CN104634767B - Manufacturing method of gallium nitride (GaN) based resonant cavity gas sensor - Google Patents

Manufacturing method of gallium nitride (GaN) based resonant cavity gas sensor Download PDF

Info

Publication number
CN104634767B
CN104634767B CN201510094227.1A CN201510094227A CN104634767B CN 104634767 B CN104634767 B CN 104634767B CN 201510094227 A CN201510094227 A CN 201510094227A CN 104634767 B CN104634767 B CN 104634767B
Authority
CN
China
Prior art keywords
gallium nitride
resonant cavity
gas sensor
metal
preparation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201510094227.1A
Other languages
Chinese (zh)
Other versions
CN104634767A (en
Inventor
张保平
翁国恩
梅洋
张江勇
应磊莹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xiamen University
Original Assignee
Xiamen University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xiamen University filed Critical Xiamen University
Priority to CN201510094227.1A priority Critical patent/CN104634767B/en
Publication of CN104634767A publication Critical patent/CN104634767A/en
Application granted granted Critical
Publication of CN104634767B publication Critical patent/CN104634767B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Investigating Or Analysing Materials By Optical Means (AREA)

Abstract

一种氮化镓基谐振腔气体传感器的制备方法,涉及气体传感器。在蓝宝石衬底GaN基外延片上制作图形化分布布拉格反射镜,然后在表面蒸发或溅射第一含金属层;在衬底表面蒸发或溅射第二含金属层;将第一含金属层和第二含金属层贴合,在真空或氮气氛围下键合,再通过激光剥离技术去除蓝宝石衬底;对去除蓝宝石衬底后的GaN基外延片进行器件分离,形成二维阵列结构,接着蒸发或溅射金属电极、分布布拉格反射镜,最后沉积聚合物涂层,完成器件制作。探测灵敏度高,易于制作成二维阵列结构,达到同时检测多种气体的目的,成本低,效率高。基于氮化镓基谐振腔结构,利用器件谐振发光波长的移动确定被检测气体含量,原理简单,制作容易且探测灵敏度高。

The invention discloses a preparation method of a gallium nitride-based resonant cavity gas sensor, relating to the gas sensor. Fabricate a patterned distributed Bragg reflector on a sapphire substrate GaN-based epitaxial wafer, then evaporate or sputter the first metal-containing layer on the surface; evaporate or sputter the second metal-containing layer on the substrate surface; combine the first metal-containing layer and The second metal-containing layer is bonded, bonded in a vacuum or nitrogen atmosphere, and then the sapphire substrate is removed by laser lift-off technology; the GaN-based epitaxial wafer after removing the sapphire substrate is separated to form a two-dimensional array structure, and then evaporated Or sputter metal electrodes, distributed Bragg reflectors, and finally deposit polymer coatings to complete device fabrication. The detection sensitivity is high, and it is easy to be made into a two-dimensional array structure to achieve the purpose of detecting multiple gases at the same time, with low cost and high efficiency. Based on the gallium nitride-based resonant cavity structure, the content of the gas to be detected is determined by using the shift of the resonant luminescent wavelength of the device. The principle is simple, the fabrication is easy and the detection sensitivity is high.

Description

一种氮化镓基谐振腔气体传感器的制备方法A preparation method of GaN-based resonant cavity gas sensor

技术领域technical field

本发明涉及气体传感器,尤其是涉及一种氮化镓基谐振腔气体传感器的制备方法。The invention relates to a gas sensor, in particular to a preparation method of a gallium nitride-based resonant cavity gas sensor.

背景技术Background technique

氮化镓基材料属于直接带隙半导体材料且具有连续可调的带隙,室温下发光波长涵盖了近红外、可见光及深紫外波段,是第三代半导体材料。由于其稳定的机械和化学性能,基于氮化镓基材料制作的光电器件在照明、全色显示、光学存储、信号检测、激光打印以及通讯等领域具有广泛的应用前景。Gallium nitride-based materials are direct bandgap semiconductor materials with continuously adjustable bandgap. The emission wavelengths at room temperature cover the near-infrared, visible light and deep ultraviolet bands. They are the third-generation semiconductor materials. Due to its stable mechanical and chemical properties, optoelectronic devices based on GaN-based materials have broad application prospects in lighting, full-color display, optical storage, signal detection, laser printing, and communication.

