CN104600186A - Manufacturing method of LED packaging body - Google Patents
Manufacturing method of LED packaging body Download PDFInfo
- Publication number
- CN104600186A CN104600186A CN201310526818.2A CN201310526818A CN104600186A CN 104600186 A CN104600186 A CN 104600186A CN 201310526818 A CN201310526818 A CN 201310526818A CN 104600186 A CN104600186 A CN 104600186A
- Authority
- CN
- China
- Prior art keywords
- electrode
- manufacture method
- led encapsulation
- encapsulation body
- emitting diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 11
- 239000003292 glue Substances 0.000 claims abstract description 34
- 238000000034 method Methods 0.000 claims abstract description 17
- 238000005507 spraying Methods 0.000 claims abstract description 10
- 239000007921 spray Substances 0.000 claims abstract description 3
- 238000005538 encapsulation Methods 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 12
- 229920003023 plastic Polymers 0.000 claims description 8
- 239000004033 plastic Substances 0.000 claims description 8
- 239000000084 colloidal system Substances 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 239000000741 silica gel Substances 0.000 claims description 2
- 229910002027 silica gel Inorganic materials 0.000 claims description 2
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention provides a manufacturing method of an LED packaging body. The method comprises the steps of providing a first electrode, a second electrode and an LED; fixing the LED and the upper surfaces of the first electrode and the second electrode; forming clearances at intervals between the upper surface of the first electrode, the upper surface of the second electrode and the lower surface of the LED; providing a dispenser capable of laterally spraying glue; fully filling heat transfer glue into the dispenser; spraying glue to the clearances through the dispenser at a certain constant speed until the clearances are full of the heat transfer glue; quickly curing the heat transfer glue. According to the method, a lateral nozzle of the dispenser is to spray the heat transfer glue to the clearances in the fixed direction, so that the clearances can be fully and uniformly filled with the heat transfer glue at a certain speed, and as a result, the effect of consistent heat transfer speed on the whole LED can be achieved.
Description
Technical field
The present invention relates to a kind of semiconductor element, particularly a kind of manufacture method of LED encapsulation body.
Background technology
Traditional Light-Emitting Diode packaging body comprises electrode and is fixed on light-emitting diode above electrode by covering crystalline substance or eutectic mode.Space is there is between described light-emitting diode and electrode.Because the thermal conductivity coefficient of air is lower, easily cause light-emitting diode can not obtain quick heat radiating and service life reduction because of heat everywhere.For improving this defect, industry is typically employed in the side point heat-conducting glue of electrode, fills up this space in then flowing between light-emitting diode and electrode space through the passive type of flow of heat-conducting glue.But heat-conducting glue usually causes space heat-conducting glue skewness everywhere because flow velocity is everywhere different, and then affects the consistency of dispelling the heat of LED encapsulation body everywhere.
Summary of the invention
In view of this, be necessary to provide a kind of manufacture method that can ensure the conforming LED encapsulation body of LED heat radiating.
A manufacture method for LED encapsulation body, comprises the following steps:
First electrode, the second electrode, light-emitting diode are provided, the upper surface of fixing described light-emitting diode and described first electrode and the second electrode, between the upper surface of described first electrode and the second electrode and the lower surface of light-emitting diode, interval arranges and is formed with space;
There is provided one can side direction glue spraying point gum machine and fill heat-conducting glue by described point gum machine, then make described point gum machine towards described space with one setting speed at the uniform velocity glue spraying until heat-conducting glue fills up described space;
Heat-conducting glue described in rapid curing.
In the present invention, because spraying heat-conducting glue by the side direction nozzle orientation of point gum machine towards space, thus heat-conducting glue can be made the speed of a setting can to fill up space uniformly everywhere, and then can reach and make the light-emitting diode effect that heat transfer rate is consistent everywhere.
Accompanying drawing explanation
Fig. 1 to Fig. 4 is the schematic diagram of the LED encapsulation body manufacture process of present pre-ferred embodiments.
Main element symbol description
Following embodiment will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.
Embodiment
The manufacture method of the LED encapsulation body of present pre-ferred embodiments comprises the steps:
Refer to Fig. 1, an insulated substrate 10 be provided, lay respectively at insulated substrate 10 relatively both sides the first electrode 20, second electrode 30, be positioned on insulated substrate 10 and be electrically connected a light-emitting diode 40 of the first electrode 20, second electrode 30 and be fixed on the first electrode 20 and the second electrode 30 and around a reflector 50 of light-emitting diode 40.
The longitudinal section of described insulated substrate 10 is up-narrow and down-wide "T"-shaped, is made up of the insulating material with good heat conductive performance.
The medial extremity of described first electrode 20 and the second electrode 30 engages with the relative both sides of insulated substrate 10 respectively, and the upper surface of the first electrode 20 and the second electrode 30 and lower surface respectively with the upper surface of insulated substrate 10 and lower surface coplanar.
The lower surface of described light-emitting diode 40 is provided with two weld pads 41.Described two weld pads 41 are welded on the first electrode 20 and the second electrode 30 upper surface respectively thus make light-emitting diode 40 fixing and be electrically connected with the first electrode 20 and the second electrode 30 respectively.The bottom surface of light-emitting diode 40 and the upper surface interval of the first electrode 20 and the second electrode 30 arrange and form a space 43.
Described reflector 50 is cup empty in, and its bottom is fixed on the first electrode 20 and the second electrode 30 outer end away from light-emitting diode 40.The inner surface of described reflector 50, the upper surface of the first electrode 20, the upper surface of the second electrode 30 and the upper surface of insulated substrate 10 form a host cavity 51 jointly.
