CN104661449A - Hole metallization method based on laser activation technology - Google Patents
Hole metallization method based on laser activation technology Download PDFInfo
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- CN104661449A CN104661449A CN201510084206.1A CN201510084206A CN104661449A CN 104661449 A CN104661449 A CN 104661449A CN 201510084206 A CN201510084206 A CN 201510084206A CN 104661449 A CN104661449 A CN 104661449A
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- laser
- hole
- method based
- activation technology
- metallization method
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
Abstract
The invention discloses a hole metallization method based on a laser activation technology. The method comprises steps as follows: holes are drilled in a printed circuit board base material with lasers, and special laser radiation is adjusted, so that drilled hole walls form nanoscale holes; catalytic particles permeate the holes to adsorb the hole walls to form an activation catalyst layer; finally, metal is deposited on hole wall surfaces by the aid of the catalyst layer, and electroplating-free metallization of micro hole walls is finished. The method has the advantages that drilling and hole wall roughening procedures are combined into one step, the process cost is reduced, and a coating is excellent in bonding performance and environment-friendly.
Description
Technical field
The present invention relates to PCB Hole Metallization method, particularly relate to a kind of based on laser irradiation modification, then made the method for circuit board micropore metal by chemical plating.
Background technology
Multilayer printed circuit board, as HDI, multilayered rigidity and flexibility board, needs to realize electrical connection by the hole metallization in through hole, blind hole or folded hole at interlayer, and then the performance of realizing circuit plate hight density height positioning efficiency.Hole metallization be dielectric material between circuit board Copper Foil as the material such as polyimides, epoxy resin impregnated glass cloth is holed, and plate layer of metal at these insulating material hole walls, realize the conducting between two-layer or multilayer copper foil circuit.Hole metallization based on chemical plating process is a kind of more traditional hole metallization method.
Chemical plating is a kind of method forming homogeneous metal coating at material surface, particularly when material be resin, pottery etc. nonmetal time, these materials Direct Electroplating cannot obtain the metal coating wanted, and chemical plating is then extraordinary selection.Chemical plating is not only simple to operate, and the metallic coating mass obtained is also higher, and coating uniformity is good, and porosity is low.Being of wide application of chemical plating, in printed circuit board field, for the hole metallization in through hole, blind hole or folded hole, also has chemical nickel and gold, the operations such as leaching silver.
Typically hole chemical plating will through pre-treatment (alligatoring), adsorb, reduce these three main process, wherein pre-treatment is to the whether upper plating of coating, and quality of coating has great impact.Particularly in the situation of hole wall surface unusual light, surface preparation in this time just seems very important.Generally, hole wall surface alligatoring can use chemical microetch process, to reach surface modification, increases contact surface area, improves tack.But this method has more limitation, different formulas will be adjusted when the material applied is different, and degree for the treatment of is wayward, easily reduces material surface evenness, affect subsequent plating layer quality; Carry out etching alligatoring to material, easily cause material aging, the life-span reduces; In addition, the introducing of chemicals also brings the problems such as Environmental Health.
Summary of the invention
The present invention is intended to improve circuit board micropore chemistry treatment before plating process, propose a kind of while circuit boring the new technology to hole wall catalytic activation, printed circuit board boring and the via hole conveniently can be realized by this technique, very little to the destruction of base material itself, and high strength galvanized steel is good, be suitable for the material of surperficial unusual light.
Adopted technical scheme of the present invention is: the method comprises the following steps:
(1) laser positioning boring, and regulate laser treatment with irradiation, make hole wall form nanoscale hole;
(2) catalyst particle is infiltrated through described hole, be adsorbed on the surface of boring, form activating catalytic layer;
(3) metal forms coating by the method for chemical plating on borehole wall surface.
Further, in described step (1), while using laser drill, regulate laser to irradiate, make hole wall occur nanoscale hole.
Further, in described step (2), described catalyst particle includes but not limited to Technique of Nano Pd, nm of gold, Nano Silver, nano-sized carbon.
Further, in described step (2), described activating catalytic layer thickness is 20nm ~ 200nm.
Further, in described step (2), after formation activating catalytic layer, drying is carried out to material surface.
Further, in described step (3), described chemical plating includes but not limited to electroless copper, nickel plating, silver-plated, gold-plated, nickel plating phosphorus boron.