气体传感器是近年来的研究热点,其用途之一是用于检测环境中有害挥发性有机物气体(比如甲醛和丙酮等)含量,这对在特定环境中工作的人的健康是非常重要的。目前报道的用于检测这些挥发性有机物气体含量的信号传导机制主要包括聚合物涂层悬臂(polymer coated cantilevers)、薄膜电阻(thin-film resistors)和光纤(opticalfibers)等(H.Jensenius,J.Thaysen,et al.,A microcantilever-based alcohol vaporsensor-application and response model,Appl.Phys.Lett.,76:2615(2000);J.Li,Y.Lu,et al.,Carbon nanotube sensors for gas and organic vapor detection,NanoLett.,3:929(2003);D.K.C.Wu,B.T.Kuhlmey,et al.,Ultrasensitive photonic crystalrefractive index sensor,Opt.Lett.,34:322(2009)),这些检测方法都具有很高的响应灵敏度。其中沉积聚合物的方法具有独特的优势,其优势在于聚合物与挥发性有机物气体之间的响应存在一一对应的关系,可以通过沉积不同的聚合物涂层,实现同时检测多种有机物气体含量的目的,提高了检测效率并降低了成本。Gas sensor is a research hotspot in recent years. One of its uses is to detect the content of harmful volatile organic compounds (such as formaldehyde and acetone) in the environment, which is very important to the health of people working in a specific environment. The currently reported signal transduction mechanisms for detecting the gas content of these volatile organic compounds mainly include polymer coated cantilevers, thin-film resistors, and optical fibers (H. Jensenius, J. Thaysen, et al., A microcantilever-based alcohol vapor sensor-application and response model, Appl. Phys. Lett., 76:2615 (2000); J. Li, Y. Lu, et al., Carbon nanotube sensors for gas and organic vapor detection, NanoLett., 3:929 (2003); DKCWu, BT Kuhlmey, et al., Ultrasensitive photonic crystal reactive index sensor, Opt.Lett., 34:322(2009)), these detection methods all have high response sensitivity. Among them, the method of depositing polymers has unique advantages. Its advantage is that there is a one-to-one correspondence between the responses of polymers and volatile organic gases. Different polymer coatings can be deposited to simultaneously detect the content of various organic gases. The purpose is to improve the detection efficiency and reduce the cost.

发明内容Contents of the invention

本发明的目的在于提供一种氮化镓基谐振腔气体传感器的制备方法。The object of the present invention is to provide a method for preparing a gallium nitride-based resonant cavity gas sensor.

本发明包括以下步骤:The present invention comprises the following steps:

1)在蓝宝石衬底GaN基外延片上制作图形化分布布拉格反射镜,然后在表面蒸发或溅射第一含金属层;1) Fabricate a patterned distributed Bragg reflector on a GaN-based epitaxial wafer on a sapphire substrate, and then evaporate or sputter the first metal-containing layer on the surface;

2)在衬底表面蒸发或溅射第二含金属层;2) evaporating or sputtering a second metal-containing layer on the surface of the substrate;

3)将第一含金属层和第二含金属层贴合,在真空或氮气氛围下键合,再通过激光剥离技术去除蓝宝石衬底;3) bonding the first metal-containing layer and the second metal-containing layer together, bonding them under a vacuum or nitrogen atmosphere, and then removing the sapphire substrate by laser lift-off technology;

4)对去除蓝宝石衬底后的GaN基外延片进行器件分离,形成二维阵列结构,接着蒸发或溅射金属电极、分布布拉格反射镜,最后沉积聚合物涂层,完成器件制作。4) Separate the GaN-based epitaxial wafer after removing the sapphire substrate to form a two-dimensional array structure, then evaporate or sputter metal electrodes, distribute Bragg reflectors, and finally deposit a polymer coating to complete the device fabrication.

