CN103481124B - A kind of diamond lap method based on complicated track - Google Patents
A kind of diamond lap method based on complicated track Download PDFInfo
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- CN103481124B CN103481124B CN201310426422.0A CN201310426422A CN103481124B CN 103481124 B CN103481124 B CN 103481124B CN 201310426422 A CN201310426422 A CN 201310426422A CN 103481124 B CN103481124 B CN 103481124B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
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Abstract
Based on a diamond lap method for complicated track, belong to Ultra-precision machining technical field, relate to a kind of diamond lap method.Described method comprises the steps: that (1) arranges suitable grinding mechanism size; (2) placement location of diamond workpiece grinding is calculated; (3) check the placement location calculated whether can ensure that in process of lapping, diamond workpiece contacts with abrasive disc all the time and do not depart from, if can not ensure, return step (2), if can ensure, continue next step; (4) adopt optimized algorithm to make the direction of grinding rate in ground flat, farthest do the even variation of 360 degree, calculate the rotating speed of each axle of grinding mechanism thus, with the rotating speed calculated, attrition process is carried out to diamond surface of the work.The present invention does not need the easy mill direction finding diamond workpiece, and can grind lower surface roughness value, and Ra value can reach about 1nm.
Description
Technical field
The invention belongs to Ultra-precision machining technical field, relate to a kind of diamond lap method.
Background technology
After World War II in order to adapt to the needs of the techniques such as wrist-watch precision component, light gadget and jewellery carving, diamond cutter starts to have developed.Its manufacturing process just originates from the grinding and polishing technology of diamond jewelry.As far back as late 1950s, for adapting to the growth requirement of the sophisticated technologies such as space flight, first the U.S. developed diamond cutter ultra precision cutting technology, namely " SPDT(Single Point Diamond Turning) technology ", the feature of this technology adopts the direct controlled working profile of numerical control method and surface roughness exactly.
In Ultra-precision machining field, the precision index of diamond cutter mainly contains---and surface roughness, cutting edge sharpness, also have the requirement of circular arc degree and linearity in addition for the diamond cutter of Circular Nose Cutting Edge and straight line sword.The importance of surface roughness is the tribological property improved between cutter and workpiece, especially for Ultra-precision Turning.The low surface roughness frictional resistance that can reduce between chip and cutter is conducive to the flowing of cutting and reduces the adhesive wear of tool surface simultaneously, improves cutting wear.
Current existing diamond cutter tool dresser process also has ion beam sputter method, thermo-chemical polishing method, not damaged chemical mechanical polishing method, vacuum plasma chemical polishing, chemical Aided Machine polishing and polishing method and laser ablation method etc. except mechanical milling method.Ion beam sputter method needs expensive equipment, and working (machining) efficiency is lower; Thermo-chemical polishing method complex process, need peripheral auxiliary equipment, working (machining) efficiency is not high yet; Not damaged chemical mechanical polishing method working (machining) efficiency is also extremely low, an about removal per minute atomic layer; Vacuum plasma chemical polishing also exists the low problem of working (machining) efficiency equally; Chemistry Aided Machine polishing and polishing method equipment needed thereby costliness, and technique is also more complicated; Laser ablation method due to the roughness of diamond surface after its ablation higher, so be only applicable to roughing.The easy method of the high efficiency low cost of diamond cutter is processed in mechanical lapping at present.But this method needs to find the direction that diamond waits to grind easily grinding on the surface, and Grinding Quality relies on more to experience.
Summary of the invention
The object of the present invention is to provide a kind of diamond lap method based on complicated track, to save the operation that natural uni-crystal diamond mechanical lapping initially needs to find easy grinding direction, and further improve lapped face roughness, reduce and artificial experience is relied on.
As shown in Figure 1, diamond surface mechanical grinding method provided by the invention, comprises the steps:
(1) suitable grinding mechanism size is set;
(2) placement location of diamond workpiece grinding is calculated;
(3) check the placement location calculated whether can ensure that in process of lapping, diamond workpiece contacts with abrasive disc all the time and do not depart from, if can not ensure, return step (2), if can ensure, continue next step;
(4) optimized algorithm is adopted to make the direction of grinding rate in ground flat, farthest do the even variation of 360 degree, calculate the rotating speed of each axle of grinding mechanism thus, carry out attrition process with calculated rotating speed to diamond surface of the work, attrition process schematic diagram as shown in Figure 2.