Refer to Fig. 2, there is provided one can side direction glue spraying point gum machine 60 and fill heat-conducting glue 63 by described point gum machine 60, then make described point gum machine 60 towards the space 43 between light-emitting diode 40 and the first electrode 20 and the second electrode 30 with the speed set at the uniform velocity glue spraying until heat-conducting glue 63 fills up described space 43.
In the present embodiment, the side of described point gum machine 60, vertically offer side to nozzle 61, heat-conducting glue 63 at the uniform velocity sprays in space 43 with the speed of a setting from described nozzle 61.Heat-conducting glue 63 can be elargol or silica gel.
Refer to Fig. 3, heat-conducting glue 63 described in rapid curing.
Refer to Fig. 4, some packaging plastics 70 be provided and make described packaging plastic 70 fill up described host cavity 51, then solidifying described packaging plastic 70.Described packaging plastic 70 can be single transparent colloid or is mixed with the transparent colloid of fluorescent material.
In the present invention, because spraying heat-conducting glue 63 by side direction nozzle 61 orientation of point gum machine 60 towards space 43, thus heat-conducting glue 63 can be made the speed of a setting can to fill up space 43 uniformly everywhere, and then can reach and make light-emitting diode 40 effect that heat transfer rate is consistent everywhere.
Be understandable that, for the person of ordinary skill of the art, other various corresponding change and distortion can be made by technical conceive according to the present invention, and all these change the protection range that all should belong to the claims in the present invention with distortion.
Claims (9)
1. a manufacture method for LED encapsulation body, comprises the following steps:
First electrode, the second electrode, light-emitting diode are provided, the upper surface of fixing described light-emitting diode and described first electrode and the second electrode, between the upper surface of described first electrode and the second electrode and the lower surface of light-emitting diode, interval arranges and is formed with space;
There is provided one can side direction glue spraying point gum machine and fill heat-conducting glue by described point gum machine, then make described point gum machine towards described space with one setting speed at the uniform velocity glue spraying until heat-conducting glue fills up described space;
Heat-conducting glue described in rapid curing.
2. the manufacture method of LED encapsulation body as claimed in claim 1, is characterized in that: the side of described point gum machine, vertically offer side to nozzle, heat-conducting glue at the uniform velocity sprays in space with the speed of a setting from described nozzle.
3. the manufacture method of LED encapsulation body as claimed in claim 1, is characterized in that: described heat-conducting glue can be elargol or silica gel.
4. the manufacture method of LED encapsulation body as claimed in claim 1, it is characterized in that: also comprise the insulated substrate between the first electrode and the second electrode, described light-emitting diode to be positioned at above described insulated substrate and and described insulated substrate interval arrange.
5. the manufacture method of LED encapsulation body as claimed in claim 4, is characterized in that: the medial extremity of described first electrode and the second electrode engages with the relative both sides of insulated substrate respectively.
6. the manufacture method of LED encapsulation body as claimed in claim 5, is characterized in that: the upper surface of described first electrode and the second electrode and lower surface respectively with the upper surface of insulated substrate and lower surface coplanar.
7. the manufacture method of LED encapsulation body as claimed in claim 1, is characterized in that: provide reflector empty in, and described reflector is fixed on the first electrode and the second electrode away from the outer end of light-emitting diode and encloses light-emitting diode.
8. the manufacture method of LED encapsulation body as claimed in claim 7, is characterized in that: provide some packaging plastics and make described packaging plastic fill up described reflector, then solidifying described packaging plastic.
9. the manufacture method of LED encapsulation body as claimed in claim 8, is characterized in that: described packaging plastic is single transparent colloid or the transparent colloid being mixed with fluorescent material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310526818.2A CN104600186A (en) | 2013-10-31 | 2013-10-31 | Manufacturing method of LED packaging body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310526818.2A CN104600186A (en) | 2013-10-31 | 2013-10-31 | Manufacturing method of LED packaging body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104600186A true CN104600186A (en) | 2015-05-06 |
Family
ID=53125824
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310526818.2A Pending CN104600186A (en) | 2013-10-31 | 2013-10-31 | Manufacturing method of LED packaging body |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104600186A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102084505A (en) * | 2008-03-17 | 2011-06-01 | 皇家飞利浦电子股份有限公司 | Underfill process for flip-chip LEDs |
| CN102354724A (en) * | 2010-10-15 | 2012-02-15 | 广东昭信灯具有限公司 | LED (Light Emitting Diode) inversion structure and preparation method thereof |
| CN103187512A (en) * | 2012-01-03 | 2013-07-03 | Lg伊诺特有限公司 | Light emitting device |
| CN103367557A (en) * | 2012-03-28 | 2013-10-23 | 刘胜 | Manufacturing method of light emitting diode wafer which emits white light directly |
-
2013
- 2013-10-31 CN CN201310526818.2A patent/CN104600186A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102084505A (en) * | 2008-03-17 | 2011-06-01 | 皇家飞利浦电子股份有限公司 | Underfill process for flip-chip LEDs |
| CN102354724A (en) * | 2010-10-15 | 2012-02-15 | 广东昭信灯具有限公司 | LED (Light Emitting Diode) inversion structure and preparation method thereof |
| CN103187512A (en) * | 2012-01-03 | 2013-07-03 | Lg伊诺特有限公司 | Light emitting device |
| CN103367557A (en) * | 2012-03-28 | 2013-10-23 | 刘胜 | Manufacturing method of light emitting diode wafer which emits white light directly |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150506 |