在步骤1)中,所述制作图形化分布布拉格反射镜可采用光刻、剥离、腐蚀或刻蚀等方法;所述分布布拉格反射镜由两种不同折射率的介质膜交错迭加而成,每层介质膜的厚度可为1/4中心波长,介质膜组合可采用TiO2/SiO2或Ta2O5/SiO2等;In step 1), methods such as photolithography, stripping, corrosion or etching can be used for making the patterned distributed Bragg reflector; the distributed Bragg reflector is formed by interleaved superposition of two dielectric films with different refractive indices, The thickness of each layer of dielectric film can be 1/4 of the central wavelength, and the combination of dielectric films can be TiO 2 /SiO 2 or Ta 2 O 5 /SiO 2 , etc.;

所述第一含金属层的组成可为Au、In、Sn、Cu、Pb等常用键合金属中的至少一种或至少两种的合金。The composition of the first metal-containing layer may be at least one or an alloy of at least two common bonding metals such as Au, In, Sn, Cu, and Pb.

在步骤2)中,所述衬底可采用硅片等;所述第二含金属层的组成可为Au、In、Sn、Cu、Pb等常用键合金属中的至少一种或至少两种的合金。In step 2), the substrate can be a silicon wafer or the like; the composition of the second metal-containing layer can be at least one or at least two of common bonding metals such as Au, In, Sn, Cu, Pb, etc. alloy.

在步骤4)中,所述器件分离可采用腐蚀或感应耦合等离子体刻蚀方法;所述金属电极可采用Ni/Au、Cr/Au或Ti/Au等;所述金属电极、分布布拉格反射镜、聚合物涂层可采用光刻、剥离、腐蚀或刻蚀等方法;所述聚合物涂层的选取取决于被探测气体,该聚合物涂层在吸收被探测气体后必须能够引起厚度与折射率的变化,比如探测丙酮可以选用聚苯乙烯等。In step 4), the separation of the device can use corrosion or inductively coupled plasma etching method; the metal electrode can use Ni/Au, Cr/Au or Ti/Au, etc.; the metal electrode, distributed Bragg reflector 1. The polymer coating can adopt methods such as photolithography, stripping, corrosion or etching; the selection of the polymer coating depends on the gas to be detected, and the polymer coating must be able to cause thickness and refraction after absorbing the gas to be detected. Rate changes, such as detection of acetone can choose polystyrene and so on.

本发明提供一种新型氮化镓基谐振腔气体传感器的制备方案,利用聚合物吸收有机物气体后厚度与折射率的变化来改变谐振腔上反射镜的反射率,从而引起谐振发光波长的移动,根据发光波长的改变量来确定被探测气体的含量。本发明的优点在于氮化镓基材料具有稳定的机械和化学性质,可以在各种恶劣环境中正常工作。同时这种传感器探测灵敏度高,易于制作成二维阵列结构,达到同时检测多种气体的目的,降低成本,提高效率。The invention provides a preparation scheme of a novel gallium nitride-based resonant cavity gas sensor, which uses changes in the thickness and refractive index of the polymer after absorbing organic gas to change the reflectivity of the reflector on the resonant cavity, thereby causing the shift of the resonant luminescent wavelength. Determine the content of the gas to be detected according to the amount of change in the luminescent wavelength. The advantage of the invention is that the GaN-based material has stable mechanical and chemical properties and can work normally in various harsh environments. At the same time, the sensor has high detection sensitivity and is easy to be fabricated into a two-dimensional array structure, thereby achieving the purpose of simultaneously detecting multiple gases, reducing costs and improving efficiency.

本发明基于氮化镓基谐振腔结构,利用器件谐振发光波长的移动来确定被检测气体含量,原理简单,制作容易且探测灵敏度高,是一种应用前景广阔的新型气体传感器。The invention is based on a gallium nitride-based resonant cavity structure, uses the movement of the resonant luminescent wavelength of the device to determine the content of the gas to be detected, has a simple principle, is easy to manufacture and has high detection sensitivity, and is a new type of gas sensor with broad application prospects.