Further, when regulating laser to irradiate, the pulse energy of laser controls at 80-125mJ, and focal height controls at 50-60mm, and laser frequency controls at 40-60kHz, and laser pulse width controls at 102-120nm, and beam diameter controls at 15-20mm.
Further, described pulse energy can also control at 100-125 mJ, and focal height can also control at 50-60 mm, and laser frequency can also control at 48-55 KHz, and laser pulse width controls at 102-120nm, and beam diameter controls at 15-20mm.
Further, described catalyst particle particle diameter is less than or equal to 100nm, and described catalyst particle should be uniformly suspended in liquid dispersed system.
Further, the thickness of coating of described chemical plating can adjust bath composition and electroless plating time obtains as required.
Particularly, select the board substrate needing the boring adding coating, and weave laser input file, process laser equipment location hole;
Base material is placed in laser process equipment, uses laser positioning boring (hole got out is micropore), and regulate laser treatment with irradiation, make hole wall form nanoscale hole.Copper Foil and dielectric layer are got out micropore by the unit are power specifically utilizing laser larger, use laser to irradiate hole wall simultaneously, and pore wall material absorption energy temperature raises rapidly and reaches fusing point (infrared laser), and material molecule is overflowed from heat affected zone in succession; Or laser energy has interrupted material molecule key, destroy metal lattice (Ultra-Violet Laser), made particles of material depart from surface and leave small hole;
Surface clean, because laser action can bring hole wall vaporization spot, utilizes plasma to clean by effects on surface, also can use additive method, the ultrasonic immersion of such as cleaning fluid;
Different according to plasma species, after cleaning out, material micropore often carries positive electricity or negative electricity; For electronegative catalyst particles, need to use acid/alkalescence adjustment, micropore is become positively charged; And for the catalyst particles of positively charged, need to use acid/alkalescence adjustment, make negative electricity on micropore band.
Infiltrate in the solution containing catalysed particulate by the complete material of adjustment, catalyst particle infiltration hole is adsorbed on material surface, forms activating catalytic layer.Catalyst solution is by the stable dispersion solution system containing nano metallic colloid or ion, nano metallic colloid or ion form the catalytic center of the coat of metal as sequential reduction, so need stronger suction-operated at material surface, even penetrate into hole inside, improve catalytic effect.Conventional catalytic metal as colloid palladium, Nano Silver, nm of gold etc.Catalytic Layer thickness can adjust within the scope of 20nm-200nm, also can change according to actual needs;
Hole wall surface has just had the basis of carrying out chemical plating after forming Catalytic Layer, usually base material is infiltrated in chemical plating fluid, catalytic center generation redox reaction forms coated metal, there is self-catalyzed reaction again in coated metal, plating process is proceeded, and hole wall surface also defines the uniform coat of metal accordingly;
Thickness of coating can adjust bath concentration and electroless plating time meets actual needs;
This method can be applied in printed circuit board makes, when need not whole plate chemical plating, can stick graphic mask before chemical plating, being exposed by exposure imaging needs copper-plated part, and then carries out copper facing again; Or after whole plate copper facing, re-use etching method form wire pattern.
The present invention utilizes laser to irradiate hole wall and completes surface coarsening pretreatment process, conveniently realizes surface modification, for the attached body of catalyst provides good condition; Due to the high efficiency of laser, batch making can be realized fast; The destruction of this technique Surface Structures is very little, does not affect the evenness in hole, and the high strength galvanized steel obtained is better.
Accompanying drawing explanation
Fig. 1 covers copper double sided board schematic diagram for what do not deal with;
Fig. 2 carries out laser drill to substrate and the schematic diagram irradiated;
Fig. 3 is that substrate laser irradiates the schematic diagram leaving small hole;
Fig. 4 is the schematic diagram that this substrate surface adsorption catalyst forms activating catalytic layer;
Fig. 5 is the schematic diagram of substrate surface chemical plating;
Wherein, A is a kind of board substrate, as polyimides, and impregnated glass fiber etc.; B is Copper Foil; C is hole; D is the activating catalytic layer formed; E is mixed layer; F is the coat of metal.
Embodiment
As shown in Figures 1 to 5, described in detail by embodiment according to invented technology below.Following embodiment just in order to better by clear for the explaination of the technology of the present invention principle, do not represent the present invention and can only limit this embodiment of use.
embodiment one:
Utilize double-sided copper-clad soft board as base material, and realize blind hole metallization, reach the object of electrical connection.
