CN104589195A - Processing method of sapphire window protecting screen of 3D electronic product - Google Patents
Processing method of sapphire window protecting screen of 3D electronic product Download PDFInfo
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- CN104589195A CN104589195A CN201510077171.9A CN201510077171A CN104589195A CN 104589195 A CN104589195 A CN 104589195A CN 201510077171 A CN201510077171 A CN 201510077171A CN 104589195 A CN104589195 A CN 104589195A
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- Prior art keywords
- sapphire substrate
- sapphire
- fixture
- polishing
- brush
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- 229910052594 sapphire Inorganic materials 0.000 title claims abstract description 141
- 239000010980 sapphire Substances 0.000 title claims abstract description 141
- 238000003672 processing method Methods 0.000 title claims abstract description 24
- 239000000758 substrate Substances 0.000 claims abstract description 100
- 238000005498 polishing Methods 0.000 claims abstract description 55
- 238000012545 processing Methods 0.000 claims abstract description 20
- 239000013078 crystal Substances 0.000 claims abstract description 13
- 238000005520 cutting process Methods 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims description 15
- 239000002173 cutting fluid Substances 0.000 claims description 14
- 238000003698 laser cutting Methods 0.000 claims description 14
- 229910001651 emery Inorganic materials 0.000 claims description 13
- 229920000742 Cotton Polymers 0.000 claims description 9
- 238000002347 injection Methods 0.000 claims description 6
- 239000007924 injection Substances 0.000 claims description 6
- 230000002045 lasting effect Effects 0.000 claims description 6
- 230000001360 synchronised effect Effects 0.000 claims description 6
- 238000004140 cleaning Methods 0.000 claims description 3
- 239000012530 fluid Substances 0.000 claims description 3
- 229910003460 diamond Inorganic materials 0.000 abstract description 2
- 239000010432 diamond Substances 0.000 abstract description 2
- 238000001035 drying Methods 0.000 abstract 1
- 230000007774 longterm Effects 0.000 abstract 1
- 238000005406 washing Methods 0.000 abstract 1
- 239000000047 product Substances 0.000 description 17
- 238000003754 machining Methods 0.000 description 7
- 238000007517 polishing process Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 206010044565 Tremor Diseases 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- -1 local Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/005—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents using brushes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
Abstract
The invention provides a processing method of a sapphire window protecting screen of a 3D electronic product, belongs to the technical field of window protecting screen processing, and solves the technical problems that the speed is slow, and the precision can be affected due to great heat generated in long-term processing as in a conventional sapphire window protecting screen processing method, a grinding wheel or diamond cutter is adopted to cut. The processing method of the sapphire window protecting screen comprises the following steps: firstly, cutting a sapphire crystal block into a sapphire substrate with a 3D convex and concave shape, secondly, putting the sapphire substrate into a frame-shaped clamp, positioning the sapphire substrate and the clamp, respectively polishing the upper surface and the lower surface of the sapphire substrate by using a first polishing brush and a second polishing brush, finally taking down the clamp from a workpiece rotating disc, washing, and drying. The sapphire substrate can be synchronously polished in a vertical plane by using the first polishing brush and the second polishing brush, the sapphire window protecting screen can be sufficiently processed at a time, and the polishing efficiency can be improved.
Description
Technical field
The invention belongs to windows be protected screen processing technique field, relate to a kind of processing method of sapphire windows be protected screen of 3D electronic product.