本发明可以容易实现传感器的二维阵列排布,实现同时检测多种挥发性有机物气体。检测原理简单表述如下:当聚合物涂层吸收特定的有机物气体后,其厚度和折射率会发生改变。由于这些聚合物直接沉积在谐振腔的上反射镜上,二者可以看成是一个统一的整体,聚合物厚度与折射率的变化将引起谐振腔上反射镜的反射率的改变,从而导致谐振腔的谐振发光波长发生移动。折射率改变越大,波长移动越明显。根据这一原理,找出谐振发光波长改变量与吸收的有机物气体浓度之间的定量关系,就可以通过传感器的谐振发光波长改变量Δλ来确定环境中某种有机物气体的浓度。The invention can easily realize the two-dimensional array arrangement of sensors, and realize simultaneous detection of multiple volatile organic compound gases. The detection principle is simply stated as follows: when the polymer coating absorbs a specific organic gas, its thickness and refractive index will change. Since these polymers are directly deposited on the upper mirror of the resonator, the two can be regarded as a unified whole, and changes in the thickness and refractive index of the polymer will cause changes in the reflectivity of the upper mirror of the resonator, resulting in resonance The resonant emission wavelength of the cavity is shifted. The greater the refractive index change, the more pronounced the wavelength shift. According to this principle, if the quantitative relationship between the change of resonance luminescence wavelength and the concentration of absorbed organic gas is found, the concentration of a certain organic gas in the environment can be determined by the change of resonance luminescence wavelength Δλ of the sensor.

附图说明Description of drawings

图1为所使用的氮化镓基外延片结构示意图;FIG. 1 is a schematic diagram of the structure of the gallium nitride-based epitaxial wafer used;

图2为在p型氮化镓上制作图形化分布布拉格反射镜示意图;Figure 2 is a schematic diagram of fabricating a patterned distributed Bragg reflector on p-type gallium nitride;

图3为金属键合示意图;Figure 3 is a schematic diagram of metal bonding;

图4为激光剥离去除蓝宝石衬底及感应耦合等离子体刻蚀分离器件后的示意图;Fig. 4 is a schematic diagram of removing the sapphire substrate by laser lift-off and separating the device by inductively coupled plasma etching;

图5为氮化镓基谐振腔发光器件二维阵列示意图;5 is a schematic diagram of a two-dimensional array of GaN-based resonant cavity light-emitting devices;

图6为沉积聚合物涂层后气体传感器二维阵列示意图。Fig. 6 is a schematic diagram of a two-dimensional array of gas sensors after depositing a polymer coating.

具体实施方式detailed description

下面将结合附图详细说明本发明的工艺流程。The process flow of the present invention will be described in detail below in conjunction with the accompanying drawings.

1)如图1所示,在蓝宝石衬底11上采用MOCVD方法,依次生长GaN低温缓冲层(30nm)、未掺杂的GaN层(2.5μm)、掺Si的n型GaN层(2.5μm)、InGaN/GaN多量子阱有源层(2nm/5nm×5)、掺Mg的AlGaN层(200nm)和掺Mg的p型GaN层(800nm)等GaN基外延层12,并在外延片生长完成后进行高温退火,以提高空穴浓度。1) As shown in Figure 1, a GaN low-temperature buffer layer (30nm), an undoped GaN layer (2.5 μm), and a Si-doped n-type GaN layer (2.5 μm) are sequentially grown on a sapphire substrate 11 by MOCVD method , InGaN/GaN multi-quantum well active layer (2nm/5nm×5), Mg-doped AlGaN layer (200nm) and Mg-doped p-type GaN layer (800nm) and other GaN-based epitaxial layers 12, and grown on the epitaxial wafer After high temperature annealing, in order to increase the hole concentration.

