CN110933858A - Laser direct writing-based flexible circuit board semi-additive preparation process - Google Patents
Laser direct writing-based flexible circuit board semi-additive preparation process Download PDFInfo
- Publication number
- CN110933858A CN110933858A CN201911127273.1A CN201911127273A CN110933858A CN 110933858 A CN110933858 A CN 110933858A CN 201911127273 A CN201911127273 A CN 201911127273A CN 110933858 A CN110933858 A CN 110933858A
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- CN
- China
- Prior art keywords
- polyimide
- circuit board
- flexible circuit
- direct writing
- laser direct
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Abstract
The invention provides a laser direct writing-based flexible circuit board semi-additive preparation process, which comprises the following steps: step 1, ultrasonically cleaning polyimide by using absolute ethyl alcohol, and then putting the polyimide into a constant-temperature water bath kettle for alkali treatment, namely surface treatment; step 2, dissolving organic copper salt in organic solvent of alkylamine and alcohol and stirring uniformly; step 3, coating the precursor solution prepared in the step 2 on the surface of the polyimide subjected to surface treatment in the step 1, and drying the polyimide subjected to spin coating in a drying oven; step 4, selecting an ultraviolet pulse laser to directly write the sample in the step 3 to obtain a conductive pattern in any shape; step 5, coating a layer of photosensitive glue on the surface of the polyimide after the laser direct writing; and 6, electroplating the sample prepared in the step 5 to prepare the flexible circuit board. By applying the technical scheme, the preparation process can be simplified, and the process parameters in the laser processing process are optimized.
Description
Technical Field
The invention relates to the technical field of emerging electronics, in particular to a laser direct writing-based flexible circuit board semi-additive preparation process.
Background
Flexible electronics is a new electronic technology for fabricating organic/inorganic electronic components on flexible/ductile plastic or thin metal substrates, and is widely used in the fields of aerospace, consumer electronics, medical electronics, and the like, due to its unique flexibility/ductility characteristics. Flexible circuits (FPCs) using flexible polymers as substrates and conductive materials such as metal films, graphene, conductive inks, liquid metals, etc. as conductors are key components of the development of flexible electronics. The FPC meets the development requirements of high density, miniaturization, lightness and thinness and high reliability of electronic products due to its excellent physical properties (flexibility, lightness and thinness, and excellent electrical properties), and in recent years, the FPC has been highlighted by the military and has an increasingly expanded specific gravity, and thus becomes one of the core power for the global PCB industry growth.
At present, FPC mainly has three manufacturing processes of a subtractive method, a full addition method and a semi-addition method. The subtractive process is a process of forming a circuit by printing a pattern on a circuit board, protecting the pattern, and etching off an excess copper layer without a resist film to remove the copper layer. The subtractive process is mature, stable and reliable, but when the subtractive process is used for manufacturing circuits, the line width and line spacing of 50 μm/50 μm or less has basically reached the maximum capability (prediction of an elliptic model) that the subtractive process can reach, and the factors bring great difficulty to the fine pattern, yield improvement and impedance control of the printed circuit board along with more serious circuit side etching. In addition, the reduction method has low utilization rate of raw materials (less than 5%), serious environmental pollution, complicated process steps and great limitations in the aspects of refinement, individuation and batch production. The full-addition method is suitable for manufacturing ultra-fine lines (the line width and the line distance are more than 40 mu m/40 mu m), and is characterized by short process flow, simple processing and low cost due to no use of copper foil, and good dispersion capability of a plating layer due to the adoption of chemical copper deposition, so the method is also suitable for the production of multilayer boards and small-aperture high-density boards, but the manufacturing cost is high, the current process is immature, and the reliability level needs to be further improved.
Disclosure of Invention
The invention aims to provide a laser direct writing-based flexible circuit board semi-additive preparation process, which simplifies the preparation process and optimizes process parameters in the laser processing process.
In order to solve the technical problem, the invention provides a laser direct writing-based flexible circuit board semi-additive preparation process, which comprises the following steps of:
step 1, ultrasonically cleaning polyimide by using absolute ethyl alcohol, then placing the polyimide into a constant-temperature water bath kettle at 55-65 ℃ for alkali treatment, namely performing surface treatment, wherein the use time is 10-20 min, and drying for later use;
step 2, dissolving organic copper salt in organic solvent of alkylamine and alcohol, and uniformly stirring by using a magnetic stirrer to obtain blue honey-like precursor solution;
step 3, coating the precursor solution prepared in the step 2 on the surface of the polyimide subjected to surface treatment in the step 1 in a spin coating mode, putting the spin-coated polyimide into a drying oven for drying, and obtaining a compact precursor film after organic matters are completely volatilized;
step 4, selecting a 355nm ultraviolet pulse laser to directly write the sample in the step 3, washing the redundant part with deionized water, and obtaining a conductive pattern in any shape on the surface of the polyimide;
step 5, coating a layer of photosensitive resist on the surface of the polyimide after the laser direct writing, and carrying out photoetching development;
and 6, electroplating the sample prepared in the step 5, and growing a copper layer along the plumbum surface of the photosensitive glue in an electroplating mode to obtain the copper layer with uniform thickness so as to prepare the flexible circuit board.