(1) selection market is commonly used, machining, flexible excellent polyimides double face copper as base material, and cuts into the size being applicable to processing.
(2) material is placed in laser process equipment, after equipment input laser operations file, laser drill (be micropore hereinafter referred to as the hole got out, embodiment two with) is carried out to copper-clad plate, regulates laser to irradiate simultaneously, make surface form nanoscale hole.Laser radiation pulses energy hole is at 60-70 mJ, and focal height controls at 1.8 mm, and laser frequency controls at 50-60 kHz, and laser pulse width controls at 102-120 nms, and beam diameter controls at 15-20 mm.
(3) substrate after boring is put into plasma cleaning equipment, the small hole of copper foil surface and hole wall is cleaned, is conducive to the absorption of catalysed particulate.
(4) different according to plasma species, after cleaning out, micropore hole wall often carries positive electricity or negative electricity; For electronegative catalyst particles, need to use acid/alkalescence adjustment, poromerics surface is become positively charged; And for the catalyst particles of positively charged, need to use acid/alkalescence adjustment, make negative electricity on poromerics surface band.
(5) regulated the substrate of electric charge to need to be immersed in catalyst solution, the catalyst solution that this example uses is business palladium colloidal solution.Submergence temperature controls at about 40 DEG C, Immersion time 5min, and water flow mode can be adopted to wash away plate face, so that catalyst component is fully combined with micropore hole wall surface.
(6) dry up under the hot blast condition of 40 DEG C after pore wall material adsoption catalysis particulate, dry temperature and time is too much unsuitable, in order to avoid destroy Catalytic Layer composition, causes catalytic effect to reduce and even loses efficacy.
(7) baseplate material is immersed in chemical copper plating solution, copper plating bath and common business copper plating solution.Temperature controls at 30 DEG C, and time controling, at 10min, makes hole wall plate layers of copper uniformly, and copper layer thickness, at about 4 μm, can adjust as required.
(8), after whole plate drying, Copper Foil pastes one deck dry film, and exposure imaging, leave resist layer pattern.
(9) etch and after removing the etchant resist on plate face, obtain the baseplate material with circuit copper cash pattern.
embodiment two:
Utilize the glass fibre flooding and know as base material, and realize blind hole metallization, reach the object of electrical connection.
(1) selection market is commonly used, the FR4 of mechanical performance excellence as base material, and cuts into the size being applicable to processing.
(2) material is placed in laser process equipment, after equipment input laser operations file, laser drill is carried out to copper-clad plate, regulates laser to irradiate simultaneously, make surface form nanoscale hole.Laser exposure chart pulse energy controls at 100-125 mJ, and focal height controls at 10-30 mm, and laser frequency controls at 48-60 kHz, and laser pulse width controls at 102-120 nm, and beam diameter controls at 15-20 mm.
(3) substrate after boring is put into plasma cleaning equipment, the small hole of copper foil surface and hole wall is cleaned, is conducive to the absorption of catalysed particulate.
(4) different according to plasma species, after cleaning out, micropore hole wall often carries positive electricity or negative electricity; For electronegative catalyst particles, need to use acid/alkalescence adjustment, poromerics surface is become positively charged; And for the catalyst particles of positively charged, need to use acid/alkalescence adjustment, make negative electricity on poromerics surface band.
(5) regulated the substrate of electric charge to need to be immersed in catalyst solution, the catalyst solution that this example uses is business palladium colloidal solution.Submergence temperature controls at about 40 DEG C, Immersion time 8min, and water flow mode can be adopted to wash away plate face, so that catalyst component is fully combined with micropore hole wall surface.
(6) dry up under the hot blast condition of 40 DEG C after pore wall material adsoption catalysis particulate, dry temperature and time is too much unsuitable, in order to avoid destroy Catalytic Layer composition, causes catalytic effect to reduce and even loses efficacy.
(7) baseplate material is immersed in chemical copper plating solution, copper plating bath and common business copper plating solution.Temperature controls at 30 DEG C, and time controling, at 15min, makes hole wall plate layers of copper uniformly, and copper layer thickness, at about 6 μm, can adjust as required.
