CN115243463A - Method for preparing single-sided circuit board by laser direct writing full addition - Google Patents
Method for preparing single-sided circuit board by laser direct writing full addition Download PDFInfo
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- CN115243463A CN115243463A CN202210970646.7A CN202210970646A CN115243463A CN 115243463 A CN115243463 A CN 115243463A CN 202210970646 A CN202210970646 A CN 202210970646A CN 115243463 A CN115243463 A CN 115243463A
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- 238000000034 method Methods 0.000 title claims abstract description 32
- 229920005989 resin Polymers 0.000 claims abstract description 57
- 239000011347 resin Substances 0.000 claims abstract description 57
- 238000001035 drying Methods 0.000 claims abstract description 44
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 43
- 229910052802 copper Inorganic materials 0.000 claims abstract description 42
- 239000010949 copper Substances 0.000 claims abstract description 42
- 238000007747 plating Methods 0.000 claims abstract description 38
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 239000000126 substance Substances 0.000 claims abstract description 15
- 230000004913 activation Effects 0.000 claims abstract description 12
- -1 silver ions Chemical class 0.000 claims abstract description 10
- 229910052709 silver Inorganic materials 0.000 claims abstract description 8
- 239000004332 silver Substances 0.000 claims abstract description 8
- 238000004140 cleaning Methods 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims description 62
- 239000000243 solution Substances 0.000 claims description 25
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 18
- 230000001678 irradiating effect Effects 0.000 claims description 8
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 claims description 8
- DGEZNRSVGBDHLK-UHFFFAOYSA-N [1,10]phenanthroline Chemical compound C1=CN=C2C3=NC=CC=C3C=CC2=C1 DGEZNRSVGBDHLK-UHFFFAOYSA-N 0.000 claims description 6
- JZCCFEFSEZPSOG-UHFFFAOYSA-L copper(II) sulfate pentahydrate Chemical compound O.O.O.O.O.[Cu+2].[O-]S([O-])(=O)=O JZCCFEFSEZPSOG-UHFFFAOYSA-L 0.000 claims description 6
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 claims description 6
- BEGBSFPALGFMJI-UHFFFAOYSA-N ethene;sodium Chemical group [Na].C=C BEGBSFPALGFMJI-UHFFFAOYSA-N 0.000 claims description 6
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 claims description 6
- 238000005406 washing Methods 0.000 claims description 6
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 claims description 4
- CQLFBEKRDQMJLZ-UHFFFAOYSA-M silver acetate Chemical compound [Ag+].CC([O-])=O CQLFBEKRDQMJLZ-UHFFFAOYSA-M 0.000 claims description 4
- 229940071536 silver acetate Drugs 0.000 claims description 4
- 229910001961 silver nitrate Inorganic materials 0.000 claims description 4
- GGCZERPQGJTIQP-UHFFFAOYSA-N sodium;9,10-dioxoanthracene-2-sulfonic acid Chemical compound [Na+].C1=CC=C2C(=O)C3=CC(S(=O)(=O)O)=CC=C3C(=O)C2=C1 GGCZERPQGJTIQP-UHFFFAOYSA-N 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 239000007864 aqueous solution Substances 0.000 claims description 3
- 229910000367 silver sulfate Inorganic materials 0.000 claims description 3
- YPNVIBVEFVRZPJ-UHFFFAOYSA-L silver sulfate Chemical compound [Ag+].[Ag+].[O-]S([O-])(=O)=O YPNVIBVEFVRZPJ-UHFFFAOYSA-L 0.000 claims description 3
- 230000003213 activating effect Effects 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- XNGYKPINNDWGGF-UHFFFAOYSA-L silver oxalate Chemical compound [Ag+].[Ag+].[O-]C(=O)C([O-])=O XNGYKPINNDWGGF-UHFFFAOYSA-L 0.000 claims description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims 1
- 229910000366 copper(II) sulfate Inorganic materials 0.000 claims 1
- 229920002523 polyethylene Glycol 1000 Polymers 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 15
- 238000000608 laser ablation Methods 0.000 abstract description 10
- 238000009713 electroplating Methods 0.000 abstract description 2
- 230000003647 oxidation Effects 0.000 abstract description 2
- 238000007254 oxidation reaction Methods 0.000 abstract description 2
- 230000003746 surface roughness Effects 0.000 abstract description 2
- 238000004873 anchoring Methods 0.000 abstract 1
- 230000001737 promoting effect Effects 0.000 abstract 1
- 239000002585 base Substances 0.000 description 51
- 230000008569 process Effects 0.000 description 8
- 239000002245 particle Substances 0.000 description 6
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000013527 degreasing agent Substances 0.000 description 4