2)如图2,对所述外延片进行光刻,然后采用电子束蒸发或磁控溅射方法生长分布布拉格反射镜,再利用剥离的方法得到图形化的分布布拉格反射镜21;分布布拉格反射镜由25层Ta2O5/SiO2堆叠而成,每层介质膜厚度为1/4中心波长,反射率在99%以上。2) As shown in Figure 2, the epitaxial wafer is subjected to photolithography, and then electron beam evaporation or magnetron sputtering methods are used to grow a distributed Bragg reflector, and then a patterned distributed Bragg reflector 21 is obtained by stripping; the distributed Bragg reflector The mirror is stacked by 25 layers of Ta 2 O 5 /SiO 2 , the thickness of each layer of dielectric film is 1/4 of the central wavelength, and the reflectivity is above 99%.

3)在分布布拉格反射镜一侧蒸发4μm的第一含金属层(Au)31,在干净的硅片33上蒸发第二含金属层(Au)32;在真空环境、350℃,4MPa压强下将第一、第二含金层键合在一起,如图3所示。3) Evaporate a 4 μm first metal-containing layer (Au) 31 on one side of the distributed Bragg reflector, and evaporate a second metal-containing layer (Au) 32 on a clean silicon wafer 33; in a vacuum environment, 350 ° C, 4 MPa pressure The first and second gold-containing layers are bonded together, as shown in FIG. 3 .

4)采用激光剥离技术把蓝宝石衬底去掉,将氮化镓基外延结构转移到硅片衬底上,并用感应耦合等离子体刻蚀方法将氮化镓基外延结构分离,如图4所示。4) The sapphire substrate is removed by laser lift-off technology, the GaN-based epitaxial structure is transferred to the silicon wafer substrate, and the GaN-based epitaxial structure is separated by inductively coupled plasma etching, as shown in FIG. 4 .

5)采用与步骤2)中相同的方法制作n型金属电极51和图形化分布布拉格反射镜52,形成完整的谐振腔结构,如图5所示。这里分布布拉格反射镜52的反射率略低于分布布拉格反射镜21的反射率。5) Fabricate the n-type metal electrode 51 and the patterned distributed Bragg reflector 52 by the same method as in step 2) to form a complete resonant cavity structure, as shown in FIG. 5 . Here, the reflectivity of the DBR 52 is slightly lower than the reflectivity of the DBR 21 .

6)最后在谐振腔的上反射镜表面沉积聚合物涂层61,完成气体传感器的制备,如图6所示。6) Finally, a polymer coating 61 is deposited on the surface of the upper mirror of the resonant cavity to complete the preparation of the gas sensor, as shown in FIG. 6 .

氮化镓基谐振腔上反射镜上沉积的聚合物涂层可以是同一种聚合物,也可以是几种不同的聚合物阵列。The polymer coating deposited on the mirror on the GaN-based resonator can be the same polymer or an array of several different polymers.

GaN基外延片可以采用分子束外延、金属有机物化学气相外延、氢化物气相外延或者磁控溅射等方法制备。GaN-based epitaxial wafers can be prepared by methods such as molecular beam epitaxy, metal-organic chemical vapor phase epitaxy, hydride vapor phase epitaxy, or magnetron sputtering.

本发明通过在氮化镓基谐振腔发光器件的上反射镜表面沉积一层特殊的聚合物涂层来实现。这种气体传感器主要用于检测环境中有害的挥发性有机物的浓度,如甲醛和丙酮等。由于氮化镓基材料具有稳定的机械和化学性能,因此这种传感器能够适应各种恶劣的环境。该传感器通电工作时,在未吸收被探测气体时有一个固定的谐振发光波长λ,当聚合物涂层吸收被探测有机气体后,聚合物层的厚度和折射率会发生改变,从而使传感器的谐振发光波长变为λ′。根据吸收气体前后谐振波长的改变量Δλ=λ′-λ,就可以确定环境中被探测有机气体的浓度。这种气体传感器的优势还在于易于实现二维阵列结构,即通过沉积不同的聚合物涂层实现同时检测多种气体,极大地提高了检测效率并降低了制作成本。The invention is realized by depositing a layer of special polymer coating on the surface of the upper reflector of the gallium nitride-based resonant cavity light-emitting device. This gas sensor is mainly used to detect the concentration of harmful volatile organic compounds in the environment, such as formaldehyde and acetone. Due to the stable mechanical and chemical properties of gallium nitride-based materials, this sensor can adapt to various harsh environments. When the sensor is powered on, it has a fixed resonant luminous wavelength λ when it does not absorb the detected gas. When the polymer coating absorbs the detected organic gas, the thickness and refractive index of the polymer layer will change, so that the sensor's The resonant luminescence wavelength becomes λ'. According to the change of resonance wavelength Δλ=λ′-λ before and after absorbing the gas, the concentration of the detected organic gas in the environment can be determined. The advantage of this gas sensor is that it is easy to realize a two-dimensional array structure, that is, to detect multiple gases simultaneously by depositing different polymer coatings, which greatly improves the detection efficiency and reduces the production cost.