(8), after whole plate drying, Copper Foil pastes one deck dry film, and exposure imaging, leave resist layer pattern.
(9) etch and after removing the etchant resist on plate face, obtain the baseplate material with circuit copper cash pattern.
Above-mentioned two examples can be found out, the base material kind can applying the inventive method is a lot, includes but not limited to common various soft or hard copper-clad plates.The coat of metal can be copper facing, silver-plated, nickel plating or other coating.
Above-mentioned two kinds of examples to invention has been detailed description, but do not mean that the present invention is only confined to this two kinds of examples.When not departing from the technology of the present invention principle, making improvements and being out of shape within the claims in the present invention and technology, also should belong to protection scope of the present invention.
Claims (10)
1., based on a hole metallization method for laser activation technology, it is characterized in that, the method comprises the following steps:
(1) laser positioning boring, and regulate laser treatment with irradiation, make hole wall form nanoscale hole;
(2) catalyst particle is infiltrated through described hole, be adsorbed on the surface of boring, form activating catalytic layer;
(3) metal forms coating by the method for chemical plating on borehole wall surface.
2. a kind of hole metallization method based on laser activation technology according to claim 1, is characterized in that: in described step (1), while using laser drill, regulates laser to irradiate, makes hole wall occur nanoscale hole.
3. a kind of hole metallization method based on laser activation technology according to claim 1, is characterized in that: in described step (2), described catalyst particle includes but not limited to Technique of Nano Pd, nm of gold, Nano Silver, nano-sized carbon.
4. a kind of hole metallization method based on laser activation technology according to claim 1, it is characterized in that: in described step (2), described activating catalytic layer thickness is 20nm ~ 200nm.
5. a kind of hole metallization method based on laser activation technology according to claim 1, is characterized in that: in described step (2), after formation activating catalytic layer, carries out drying to material surface.
6. a kind of hole metallization method based on laser activation technology according to claim 1, is characterized in that: in described step (3), and described chemical plating includes but not limited to electroless copper, nickel plating, silver-plated, gold-plated, nickel plating phosphorus boron.
7. a kind of hole metallization method based on laser activation technology according to claim 1, it is characterized in that: when regulating laser to irradiate, the pulse energy of laser controls at 80-125mJ, focal height controls at 50-60mm, laser frequency controls at 40-60kHz, laser pulse width controls at 102-120nm, and beam diameter controls at 15-20mm.
8. a kind of hole metallization method based on laser activation technology according to claim 7, it is characterized in that: described pulse energy can also control at 100-125 mJ, focal height can also control at 50-60 mm, laser frequency can also control at 48-55 KHz, laser pulse width controls at 102-120nm, and beam diameter controls at 15-20mm.
9. a kind of hole metallization method based on laser activation technology according to claim 1, is characterized in that: described catalyst particle particle diameter is less than or equal to 100nm, and described catalyst particle should be uniformly suspended in liquid dispersed system.
10. a kind of hole metallization method based on laser activation technology according to claim 6, is characterized in that: the thickness of coating of described chemical plating can adjust bath composition as required and electroless plating time obtains.
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| CN105198491A (en) * | 2015-09-14 | 2015-12-30 | 武汉利之达科技有限公司 | Method for preparing ceramic substrate containing conductive copper cylinder |
| CN105451456A (en) * | 2015-12-08 | 2016-03-30 | 昆山联滔电子有限公司 | Manufacturing method for non-conductive base material conductor circuit |
| CN107403692A (en) * | 2016-05-18 | 2017-11-28 | 中山因塞施特电子科技有限公司 | A kind of chip inductor and preparation method thereof |
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| CN1582095A (en) * | 2003-08-06 | 2005-02-16 | 中国科学院福建物质结构研究所二部 | Mask-free ceramic base board interconnecting lead manufacturing technique |
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Address after: No.17, Xianggong Road, Hongwan Industrial Zone, Xiangzhou District, Zhuhai City, Guangdong Province, 519000 Patentee after: Zhuhai Zhongjing Yuansheng Electronic Technology Co.,Ltd. Address before: No. 17, Xianggong Road, Hongwan Industrial Zone, Nanping, Xiangzhou District, Zhuhai City, Guangdong Province, 519060 Patentee before: ZHUHAI TOPSUN ELECTRONIC TECHNOLOGY Co.,Ltd. |
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