- 238000005237 degreasing agent Methods 0.000 description 4
- 239000002253 acid Substances 0.000 description 3
- 239000011149 active material Substances 0.000 description 3
- 230000003197 catalytic effect Effects 0.000 description 3
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920005570 flexible polymer Polymers 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000000976 ink Substances 0.000 description 1
- 238000010147 laser engraving Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910001338 liquidmetal Inorganic materials 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021392 nanocarbon Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
Abstract
The invention discloses a method for preparing a single-sided circuit board by laser direct writing full addition, which comprises the steps of laser direct writing, activation, drying, laser rewriting, chemical copper plating and cleaning and drying, wherein two times of laser ablation are adopted, the first laser ablation is used for increasing the surface roughness and the oxidation degree of a resin substrate and is used for adsorbing a large amount of silver ions to avoid plating leakage, the second laser ablation is used for promoting the substrate to be melted and then wrapping and anchoring the silver ions so as to enhance the binding force between the substrate and a copper layer, the yield of a circuit board manufactured by an addition method can be greatly improved by two times of laser ablation, compared with the traditional full addition method, the steps of adhering a dry film, developing, removing the film, electroplating thick copper and the like are omitted, the production flow can be obviously reduced, the production efficiency is improved, and the production cost is reduced.
Description
Technical Field
The invention belongs to the technical field of PCBs, and particularly relates to a method for preparing a circuit board by laser direct-writing full-addition.
Background
Flexible electronics is a new electronic technology for fabricating organic/inorganic electronic components on flexible/ductile plastic or thin metal substrates, and is widely used in the fields of aerospace, consumer electronics, medical electronics, and the like, due to its unique flexibility/ductility characteristics. Flexible circuits (FPCs) using flexible polymers as substrates and conductive materials such as metal films, graphene, conductive inks, liquid metals, etc. as conductors are key components of the development of flexible electronics. The FPC meets the development requirements of high density, miniaturization, lightness and thinness and high reliability of electronic products due to its excellent physical properties (flexibility, lightness and thinness, and excellent electrical properties), and in recent years, the FPC has been highlighted by the military and has an increasingly expanded specific gravity, and thus becomes one of the core power for the global PCB industry growth.
A great amount of acid, alkali and chemicals are inevitably applied when the FPC is produced by adopting a subtractive method, and more water resources are consumed. After these materials are used in the production line, if the waste is not treated for a good second time, the environment is polluted greatly, and the influence of the FPC production on the environment needs to be controlled and improved.
The full addition method is suitable for manufacturing ultra-fine lines (the line width and line distance is more than 15 mu m/15 mu m), has the characteristics of short process flow, simple processing and low cost due to no use of copper foil, adopts chemical copper deposition, and has good coating dispersion capacity, thereby being suitable for the production of multilayer boards and small-aperture high-density boards. However, the current full addition methods (such as the technical solutions disclosed in patent documents CN108541146A and CN 106973517A) also face the problems of poor adhesion of copper surface, large difference between the heat resistance and reliability standard and the prior art standard, and the like, and secondly, most full addition methods (such as the technical solutions disclosed in patent documents CN110072345A, CN110933858A, CN112867274A and CN 113463143A) also need to be equipped with processes of dry film application → exposure → development, and the like, which greatly increases the production cost and pollutant discharge.