Compared with the prior art, the technical scheme of the invention has the following beneficial effects:
the invention provides a laser direct writing-based flexible circuit board semi-additive manufacturing process, wherein a conductive pattern is obtained on the basis of a laser direct writing technology to replace a thin copper foil, a final circuit pattern can be directly obtained by controlling a laser track, the manufacturing process is simplified, and meanwhile, technological parameters in a laser processing process, such as spot diameter, scanning speed, repetition frequency, pulse width and the like, can be optimized to obtain a fine conductive circuit less than or equal to 30 mu m. By applying the photoetching development technology and repeating the circuit pattern, the copper layer can grow along the vertical plane in the subsequent electroplating process, the edges of the copper wire are ensured to be neat and have no burrs, and the refinement of the flexible circuit is improved. The invention belongs to an improved semi-additive method, base copper is obtained by adopting a laser direct writing technology, any conductive pattern can be obtained by controlling the movement track of laser, and the method has high flexibility. Meanwhile, the thickness of the film is adjusted to obtain base copper with different thicknesses. In addition, compared with the traditional semi-addition method using copper foil as base copper, the method does not need subsequent differential etching, can simplify the preparation process and avoid environmental pollution.
Detailed Description
The present invention is further illustrated by the following detailed description.
A laser direct writing-based flexible circuit board semi-additive preparation process comprises the following steps:
step 1, ultrasonically cleaning polyimide by using absolute ethyl alcohol, then placing the polyimide into a constant-temperature water bath kettle at 55-65 ℃ for alkali treatment, namely performing surface treatment, wherein the improvement of the hydrophilicity of a substrate is facilitated, the use time is 10-20 min, and the polyimide is dried for later use;
step 2, dissolving organic copper salt in organic solvent of alkylamine and alcohol, and uniformly stirring by using a magnetic stirrer to obtain blue honey-like precursor solution;
step 3, coating the precursor solution prepared in the step 2 on the surface of the polyimide subjected to surface treatment in the step 1 in a spin coating mode, putting the spin-coated polyimide into a drying oven for drying, and obtaining a compact precursor film after organic matters are completely volatilized;
step 4, selecting a 355nm ultraviolet pulse laser to directly write the sample in the step 3, washing the redundant part with deionized water, and obtaining a conductive pattern in any shape on the surface of the polyimide;
step 5, coating a layer of photosensitive resist on the surface of the polyimide after the laser direct writing, and carrying out photoetching development;
and 6, electroplating the sample prepared in the step 5, and growing a copper layer along the plumbum surface of the photosensitive glue in an electroplating mode to obtain the copper layer with uniform thickness so as to prepare the flexible circuit board.
The invention provides a laser direct writing-based flexible circuit board semi-additive manufacturing process, wherein a conductive pattern is obtained on the basis of a laser direct writing technology to replace a thin copper foil, a final circuit pattern can be directly obtained by controlling a laser track, the manufacturing process is simplified, and meanwhile, technological parameters in a laser processing process, such as spot diameter, scanning speed, repetition frequency, pulse width and the like, can be optimized to obtain a fine conductive circuit less than or equal to 30 mu m. By applying the photoetching development technology and repeating the circuit pattern, the copper layer can grow along the vertical plane in the subsequent electroplating process, the edges of the copper wire are ensured to be neat and have no burrs, and the refinement of the flexible circuit is improved. The invention belongs to an improved semi-additive method, base copper is obtained by adopting a laser direct writing technology, any conductive pattern can be obtained by controlling the movement track of laser, and the method has high flexibility. Meanwhile, the thickness of the film is adjusted to obtain base copper with different thicknesses. In addition, compared with the traditional semi-addition method using copper foil as base copper, the method does not need subsequent differential etching, can simplify the preparation process and avoid environmental pollution.
The above description is only a preferred embodiment of the present invention, but the design concept of the present invention is not limited thereto, and any person skilled in the art can make insubstantial changes in the technical scope of the present invention within the technical scope of the present invention, and the actions infringe the protection scope of the present invention are included in the present invention.