Claims (12)

1. a kind of preparation method of gallium nitride based resonant cavity gas sensor is it is characterised in that comprise the following steps:
1) make graphical distribution Bragg reflector on Sapphire Substrate GaN base epitaxial wafer, then in surface evaporation or splash Penetrate the first metal-containing layer;
2) in sapphire substrate surface evaporation or sputtering the second metal-containing layer;
3) the first metal-containing layer and the second metal-containing layer are fitted, be bonded under vacuum or nitrogen atmosphere, then pass through laser lift-off Technology removes Sapphire Substrate;
4) device isolation carried out to the GaN base epitaxial wafer removing after Sapphire Substrate, forms two-dimensional array structure, then evaporation or Splash-proofing sputtering metal electrode, distribution Bragg reflector, last deposited polymeric coatings, complete element manufacturing.
2. as claimed in claim 1 a kind of preparation method of gallium nitride based resonant cavity gas sensor it is characterised in that in step 1), in, the graphical distribution Bragg reflector of described making adopts photoetching, stripping, corrosion or lithographic method.
3. as claimed in claim 1 a kind of preparation method of gallium nitride based resonant cavity gas sensor it is characterised in that in step 1), in, described distribution Bragg reflector is formed by the staggered superposition of deielectric-coating of two kinds of different refractivities, the thickness of every layer dielectric Spend for 1/4 centre wavelength, deielectric-coating combination adopts TiO2/SiO2Or Ta2O5/SiO2.
4. as claimed in claim 1 a kind of preparation method of gallium nitride based resonant cavity gas sensor it is characterised in that in step 1) in, at least one consisting of in Au, In, Sn, Cu, Pb bond wire of described first metal-containing layer.
5. as claimed in claim 1 a kind of preparation method of gallium nitride based resonant cavity gas sensor it is characterised in that in step 1) in, described first metal-containing layer consist of in Au, In, Sn, Cu, Pb bond wire at least two alloy.
6. as claimed in claim 1 a kind of preparation method of gallium nitride based resonant cavity gas sensor it is characterised in that in step 2) in, at least one consisting of in Au, In, Sn, Cu, Pb bond wire of described second metal-containing layer.
7. as claimed in claim 1 a kind of preparation method of gallium nitride based resonant cavity gas sensor it is characterised in that in step 2) in, described second metal-containing layer consist of in Au, In, Sn, Cu, Pb bond wire at least two alloy.
8. as claimed in claim 1 a kind of preparation method of gallium nitride based resonant cavity gas sensor it is characterised in that in step 4), in, described device isolation is using corrosion or sense coupling method.
9. as claimed in claim 1 a kind of preparation method of gallium nitride based resonant cavity gas sensor it is characterised in that in step 4), in, described metal electrode adopts Ni/Au, Cr/Au or Ti/Au.
10. as claimed in claim 1 a kind of preparation method of gallium nitride based resonant cavity gas sensor it is characterised in that in step 4), in, described metal electrode, distribution Bragg reflector, polymer coating adopt photoetching, stripping, corrosion or lithographic method.
11. as claimed in claim 1 a kind of preparation method of gallium nitride based resonant cavity gas sensor it is characterised in that in step 4), in, the selection of described polymer coating depends on detected gas, and this polymer coating is necessary after absorbing detected gas The change of thickness and refractive index can be caused.
12. as claimed in claim 11 a kind of preparation method of gallium nitride based resonant cavity gas sensor it is characterised in that described Detected gas is acetone, and polymer coating selects polystyrene.
CN201510094227.1A 2015-03-03 2015-03-03 Manufacturing method of gallium nitride (GaN) based resonant cavity gas sensor Active CN104634767B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510094227.1A CN104634767B (en) 2015-03-03 2015-03-03 Manufacturing method of gallium nitride (GaN) based resonant cavity gas sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510094227.1A CN104634767B (en) 2015-03-03 2015-03-03 Manufacturing method of gallium nitride (GaN) based resonant cavity gas sensor