As shown in Figure 3, grinding mechanism of the present invention for abrasive disc provide motion containing three axles, comprise reciprocal axle, planet axis, main shaft.Wherein back and forth axle realizes the linear reciprocating motion of abrasive disc by slider-crank mechanism, and crank length is adjustable.The size of the grinding mechanism arranged comprises the eccentric throw of the crank length of reciprocal axle and length of connecting rod, planet axis, the external diameter of abrasive disc and internal diameter.
The method arranging grinding mechanism size in the present invention is after the size setting grinding mechanism, adopt the inspection of the method for the placement location calculating diamond workpiece whether to meet abrasive disc in attrition process process at this placement location to be in any position diamond workpiece and not depart from abrasive disc, if do not meet, continue adjustment grinding mechanism size, until meet.The method of the placement location of described calculating diamond workpiece is:
1) according to the region that the size estimation plane of grinding wheel arranged can cover, enough intensive point of arranging in the region that this can cover, provides the three-dimensional coordinate of all these points;
2) interval of moving according to reciprocal axle and planet eccentric throw, calculate that abrasive disc center can arrive coordinate a little, then according to the region that the external diameter of abrasive disc and internal diameter just can cover when each position in the hope of abrasive disc center;
3) check 1 successively) in point, if this point is always in the overlay area of abrasive disc, retain this point, if this point is not always in the overlay area of abrasive disc, delete this point;
4) by 3) in the strokes and dots that remains in a coordinate system, obtain the region described by these points, be the diamond workpiece of grinding and the contact area of abrasive disc, this region just determines the placement location of diamond workpiece.
The physical dimension of above-mentioned setting can make abrasive disc always can cover a certain region in process of lapping.
Above-mentioned test specimen to be ground is placed on the position that always can contact with abrasive disc, and no matter which position abrasive disc is in process of lapping.
The function of optimised algorithm optimization is called the object function of optimized algorithm, and the object function optimized in the present invention is the standard deviation of grinding angular distribution in ground flat.The computational methods of this standard deviation are:
1, in the Simulink tool box of Matlab, set up the multi-body Dynamics Model of grinding mechanism;
2, the speed of each moment grinding contact point on abrasive disk and diamond workpiece is calculated;
3, each moment grinding rate and the deflection in ground flat thereof is calculated;
4, the distribution of calculated direction angle in 360 degree of scopes;
5, the standard deviation of Computation distribution.
The target optimized is that standard deviation gets minimum of a value, and the rotating speed of the reciprocal axle, planet axis and the main shaft that now obtain is the rotating speed of actual processing.
The present invention, owing to making to grind the change that 360 degree of scopes are made in direction in ground flat, finds adamantine easy mill direction so not be used in when starting to grind by examination mill.To change in the most uniform mode owing to optimizing rear grinding direction, further can improve surface roughness, make attrition process surface more smooth, Ra value can reach about 1nm simultaneously.
Accompanying drawing explanation
Fig. 1 is Ginding process flow chart;
Fig. 2 is the attrition process schematic diagram comprising abrasive disc and workpiece placement platform;
Fig. 3 is grinding wheel movement schematic diagram of mechanism;
Fig. 4 is embodiment 1 medium plain emery wheel card overlay area;
In figure, 1 is counterweight, and 2 is fixed pulley, and 3 is air supporting slide carriage, and 4 is knife rest, and 5 is diamond test specimen, and 6 is abrasive disc, and 7 is reciprocal axle, and 8 is crank, and 9 is connecting rod, and 10 is main shaft, and 11 is planet axis, and 12 is reciprocating block slider.
Detailed description of the invention
Below by an example, diamond lap method of the present invention is described; but do not limit to so; everyly technical solution of the present invention modified or equivalent to replace, and not departing from the spirit and scope of technical solution of the present invention, all should be encompassed in protection scope of the present invention.
Reciprocal axle crank length is set to 10mm, and length of connecting rod is 460mm, and speed adjustable range is 1-32 r/min.Planet axis speed adjustable range is 1-32 r/min, and planet eccentric throw is 30mm.Main shaft speed adjustable range is set to 4203-8298r/min.Emery wheel external diameter Φ 86mm, internal diameter Φ 35mm.Calculate the region no matter emery wheel can cover in its card of any position, size is enough, and its center is treats mill diamond surface of the work placement location.Adopt genetic algorithm to be optimized in conjunction with the rotating speed of above-mentioned object function to each axle the rotating speed obtaining three optimum axles as optimized algorithm to coordinate, i.e. main shaft 4366r/min, planet axis 20r/min, reciprocal axle 8r/min.Employing granularity is the copper base diamond emery wheel of 800, and be combined on grinder with this and grind adamantine surface, obtaining surface roughness is Ra=1.02nm.