Background technology
Along with developing rapidly of science and technology, at such as mobile phone, palm PC, automatic navigator, the electronic products such as notebook computer apply touch-screen widely, along with developing rapidly of science and technology, at such as mobile phone, palm PC, automatic navigator, the electronic products such as notebook computer apply touch-screen widely, more common glass, sapphire crystal has excellent optical property, mechanical performance and chemical stability, intensity is high, hardness is large, resistance to erosion, can work, thus be widely used in infrared military installation under the mal-condition close to 2000 degree of high temperature, the window material of satellite spatial technology high intensity laser beam, the crystal structure of its uniqueness, excellent mechanical property, good thermal property just sapphire crystal becomes the semiconductor light-emitting-diode (LED) of practical application, the backing material that large scale integrated circuit SO1 and SOS and superconducting nano mechanism film etc. are ideal, effectively raises the damage resistant ability as protection screen and mechanical properties strength.Sapphire can make 3D class windows be protected screen.The burning hot listing of various 3D series products, touch-screen industry is also like this, gradually to 3D future development, therefore we are for the glossing of 3D product, have developed the approach of series of new especially, for the surface finish to 3D product, improve traditional accurately machined limitation of 2D/2.5D product.
The finishing method of sapphire windows be protected screen generally all adopts emery wheel or diamond cutter cutting, and speed is slow, and long-time processing heating height easily affects precision.
Summary of the invention
The present invention is directed to the problems referred to above that existing technology exists; the processing method that a kind of sapphire windows be protected of 3D electronic product shields is provided; technical problem to be solved by this invention is: how to realize carrying out disposable polishing to the sapphire windows be protected screen of 3D shape, thus improve polishing efficiency.
Object of the present invention realizes by following technical proposal:
A processing method for the sapphire windows be protected screen of 3D electronic product, sapphire windows be protected screen comprises transparent sapphire substrate, and it is characterized in that, this processing method comprises the steps:
A, preparatory processing: sapphire crystal block is cut into the sapphire substrate with 3D concaveconvex shape;
B, clamping: the fixture that a frame shaped is set, this clamp edges has and by the Access Division of sapphire substrate edge local, sapphire substrate can be loaded in this fixture and location both making;
C, polishing: the fixture that sapphire substrate is housed is put on the working rotary table of a level, this fixture is located mutually with working rotary table, this working rotary table has through hole, when after fixture and working rotary table location, described sapphire substrate and through hole are in just to position, described via area is greater than the area of described sapphire substrate maximum side, the first polish brush is provided with above working rotary table, the second polish brush is provided with in the below of working rotary table, described first polish brush and the second polish brush are vertically in just to position, described first polish brush is by carrying out polishing from transferring to the upper surface of sapphire substrate, described second polish brush passes described through hole and carries out polishing by rotation to the lower surface of sapphire substrate, described first polish brush and the second polish brush synchronously carry out polishing,
D, blanking: taken off from working rotary table by fixture, put into cleaning fluid by fixture and clean, and taken out by polished sapphire substrate and dry from fixture.
Its principle is as follows: the sapphire substrate of 3D shape mainly refers to this sapphire substrate surface irregularity or shape is not tabular.Jig Design become frame-shaped that the upper and lower surface of sapphire substrate all can be polished simultaneously, working rotary table is provided with through hole and makes the second polish brush can carry out polishing to the lower surface of sapphire substrate, first polish brush and the second polish brush carry out synchronous polishing to sapphire substrate and can not only disposable processing put in place in vertical plane, improve the efficiency of polishing, sapphire substrate upper and lower surface stress balance can also be made in polishing process, make sapphire substrate microcosmic be not easy to tremble in polishing process, indirectly can improve the quality of polishing.
In the processing method that the sapphire windows be protected of above-mentioned a kind of 3D electronic product shields; the first polish brush in described step c and the second polish brush include a brush; described brush end face is fixed with the brush body that some bundles parallel, and the length of each brush body is all not identical.Brush body length is not identical can make brush finish form rough structure, and the sapphire substrate of rough brush finish and 3D shape matches, and there will not be polishing dead angle, improves the quality after polishing and polishing velocity.
In the processing method that the sapphire windows be protected of above-mentioned a kind of 3D electronic product shields, in described step c, each working rotary table is placed with the fixture that at least three are equipped with sapphire substrate, three fixtures are uniformly distributed along the circumference of working rotary table, the first polish brush and the second polish brush is first made synchronously to carry out polishing to the sapphire substrate on one of them fixture, then the sapphire substrate on the first polish brush and the next fixture of the synchronous polishing of the second polish brush is made by rotation work rotating disk, take off this fixture at once after sapphire substrate polishing on a fixture completes and change the fixture that non-polishing sapphire substrate is housed.Multiple fixture can carry out wheel and turn, and goes round and begins again, and can realize continuous print processing, thus improve the efficiency of polishing.
In the processing method that the sapphire windows be protected of above-mentioned a kind of 3D electronic product shields, first the sapphire crystal block of bulk is put into the enterprising line cutting of Linear cut machine in described step a, by Linear cut, sapphire crystal block is cut into the sapphire substrate of rectangle; Sapphire substrate is put on laser cutting machine and carry out laser cutting, by laser, sapphire substrate is cut into 3D concaveconvex shape, put on grinding machine by the sapphire substrate after roughing, adopt emery cutter to carry out chamfering to the edge of sapphire substrate, chamfer dimesion is C0.15mm-0.2mm; Adopt the outline of emery cutter to the sapphire substrate after chamfering to refine, in lapping process, inject cutting fluid, keep temperature to be 30 DEG C-60 DEG C by lasting injection cutting fluid.Adopt Linear cut mode can make full use of the benefit that linear cutter cost is low, process velocity is fast to the processing of blank, evade the problem of Linear cut precision deficiency.Laser is adopted to carry out to sapphire substrate the process velocity that roughing can make full use of laser, although Laser Processing cost compare is high, but the accuracy of laser is higher can cutting sapphire fast, and 3D labyrinth needs this high-precision cutting mode of laser cutting to carry out accurate machining.The edge of sapphire substrate needs chamfering, because laser is not easy chamfering, emery cutter is adopted to carry out chamfering more steady, and make the process for sapphire-based panel edges after chamfering not sharp, security is good, chamfer dimesion be C0.15mm-0.2mm also through meticulously calculating, the chamfering of this size not only can improve security and attractive in appearance, and can not affect the safe distance of through hole and sapphire substrate.To cut well rear surplus little due to precision for laser cutting, the scrap rate of emery cutter is decreased when making accurately machined, because the cutting speed of emery cutter is much slower than laser cutting, therefore laser cutting surplus can substantially increase the speed of overall processing less, machining control temperature can improve accuracy, ensures the quality of finished product.
In the processing method that the sapphire windows be protected of above-mentioned a kind of 3D electronic product shields, in described step a, in chamfer process, inject cutting fluid, keep temperature to be 30 DEG C-60 DEG C by lasting injection cutting fluid.A large amount of heats can be produced in the process that chamfering is cut, adopt cutting fluid to keep suitable temperature that machining accuracy can be made to improve.
In the processing method that the sapphire windows be protected of above-mentioned a kind of 3D electronic product shields, in described step b, the Access Division of fixture is L-shaped, is equipped with foamed cotton layer between described Access Division and sapphire substrate, and the thickness of described foamed cotton layer is 0.5mm-1mm.Can protect the edge of sapphire substrate after being provided with foamed cotton layer, and make it in polishing processing, reduce vibrations, improve the quality of polishing.
Compared with prior art, advantage of the present invention is as follows:
1, this processing method makes the first polish brush and the second polish brush carry out synchronous polishing to sapphire substrate in vertical plane, can not only disposable processing put in place, improve the efficiency of polishing, sapphire substrate upper and lower surface stress balance can also be made in polishing process, make sapphire substrate microcosmic be not easy to tremble in polishing process, indirectly can improve the quality of polishing.
Accompanying drawing explanation
Fig. 1 is the structural representation of working rotary table and fixture.
Fig. 2 is the machining state schematic diagram of this processing method.
In figure, 1 sapphire substrate; 2 fixtures; 3 working rotary tables; 4 first polish brushes; 5 second polish brushes; 6 foamed cotton layers; 7 brushs; 8 brush bodies.