Publications (2)

Publication Number Publication Date
CN104634767A CN104634767A (en) 2015-05-20
CN104634767B true CN104634767B (en) 2017-02-22

Family

ID=53213760

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510094227.1A Active CN104634767B (en) 2015-03-03 2015-03-03 Manufacturing method of gallium nitride (GaN) based resonant cavity gas sensor

Country Status (1)

Country Link
CN (1) CN104634767B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105742958A (en) * 2016-02-23 2016-07-06 中山大学 III-nitride luminescent device with DBR mask and preparation method
CN107887790A (en) * 2017-09-27 2018-04-06 华东师范大学 A kind of multi-wavelength GaN base asymmetric quantum well surface-emitting laser and preparation method thereof
CN111063725B (en) * 2019-12-19 2021-01-19 太原理工大学 Three-dimensional gallium nitride-based exhalation type gas sensor and preparation method thereof
CN114076739B (en) * 2020-08-21 2023-09-12 广东工业大学 RCLED-based sensor and manufacturing method thereof
CN114923877B (en) * 2022-05-17 2025-03-18 中国科学院上海微系统与信息技术研究所 A multi-gas detection chip and preparation method thereof

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10032062C2 (en) * 2000-07-01 2002-06-27 Eads Deutschland Gmbh Gas sensor and use of a field effect transistor as a gas sensor
US6420242B1 (en) * 1998-01-23 2002-07-16 The Regents Of The University Of California Separation of thin films from transparent substrates by selective optical processing
JP2009147347A (en) * 2007-12-17 2009-07-02 Palo Alto Research Center Inc Buried aperture nitride light emitting device
JP2011094969A (en) * 2009-10-27 2011-05-12 Tokyo Institute Of Technology Gas sensor
EP2434274A1 (en) * 2010-09-27 2012-03-28 Stichting IMEC Nederland Sensor, method for detecting the presence and / or concentration of an analyte using the sensor and use of the method
CN102401788A (en) * 2011-05-18 2012-04-04 曹暾 Microfluidic chip biosensor with integrated Fabry-Perot optical resonant cavity
CN103227265A (en) * 2013-04-12 2013-07-31 厦门大学 Non-planar bonding method for fabricating gallium nitride-based light emitting device
CN203800048U (en) * 2013-11-25 2014-08-27 江苏新广联科技股份有限公司 Hydrogen sensor chip based on two-dimensional electron gas
US8860005B1 (en) * 2013-08-08 2014-10-14 International Business Machines Corporation Thin light emitting diode and fabrication method

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1664724A4 (en) * 2003-09-12 2007-05-02 Nanomix Inc Carbon dioxide nanoelectronic sensor

