CN104592923A - 一种紫外光引发的可延迟固化的单组份环氧胶黏剂及制备方法 - Google Patents
一种紫外光引发的可延迟固化的单组份环氧胶黏剂及制备方法 Download PDFInfo
- Publication number
- CN104592923A CN104592923A CN201510006072.1A CN201510006072A CN104592923A CN 104592923 A CN104592923 A CN 104592923A CN 201510006072 A CN201510006072 A CN 201510006072A CN 104592923 A CN104592923 A CN 104592923A
- Authority
- CN
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- Prior art keywords
- ammonium salt
- quaternary ammonium
- epoxy resin
- photobase generator
- distilled water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000002360 preparation method Methods 0.000 title claims description 7
- 229920006332 epoxy adhesive Polymers 0.000 title abstract description 5
- 239000003822 epoxy resin Substances 0.000 claims abstract description 25
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 25
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims abstract description 17
- 238000001723 curing Methods 0.000 claims abstract description 15
- -1 sodium tetraphenylborate Chemical compound 0.000 claims abstract description 15
- 239000007788 liquid Substances 0.000 claims abstract description 11
- 239000012153 distilled water Substances 0.000 claims abstract description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 9
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims abstract description 7
- 238000006243 chemical reaction Methods 0.000 claims abstract description 5
- 238000001035 drying Methods 0.000 claims abstract description 5
- 238000005349 anion exchange Methods 0.000 claims abstract description 4
- 239000002994 raw material Substances 0.000 claims abstract description 3
- 238000003756 stirring Methods 0.000 claims description 19
- 150000003242 quaternary ammonium salts Chemical class 0.000 claims description 16
- 239000003795 chemical substances by application Substances 0.000 claims description 13
- 239000004593 Epoxy Substances 0.000 claims description 9
- 239000011230 binding agent Substances 0.000 claims description 8
- 229920003048 styrene butadiene rubber Polymers 0.000 claims description 8
- 229920000459 Nitrile rubber Polymers 0.000 claims description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Polymers C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 7
- 238000012986 modification Methods 0.000 claims description 7
- 230000004048 modification Effects 0.000 claims description 7
- 239000002131 composite material Substances 0.000 claims description 6
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical class CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 claims description 5
- 239000004925 Acrylic resin Substances 0.000 claims description 5
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 4
- 238000012545 processing Methods 0.000 claims description 3
- 238000011175 product filtration Methods 0.000 claims description 3
- 238000001953 recrystallisation Methods 0.000 claims description 3
- DMYOHQBLOZMDLP-UHFFFAOYSA-N 1-[2-(2-hydroxy-3-piperidin-1-ylpropoxy)phenyl]-3-phenylpropan-1-one Chemical compound C1CCCCN1CC(O)COC1=CC=CC=C1C(=O)CCC1=CC=CC=C1 DMYOHQBLOZMDLP-UHFFFAOYSA-N 0.000 claims description 2
- MNAHQWDCXOHBHK-UHFFFAOYSA-N 1-phenylpropane-1,1-diol Chemical compound CCC(O)(O)C1=CC=CC=C1 MNAHQWDCXOHBHK-UHFFFAOYSA-N 0.000 claims description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 2
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 2
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 2
- 238000002156 mixing Methods 0.000 abstract description 7
- 239000000463 material Substances 0.000 abstract description 6
- 239000000853 adhesive Substances 0.000 abstract description 5
- 230000001070 adhesive effect Effects 0.000 abstract description 5
- 239000013078 crystal Substances 0.000 abstract 3
- 239000000126 substance Substances 0.000 abstract 3
- LIGACIXOYTUXAW-UHFFFAOYSA-N phenacyl bromide Chemical compound BrCC(=O)C1=CC=CC=C1 LIGACIXOYTUXAW-UHFFFAOYSA-N 0.000 abstract 2
- 230000003111 delayed effect Effects 0.000 abstract 1
- 239000000945 filler Substances 0.000 abstract 1
- 238000001914 filtration Methods 0.000 abstract 1
