CN104620685A - 用于标定分配的沉积物的方法与设备 - Google Patents

用于标定分配的沉积物的方法与设备 Download PDF

Info

Publication number
CN104620685A
CN104620685A CN201380041529.1A CN201380041529A CN104620685A CN 104620685 A CN104620685 A CN 104620685A CN 201380041529 A CN201380041529 A CN 201380041529A CN 104620685 A CN104620685 A CN 104620685A
Authority
CN
China
Prior art keywords
dispenser
line width
adjusting
average line
predetermined tolerance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201380041529.1A
Other languages
English (en)
Chinese (zh)
Inventor
乔纳森·乔尔·布卢姆
萨蒂什·卡韦蒂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Illinois Tool Works Inc
Original Assignee
Illinois Tool Works Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Illinois Tool Works Inc filed Critical Illinois Tool Works Inc
Publication of CN104620685A publication Critical patent/CN104620685A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0469—Surface mounting by applying a glue or viscous material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3485—Application of solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CN201380041529.1A 2012-08-30 2013-08-28 用于标定分配的沉积物的方法与设备 Pending CN104620685A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/598,719 2012-08-30
US13/598,719 US20140060144A1 (en) 2012-08-30 2012-08-30 Method and apparatus for calibrating dispensed deposits
PCT/US2013/057152 WO2014036185A1 (en) 2012-08-30 2013-08-28 Method and apparatus for calibrating dispensed deposits

Publications (1)

Publication Number Publication Date
CN104620685A true CN104620685A (zh) 2015-05-13

Family

ID=49209530

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380041529.1A Pending CN104620685A (zh) 2012-08-30 2013-08-28 用于标定分配的沉积物的方法与设备

Country Status (8)

Country Link
US (1) US20140060144A1 (https=)
EP (1) EP2891391A1 (https=)
JP (1) JP2015528388A (https=)
KR (1) KR20150052043A (https=)
CN (1) CN104620685A (https=)
PH (1) PH12015500029A1 (https=)
TW (1) TW201410333A (https=)
WO (1) WO2014036185A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9789497B1 (en) * 2016-06-20 2017-10-17 Nordson Corporation Systems and methods for applying a liquid coating to a substrate
WO2019084348A1 (en) * 2017-10-27 2019-05-02 Nordson Corporation SYSTEMS AND METHODS FOR CONTROLLING THE SPEED OF A CLOSED LOOP LIQUID FOR EJECTION
CN114555243A (zh) 2019-10-14 2022-05-27 3M创新有限公司 使用便携式测量设备来进行的自动化液体粘合剂分配
US11246249B2 (en) 2020-04-15 2022-02-08 Illinois Tool Works Inc. Tilt and rotate dispenser having strain wave gear system
US11904337B2 (en) 2021-08-03 2024-02-20 Illinois Tool Works Inc. Tilt and rotate dispenser having material flow rate control
US11805634B2 (en) * 2021-08-03 2023-10-31 Illinois Tool Works Inc. Tilt and rotate dispenser having motion control
US12468285B2 (en) 2023-03-08 2025-11-11 Illinois Tool Works Inc. Intersect command vision locating system and method
US12226795B2 (en) 2023-04-14 2025-02-18 Illinois Tool Works Inc. Dispense volume adjustment based on gap width of located features

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000065316A1 (en) * 1999-04-23 2000-11-02 Nordson Corporation Viscous material dispensing system and method with feedback control
US20030209560A1 (en) * 2002-05-10 2003-11-13 Asm Assembly Automation Ltd Dispensation of controlled quantities of material onto a substrate
US7329458B2 (en) * 2003-03-25 2008-02-12 Kabushiki Kaisha Toshiba Wiring member and method of manufacturing the same
CN101204890A (zh) * 2006-12-20 2008-06-25 帕洛阿尔托研究中心公司 印刷平滑微尺度特征的方法
TW200827040A (en) * 2006-12-29 2008-07-01 Ind Tech Res Inst Real-time dispenser fault detection and classification method

