecting piece head is made of PEEK.
Preferably, the first driving part comprises a vertical lifting moving table for driving the first load plate to move in the Z-axis direction and a gantry moving table for driving the vertical lifting moving table to move in the X, Y-axis direction, the gantry moving table comprises a base, a pair of parallel first guide rails horizontally arranged on the base, an upper shaft bottom plate slidably arranged between the pair of first guide rails, a pair of parallel second guide rails horizontally arranged on the upper shaft bottom plate, and an upper shaft load plate slidably arranged on the pair of second guide rails, the first guide rails are perpendicular to the second guide rails, the middle part of the upper shaft bottom plate is downwards sunken to form a sinking chute, the bottom of the sinking chute stretches into the sinking chute and slides along the sinking chute, and the bottom of the vertical lifting moving table is arranged on the inner bottom of the sinking chute.
The invention at least comprises the following beneficial effects:
according to the invention, through designing the first driving piece, the first load plate, the second driving piece, the second load plate, the vacuum chuck, the splicing column, the third driving piece and the through hole, when the wafer photoetching is finished, the wafer is adsorbed on the vacuum chuck, and when the wafer needs to be taken away by the manipulator, the third driving piece drives the splicing column to extend upwards, so that the wafer is jacked up to be separated from the vacuum chuck, and an operable space of the manipulator is provided, so that the manipulator is convenient to take away; on the whole, the cooperation adjustment of the original vertical lifting motion platform and the micro-motion platform is avoided, and the operation is simple and quick.
Additional advantages, objects, and features of the invention will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from practice of the invention.
Drawings
FIG. 1 is a perspective view of a wafer carrier according to one embodiment of the present invention;
FIG. 2 is a perspective view of a lifting assembly according to one embodiment of the present invention;
FIG. 3 is a front view of a lifting assembly according to one embodiment of the present invention;
FIG. 4 is a side view of a construction of a lifting assembly according to one embodiment of the invention;
fig. 5 is a top view of a structure of a lifting assembly according to one embodiment of the present invention.
FIG. 6 is a perspective view of the tab post, the circular block, and the connecting rod according to one embodiment of the present invention;
FIG. 7 is a front view of the structure of the tab post, the circular block and the connecting rod according to one embodiment of the present invention;
FIG. 8 is a schematic diagram of the six-degree-of-freedom micro-motion platform and the vertical lifting motion platform according to one embodiment of the present invention installed in the sinking tank;
FIG. 9 is a schematic diagram of the six-degree-of-freedom micro-motion platform and the vertical lifting motion platform according to one embodiment of the present invention mounted at the bottom of the sinking tank;
FIG. 10 is a front view of the six degree of freedom micro-motion platform, the vertical lift motion platform, the lifting assembly, and the adapter connection structure according to one embodiment of the present invention;
FIG. 11 is a perspective view of a connection structure between the six degree of freedom micro-motion platform and the tab post according to one embodiment of the present invention;
FIG. 12 is a perspective view of a six degree of freedom micro-motion platform according to one embodiment of the present invention;
FIG. 13 is a perspective view of a six degree of freedom micro-motion platform according to one embodiment of the present invention;
fig. 14 is a schematic structural view of the gantry moving table according to one embodiment of the present invention;
FIG. 15 is a schematic view of a connection structure between the lifting assembly and the adapter according to one embodiment of the present invention;
fig. 16 is a schematic diagram of a connection structure of the adaptor according to one embodiment of the present invention.
Reference numerals: 1-vertical plates; 2-sliding rails; 3-voice coil motor; 4-a vacuum chuck; 5-a third load plate; 6-grating ruler; 7-reading head; 8-a base; 9-a reading head mounting block; 10-limiting plates; 11-anti-collision nails; 12-limiting poking pieces; 13-a photoelectric switch; 14-a transfer block; 15-six degrees of freedom micro-motion platform; 16-a sinking groove; 17-a vertical lifting movement table; 18-perforating; 19-a gantry motion stage; 191-a base; 192-a first rail; 193-second rail; 194-upper shaft bottom plate; 195-upper shaft load plate; 20-sinking chute; 21-mounting holes; 41-connecting rods; 42-tab posts; 43-connector; 44-tracheal micro-connector; 45-circular blocks; 46-airway.
Detailed Description
The present invention is described in further detail below with reference to the drawings to enable those skilled in the art to practice the invention by referring to the description.
It will be understood that terms, such as "having," "including," and "comprising," as used herein, do not preclude the presence or addition of one or more other elements or groups thereof.
As shown in fig. 1-16, the present invention provides a wafer carrying device, which includes a first driving member, a first load board, a second driving member, a second load board, and a vacuum chuck 4 sequentially disposed from bottom to top, wherein the first driving member drives the first load board to make a large-stroke linear motion on XYZ three axes, the second driving member is disposed on the first load board and drives the second load board to make a micro motion with six degrees of freedom, the vacuum chuck 4 is disposed on the second load board, and the wafer carrying device further includes a lifting assembly, and the lifting assembly includes:
at least two vertical tab posts 42;
a third driving member disposed on the first load plate and below the second driving member;
the second driving member, the second load board and the vacuum chuck 4 are provided with coaxial through holes 18 with the same diameter so as to form a channel corresponding to the tab column 42, the third driving member drives the top of the tab column 42 to synchronously reciprocate in and out of the top of the channel in the vertical direction, and the channel enables the tab column 42 to adapt to the second load board to perform six-degree-of-freedom micro motion;
in the above technical solution, the first load board and the second load board are both horizontally disposed, the first driving member is a structure well known to those skilled in the art, for example, the first driving member includes a lifting platform for driving the first load board to move in the Z-axis direction and a gantry motion platform 19 for driving the lifting platform to move in the X, Y axis direction, the first load board and the lifting platform form a vertical lifting motion platform 17, and the structure of the vertical lifting motion platform 17 may be as follows
202122083834.1, the gantry motion table 19 may be a high-precision gantry motion table 19 disclosed in 202122483486.7, the high-precision gantry motion table 19 includes an upper shaft load plate 195 and a driving assembly for driving the upper shaft load plate 195 to move in the X, Y axial direction, and the vertical lifting motion table 17 is disposed on the upper shaft load plate 195; the second driving member and the second load board form a six-degree-of-freedom micro-motion platform 15, the structure of the six-degree-of-freedom micro-motion platform 15 is the six-degree-of-freedom micro-motion platform 15 disclosed in the patent with application number 202122053282.X, an installation space is reserved between the six-degree-of-freedom micro-motion platform 15 and the first load board, the middle part of the bottom of the six-degree-of-freedom micro-motion platform 15 can be fixedly connected with the first load board through a plurality of vertical connecting columns, a middle space is enclosed between the plurality of connecting columns, the third driving member is installed in the middle space, the third driving member can be a linear motor, and a rotor of the third driving member moves in the vertical direction, each tab column 42 is fixedly connected with a rotor of the linear motor so as to lift the follower, a plurality of coaxial holes 18 with the same diameter are formed in the vacuum chuck 4 and the six-degree-of-freedom micro-motion platform 15 so as to form a plurality of channels for the tab columns 42 to penetrate, the plurality of channels are in one-to-one correspondence with the plurality of tab columns 42, the holes 18 on the vacuum chuck 4 are uniformly distributed at intervals along the circumferential direction of the vacuum chuck 4, the number of the tab columns 42 can be two, three or four, and the like, according to practical design, the third driving piece drives the top of the tab column 42 to enter and exit the top of the channels in the vertical direction (namely enter and exit the holes 18 on the vacuum chuck 4); the channel enables the tab post 42 to adapt to the second load plate to perform six-degree-of-freedom micro-motion, namely, the diameter of the channel needs to consider micro-motion and micro-rotation on a X, Y, Z shaft generated by the second load plate to perform six-degree-of-freedom micro-motion during design, the diameter of the channel can be adjusted and designed adaptively according to practical situations after the second load plate performs six-degree-of-freedom micro-motion, the tab post 42 component is still in the channel, and in practical use, the stroke of the micro-motion platform is within a range of hundreds of micrometers, and the gap between the channel and the tab post is a few millimeters; the lifting component is not contacted with the six-degree-of-freedom micro-stage; further, the large stroke of the first driving piece on the XYZ three axes and the small stroke and the rotation angle of the six-degree-of-freedom micro-motion platform on the XYZ three axes can be designed according to practical situations, for example, the large stroke range of the first driving piece can be: the X axis is 0-970mm, the Y axis is 0-340mm, the Z axis is 0-25mm, and the small stroke range of the six-degree-of-freedom micro-motion platform on the XYZ three axes can be: XYZ are all 0-110 mu m, and the rotation angles (theta x/theta y/theta z) are all: 60arcsec;
in the technical scheme, in the use process, the wafer is always adsorbed on the vacuum chuck 4 in the photoetching process, when the wafer is completely photoetched and the manipulator needs to take away the wafer, the third driving piece drives the tab column 42 to extend upwards, and the wafer is jacked up to be separated from the vacuum chuck 4, so that an operable space of the manipulator is provided, and the manipulator is convenient to take away;
by adopting the technical scheme, the beneficial effects that through designing first driving piece, first load board, second driving piece, second load board, vacuum chuck 4, splicing column 42, third driving piece, perforation 18, the cooperation adjustment of original vertical lifting motion platform 17 and micro-gap platform has been avoided, easy operation, quick.