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6420242B1 (en) * 1998-01-23 2002-07-16 The Regents Of The University Of California Separation of thin films from transparent substrates by selective optical processing
DE10032062C2 (en) * 2000-07-01 2002-06-27 Eads Deutschland Gmbh Gas sensor and use of a field effect transistor as a gas sensor
JP2009147347A (en) * 2007-12-17 2009-07-02 Palo Alto Research Center Inc Buried aperture nitride light emitting device
JP2011094969A (en) * 2009-10-27 2011-05-12 Tokyo Institute Of Technology Gas sensor
EP2434274A1 (en) * 2010-09-27 2012-03-28 Stichting IMEC Nederland Sensor, method for detecting the presence and / or concentration of an analyte using the sensor and use of the method
CN102401788A (en) * 2011-05-18 2012-04-04 曹暾 Microfluidic chip biosensor with integrated Fabry-Perot optical resonant cavity
CN103227265A (en) * 2013-04-12 2013-07-31 厦门大学 Non-planar bonding method for fabricating gallium nitride-based light emitting device
US8860005B1 (en) * 2013-08-08 2014-10-14 International Business Machines Corporation Thin light emitting diode and fabrication method
CN203800048U (en) * 2013-11-25 2014-08-27 江苏新广联科技股份有限公司 Hydrogen sensor chip based on two-dimensional electron gas

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
Chih-Chien Lin et al..GaN-Based Resonant-Cavity Light-Emitting Diodes With Top and Bottom Dielectric Distributed Bragg Re&#64258 *
ectors.《IEEE PHOTONICS TECHNOLOGY LETTERS》.2010,第22卷(第17期),第1291-1293页. *
Polymer Distributed Bragg Reflectors for Vapor Sensing;Paola Lova et al.;《ACS Photonics》;20150302;第2卷;第537-543页 *
微悬臂梁阵列在电子鼻及生物传感中的应用;张柏林 等;《黑龙江大学自然科学学报》;20111031;第28卷(第5期);第676-689,695页 *

Also Published As

Publication number Publication date
CN104634767A (en) 2015-05-20

Similar Documents

Publication Publication Date Title
CN104634767B (en) Manufacturing method of gallium nitride (GaN) based resonant cavity gas sensor
US8022432B2 (en) Light-emitting device comprising conductive nanorods as transparent electrodes
CN106684220B (en) A kind of AlGaInP light-emitting diode thin film chip structure and its preparation method
CN102255013B (en) Method for making light-emitting diode with vertical structure through stripping GaN based epitaxial layer and sapphire substrate by using wet process
US20150380609A1 (en) Light Emitter With Coating Layers
CN101312228B (en) Semiconductor light emitting element and manufacturing method thereof
JP2007220972A (en) Semiconductor light emitting device, method for manufacturing the same, and lamp
KR20090106299A (en) Group III-nitride semiconductor light emitting diode device having an ohmic contact light extracting structure layer and a method of manufacturing the same
CN102800773A (en) Semiconductor light emitting device and manufacturing method of the same
CN109326686A (en) A kind of manufacturing method of flip-chip light-emitting diode chip
CN105023984B (en) A kind of preparation method of the light emitting diode (LED) chip with vertical structure based on GaN thick films
CN105655387A (en) Semiconductor epitaxial wafer and preparation method thereof
JP2021528869A (en) Ultraviolet LED chip for improving light extraction efficiency and its manufacturing method
CN104319326B (en) Light-emitting diode manufacturing method
WO2006011497A1 (en) Light emitting element and manufacturing method thereof
CN101740702A (en) ZnO nanosphere-based GaN-based light emitting diode surface roughening method
CN104241480A (en) High-power infrared light-emitting diode manufacturing method
JP2008016629A (en) Manufacturing method of group iii nitride light emitting diode element
CN102064250B (en) Substrate-glaring SiC substrate vertical structure light-emitting tube and preparation method thereof
WO2015070669A1 (en) Light-emitting diode chip and manufacturing method therefor
CN110718614A (en) Ultraviolet light-emitting diode chip for improving light extraction efficiency and manufacturing method thereof
KR100621918B1 (en) Light-emitting device comprising transparent conductive nanorods as electrodes
CN103367580A (en) LED (Light-Emitting Diode) chip with high luminous efficiency and manufacturing method thereof
US20190312174A1 (en) Light emitting device for light amplification using graphene quantum dot and method for producing the device
CN103700742B (en) There is light emitting diode of high reflectance electrode and preparation method thereof

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant