CN203616356U - Manual probe bench for testing semiconductor chip - Google Patents
Manual probe bench for testing semiconductor chip Download PDFInfo
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- CN203616356U CN203616356U CN201320796576.4U CN201320796576U CN203616356U CN 203616356 U CN203616356 U CN 203616356U CN 201320796576 U CN201320796576 U CN 201320796576U CN 203616356 U CN203616356 U CN 203616356U
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- vacuum cup
- probe station
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- wafer
- supporting platform
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Abstract
A manual probe bench for testing a semiconductor chip belongs to the technical field of probe benches. The manual probe bench comprises a probe bench pedestal, a chip supporting stage, a chip supporting stage seat, a rapid addressing mechanism, a locking mechanism and a fine tuning mechanism; and is characterized in that the locking mechanism is composed of a vacuum chuck, the fining tuning mechanism is composed of a connecting rod, a fine tuning guide plate, a fine tuning handle, a spherical plain bearing and an aligning bearing, the rapid addressing mechanism is fixed and locked when the vacuum chuck is locked with the top surface of the probe bench pedestal in a vacuum state, the bottom end of the fine tuning handle is connected with the spherical plain bearing, the middle portion of the fine tuning handle is connected with one end of the connecting rod via the aligning bearing, the other end of the connecting rod is connected with the chip supporting stage seat, and when the fine tuning handle is dialed, the aligning bearing can swing within 360 degree in the horizontal plane and the connecting rod is driven to move in any direction in the horizontal plane to realize fine tuning of the chip supporting stage seat. In the chip testing and aligning process, the manual probe bench can lock the rapid addressing mechanism after completion of rapid coarse alignment to realize fine tuning and accurate aligning.
Description
Technical field
The utility model relates to the manual probe station of a kind of semiconductor die testing, and especially the locking of the vacuum of the manual probe station of semiconductor die testing and micro-adjusting mechanism, belong to probe station technical field.
Background technology
In the production and development process of semi-conductor chip, need to carry out procedural test and terminal test to the parameters of chip, completing the required test aligning equipment of test is mainly probe station.The kind of probe station comprises full-automatic probe station, semi-automatic probe station and manual probe station.Full-automatic probe station and semi-automatic probe station are mainly used in the batch testing of chip finished product.Because having, manual probe station can take a sample test at random efficiency high, so in semi-conductor chip production testing process, need to randomly draw a small amount of discontinuous test point and carry out sample testing chip parameter time, substantially all use manual probe station.Manually probe station can quickly, accurately and conveniently find required test point on the chip being placed on wafer-supporting platform, such as base, the launch site etc. of triode, probe on manual probe station is reliably contacted with test point, the test condition arranging on supporting testing tool is added on tested tube core by probe, realizes the object to core parameter testing.Owing to having several thousand to several ten thousand tube cores on a slice diameter chip that is 100mm, maximum (diodes) have more than 100,000, the size of each tube core is less, the size of base and launch site is all less than 0.1mm, adopt manual operation, realize and on chip, find arbitrarily a tube core, probe is aimed at accurately to the test zone of this tube core, the accuracy requirement higher to being designed with of equipment, this is mainly reflected in can be by coarse adjustment action locking after coarse adjustment has been moved, realize fine adjustment function, probe is accurately aimed to test zone.
Manually probe station major part does not all have fine adjustment function setting in the market, and little die testing is aimed at extremely inconvenient.Some is provided with the probe station of micromatic setting, conventionally all adopts mechanical cam locking and electromagnet to lock to realize this function, but complex structure, and vibration is large, has offset phenomena to occur in locking process, and precision is lower, and low precision while testing tubule core, efficiency are low.
Utility model content
The purpose of this utility model is for above-mentioned the deficiencies in the prior art, provides a kind of semiconductor die testing manual probe station, after making chip to be measured complete immediate addressing in test process to aim at, can be fast, convenient, accurately aim at accurately.