- 238000013007 heat curing Methods 0.000 abstract 1
- 239000012745 toughening agent Substances 0.000 abstract 1
- 238000005406 washing Methods 0.000 abstract 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 14
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 10
- 239000004842 bisphenol F epoxy resin Substances 0.000 description 8
- 238000007599 discharging Methods 0.000 description 8
- 229910052681 coesite Inorganic materials 0.000 description 7
- 229910052906 cristobalite Inorganic materials 0.000 description 7
- 239000000377 silicon dioxide Substances 0.000 description 7
- 235000012239 silicon dioxide Nutrition 0.000 description 7
- 229910052682 stishovite Inorganic materials 0.000 description 7
- 229910052905 tridymite Inorganic materials 0.000 description 7
- 238000004026 adhesive bonding Methods 0.000 description 6
- 238000006116 polymerization reaction Methods 0.000 description 5
- 238000012360 testing method Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000004513 sizing Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000011017 operating method Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
Abstract
Description
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510006072.1A CN104592923B (zh) | 2015-01-07 | 2015-01-07 | 一种紫外光引发的可延迟固化的单组份环氧胶黏剂及制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201510006072.1A CN104592923B (zh) | 2015-01-07 | 2015-01-07 | 一种紫外光引发的可延迟固化的单组份环氧胶黏剂及制备方法 |
Publications (2)
Publication Number | Publication Date |
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CN104592923A true CN104592923A (zh) | 2015-05-06 |
CN104592923B CN104592923B (zh) | 2016-05-11 |
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CN201510006072.1A Active CN104592923B (zh) | 2015-01-07 | 2015-01-07 | 一种紫外光引发的可延迟固化的单组份环氧胶黏剂及制备方法 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107880833A (zh) * | 2017-12-05 | 2018-04-06 | 烟台德邦科技有限公司 | 一种uv热双固化环氧胶粘剂及其制备方法 |
CN108130029A (zh) * | 2017-12-22 | 2018-06-08 | 烟台德邦科技有限公司 | 一种uv延迟固化的导电银胶及其制备方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101679829A (zh) * | 2007-06-14 | 2010-03-24 | 积水化学工业株式会社 | 光固化型粘合剂组合物 |
-
2015
- 2015-01-07 CN CN201510006072.1A patent/CN104592923B/zh active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101679829A (zh) * | 2007-06-14 | 2010-03-24 | 积水化学工业株式会社 | 光固化型粘合剂组合物 |
Non-Patent Citations (2)
Title |
---|
王静等: "季铵盐型光潜碱的合成及光化学特性研究", 《信息记录材料》 * |
许文杰等: "光敏性季铵盐的合成与性能研究", 《功能高分子学报》 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107880833A (zh) * | 2017-12-05 | 2018-04-06 | 烟台德邦科技有限公司 | 一种uv热双固化环氧胶粘剂及其制备方法 |
CN108130029A (zh) * | 2017-12-22 | 2018-06-08 | 烟台德邦科技有限公司 | 一种uv延迟固化的导电银胶及其制备方法 |
Also Published As
Publication number | Publication date |
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CN104592923B (zh) | 2016-05-11 |
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Address after: 264000 workshop No. 12, No. 3 middle Wolong Road, Zhifu District, Shandong, Yantai Applicant after: YANTAI SEAYU NEW MATERIALS CORP., LTD. Address before: 264000 workshop No. 12, No. 3 middle Wolong Road, Zhifu District, Shandong, Yantai Applicant before: Yantai Seayu Electronic Co., Ltd. |
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Free format text: CORRECT: APPLICANT; FROM: YANTAI SEAYU ELECTRONIC CO., LTD. TO: YANTAI XINYOU NEW MATERIAL CO., LTD. |
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Address after: 264000 No. 12-2, Wolong Middle Road, Yantai City, Shandong Province Patentee after: YANTAI XINYOU NEW MATERIAL Co.,Ltd. Address before: 264000 plant 3, No. 12, Wolong Middle Road, Zhifu District, Yantai City, Shandong Province Patentee before: YANTAI SEAYU NEW MATERIALS Corp.,Ltd. |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: The invention relates to a UV initiated one component epoxy adhesive which can delay curing and a preparation method thereof Effective date of registration: 20220225 Granted publication date: 20160511 Pledgee: Shanghai Pudong Development Bank Limited by Share Ltd. Yantai branch Pledgor: YANTAI XINYOU NEW MATERIAL Co.,Ltd. Registration number: Y2022980001866 |