In another aspect, the third driving member includes:
the horizontal base 8 is arranged on the first load board, the vertical board 1 is arranged on the base 8, a pair of parallel and vertically arranged slide rails 2 are arranged on the vertical board 1, and a sliding block is arranged on each slide rail 2;
a vertical third load plate 5 fixedly connected with a pair of sliding blocks;
the mounting block is fixedly connected with the top of the third load board 5, and the tab column 42 is arranged on the mounting block;
the grating ruler 6 is arranged on the third load board 5, and a reading head 7 matched with the grating ruler 6 is arranged on the base 8;
a linear motor which drives the third load plate 5 to slide;
in the above technical scheme, a horizontal plate is arranged at the top of the vertical plate 1, the vertical plate 1 and the horizontal plate form an L-shaped plate, a rotor of the linear motor is mounted on the horizontal plate, the rotor of the linear motor is fixedly connected with the mounting block so as to sequentially drive the mounting block and the third load plate 5 to move when the rotor of the linear motor moves, wherein the third load plate 5 is limited to move in the vertical direction along a pair of guide rails through a sliding block; the base 8 is provided with a reading head mounting block 9, the reading head 7 is mounted on the reading head mounting block 9, the grating ruler 6 is arranged on the load board, the grating ruler 6 is matched with the reading head 7, and the grating ruler 6 is used as position feedback to realize closed-loop control of the structure, so that higher precision requirements (micron-level positioning and hundred-nanometer-level repeated positioning) are met;
in the technical scheme, when the wafer needs to be lifted upwards in the use process, the linear motor rotor moves upwards to drive the splicing column 42 to move upwards so as to lift the wafer top out of the vacuum chuck 4;
adopt this technical scheme, the beneficial effect who obtains is, through design base 8, vertical board 1, slide rail 2, slider, installation piece, grating chi 6, reading head 7, linear electric motor, provides the structure of a third driving piece, draws materials and simple to operate, and drive stability is better in vertical direction.
In another technical scheme, a horizontal plate is arranged at the top of the vertical plate 1; the linear motor is a voice coil motor 3, a rotor of the voice coil motor 3 is arranged on the horizontal plate, and the rotor of the voice coil motor 3 is fixedly connected with the mounting block so as to drive the mounting block to move when the rotor moves; by adopting the technical scheme, the voice coil motor 3 is adopted to directly drive, a transmission link driven by a servo motor is omitted, the driving efficiency is improved, the size of the structure is greatly reduced, and the installation and application in a limited space can be fully satisfied.
In another embodiment, there are three tab posts 42; the mounting block comprises a horizontal circular block 45 and three connecting rods 41 which are uniformly and horizontally arranged along the circumferential wall surface of the circular block 45, wherein the three connecting rods 41 are in one-to-one correspondence with three splicing columns 42, and the bottoms of the splicing columns 42 are arranged on the top surfaces of the corresponding connecting rods 41; specifically, the bottom of the circular block 45 is fixedly connected with the load board, the top of the circular block 45 is fixedly connected with the mover of the voice coil motor 3, and the tops of the three splicing columns 42 are coplanar; by adopting the technical scheme, the beneficial effect is that the three splicing columns 42 are designed to form a three-point supporting mode, so that the supporting effect is good, and the wafer lifting device is more stable.