The purpose of this utility model is achieved through the following technical solutions: the manual probe station of semiconductor die testing, comprise probe station base, be arranged on microscope, lifting table on probe station base column, be fixed on lifting table for the probe carriage of installation testing probe, for place chip to be tested wafer-supporting platform, wafer-supporting platform seat, immediate addressing mechanism, latch mechanism and the micro-adjusting mechanism of wafer-supporting platform are installed, below described probe station base, be provided with electrical appliance kit, described wafer-supporting platform seat is placed on the guide rail of immediate addressing mechanism, it is characterized in that
Described latch mechanism is made up of vacuum cup, and described micro-adjusting mechanism is made up of connecting rod, fine setting guide plate, trimming handle, oscillating bearing, self-aligning bearing,
The table top laminating of described vacuum cup and probe station base, described micro-adjusting mechanism is arranged on vacuum cup, vacuum cup is connected with immediate addressing mechanism by fine setting guide plate, when the table top of vacuum cup and probe station base is vacuum locking state, and the locking that is fixed of immediate addressing mechanism;
Described trimming handle bottom is connected with oscillating bearing, trimming handle middle part connects connecting rod one end by the self-aligning bearing being embedded in connecting rod, the described connecting rod other end is connected with wafer-supporting platform seat, stir trimming handle top, by the point action of oscillating bearing, self-aligning bearing can do 360 ° of swings in surface level, and in surface level, does the movement of any direction by self-aligning bearing drivening rod, realizes the fine setting of wafer-supporting platform seat.
Described fine setting guide plate is between immediate addressing mechanism X-axis guide rail and vacuum cup, the radial ball bearing arranging on two Y-direction gathering sills that arrange on fine setting guide plate and four drift angles, respectively with vacuum cup on a directions X gathering sill of four radial ball bearings arranging and the X-axis rail back setting of immediate addressing mechanism form respectively to slide and pay, form the connection of vacuum cup and immediate addressing mechanism and control the guiding that relatively moves of vacuum cup and wafer-supporting platform seat in trim process;
Trimming handle is in trim process, vacuum cup and wafer-supporting platform seat have coordinated by finely tuning four radial ball bearings on guide plate and the directions X gathering sill of immediate addressing mechanism X-axis rail back setting at the mobile guide of directions X, have been coordinated by four radial ball bearings on two Y-direction gathering sills and the vacuum cup of finely tuning on guide plate at the mobile guide of Y-direction.
Described vacuum cup lower surface is provided with vacuum chamber, and vacuum chamber is arranged between vacuum cup and probe station base, and fits with the table top of probe station base, and the diameter of vacuum chamber is 95mm.
In described electrical appliance kit, be provided with electrical equipment, Pneumatic component, electrical equipment, Pneumatic component are connected and composed by 24 volts of power supplys of direct current, solenoid valve, locking button circuit, locking button is in normally open, now vacuum cup imports vacuum, the table top of vacuum cup and probe station base is vacuum locking state, the locking that is fixed of immediate addressing mechanism, finely tunes wafer-supporting platform seat by micro-adjusting mechanism; When locking button is closed, in vacuum cup, vacuum discharges, and the table top of vacuum cup and probe station base is antivacuum locking state.
Described solenoid valve is 23 three-way electromagnetic valves.
Described vacuum cup is being coated with probe station base table top binding face place the teflon coatings that 0.3mm is thick.
In chip testing process, when immediate addressing mechanism completes after coarse adjustment aligning, need to realize by fine setting alignment actions the accurate contraposition of tested pilot on test probe and chip, complete test.Vacuum cup in the utility model and micro-adjusting mechanism can easily be realized the accurate contraposition after chip coarse adjustment to be measured, and compact conformation, accurately reliable.After being locked, immediate addressing mechanism can implement fine alignment by micro-adjusting mechanism, its feature is vacuum suction function, vacuum cup is adsorbed on the base table top of probe station, by fine setting guide plate, immediate addressing mechanism action is locked, because micro-adjusting mechanism is arranged on vacuum cup, after vacuum cup is fixing, the position of micro-adjusting mechanism is also fixed, now adjust the trimming handle on micro-adjusting mechanism, can drive wafer-supporting platform to do trimming movement by the connecting rod being connected with trimming handle, realizing fine setting aims at, the size of adjustable range is determined by the drift angle size of trimming handle.Controlling sucking and loosening of vacuum cup, is to lock button by operation to control on vacuum cup in vacuum chamber, whether to import vacuum, and the break-make of switching vacuum in vacuum cup can be controlled the sorption of sucker and loosen.