For example, patent document CN104661441B discloses a laser activation technique for manufacturing a circuit board by an addition method, which adopts laser ablation to form a circuit track pattern on the surface of an insulating base material, and forms a nano-scale hole on the surface of the base material track under the action of laser irradiation; then catalytic particles (colloidal palladium, nano metal particles and nano carbon) penetrate through the holes and are adsorbed on the surface of the material to form a catalytic activation layer, and a conductive pattern is formed in the groove by a chemical copper plating method. The process needs to disperse solid particles in a solution and realize the adsorption of the solid particles on the surface of a base material by adjusting the charges of the base material and the solid particles, and the technical scheme has two problems: (1) Solid particles are easy to agglomerate and oxidize when being dispersed in a solution, and the agglomeration can cause the solid particles to settle so as to reduce the catalytic activity; (2) Relying only on electrostatic attraction and porosity, one also faces poor adhesion between the copper layer and the substrate.
Further, as disclosed in patent documents CN104582278A and CN107148155A, active materials are directly doped into a substrate, and then irradiated by laser, exposed, and then electroless copper plating is performed to obtain a desired conductive pattern, which is expensive due to the large amount of active materials to be doped into the substrate, and the doping of large amount of active materials also causes the substrate to have reduced properties such as tensile strength, dielectric properties, toughness, etc.
Further, as disclosed in patent publication No. CN112469199A, a circuit board can be produced by directly exposing aluminum to laser radiation and then starting electroless copper plating by relying on the activation of aluminum, but this method is only applicable to substrates containing aluminum, but most substrates do not contain aluminum, such as polytetrafluoroethylene, polyimide, epoxy resin, liquid crystal, etc., and thus this method is not widely used.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides the method for preparing the single-sided circuit board by laser direct-writing full addition, which can reduce the production flow, improve the efficiency and reduce the production cost.
The technical scheme adopted by the invention for solving the technical problems is as follows:
a method for preparing a single-sided circuit board by laser direct writing full addition comprises the following steps:
s1: laser direct writing: fixing the resin base material under an infrared laser with the wavelength of 1064 nm through a positioning hole, and according to a set path, irradiating (ablating) the resin base material by laser to enable the surface of a track (a scribed line area) to be highly oxidized and form high roughness at the same time, wherein the high roughness is used for adsorbing a large amount of silver ions to avoid plating leakage; the power of the infrared laser is 20-50W, the frequency is 20-100 KHz, and the scanning speed is 2000-3000 mm/s.
S2: activation: immersing the resin substrate subjected to direct writing into a silver ion activation solution for 30-180s; the silver ion activating solution is 0.2-1 g/L silver salt water solution, so that silver ions are attached to the surface of the track after laser ablation.
S3: drying: and (3) drying the activated resin base material in a drying oven at 120-180 ℃ for 3 hours.
S4: laser copying: and fixing the dried resin base material under an infrared laser with the wavelength of 1064 nm through a positioning hole, and irradiating the resin base material with laser according to the same path as the path in the step S1 to make the surface of the track melt, wrap and anchor silver ions so as to enhance the bonding force between the base material and the copper layer, wherein the power of the infrared laser is 10-30W, the frequency is 110-200 KHz, and the scanning rate is 1000-5000 mm/S.
S5: chemical copper plating: and (4) putting the resin base material subjected to laser copying into an electroless copper plating solution for copper plating.
S6: cleaning and drying: and (3) washing and drying the resin base material after copper plating by adopting a conventional process to obtain the fine circuit board.
Preferably, the silver salt aqueous solution is one or a mixture of more than two of silver nitrate, silver acetate, silver sulfate and silver oxalate in any proportion.