Claims (1)
1. A laser direct writing-based flexible circuit board semi-additive preparation process is characterized by comprising the following steps:
step 1, ultrasonically cleaning polyimide by using absolute ethyl alcohol, then placing the polyimide into a constant-temperature water bath kettle at 55-65 ℃ for alkali treatment, namely performing surface treatment, wherein the use time is 10-20 min, and drying for later use;
step 2, dissolving organic copper salt in organic solvent of alkylamine and alcohol, and uniformly stirring by using a magnetic stirrer to obtain blue honey-like precursor solution;
step 3, coating the precursor solution prepared in the step 2 on the surface of the polyimide subjected to surface treatment in the step 1 in a spin coating mode, putting the spin-coated polyimide into a drying oven for drying, and obtaining a compact precursor film after organic matters are completely volatilized;
step 4, selecting a 355nm ultraviolet pulse laser to directly write the sample in the step 3, washing the redundant part with deionized water, and obtaining a conductive pattern in any shape on the surface of the polyimide;
step 5, coating a layer of photosensitive resist on the surface of the polyimide after the laser direct writing, and carrying out photoetching development;
and 6, electroplating the sample prepared in the step 5, and growing a copper layer along the plumbum surface of the photosensitive glue in an electroplating mode to obtain the copper layer with uniform thickness so as to prepare the flexible circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911127273.1A CN110933858A (en) | 2019-11-18 | 2019-11-18 | Laser direct writing-based flexible circuit board semi-additive preparation process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911127273.1A CN110933858A (en) | 2019-11-18 | 2019-11-18 | Laser direct writing-based flexible circuit board semi-additive preparation process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110933858A true CN110933858A (en) | 2020-03-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911127273.1A Pending CN110933858A (en) | 2019-11-18 | 2019-11-18 | Laser direct writing-based flexible circuit board semi-additive preparation process |
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| CN (1) | CN110933858A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112105143A (en) * | 2020-10-15 | 2020-12-18 | 河南博美通电子科技有限公司 | Flexible circuit board structure with aluminum foil replacing high-polymer flexible film and preparation process |
| CN114126201A (en) * | 2021-12-01 | 2022-03-01 | 广德东风电子有限公司 | PCB based on pulse VCP electroplating and preparation process thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5378508A (en) * | 1992-04-01 | 1995-01-03 | Akzo Nobel N.V. | Laser direct writing |
| CN103087582A (en) * | 2013-01-25 | 2013-05-08 | 天津理工大学 | Preparation method of low-temperature sintering nano copper conductive ink |
| CN103763862A (en) * | 2014-01-17 | 2014-04-30 | 西安工程大学 | Method for manufacturing flexible printed circuit board |
| CN108633186A (en) * | 2018-04-18 | 2018-10-09 | 北京航空航天大学 | A kind of method that large-area laser direct write prepares flexible miniature telegraph circuit |
| CN109270798A (en) * | 2018-08-31 | 2019-01-25 | 北京航空航天大学 | The method and copper ion ink of the anti-oxidant copper micro-structure of femtosecond laser direct write |
-
2019
- 2019-11-18 CN CN201911127273.1A patent/CN110933858A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5378508A (en) * | 1992-04-01 | 1995-01-03 | Akzo Nobel N.V. | Laser direct writing |
| CN103087582A (en) * | 2013-01-25 | 2013-05-08 | 天津理工大学 | Preparation method of low-temperature sintering nano copper conductive ink |
| CN103763862A (en) * | 2014-01-17 | 2014-04-30 | 西安工程大学 | Method for manufacturing flexible printed circuit board |
| CN108633186A (en) * | 2018-04-18 | 2018-10-09 | 北京航空航天大学 | A kind of method that large-area laser direct write prepares flexible miniature telegraph circuit |
| CN109270798A (en) * | 2018-08-31 | 2019-01-25 | 北京航空航天大学 | The method and copper ion ink of the anti-oxidant copper micro-structure of femtosecond laser direct write |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112105143A (en) * | 2020-10-15 | 2020-12-18 | 河南博美通电子科技有限公司 | Flexible circuit board structure with aluminum foil replacing high-polymer flexible film and preparation process |
| CN114126201A (en) * | 2021-12-01 | 2022-03-01 | 广德东风电子有限公司 | PCB based on pulse VCP electroplating and preparation process thereof |
| CN114126201B (en) * | 2021-12-01 | 2023-07-28 | 广德东风电子有限公司 | PCB based on pulse VCP electroplating and preparation method thereof |
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