The lower surface of this novel middle vacuum cup is provided with the vacuum chamber that a diameter is 95mm, the work top laminating of vacuum chamber and probe station, design a vacuum passage, as required vacuum chamber is imported vacuum or discharges vacuum, in the time of the indoor importing vacuum of vacuum, vacuum cup can be adsorbed on probe station work top firmly, and in the time that the vacuum of the indoor importing of vacuum is cut off, the suction of vacuum cup can disappear automatically due to releasing of vacuum.When vacuum chamber vacuum be-when 0.04MPa, more than the suction of vacuum cup and work top can reach 15Kgf, reacting force when wafer-supporting platform moves while meeting fine setting far away.Wherein:
Vacuum chamber diameter=φ 95mm;
Vacuum chamber area=3.14 × (95 ÷ 2) 2=7084mm2=70.84 cm2;
Import vacuum chamber vacuum pressure=-0.04MPa=-4.08 × 10
-1kgf/cm2;
Lead and pour into after vacuum, theoretical sucker and the work top suction of calculating:
4.08×10
-1Kgf/?cm2×70.84cm
22＝28.9Kgf；
Locking efficiency is by 60% design;
Import after vacuum sucker and work top suction=28.9 Kgf × 0.6=17.34 Kgf.
The one side contacting with the table top of probe station base on vacuum cup in the utility model, has adopted Teflon surface coating treatment technology, has both guaranteed leakage efficiency, the friction factor when reducing vacuum cup simultaneously and moving on probe station working surface.
When in the utility model, micro-adjusting mechanism is adjusted, coordinated by the directions X gathering sill of finely tuning below the X-axis seat of 4 radial ball bearings on guide plate angle and immediate addressing mechanism in the guiding of plane X direction; Guiding in plane Y-direction has coordinated by finely tuning 2 Y-direction gathering sills on guide plate and 4 radial ball bearings that are fixed on vacuum cup.
The utility model is simple and reasonable, easily realization, electrical equipment, the Pneumatic component of vacuum cup, connecting rod, trimming handle, fine setting guide plate and control vacuum, can be in chip testing alignment procedures, complete Fast Coarse aim at after immediate addressing mechanism is locked, implement trimming movement, realize fine alignment.Wafer-supporting platform both, with the action of immediate addressing winding machine coarse alignment, can, in the situation that immediate addressing mechanism is locked, be subject to micro-adjusting mechanism control again, realized fine alignment.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model;
Fig. 2 is the structural representation of micro-adjusting mechanism in the utility model;
Fig. 3 is the structural representation of finely tuning guide plate in the utility model;
Fig. 4 be in Fig. 3 A-A to sectional structure schematic diagram;
Fig. 5 is electrical equipment in the utility model, Pneumatic component control principle drawing
In figure: 1 electrical appliance kit, 2 probe station bases, 3 immediate addressing mechanisms, 4 micro-adjusting mechanisms, 5 wafer-supporting platform seats, 6 wafer-supporting platforms, 7 lifting tables, 8 probe carriages, 9 microscopes, 10 vacuum cups, 11 connecting rods, 12 fine setting guide plates, 13 trimming handles, 14 oscillating bearings, 15 self-aligning bearings, 16 directions X gathering sills, 17 Y-direction gathering sills, 18 radial ball bearings, 19 radial ball bearings, 20 vacuum chambers, 21 power supplys, 22 solenoid valves, 23 locking buttons.
Embodiment
The manual probe station of semiconductor die testing, comprise probe station base 2, be arranged on probe station base column for observing standby microscope 9, the lifting table 7 of surveying chip, be fixed on the probe carriage 8 for installation testing probe on lifting table, for place chip to be tested wafer-supporting platform 6, wafer-supporting platform seat 5, immediate addressing mechanism 3, latch mechanism and the micro-adjusting mechanism 4 of wafer-supporting platform are installed, below probe station base, be provided with electrical appliance kit 1, wafer-supporting platform seat is placed on the guide rail of immediate addressing mechanism.