Equipment that the present embodiment adopts is monocrystalline diamond PG3B planet-shaped grinder.Monocrystalline diamond PG3B planet-shaped grinder is a kind of business-like diamond cutter abrasive machine, originates from the Coborn company of Britain.Described calculate place the region of waiting to grind diamond test specimen as shown in Figure 4.Abscissa initial point in Fig. 4 is the center of reciprocating motion length, and ordinate initial point is planetary motion center.Described optimization in calculating adopts the Simulink module in Matlab to set up for the Machine simulation model calculating grinding rate, can be easy to the speed at the grinding contact point place gathered on emery wheel in the model, and note down, for calculating target function.The optimization aim of described optimized algorithm is that target function value is minimum.The roughness AMF of described lapped face records.
Claims (4)
1., based on a diamond lap method for complicated track, it is characterized in that described Ginding process comprises the steps:
(1) arrange suitable grinding mechanism size, concrete grammar is as follows:
After setting the size of grinding mechanism, adopt the inspection of the method for the placement location calculating diamond workpiece whether to meet abrasive disc in attrition process process at this placement location to be in any position diamond workpiece and not depart from abrasive disc, if do not meet, continue adjustment grinding mechanism size, until meet;
(2) placement location of diamond workpiece grinding is calculated;
(3) check the placement location calculated whether can ensure that in process of lapping, diamond workpiece contacts with abrasive disc all the time and do not depart from, if can not ensure, return step (2), if can ensure, continue next step;
(4) optimized algorithm is adopted to make the direction of grinding rate in ground flat, farthest do the even variation of 360 degree, calculate the rotating speed of each axle of grinding mechanism thus, with calculated rotating speed, attrition process is carried out to diamond surface of the work, wherein: the object function of described optimized algorithm is the standard deviation of grinding angular distribution in ground flat, and the computational methods of this standard deviation are:
1) in the Simulink tool box of Matlab, set up the multi-body Dynamics Model of grinding mechanism;
2) speed of each moment grinding contact point on abrasive disk and diamond workpiece is calculated;
3) each moment grinding rate and the deflection in ground flat thereof is calculated;
4) distribution of calculated direction angle in 360 degree of scopes;
5) standard deviation of Computation distribution.
2. the diamond lap method based on complicated track according to claim 1, is characterized in that described grinding mechanism size comprises crank length and length of connecting rod, the eccentric throw of planet axis, the external diameter of abrasive disc and the internal diameter of reciprocal axle.
3. the diamond lap method based on complicated track according to claim 1, is characterized in that the method for the placement location of described calculating diamond workpiece is:
1) according to the region that the size estimation plane of grinding wheel arranged can cover, enough intensive point of arranging in the region that this can cover, provides the three-dimensional coordinate of all these points;
2) interval of moving according to reciprocal axle and planet eccentric throw, calculate that abrasive disc center can arrive coordinate a little, then try to achieve according to the external diameter of abrasive disc and internal diameter the region that abrasive disc center covers when each position;
3) check 1 successively) in point, if this point is always in the overlay area of abrasive disc, retain this point, if this point is not always in the overlay area of abrasive disc, delete this point;
4) by 3) in the strokes and dots that remains in a coordinate system, obtain the region described by these points, be the diamond workpiece of grinding and the contact area of abrasive disc, this region just determines the placement location of diamond workpiece.
4. the diamond lap method based on complicated track according to claim 1, is characterized in that each axle rotating speed of the best that described optimization obtains is the rotating speed of object function reciprocal axle, planet axis and main shaft when obtaining minimum of a value.
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| CN104070428A (en) * | 2014-07-17 | 2014-10-01 | 哈尔滨工业大学 | Device suitable for mechanical blade sharpening of diamond slicing cutter |
| US9839984B2 (en) * | 2014-08-14 | 2017-12-12 | Kennametal Inc. | Method of making a cutting tap with a correction grind |
| CN104148996B (en) * | 2014-08-28 | 2016-03-30 | 哈尔滨工业大学 | A kind of plane decoupling complicated track polishing equipment |
| CN105196116B (en) * | 2015-08-18 | 2017-06-16 | 哈尔滨工业大学 | A kind of mechanical grinding method of high-precision diamond glass formula pressure head |
| CN114986393B (en) * | 2022-06-14 | 2023-04-04 | 广东天太机器人有限公司 | Automatic-deviation-correcting polishing and grinding mechanical arm control system and method |
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| SU716789A1 (en) * | 1978-04-13 | 1980-02-25 | Северо-Западный Заочный Политехнический Институт | Machine for grinding diamond cutting tools |
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