Detailed description of the invention
Be below specific embodiments of the invention and by reference to the accompanying drawings, technical scheme of the present invention is further described, but the present invention be not limited to these embodiments.
As depicted in figs. 1 and 2, sapphire windows be protected screen comprises transparent sapphire substrate 1, and this processing method comprises the steps:
A, preparatory processing: sapphire crystal block is cut into the sapphire substrate 1 with 3D concaveconvex shape; First the sapphire crystal block of bulk is put into the enterprising line cutting of Linear cut machine in step a, by Linear cut, sapphire crystal block is cut into the sapphire substrate 1 of rectangle; Sapphire substrate 1 is put on laser cutting machine and carry out laser cutting, by laser, sapphire substrate 1 is cut into 3D concaveconvex shape, sapphire substrate 1 after roughing is put on grinding machine, adopt emery cutter to carry out chamfering to the edge of sapphire substrate 1, chamfer dimesion is C0.15mm-0.2mm; Adopt the outline of emery cutter to the sapphire substrate 1 after chamfering to refine, in lapping process, inject cutting fluid, keep temperature to be 30 DEG C-60 DEG C by lasting injection cutting fluid; Adopt Linear cut mode can make full use of the benefit that linear cutter cost is low, process velocity is fast to the processing of blank, evade the problem of Linear cut precision deficiency.Laser is adopted to carry out to sapphire substrate 1 process velocity that roughing can make full use of laser, although Laser Processing cost compare is high, but the accuracy of laser is higher can cutting sapphire fast, and 3D labyrinth needs this high-precision cutting mode of laser cutting to carry out accurate machining.As depicted in figs. 1 and 2, the edge of sapphire substrate 1 needs chamfering, because laser is not easy chamfering, emery cutter is adopted to carry out chamfering more steady, and making the sapphire substrate after chamfering 1 edge not sharp, security is good, and chamfer dimesion is that C0.15mm-0.2mm is also through meticulously calculating, the chamfering of this size not only can improve security and attractive in appearance, and can not affect the safe distance of through hole and sapphire substrate 1.To cut well rear surplus little due to precision for laser cutting, the scrap rate of emery cutter is decreased when making accurately machined, because the cutting speed of emery cutter is much slower than laser cutting, therefore laser cutting surplus can substantially increase the speed of overall processing less, machining control temperature can improve accuracy, ensures the quality of finished product.In chamfer process, inject cutting fluid in step a, keep temperature to be 30 DEG C-60 DEG C by lasting injection cutting fluid.A large amount of heats can be produced in the process that chamfering is cut, adopt cutting fluid to keep suitable temperature that machining accuracy can be made to improve.
B, clamping: the fixture 2 that a frame shaped is set, this fixture 2 edge has and by the Access Division of sapphire substrate 1 edge local, sapphire substrate 1 can be loaded in this fixture 2 and location both making; In step b, the Access Division of fixture 2 is L-shaped, is equipped with foamed cotton layer 6 between Access Division and sapphire substrate 1, and the thickness of foamed cotton layer 6 is 0.5mm-1mm.Can protect the edge of sapphire substrate 1 after being provided with foamed cotton layer 6, and make it in polishing processing, reduce vibrations, improve the quality of polishing.