Latch mechanism is made up of vacuum cup 10, and micro-adjusting mechanism 4 is made up of connecting rod 11, fine setting guide plate 12, trimming handle 13, oscillating bearing 14, self-aligning bearing 15.The table top laminating of vacuum cup and probe station base, micro-adjusting mechanism 4 is arranged on vacuum cup, and vacuum cup is connected with immediate addressing mechanism by fine setting guide plate.Vacuum cup lower surface is provided with vacuum chamber 20, and vacuum chamber is arranged between vacuum cup and probe station base, and fits with the table top of probe station base, and the diameter of vacuum chamber is 95mm.In electrical appliance kit 1, be provided with electrical equipment, Pneumatic component, electrical equipment, Pneumatic component are connected and composed by 21,23 three-way electromagnetic valves 22 of 24 volts of power supplys of direct current, locking button 23 circuit.Locking button is in normally open, and now vacuum cup imports vacuum, and the table top of vacuum cup and probe station base is vacuum locking state, and the locking that is fixed of immediate addressing mechanism, finely tunes wafer-supporting platform seat by micro-adjusting mechanism; Locking button closure, in vacuum cup, vacuum discharges, and the table top of vacuum cup and probe station base is antivacuum locking state.
Trimming handle bottom is connected with oscillating bearing, trimming handle middle part connects connecting rod one end by the self-aligning bearing being embedded in connecting rod, the connecting rod other end is connected with wafer-supporting platform seat 5, stir trimming handle, by the point action of oscillating bearing, can make self-aligning bearing in surface level, do 360 ° of swings, and in surface level, do the movement of any direction by self-aligning bearing drivening rod, realize the fine setting of wafer-supporting platform seat.
Fine setting guide plate is provided with two Y-direction gathering sills 17, on its four drift angles, is respectively equipped with radial ball bearing 18, and vacuum cup is provided with four radial ball bearings 19, and immediate addressing mechanism is provided with two directions X gathering sills 16.
The radial ball bearing arranging respectively on two Y-direction gathering sills that arrange on fine setting guide plate and four drift angles, respectively with vacuum cup on a directions X gathering sill of four radial ball bearings arranging and the X-axis rail back setting of immediate addressing mechanism form respectively to slide and pay, form the connection of vacuum cup and immediate addressing mechanism and control the guiding that relatively moves of vacuum cup and wafer-supporting platform seat in trim process.
Trimming handle is in trim process, vacuum cup and wafer-supporting platform seat have coordinated by finely tuning four radial ball bearings on guide plate and the directions X gathering sill of immediate addressing mechanism X-axis rail back setting at the mobile guide of directions X, have been coordinated by four radial ball bearings on two Y-direction gathering sills and the vacuum cup of finely tuning on guide plate at the mobile guide of Y-direction.
Vacuum cup is being coated with probe station base table top binding face place the teflon coatings that 0.3mm is thick.
The switching that in the utility model, vacuum cup vacuum imports realizes by following action, as shown in Figure 5, K1(locks button 22) be to control often the opening without self-locking button switch of vacuum cup, in the time that K switch 1 is not pressed, vacuum source is delivered to vacuum pressure in vacuum chamber by solenoid valve D1, sucker locking.This kind of state is applicable to fine setting, test and idle period.In the time of needs coarse adjustment, press K switch 1, solenoid valve D1 action, cuts off the vacuum source in vacuum chamber, residual vacuum in vacuum chamber outwards discharges by solenoid valve simultaneously,, chuck surface and susceptor surface are in free state, and locking action disappears, now can carry out the coarse adjustment alignment function of immediate addressing, release button K1 after coarse adjustment has been aimed at, resets after solenoid valve D1 dead electricity, and vacuum cup recovers locking action.In practical operation, operator if do immediate addressing coarse adjustment alignment function time, press K1 switch, just can easily realize coarse adjustment alignment function; In the time that end is aimed in coarse adjustment, decontrol K1 switch, just can realize fine setting and test function.
Probe carriage 8 is for installation testing probe, there is three-dimensional regulation function, magnetic bases can easily be fixed on lifting table 7, wafer-supporting platform 6 is for placing chip to be tested, together with after fixing with wafer-supporting platform seat 5, be arranged on the guide rail of immediate addressing mechanism 3, can realize the adjustment function of θ direction on surface level.Vacuum cup 10 is by after the locking of immediate addressing mechanism, and micro-adjusting mechanism drives wafer-supporting platform to realize the fine adjustment function that chip moves by connecting rod; The effect of probe station base 2 is except the skeleton as whole equipment, and the smooth finish to work top and wearing quality have designed higher requirement, to guarantee the efficiency of vacuum cup and the durability degree of use.Base 2 electrical appliance kit below, for erecting equipment power supply and control apparatus and pneumatic element, is realized and is controlled function, and complete machine structure is coordinated, one integrated mass.