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4769551A (en) * 1986-06-27 1988-09-06 Nippon Kogaku K.K. Pattern detecting apparatus utilizing energy beam
JP2716052B2 (ja) * 1987-01-13 1998-02-18 株式会社日立製作所 加工方法及び装置並びに加工品質管理方法
US5819983A (en) 1995-11-22 1998-10-13 Camelot Sysems, Inc. Liquid dispensing system with sealing augering screw and method for dispensing
JP2002040342A (ja) * 2000-07-24 2002-02-06 Ricoh Co Ltd 光走査装置・光走査方法および画像形成装置
US7264323B2 (en) * 2002-11-22 2007-09-04 Codonics, Inc. Achieving laser-quality medical hardcopy output from thermal print devices
US7980197B2 (en) 2006-11-03 2011-07-19 Illinois Tool Works, Inc. Method and apparatus for dispensing a viscous material on a substrate
US8059915B2 (en) * 2006-11-20 2011-11-15 Videosurf, Inc. Apparatus for and method of robust motion estimation using line averages
JP5204451B2 (ja) * 2007-09-28 2013-06-05 株式会社ニューフレアテクノロジー 荷電粒子ビーム描画装置および荷電粒子ビーム描画方法
JP2010067674A (ja) * 2008-09-09 2010-03-25 Toray Ind Inc 金属積層基板の製造方法及びそれにより得られる金属積層基板
JP5651981B2 (ja) * 2010-03-31 2015-01-14 日本電気株式会社 塗布圧力制御装置、方法及びプログラム並びにこれを用いた塗布装置
EP2593517B1 (en) * 2010-07-16 2017-04-05 E. I. du Pont de Nemours and Company Cross-linked pigment dispersion based on polyurethane dispersants
US8458626B1 (en) * 2012-01-20 2013-06-04 International Business Machines Corporation Method for calibrating an SRAF printing model
US9057642B2 (en) * 2012-12-03 2015-06-16 Illinois Tool Works Inc. Method and apparatus for calibrating a dispenser

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000065316A1 (en) * 1999-04-23 2000-11-02 Nordson Corporation Viscous material dispensing system and method with feedback control
US20030209560A1 (en) * 2002-05-10 2003-11-13 Asm Assembly Automation Ltd Dispensation of controlled quantities of material onto a substrate
US7329458B2 (en) * 2003-03-25 2008-02-12 Kabushiki Kaisha Toshiba Wiring member and method of manufacturing the same
CN101204890A (zh) * 2006-12-20 2008-06-25 帕洛阿尔托研究中心公司 印刷平滑微尺度特征的方法
TW200827040A (en) * 2006-12-29 2008-07-01 Ind Tech Res Inst Real-time dispenser fault detection and classification method

Also Published As

Publication number Publication date
TW201410333A (zh) 2014-03-16
JP2015528388A (ja) 2015-09-28
US20140060144A1 (en) 2014-03-06
EP2891391A1 (en) 2015-07-08
KR20150052043A (ko) 2015-05-13
PH12015500029A1 (en) 2015-02-23
WO2014036185A1 (en) 2014-03-06

Similar Documents

Publication Publication Date Title
CN104620685A (zh) 用于标定分配的沉积物的方法与设备
US6541063B1 (en) Calibration of a dispensing system
CN100441317C (zh) 非接触式粘性物质喷射系统及其投放粘性物质的方法
US8616042B2 (en) Method and apparatus for calibrating dispensed deposits
CN104938044B (zh) 用于标定分配器的方法和设备
US10926287B2 (en) Method of calibrating a dispenser
JPH10202161A (ja) ロボットによる液体精密塗布方法および液体塗布装置
CN104275277A (zh) 粘性材料涂覆调校方法
CN118044347A (zh) 具有材料流率控制的倾斜和旋转分配器
CN100518954C (zh) 利用非接触式投放器将粘性物质喷射到基底上的方法
US12226795B2 (en) Dispense volume adjustment based on gap width of located features
JP2026513985A (ja) 位置特定された特徴部のギャップ幅に基づく供給量の調整

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20150513

WD01 Invention patent application deemed withdrawn after publication