Preferably, the electroless copper plating solution comprises the following components in percentage by weight: 10 g/L of copper sulfate pentahydrate, 40 g/L of sodium ethylene diamine tetracetate, 1, 10-o-phenanthroline 20 mg/L, 5g/L of formaldehyde, 15g/L of sodium hydroxide and 0.1 g/L of sodium dodecyl benzene sulfonate.
The invention has the beneficial effects that:
1. compared with the traditional full addition method, the method has the advantages that the steps of dry film pasting, developing, film stripping, thick copper electroplating and the like are omitted, the production flow can be obviously reduced, the production efficiency is improved, and the production cost is reduced.
2. The invention adopts two times of laser ablation, the first time of laser ablation is to increase the surface roughness and the oxidation degree of the resin base material and is used for adsorbing a large amount of silver ions to avoid plating leakage, the second time of laser ablation is to promote the base material to be melted and wrap and anchor the silver ions so as to enhance the binding force between the base material and the copper layer, and the yield of the circuit board manufactured by the additive method can be greatly improved by two times of laser ablation.
3. The invention adopts the cheap infrared laser (infrared laser engraving machine), the pulse frequency of the laser is far lower than that of a nanosecond laser and a picosecond laser, the scanning speed is high, and the production efficiency is high.
Detailed Description
Example 1
The resin base material is PI (polyimide) material with thickness of 60 μm, and is cut into proper size, immersed in HN-AD3 (produced by Shandongxin Yihong chemical technology Co., ltd.) acidic degreasing agent for 3 minutes, taken out, washed with water for three times, and dried.
S1, laser direct writing: the resin base material is aligned through the positioning hole and then placed in an infrared laser with the wavelength of 1064 nm, a computer end inputs a laser path file, and after laser focusing is finished, direct writing is carried out on the surface of the resin base material, wherein the specific parameters of the infrared laser are as follows: the power is 30W, the scanning speed is 2500mm/s, and the frequency is 20KHz.
S2, activation: and (3) immersing the resin substrate after the direct writing is finished into a 0.2 g/L silver acetate solution for 60 s.
S3, drying: and drying the activated resin base material in a drying oven at 120 ℃, wherein the drying time is 3 hours.
S4: laser copying: fixing the dried resin base material under an infrared laser with the wavelength of 1064 nm through a positioning hole, and irradiating the resin base material by laser according to the same path as the step S1, wherein the specific parameters of the infrared laser are as follows: the power is 10W, the scanning speed is 3000mm/s, and the frequency is 110KHz.
S5: chemical copper plating: and immersing the resin base material after the copying into an electroless copper plating solution for electroless copper plating for 1 h. The electroless copper plating solution consists of the following components: 10 g/L of copper sulfate pentahydrate, 40 g/L of sodium ethylene diamine tetracetate, 1, 10-o-phenanthroline 20 mg/L, 5g/L of formaldehyde, 15g/L of sodium hydroxide and 0.1 g/L of sodium dodecyl benzene sulfonate.
S6: cleaning and drying: and (3) washing and drying the resin base material after copper plating by adopting a conventional process, wherein the drying temperature is 150 ℃ and the drying time is 3 hours, so as to obtain the fine circuit board.
Example 2
The resin base material is made of PET (polyethylene terephthalate) and has a thickness of 60 μm, is cut into a proper size, is immersed in HN-AD3 (produced by Shandong Xin Yi hong chemical technology Co., ltd.) acidic degreasing agent for 3 minutes, is taken out, is washed for three times, and is dried.
S1, laser direct writing: the resin base material is aligned through the positioning hole and then placed in an infrared laser with the wavelength of 1064 nm, a computer end inputs a laser path file, and after laser focusing is finished, direct writing is carried out on the surface of the resin base material, wherein the specific parameters of the infrared laser are as follows: the power is 20W, the scanning speed is 2500mm/s, and the frequency is 100KHz.
