CN104684274A - High-density super-density pitch welded plate and processing technology thereof - Google Patents
High-density super-density pitch welded plate and processing technology thereof Download PDFInfo
- Publication number
- CN104684274A CN104684274A CN201510099437.XA CN201510099437A CN104684274A CN 104684274 A CN104684274 A CN 104684274A CN 201510099437 A CN201510099437 A CN 201510099437A CN 104684274 A CN104684274 A CN 104684274A
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- Prior art keywords
- welded plate
- welding
- density
- tin
- feet
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a high-density super-density pitch welded plate. The high-density super-density pitch welded plate comprises a welding pad array with a plurality of welding pads, wherein a weld-aid layer and a glue sealing layer are arranged on the welded plate. The invention also discloses a processing technology of the high-density super-density pitch welded plate, the processing technology comprises the following steps: S1, directly printing a solder paste on a substrate of the welded plate; S2, directly connecting an SMD component with a BGA part solder ball; S3, sealing with glue after welding, sealing all part feet and SMD component feet with the glue, directly welding the SMD component through the tin of the BGA part solder ball. The solder paste on the welded plate is cooperatively used, so that the problem of the pseudo soldering or insufficient strength of a component junction, caused by too little tin on the solder ball and due to no addition of tin during the welding process, can be reasonably solved. The welding strength between the part feet and the SMD component is greatly reinforced through the solder paste. A tin paste printing process is removed in the method, the solder paste is directly printed and the IC is pasted, so that the deviation caused by the printing of the tin paste can be reduced and the short circuit of the adjacent welding feet can be avoided. The welded plate provided by the invention is directly sealed after being welded, so that the easy crackle of the part feet and the SMD component feet can be effectively avoided and the strength of the part can be reinforced.
Description
Technical field
The invention belongs to electronic circuit technology field, be specifically related to the ultra dense pitch welded plate of a kind of high density and processing technology thereof.
Background technology
Circuit board is the vitals realizing Electronic products manufacturing or making, after electric circuit diagram design completes, often needs to spend a large amount of corresponding circuit boards of man power and material's designing and making, so that the connection of the circuit shown on realizing circuit figure.
In order to the rapid welding of realizing circuit element, people devise general-purpose circuit board, to simplify the designing and making of circuit board.
At present, answer client development requirement, capacitance plate touch screen is developed to suspension touch control screen, requires that the pitch of IC leg is 0.13mm, but conventional IC pitch is 0.4mm, and this can not be reached by the way of current industry in attachment industry.
The usual way of current IC first prints tin cream, chip mounter is adopted to carry out paster again, then Reflow Soldering is crossed, the precision of current print solder paste is +/-0.03mm, and scolding tin pad is 0.07mm, and spacing is 0.06mm, require that IC leg pitch is 0.13mm, but according to existing technique, the skew of paste solder printing just exceedes spacing half, and is added with paster precision again and just causes short circuit.
Therefore, need a kind of new technical scheme to reach above-mentioned requirements.
Summary of the invention
Goal of the invention: for above-mentioned prior art Problems existing and deficiency, the object of this invention is to provide the ultra dense pitch welded plate of a kind of high density and processing technology thereof.
Technical scheme: the invention discloses the ultra dense pitch welded plate of a kind of high density, comprise the pad arrays of multiple weld pad, described welded plate is provided with and helps layer and adhesive layer.
As further optimization of the present invention, the layer that helps of the present invention is made up of weld-aiding cream.
As further optimization of the present invention, the spacing between the contiguous weld pad of the present invention two is minimum is 0.13mm.
As further optimization of the present invention, adhesive layer of the present invention is coated on outside surface mount elements.
The invention also discloses a kind of high density ultra dense pitch welded plate processing technology, comprise the following steps:
S1, on welded plate substrate, directly print weld-aiding cream;
S2, directly employing BGA part tin ball are connected with surface mount elements;
S3, welding carry out sealing after terminating, and part pin and surface mount elements pin are all lived by rubber seal.
Beneficial effect: the present invention compared with prior art, have the following advantages: the present invention is directly welded with surface mount elements by the tin of BGA part tin ball, coordinate the weld-aiding cream on welded plate simultaneously, rationally solve owing to not adding tin in welding process, the very few easy formation rosin joint of tin on tin ball or with the problems such as component contacts insufficient strength, the weld strength between part pin and surface mount elements is greatly strengthened by weld-aiding cream, the present invention directly carries out sealing after welding completes, effectively prevent part pin and surface mount elements pin from easily splitting, reach the effect of strengthening part strength, the present invention removes print tin cream technique, and directly print weld-aiding cream and paste IC, decrease the skew brought because of print solder paste, avoid adjacent leg short circuit problem, structure of the present invention is simple, processing step is few, can meet paster leg pitch is the development requires of 0.13mm, there is good economic benefit.
figure of description
Fig. 1 is cross section structure schematic diagram of the present invention;
Fig. 2 is structural representation of the present invention;
1--substrate, 2--help layer, 3-adhesive layer, 4-weld pad.
Embodiment
Below in conjunction with specific embodiment, the present invention is described in detail; but illustrate that protection scope of the present invention is not limited to the concrete scope of the present embodiment simultaneously; based on the embodiment in the present invention; those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
It should be noted that, in describing the invention, except as otherwise noted, the implication of " multiple " is two or more; Term " on ", D score, "left", "right", " interior ", " outward ", " front end ", " rear end ", " head ", the orientation of the instruction such as " afterbody " or position relationship be based on orientation shown in the drawings or position relationship, only the present invention for convenience of description and simplified characterization, instead of indicate or imply that the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore can not be interpreted as limitation of the present invention.In addition, term " first ", " second ", " the 3rd " etc. only for describing object, and can not be interpreted as instruction or hint relative importance.