C, polishing: the fixture 2 that sapphire substrate 1 is housed is put on the working rotary table 3 of a level, this fixture 2 is located mutually with working rotary table 3, this working rotary table 3 has through hole, after fixture 2 and working rotary table 3 are located, sapphire substrate 1 and through hole are in just to position, via area is greater than the area of sapphire substrate 1 maximum side, the first polish brush 4 is provided with above working rotary table 3, the second polish brush 5 is provided with in the below of working rotary table 3, first polish brush 4 and the second polish brush 5 are vertically in just to position, first polish brush 4 is by carrying out polishing from transferring to the upper surface of sapphire substrate 1, second polish brush 5 passes through hole and carries out polishing by rotation to the lower surface of sapphire substrate 1, first polish brush 4 and the second polish brush 5 synchronously carry out polishing, the first polish brush 4 in step c and the second polish brush 5 include a brush 7, and brush 7 end face is fixed with the brush body 8 that some bundles parallel, and the length of each brush body 8 is all not identical.Brush body 8 length is not identical can make brush finish form rough structure, and the sapphire substrate 1 of rough brush finish and 3D shape matches, and there will not be polishing dead angle, improves the quality after polishing and polishing velocity.As depicted in figs. 1 and 2, in step c, each working rotary table 3 is placed with the fixture 2 that at least three are equipped with sapphire substrate 1, three fixtures 2 are uniformly distributed along the circumference of working rotary table 3, the first polish brush 4 and the second polish brush 5 is first made synchronously to carry out polishing to the sapphire substrate 1 on one of them fixture 2, then the sapphire substrate 1 on the first polish brush 4 and the next fixture 2 of the synchronous polishing of the second polish brush 5 is made by rotation work rotating disk 3, take off this fixture 2 at once after sapphire substrate 1 polishing on a fixture 2 completes and change the fixture 2 that non-polishing sapphire substrate 1 is housed.Multiple fixture 2 can carry out wheel and turn, and goes round and begins again, and can realize continuous print processing, thus improve the efficiency of polishing.
D, blanking: taken off from working rotary table 3 by fixture 2, put into cleaning fluid by fixture 2 and clean, and taken out by polished sapphire substrate 1 and dry from fixture 2.As depicted in figs. 1 and 2, the sapphire substrate 1 of 3D shape mainly refers to this sapphire substrate 1 surface irregularity or shape is not tabular.Fixture 2 being designed to frame-shaped makes the upper and lower surface of sapphire substrate 1 all can be polished simultaneously, working rotary table 3 is provided with through hole and makes the second polish brush 5 can carry out polishing to the lower surface of sapphire substrate 1, first polish brush 4 and the second polish brush 5 carry out synchronous polishing to sapphire substrate 1 and can not only disposable processing put in place in vertical plane, improve the efficiency of polishing, sapphire substrate 1 upper and lower surface stress balance can also be made in polishing process, make sapphire substrate 1 microcosmic be not easy to tremble in polishing process, indirectly can improve the quality of polishing.
Specific embodiment described herein is only to the explanation for example of the present invention's spirit.Those skilled in the art can make various amendment or supplement or adopt similar mode to substitute to described specific embodiment, but can't depart from spirit of the present invention or surmount the scope that appended claims defines.
Claims (6)
1. a processing method for the sapphire windows be protected screen of 3D electronic product, sapphire windows be protected screen comprises transparent sapphire substrate (1), and it is characterized in that, this processing method comprises the steps:
A, preparatory processing: sapphire crystal block is cut into the sapphire substrate (1) with 3D concaveconvex shape;
B, clamping: the fixture (2) that a frame shaped is set, this fixture (2) edge has and by the Access Division of sapphire substrate (1) edge local, sapphire substrate (1) can be loaded in this fixture (2) and location both making;
C, polishing: the fixture (2) that sapphire substrate (1) is housed is put on the working rotary table (3) of a level, this fixture (2) is located mutually with working rotary table (3), (3) have through hole to this working rotary table, when after fixture (2) and working rotary table (3) location, described sapphire substrate (1) and through hole are in just to position, described via area is greater than the area of described sapphire substrate (1) maximum side, the first polish brush (4) is provided with in the top of working rotary table (3), the second polish brush (5) is provided with in the below of working rotary table (3), described first polish brush (4) and the second polish brush (5) are vertically in just to position, described first polish brush (4) is by carrying out polishing from transferring to the upper surface of sapphire substrate (1), described second polish brush (5) is through described through hole and carry out polishing by the lower surface of rotation to sapphire substrate (1), described first polish brush (4) and the second polish brush (5) synchronously carry out polishing,
D, blanking: taken off from working rotary table (3) by fixture (2), put into cleaning fluid by fixture (2) and clean, and taken out by polished sapphire substrate (1) and dry from fixture (2).