S2, activation: and immersing the resin base material after the direct writing is finished in 1g/L silver nitrate solution for 30 s.
S3, drying: and drying the activated resin base material in a drying oven at 120 ℃, wherein the drying time is 3 hours.
S4: laser copying: fixing the dried resin base material under an infrared laser with the wavelength of 1064 nm through a positioning hole, and irradiating the resin base material by laser according to the same path as the step S1, wherein the specific parameters of the infrared laser are as follows: the power is 10W, the scanning speed is 5000mm/s, and the frequency is 160KHz.
S5: chemical copper plating: and immersing the resin base material after the copying into an electroless copper plating solution for electroless copper plating for 1 h. The electroless copper plating solution consists of the following components: 10 g/L of copper sulfate pentahydrate, 40 g/L of sodium ethylene diamine tetracetate, 1, 10-o-phenanthroline 20 mg/L, 5g/L of formaldehyde, 15g/L of sodium hydroxide and 0.1 g/L of sodium dodecyl benzene sulfonate.
S6: cleaning and drying: and (3) washing and drying the resin base material after copper plating by adopting a conventional process, wherein the drying temperature is 120 ℃ and the drying time is 3 hours, so as to obtain the fine circuit board.
Example 3
The resin base material is LCP (liquid crystal polymer) material, the thickness is 60 μm, the resin base material is cut into proper size, immersed in HN-AD3 (produced by Shandongxin Yihong chemical technology Co., ltd.) acid degreasing agent for 3 minutes, taken out, washed for three times and dried.
S1, laser direct writing: placing a resin base material in an infrared laser with the wavelength of 1064 nm, inputting a laser path file by a computer, after laser focusing is finished, directly writing the surface of the resin base material, wherein the specific parameters of the infrared laser are as follows: the power is 50W, the scanning speed is 2000mm/s, and the frequency is 80KHz.
S2, activation: and immersing the resin substrate after the direct writing is finished in 0.2 g/L silver sulfate and 0.2 g/L silver acetate aqueous solution for 60 s.
S3, drying: and drying the activated resin base material in a drying oven at 180 ℃, wherein the drying time is 3 hours.
S4: laser copying: fixing the dried resin base material under an infrared laser with the wavelength of 1064 nm through a positioning hole, and irradiating the resin base material by laser according to the same path as the step S1, wherein the specific parameters of the infrared laser are as follows: the power is 30W, the scanning speed is 1000mm/s, and the frequency is 200KHz.
S5: chemical copper plating: and immersing the resin base material after the copying into an electroless copper plating solution for electroless copper plating for 1 h. The electroless copper plating solution consists of the following components: 10 g/L of copper sulfate pentahydrate, 40 g/L of sodium ethylene diamine tetracetate, 1, 10-o-phenanthroline 20 mg/L, 5g/L of formaldehyde, 15g/L of sodium hydroxide and 0.1 g/L of sodium dodecyl benzene sulfonate.
S6: cleaning and drying: and (3) washing and drying the resin base material after copper plating by adopting a conventional process, wherein the drying temperature is 180 ℃ and the drying time is 3 hours, so as to obtain the fine circuit board.
Example 4
The resin base material is made of FR4 (epoxy glass fiber board) material, the thickness is 60 mu m, the resin base material is cut into proper size, is immersed in HN-AD3 (produced by Shandong Xin Yi hong chemical technology Co., ltd.) acid degreasing agent for 3 minutes, is taken out, is washed for three times and is dried.
S1, laser direct writing: placing a resin base material in an infrared laser with the wavelength of 1064 nm, inputting a laser path file by a computer, and after laser focusing is finished, directly writing the surface of the resin base material, wherein the specific parameters of the infrared laser are as follows: the power is 35W, the scanning speed is 3000mm/s, and the frequency is 80KHz.
S2, activation: and immersing the resin base material after the direct writing is finished in 1g/L silver nitrate solution for 90 s.