In another technical scheme, the device further comprises a transfer block 14, wherein the transfer block 14 is arranged between the first load board and the first driving piece, the bottom of the transfer block 14 is fixedly connected with the first load board, the top of the transfer block 14 is fixedly connected with the first driving piece, the middle of the transfer block 14 is provided with a mounting hole 21 in a penetrating way, and the bottom of the base 8 is fixedly connected with the first load board through the mounting hole 21; specifically, as shown in fig. 16, the adapter block 14 includes a block body and a connecting plate extending along a circumferential direction of the block body, the connecting plate is connected with the first load board through a screw, the top of the block body is fixedly connected with the bottom of the six-degree-of-freedom micro-motion platform 15, a mounting hole 21 is formed in the middle of the block body, the mounting hole 21 is adapted to the third driving piece, and the bottom of the base 8 passes through the mounting hole 21 and is fixedly connected with the first load board; by adopting the technical scheme, the beneficial effect that obtains is through designing the adapter block 14, provides a connected mode between third driving piece, first load board and the second driving piece, simple to operate, quick and save space.
In another technical scheme, a pair of photoelectric switches 13 are arranged on one side wall of the vertical plate 1 in a height manner, a pair of limit pulling pieces 12 are arranged on one side wall of the third load plate 5 in a height manner, the pair of limit pulling pieces 12 correspond to the pair of photoelectric switches 13, and the pair of limit pulling pieces 12 move between the pair of photoelectric switches 13, so that when the limit pulling pieces 12 move to the corresponding photoelectric switches 13, the photoelectric switches 13 are triggered to form electric limit; specifically, as shown in fig. 4, a pair of photoelectric switches 13 are sequentially disposed on the side wall of the vertical plate 1 from top to bottom, a pair of limit paddles 12 are sequentially disposed on the third load plate 5 from top to bottom, the photoelectric switch 13 located at a high position corresponds to the limit paddle 12 located at a high position, the photoelectric switch 13 located at a low position corresponds to the limit paddle 12 located at a low position, and when the limit paddles 12 move to the corresponding photoelectric switches 13, the corresponding photoelectric switches 13 are triggered to form an electric limit; by adopting the technical scheme, the beneficial effect that through setting up photoelectric switch 13, spacing plectrum 12, form the electricity spacing to whole device to ensure that the splicing post reciprocates the osculum in the within range of settlement, avoid splicing post to surpass the limit range of voice coil motor and slide rail.
In another technical scheme, a horizontal anti-collision nail 11 is arranged on the third load board 5, a vertical limiting board 10 is arranged on the base 8, a slot hole along the vertical direction is formed in the limiting board 10, and the anti-collision nail 11 extends into the slot hole and moves up and down in the slot hole to form mechanical limiting; specifically, as shown in fig. 3, the anti-collision nail 11 is in a horizontal column shape, the slot hole is a rectangular hole, the anti-collision nail 11 extends into the slot hole and moves in the vertical direction in the slot hole under the movement of the third load, when the anti-collision nail 11 moves to the top of the slot hole, the slot hole prevents the anti-collision nail 11 from moving upwards continuously, and the third load board 5 can be prevented from derailing under the condition of failure of the third driving member; by adopting the technical scheme, the beneficial effect that through setting up crashproof nail 11, limiting plate 10, slotted hole, formed mechanical spacing, can avoid third load board 5 derailment.
In another technical scheme, the mounting block, the connecting rod 41 and the splicing column 42 are internally provided with air passages 46 which are sequentially communicated, the air passages 46 of the splicing column 42 penetrate through the top of the splicing column 42, and the air passages 46 are communicated with a vacuumizing device; specifically, as shown in fig. 6 to 7, the mounting block comprises a circular block 45 and three connecting rods 41 uniformly arranged along the circumferential wall surface of the circular block 45 at intervals, the connecting rods 41 are square blocks, the tops of the connecting rods 41 are provided with splicing columns 42, the splicing columns 42 comprise large-diameter bottom columns and small-diameter struts which are coaxially connected in sequence from bottom to top, the bottoms of the splicing columns 42 are fixedly connected with the connecting rods 41, the circular block 45, the connecting rods 41 and the splicing columns 42 are provided with air passages 46 which are sequentially communicated, the air passages 46 at the tops of the splicing columns 42 are communicated with the outside, one connecting rod 41 is provided with an air inlet which is communicated with the air passages 46, and an air pipe micro joint 44 is arranged at the air inlet and is communicated with a vacuumizing device; when the wafer suction device is used, the vacuum pumping device is started to generate suction at the air inlet, the suction is transmitted to the air passage 46 at the top of each splicing column 42 through the air passage 46, and suction is generated at the top of each splicing column 42, so that the wafer is conveniently adsorbed; by adopting the technical scheme, the wafer lifting device has the beneficial effects that by arranging the air passage 46, the wafer is conveniently adsorbed on the top of the splicing column 42 when the wafer is lifted, and the stability of the wafer in the lifting process is improved.