Operation steps of the present utility model is as follows: 1. chip to be measured is placed on wafer-supporting platform; 2. press locking button, utilize immediate addressing mechanism that wafer-supporting platform is placed in to the rear locking button that discharges under microscope, adjust as required microscope focal length and enlargement ratio; 3. according to test request, one or two test probes are adjusted to the correspondence position of test point; 4. on testing tool, choose suitable test condition; 5. press locking button, utilize immediate addressing mechanism to find and take a sample test tube core, and moved under probe; 6. discharge locking button, realize locking function, the test zone of tube core is aimed at probe by operation micro-adjusting mechanism; 7. operational testing handle, wafer-supporting platform can be along Z-direction upwards, makes test probe engaged test region, tests; 8. record test data; 9. operational testing handle, makes wafer-supporting platform reset in Z-direction; Repeat 5. 6. 7. 8. the next test point on same chip to be tested; 10. repeat 1. 5. 6. 7. 8. next sheet chip to be tested.
In chip testing alignment procedures, operating personnel, as long as need to handle trimming handle according to aiming at, just can, fast and accurately by the test point of tested chip and probe alignment, implement test jobs.Micro-adjusting mechanism is arranged on vacuum cup, and after immediate addressing mechanism is locked, operating personnel can be quickly and accurately by probe alignment test zone by adjusting trimming handle.An oscillating bearing is arranged at trimming handle bottom, can make trimming handle in certain angular range, do 360 degree swing as a fulcrum.There is a self-aligning bearing at regulating rod middle part, the one end that connects trimming handle and connecting rod, the other end of connecting rod is connected with wafer-supporting platform, in the time that trimming handle swings, can drive wafer-supporting platform on surface level, to do the movement of any direction by connecting rod, play test chip is done to the effect that fine setting is aimed at.
As shown in Figure 5, there is a power supply that is input as AC 220 V, is output as 6 volts of 24 volts of direct currents and direct currents.24 volts of direct currents are used for controlling solenoid valve, and 6 volts of direct currents are for microscope built-in light source lighting bulb.D1 is 23 three-way electromagnetic valves, for controlling vacuum cup.D1 is controlled by K switch 1, and K1 is disconnected, pours vacuum in vacuum cup into, is vacuum locking state.K1 closes, and in vacuum cup, vacuum discharges, and is antivacuum locking state.D2 is 23 three-way electromagnetic valves, and for controlling wafer-supporting platform vacuum, effect is according to test needs, by the chip sorption on wafer-supporting platform or loosen, guarantees that test parameter is accurate by suction-operated, and test fluctuating plate is smooth.
Claims (6)
1. the manual probe station of semiconductor die testing, comprise probe station base, be arranged on microscope, lifting table on probe station base column, be fixed on lifting table for the probe carriage of installation testing probe, for place chip to be tested wafer-supporting platform, wafer-supporting platform seat, immediate addressing mechanism, latch mechanism and the micro-adjusting mechanism of wafer-supporting platform are installed, below described probe station base, be provided with electrical appliance kit, described wafer-supporting platform seat is placed on the guide rail of immediate addressing mechanism, it is characterized in that
Described latch mechanism is made up of vacuum cup, and described micro-adjusting mechanism is made up of connecting rod, fine setting guide plate, trimming handle, oscillating bearing, self-aligning bearing,
The table top laminating of described vacuum cup and probe station base, described micro-adjusting mechanism is arranged on vacuum cup, vacuum cup is connected with immediate addressing mechanism by fine setting guide plate, when the table top of vacuum cup and probe station base is vacuum locking state, and the locking that is fixed of immediate addressing mechanism;
Described trimming handle bottom is connected with oscillating bearing, trimming handle middle part connects connecting rod one end by the self-aligning bearing being embedded in connecting rod, the described connecting rod other end is connected with wafer-supporting platform seat, stir trimming handle top, by the point action of oscillating bearing, self-aligning bearing can do 360 ° of swings in surface level, and in surface level, does the movement of any direction by self-aligning bearing drivening rod, realizes the fine setting of wafer-supporting platform seat.