2. the processing method of the sapphire windows be protected screen of a kind of 3D electronic product according to claim 1; it is characterized in that; the first polish brush (4) in described step c and the second polish brush (5) include a brush (7); described brush (7) end face is fixed with the brush body (8) that some bundles parallel, and the length of each brush body (8) is all not identical.
3. the processing method of the sapphire windows be protected screen of a kind of 3D electronic product according to claim 1 and 2, it is characterized in that, in described step c, each working rotary table (3) is placed with the fixture (2) that at least three are equipped with sapphire substrate (1), three fixtures (2) are uniformly distributed along the circumference of working rotary table (3), the first polish brush (4) and the second polish brush (5) is first made synchronously to carry out polishing to the sapphire substrate (1) on one of them fixture (2), then the sapphire substrate (1) on the first polish brush (4) and the next fixture (2) of the synchronous polishing of the second polish brush (5) is made by rotation work rotating disk (3), take off this fixture (2) at once after sapphire substrate (1) polishing on a fixture (2) completes and change the fixture (2) that non-polishing sapphire substrate (1) is housed.
4. the processing method of the sapphire windows be protected screen of a kind of 3D electronic product according to claim 3, it is characterized in that, first the sapphire crystal block of bulk is put into the enterprising line cutting of Linear cut machine in described step a, by Linear cut, sapphire crystal block is cut into the sapphire substrate (1) of rectangle; Sapphire substrate (1) is put on laser cutting machine and carries out laser cutting, by laser, sapphire substrate (1) is cut into 3D concaveconvex shape, sapphire substrate (1) after roughing is put on grinding machine, adopt the edge of emery cutter to sapphire substrate (1) to carry out chamfering, chamfer dimesion is C0.15mm-0.2mm; Adopt the outline of emery cutter to the sapphire substrate (1) after chamfering to refine, in lapping process, inject cutting fluid, keep temperature to be 30 DEG C-60 DEG C by lasting injection cutting fluid.
5. the processing method of the sapphire windows be protected screen of a kind of 3D electronic product according to claim 4, is characterized in that, inject cutting fluid in described step a in chamfer process, keep temperature to be 30 DEG C-60 DEG C by lasting injection cutting fluid.
6. the processing method of the sapphire windows be protected screen of a kind of 3D electronic product according to claim 1 and 2; it is characterized in that; in described step b, the Access Division of fixture (2) is L-shaped; be equipped with foamed cotton layer (6) between described Access Division and sapphire substrate (1), the thickness of described foamed cotton layer (6) is 0.5mm-1mm.
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| CN201510077171.9A CN104589195B (en) | 2015-02-12 | 2015-02-12 | A kind of processing method of the sapphire windows be protected screen of 3D electronic products |
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| CN201510077171.9A CN104589195B (en) | 2015-02-12 | 2015-02-12 | A kind of processing method of the sapphire windows be protected screen of 3D electronic products |
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| CN105150394A (en) * | 2015-06-18 | 2015-12-16 | 江苏苏创光学器材有限公司 | Production method for sapphire touch screen panel |
| CN106392854A (en) * | 2015-07-29 | 2017-02-15 | 蓝思科技（长沙）有限公司 | Device and system used for sapphire product appearance polishing and polishing method |
| CN106466796A (en) * | 2015-08-21 | 2017-03-01 | 蓝思科技（长沙）有限公司 | A kind of manufacture method of 3D sapphire panel and sapphire panel |
| CN108237441A (en) * | 2016-12-23 | 2018-07-03 | 蓝思科技（长沙）有限公司 | The processing method of 3D curve ceramic thin slices and its 3D curve ceramic thin slices of acquisition |
| CN108262679A (en) * | 2018-01-19 | 2018-07-10 | 厦门祐尼三的新材料科技有限公司 | 3D sapphires cover board, processing method and electronic equipment |
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