In another technical scheme, a tab head 43 is adhered to the top of the tab post 42, and the tab head 43 is made of PEEK; specifically, the tab head 43 is laid on top of the tab post 42; by adopting the technical scheme, the beneficial effect is that the wafer quality is poor due to the influence on the wafer when the tab post 42 is contacted with the wafer can be reduced by designing the tab head 43 made of PEEK material.
In another aspect, the first driving member includes a vertical lifting moving table 17 for driving the first load board to move in the Z-axis direction and a gantry moving table 19 for driving the vertical lifting moving table 17 to move in the X, Y axis direction, the gantry moving table 19 includes a base 191, a pair of parallel first guide rails 192 horizontally disposed on the base 191, an upper shaft bottom plate 194 slidably disposed between the pair of first guide rails 192, a pair of parallel second guide rails 193 horizontally disposed on the upper shaft bottom plate 194, and an upper shaft load board 195 slidably disposed on the pair of second guide rails 193, the first guide rails 192 and the second guide rails 193 are perpendicular, a middle portion of the upper shaft bottom plate 194 is recessed downward to form a sinking chute 20, a middle portion of the upper shaft load board 195 is recessed downward to form a sinking chute 16, a bottom portion of the sinking chute 16 is extended into the sinking chute 20 and slides along the sinking chute 20, and a bottom portion of the vertical lifting moving table 17 is disposed on the sinking chute 16;
in the above technical solution, specifically, the base 191 of the gantry moving table 19 is made of granite to ensure structural stability, a pair of parallel first rails 192 are provided on the base 191, a first slide block is provided on the first rails 192, a pair of first slide blocks are fixedly connected with an upper shaft bottom plate 194, a pair of parallel second rails 193 are provided on the upper shaft bottom plate 194, a second slide block is provided on the second rails 193, an upper shaft load plate 195 is fixedly connected on the pair of second slide blocks, and the first rails 192 and the second rails 193 are perpendicular to realize large-stroke movement on the X, Y shaft; the vertical lifting movement table 17 is arranged in the sinking groove 16; by adopting the technical scheme, the beneficial effects that through designing the sinking chute 20 and the sinking chute 16, the height of the six-degree-of-freedom micro-motion platform 15 is conveniently reduced, the X, Y shaft is ensured to realize centroid driving, and the driving precision is improved so as to reduce Abbe errors of the wafer in the processing and adjusting processes.
The number of equipment and the scale of processing described herein are intended to simplify the description of the present invention. Applications, modifications and variations to the wafer carrier of the present invention will be readily apparent to those skilled in the art.
Although embodiments of the present invention have been disclosed above, it is not limited to the details and embodiments shown and described, it is well suited to various fields of use for which the invention would be readily apparent to those skilled in the art, and accordingly, the invention is not limited to the specific details and illustrations shown and described herein, without departing from the general concepts defined in the claims and their equivalents.
Claims (10)
1. The wafer bearing device comprises a first driving piece, a first load plate, a second driving piece, a second load plate and a vacuum chuck which are sequentially arranged from bottom to top, wherein the first driving piece drives the first load plate to do large-stroke linear motion on XYZ three axes, the second driving piece is arranged on the first load plate and drives the second load plate to do six-degree-of-freedom micro motion, and the vacuum chuck is arranged on the second load plate.
At least two vertical tab posts;
a third driving member disposed on the first load plate and below the second driving member;
the second driving piece, the second load plate and the vacuum chuck are all provided with coaxial through holes with the same diameter so as to form a channel corresponding to the splicing column, the third driving piece drives the top of the splicing column to synchronously reciprocate in and out of the top of the channel in the vertical direction, and the channel enables the splicing column to adapt to the second load plate to perform six-degree-of-freedom micro motion.