2. the manual probe station of semiconductor die testing according to claim 1, it is characterized in that, described fine setting guide plate is between immediate addressing mechanism X-axis guide rail and vacuum cup, the radial ball bearing arranging on two Y-direction gathering sills that arrange on fine setting guide plate and four drift angles, respectively with vacuum cup on a directions X gathering sill of four radial ball bearings arranging and the X-axis rail back setting of immediate addressing mechanism form respectively to slide and pay, form the connection of vacuum cup and immediate addressing mechanism and control the guiding that relatively moves of vacuum cup and wafer-supporting platform seat in trim process,
Trimming handle is in trim process, vacuum cup and wafer-supporting platform seat have coordinated by finely tuning four radial ball bearings on guide plate and the directions X gathering sill of immediate addressing mechanism X-axis rail back setting at the mobile guide of directions X, have been coordinated by four radial ball bearings on two Y-direction gathering sills and the vacuum cup of finely tuning on guide plate at the mobile guide of Y-direction.
3. the manual probe station of semiconductor die testing according to claim 1, it is characterized in that, described vacuum cup lower surface is provided with vacuum chamber, and vacuum chamber is arranged between vacuum cup and probe station base, and fit with the table top of probe station base, the diameter of vacuum chamber is 95mm.
4. the manual probe station of semiconductor die testing according to claim 1, it is characterized in that, in described electrical appliance kit, be provided with electrical equipment, Pneumatic component, electrical equipment, Pneumatic component are connected and composed by 24 volts of power supplys of direct current, solenoid valve, locking button circuit, locking button is in normally open, and now vacuum cup imports vacuum, and the table top of vacuum cup and probe station base is vacuum locking state, the locking that is fixed of immediate addressing mechanism, finely tunes wafer-supporting platform seat by micro-adjusting mechanism; When locking button is closed, in vacuum cup, vacuum discharges, and the table top of vacuum cup and probe station base is antivacuum locking state.
5. the manual probe station of semiconductor die testing according to claim 4, is characterized in that, described solenoid valve is 23 three-way electromagnetic valves.
6. the manual probe station of semiconductor die testing according to claim 1, is characterized in that, described vacuum cup is being coated with probe station base table top binding face place the teflon coatings that 0.3mm is thick.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320796576.4U CN203616356U (en) | 2013-12-06 | 2013-12-06 | Manual probe bench for testing semiconductor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320796576.4U CN203616356U (en) | 2013-12-06 | 2013-12-06 | Manual probe bench for testing semiconductor chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203616356U true CN203616356U (en) | 2014-05-28 |
Family
ID=50768987
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320796576.4U Expired - Fee Related CN203616356U (en) | 2013-12-06 | 2013-12-06 | Manual probe bench for testing semiconductor chip |
Country Status (1)
| Country | Link |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104020327A (en) * | 2014-06-19 | 2014-09-03 | 中国电子科技集团公司第五十八研究所 | Probe station for chip total dose irradiation test |
| CN104155563A (en) * | 2014-08-26 | 2014-11-19 | 昆山迈致治具科技有限公司 | Test fixture of circuit board |
| CN115656755A (en) * | 2022-10-19 | 2023-01-31 | 上海柯舜科技有限公司 | Vacuum probe station |
-
2013
- 2013-12-06 CN CN201320796576.4U patent/CN203616356U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104020327A (en) * | 2014-06-19 | 2014-09-03 | 中国电子科技集团公司第五十八研究所 | Probe station for chip total dose irradiation test |
| CN104155563A (en) * | 2014-08-26 | 2014-11-19 | 昆山迈致治具科技有限公司 | Test fixture of circuit board |
| CN104155563B (en) * | 2014-08-26 | 2018-02-02 | 昆山迈致治具科技有限公司 | A kind of measurement jig of circuit board |
| CN115656755A (en) * | 2022-10-19 | 2023-01-31 | 上海柯舜科技有限公司 | Vacuum probe station |
| CN115656755B (en) * | 2022-10-19 | 2023-11-28 | 上海柯舜科技有限公司 | Vacuum probe table |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140528 Termination date: 20161206 |