Embodiment
As shown in Figure 1, the ultra dense pitch welded plate of a kind of high density of the present embodiment, comprises the pad arrays of multiple weld pad 4, and described welded plate is provided with and helps layer 2 and adhesive layer 3, and adhesive layer is coated on outside surface mount elements.
The layer 2 that helps of the present embodiment is made up of weld-aiding cream.
Spacing between two contiguous weld pads 4 of the present embodiment is minimum is 0.13mm.
Realize the processing technology of the ultra dense pitch welded plate of a kind of high density of the present embodiment, comprise the following steps:
S1, on welded plate substrate 1, directly print weld-aiding cream;
S2, directly employing BGA part tin ball are connected with surface mount elements;
S3, welding carry out sealing after terminating, and are all lived by rubber seal by part pin.
Traditionally, welded plate substrate first should print tin cream, but the present invention does not print tin cream and directly prints weld-aiding cream.
The chip mounter paster precision of the present embodiment is +/-0.03mm.
The present embodiment is directly welded with paster weld pad by the tin of BGA part tin ball, coordinate the weld-aiding cream on welded plate simultaneously, rationally solve owing to not adding tin in welding process, the very few easy formation rosin joint of tin on tin ball or with the problems such as component contacts insufficient strength, the weld strength between part pin and surface mount elements is greatly strengthened by weld-aiding cream, directly sealing is carried out after welding completes, effectively prevent part pin and surface mount elements pin from easily splitting, reach the effect of strengthening part strength, the present invention removes print tin cream technique, and directly print weld-aiding cream and paste IC, decrease the skew brought because of print solder paste, avoid adjacent leg short circuit problem, structure of the present invention is simple, processing step is few, can meet paster leg pitch is the development requires of 0.13mm
Embodiments of the invention provide in order to example with for the purpose of describing, and are not exhaustively or limit the invention to disclosed form.Many modifications and variations are apparent for the ordinary skill in the art.Selecting and describing embodiment is in order to principle of the present invention and practical application are better described, and enables those of ordinary skill in the art understand the present invention thus design the various embodiments with various amendment being suitable for special-purpose.
Claims (5)
1. the ultra dense pitch welded plate of high density, is characterized in that: the pad arrays comprising multiple weld pad, and described welded plate is provided with and helps layer and adhesive layer.
2. the ultra dense pitch welded plate of a kind of high density according to claim 1, is characterized in that: described in help layer to be made up of weld-aiding cream.
3. the ultra dense pitch welded plate of a kind of high density according to claim 1, is characterized in that: the minimum spacing between described two contiguous weld pads is 0.13mm.
4. the ultra dense pitch welded plate of a kind of high density according to claim 1, is characterized in that: described adhesive layer is coated on outside surface mount elements.
5. a high density ultra dense pitch welded plate processing technology, is characterized in that: comprise the following steps:
S1, on welded plate substrate, directly print weld-aiding cream;
S2, directly employing BGA part tin ball are connected with surface mount elements;
S3, welding carry out sealing after terminating, and part pin and surface mount elements pin are all lived by rubber seal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510099437.XA CN104684274A (en) | 2015-03-06 | 2015-03-06 | High-density super-density pitch welded plate and processing technology thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510099437.XA CN104684274A (en) | 2015-03-06 | 2015-03-06 | High-density super-density pitch welded plate and processing technology thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104684274A true CN104684274A (en) | 2015-06-03 |
Family
ID=53318678
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510099437.XA Pending CN104684274A (en) | 2015-03-06 | 2015-03-06 | High-density super-density pitch welded plate and processing technology thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN104684274A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1154908A (en) * | 1997-07-29 | 1999-02-26 | Nec Corp | Method for correcting warping of bga case |
| JP2000244110A (en) * | 1999-02-23 | 2000-09-08 | Nec Ibaraki Ltd | Method of mounting bga package |
| CN102142402A (en) * | 2010-02-02 | 2011-08-03 | 力成科技股份有限公司 | Flip-chip construction maintaining solder positioning |
| CN102598252A (en) * | 2010-06-15 | 2012-07-18 | 松下电器产业株式会社 | Package structure, method for manufacturing same, and method for repairing package structure |
| CN102686044A (en) * | 2012-05-14 | 2012-09-19 | 江苏中科梦兰电子科技有限公司 | Method for removing residual solder tin from soldering-pan during repair and replacement of ball grid array (BGA) chip |
| CN204392693U (en) * | 2015-03-06 | 2015-06-10 | 昆山意力电路世界有限公司 | The ultra dense pitch welded plate of a kind of high density |
-
2015
- 2015-03-06 CN CN201510099437.XA patent/CN104684274A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1154908A (en) * | 1997-07-29 | 1999-02-26 | Nec Corp | Method for correcting warping of bga case |
| JP2000244110A (en) * | 1999-02-23 | 2000-09-08 | Nec Ibaraki Ltd | Method of mounting bga package |
| CN102142402A (en) * | 2010-02-02 | 2011-08-03 | 力成科技股份有限公司 | Flip-chip construction maintaining solder positioning |
| CN102598252A (en) * | 2010-06-15 | 2012-07-18 | 松下电器产业株式会社 | Package structure, method for manufacturing same, and method for repairing package structure |
| CN102686044A (en) * | 2012-05-14 | 2012-09-19 | 江苏中科梦兰电子科技有限公司 | Method for removing residual solder tin from soldering-pan during repair and replacement of ball grid array (BGA) chip |
| CN204392693U (en) * | 2015-03-06 | 2015-06-10 | 昆山意力电路世界有限公司 | The ultra dense pitch welded plate of a kind of high density |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150603 |