S3, drying: and drying the activated resin base material in a drying oven at 140 ℃, wherein the drying time is 3 hours.
S4: laser copying: fixing the dried resin base material under an infrared laser with the wavelength of 1064 nm through a positioning hole, and irradiating the resin base material by laser according to the same path as the step S1, wherein the specific parameters of the infrared laser are as follows: the power is 20W, the scanning speed is 4000mm/s, and the frequency is 160KHz.
S5: chemical copper plating: and immersing the resin base material after the copying into an electroless copper plating solution for electroless copper plating for 1 h. The electroless copper plating solution consists of the following components: 10 g/L of copper sulfate pentahydrate, 40 g/L of sodium ethylene diamine tetracetate, 1, 10-o-phenanthroline 20 mg/L, 5g/L of formaldehyde, 15g/L of sodium hydroxide and 0.1 g/L of sodium dodecyl benzene sulfonate.
S6: cleaning and drying: and (3) washing and drying the resin base material after copper plating by adopting a conventional process, wherein the drying temperature is 140 ℃ and the drying time is 3 hours, so as to obtain the fine circuit board.
The thickness of the plating layer of the single-sided circuit board prepared in the above embodiments 1 to 4 is about 15 μm, and the yield is more than 90%.
The above embodiments do not limit the scope of the present invention, and those skilled in the art can make equivalent modifications and variations without departing from the overall concept of the present invention.
Claims (4)
1. A method for preparing a single-sided circuit board by laser direct writing full addition is characterized by comprising the following steps:
s1: laser direct writing: fixing the resin base material under an infrared laser with the wavelength of 1064 nm, and according to a set path, irradiating the resin base material by laser to highly oxidize the surface of the rail and form high roughness at the same time; the power of the infrared laser is 20-50W, the frequency is 20-100 KHz, and the scanning speed is 2000-3000 mm/s;
s2: and (3) activation: immersing the resin substrate subjected to direct writing into a silver ion activation solution for 30-180s; the silver ion activating solution is 0.2-1 g/L silver salt water solution;
s3: drying: drying the activated resin base material in a drying oven at 120-180 ℃;
s4: laser copying: fixing the dried resin base material under an infrared laser with the wavelength of 1064 nm, and irradiating the resin base material with laser according to the same path as the step S1 to melt and anchor silver ions on the surface of the track, wherein the power of the infrared laser is 10-30W, the frequency is 110-200 KHz, and the scanning rate is 1000-5000 mm/S;
s5: chemical copper plating: putting the resin base material subjected to laser copying into a chemical copper plating solution for copper plating;
s6: cleaning and drying: and washing and drying the resin substrate after copper plating to obtain the fine circuit board.
2. The method for preparing a single-sided circuit board by laser direct writing full addition according to claim 1, wherein the aqueous solution of silver salt is one or a mixture of more than two of silver nitrate, silver acetate, silver sulfate or silver oxalate in any proportion.
3. The method for preparing a single-sided circuit board by laser direct-write full addition according to claim 1, wherein the electroless copper plating solution comprises the following components in percentage by weight: 10 g/L of blue vitriol; sodium ethylene diamine tetracetate 40 g/L; PEG-1000 g/L;1, 10-o-phenanthroline 20 mg/L; 5g/L of formaldehyde; 15g/L of sodium hydroxide; 0.1 g/L sodium dodecyl benzene sulfonate.
4. The method for preparing a single-sided circuit board according to claim 1, wherein the resin substrate is one of PET, PI, FR4 and LCP.
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| CN202210970646.7A CN115243463A (en) | 2022-08-13 | 2022-08-13 | Method for preparing single-sided circuit board by laser direct writing full addition |
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| CN202210970646.7A CN115243463A (en) | 2022-08-13 | 2022-08-13 | Method for preparing single-sided circuit board by laser direct writing full addition |
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