2. The wafer carrier of claim 1, wherein the third drive comprises:
the horizontal base is arranged on the first load plate, a vertical plate is arranged on the base, a pair of parallel and vertically arranged sliding rails are arranged on the vertical plate, and a sliding block is arranged on each sliding rail;
a vertical third load plate fixedly connected with the pair of sliding blocks;
the mounting block is fixedly connected with the top of the third load board, and the tab column is arranged on the mounting block;
the grating ruler is arranged on the third load board, and a reading head matched with the grating ruler is arranged on the base;
and the linear motor drives the third load plate to slide.
3. The wafer carrier of claim 2, wherein a horizontal plate is provided on top of the vertical plate; the linear motor is a voice coil motor, a rotor of the voice coil motor is arranged on the horizontal plate, and the rotor of the voice coil motor is fixedly connected with the mounting block so as to drive the mounting block to move when the rotor moves.
4. The wafer carrier of claim 3, wherein there are three tab posts; the installation piece includes horizontal circular piece, follows circular piece circumference wall interval is even and three connecting rods that the level set up, and three connecting rods correspond with three piece posts one-to-one, the bottom of piece post is established on corresponding connecting rod top surface.
5. The wafer carrier of claim 2, further comprising a transfer block disposed between the first load plate and the first driving member, the transfer block having a bottom portion fixedly coupled to the first load plate and a top portion fixedly coupled to the first driving member, a mounting hole extending through a middle portion of the transfer block, and a bottom portion of the base fixedly coupled to the first load plate through the mounting hole.
6. The wafer carrier of claim 4, wherein a pair of photoelectric switches are disposed on a side wall of the vertical plate, and a pair of limit paddles are disposed on a side wall of the third load plate, wherein the pair of limit paddles correspond to the pair of photoelectric switches and move between the pair of photoelectric switches, so as to trigger the photoelectric switches to form an electrical limit when the limit paddles move to the corresponding photoelectric switches.
7. The wafer carrier of claim 6, wherein the third load plate is provided with a horizontal anti-collision pin, the base is provided with a vertical limiting plate, the limiting plate is provided with a slot along a vertical direction, and the anti-collision pin extends into the slot and moves up and down in the slot to form a mechanical limit.
8. The wafer carrier of claim 4, wherein the mounting block, the connecting rod, and the tab post are internally provided with sequentially communicating air passages, and the air passages of the tab post extend through the top of the tab post, the air passages being in communication with a vacuum extractor.
9. The wafer carrier of claim 8, wherein the tab post has a tab head attached to a top thereof, the tab head being made of PEEK.
10. The wafer carrier of claim 1, wherein the first driving member comprises a vertical lifting platform for driving the first load plate to move in a Z-axis direction and a gantry moving platform for driving the vertical lifting platform to move in a X, Y-axis direction, the gantry moving platform comprises a base, a pair of parallel first guide rails horizontally arranged on the base, an upper shaft bottom plate slidably arranged between the pair of first guide rails, a pair of parallel second guide rails horizontally arranged on the upper shaft bottom plate, and an upper shaft load plate slidably arranged on the pair of second guide rails, the first guide rails are perpendicular to the second guide rails, a middle part of the upper shaft bottom plate is recessed downwards to form a sinking chute, a middle part of the upper shaft load plate is recessed downwards to form a sinking chute, a bottom of the sinking chute extends into the sinking chute and slides along the sinking chute, and a bottom of the vertical lifting platform is arranged on an inner bottom of the sinking chute.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310379220.9A CN116387234B (en) | 2023-04-11 | 2023-04-11 | Wafer bearing device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310379220.9A CN116387234B (en) | 2023-04-11 | 2023-04-11 | Wafer bearing device |
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| CN116387234A true CN116387234A (en) | 2023-07-04 |
| CN116387234B CN116387234B (en) | 2023-12-19 |
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| CN117080156A (en) * | 2023-10-18 | 2023-11-17 | 盛吉盛(宁波)半导体科技有限公司 | Carrier device for wafer detection |
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| CN116387234B (en) | 2023-12-19 |
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