CN104576440A - 配置涂胶显影机内工艺模块数量及机器人速度的方法 - Google Patents

配置涂胶显影机内工艺模块数量及机器人速度的方法 Download PDF

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CN104576440A
CN104576440A CN201310526288.1A CN201310526288A CN104576440A CN 104576440 A CN104576440 A CN 104576440A CN 201310526288 A CN201310526288 A CN 201310526288A CN 104576440 A CN104576440 A CN 104576440A
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胡延兵
冯伟
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Shenyang Core Source Microelectronic Equipment Co., Ltd.
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
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    • H01—ELECTRIC ELEMENTS
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Abstract

本发明涉及用以在集成电路生产时，开发设计高产能并与光刻机联线生产的涂胶显影机，需要合理配置机台内工艺处理模块的数量及机器人工艺传递的速度，本发明提供一种配置涂胶显影机内工艺处理模块数量及机器人工艺传递速度的方法，根据目标产能确立机台的工艺时间参数，设计机台内各个工艺处理模块的工艺处理周期时间参数与各个晶圆传递机器人的工艺传递周期时间参数，使得三个时间参数保持一致。

Description

配置涂胶显影机内工艺模块数量及机器人速度的方法
技术领域
本发明涉及半导体技术领域，具体的说涉及开发设计涂胶显影机时，配置涂胶显影机内工艺处理模块数量及机器人工艺传递速度的方法。
背景技术
目前，大规模集成电路生产线上，要求与光刻机联线作业的涂胶显影机的产能较大，并且要高于光刻机产能，这种高产能并与光刻机联线生产的涂胶显影机，其主要功能是将晶圆在本机的片盒中卸载后，在本机内进行涂胶工艺处理，之后通过接口部分进入光刻机中曝光，之后再经接口部分返回本机进行显影工艺处理，最后再将晶圆装载回本机的片盒。
该涂胶显影机主要需要完成涂胶前增粘处理、涂胶、涂胶后软烘，曝光后烘烤、显影、显影后硬烘等主要工艺处理过程，使得该机台内工艺模块种类及数量较多、晶圆传递的机器人较多。
涂胶显影机的产能主要取决于机台内工艺模块的产能、工艺模块的数量及机器人的传片速度、晶圆传递路径、机台内工艺模块的结构及布局等方面，几方面之间还存在一定的影响关系。进行涂胶显影机的设计，需要在以上几个方面着手，还必须考虑它们之间的相互关系，才能完成高性价比产品的开发设计。
发明内容
开发设计高产能并与光刻机联线生产的涂胶显影机，需要合理配置机台内工艺处理模块的数量及机器人工艺传递的速度，本发明提供一种配置涂胶显影机内工艺处理模块数量及机器人工艺传递速度的方法，根据目标产能确立机台的工艺时间参数，设计机台内各个工艺处理模块的工艺处理周期时间参数与各个晶圆传递机器人的工艺传递周期时间参数，使得三个时间参数保持一致。
本发明为实现上述目的所采用的技术方案是：一种配置涂胶显影机内工艺模块数量及机器人速度的方法，根据目标产能确立机台的工艺时间参数TP，设计机台内各个工艺处理模块的工艺处理周期时间参数与晶圆传递机器人的工艺传递周期时间参数，使得三个时间参数趋于一致。
所述根据目标产能确立机台的工艺时间参数TP=3600/目标产能。
所述涂胶显影机内各个工艺处理模块的工艺处理周期时间参数Tn=（模块工艺处理时间+模块工艺辅助时间）/模块数量。
所述涂胶显影机内各个工艺处理模块的工艺处理周期时间参数Tn通过配置模块数量，使得Tn与TP的差值最小。
所述涂胶显影机内各个晶圆传递机器人的工艺传递周期时间参数Tr=两个工艺处理模块之间的晶圆传递时间×需要机器人传递晶圆服务的工艺模块种类数量。
所述涂胶显影机内各个晶圆传递机器人的工艺传递周期时间参数Tr通过配置两个工艺处理模块之间的晶圆传递时间，使得Tn与TP的差值最小。
本发明具有以下优点及有益效果：
1、本发明在给定工艺技术要求，即给定模块的工艺时间与整机产能要求后，就可以配制出工艺处理模块的数量及工艺传递晶圆的速度，减少了试制过程中的资金浪费，缩短了设计开发周期。
2、本发明合理配置了工艺处理模块的数量与晶圆的工艺传递速度，使得二者与目标产品的产能要求相匹配，三者形成了有机的联系，减少资源的浪费，提高了开发产品的性价比。
附图说明
图l是本发明的开发设计涂胶显影机架构示意图。
其中，主要工艺处理模块包括：涂胶前冷却处理、显影后冷却处理、增粘处理、涂胶处理、涂胶后软烘处理、显影后硬烘处理、显影处理、显影前冷却处理、软烘后冷却处理、曝光后烘烤处理、晶圆边缘曝光处理等十一种；
辅助工艺处理模块包括：晶圆卸载/装载处理、晶圆缓冲存放处理、光刻机入口载台、光刻机出口载台等四种；
晶圆传递机器人包括：片盒机器人、涂胶机器人、显影机器人、接口机器人等四种。
具体实施方式
下面结合附图及实施例对本发明做进一步的详细说明。
以开发设计产能是150片/小时的涂胶显影机为例，该涂胶显影机可以与光刻机联线生产。
1、确立机台的工艺时间参数：
依据目标产能150片/小时，参数TP=3600/150=24
2、设计涂胶显影主要工艺环节模块的工艺处理周期时间参数：
依据机台内给定的主要模块工艺处理时间及工艺辅助时间，配置相应工艺处理模块个数，按照Tn=（模块工艺处理时间+模块工艺辅助时间）/模块数量，取得各个工艺处理模块的Tn参数值，尽量保证该参数值接近TP参数值；按照工艺处理模块产能=3600/Tn，取得各个工艺处理模块的产能值。
3、设计涂胶显影机内各个晶圆传递机器人的工艺传递周期时间参数：
各个晶圆传递机器人的工艺传递周期时间参数，各个机器人服务的工艺模块种类及具体工艺模块名称，配置各个晶圆传递机器人的速度，即设定机器人在两个工艺处理模块之间的晶圆传递时间，按照参数Tr=两个工艺处理模块之间的晶圆传递时间x传递机器人服务工艺处理模块种类，取得各个工艺传递机器人的Tr参数值，尽量保证该参数值接近TP参数值；按照晶圆传递工艺机器人产能=3600/Tr，取得各个晶圆传递机器人的产能值。
4、匹配涂胶显影机的三个时间参数：
在明确了开发设计的涂胶显影机的目标产能后，首先确定了机台的工艺时间参数TP为24，再设计工艺处理周期时间参数Tn和工艺传递周期时间参数Tr，参数值在23.0-23.6之间，Tn与Tr基本维持在一个数量级之内，这样使得工艺处理模块的模块产能与工艺传递机器人的传递产能较为接近，Tn和Tr参数值略小于TP参数值，可以实现机台的目标产能。
本发明的设计方法可以有效地减少涂胶显影机在试制过程中的资源浪费，缩短了设计开发周期，提高了开发产品的性价比。

Claims (6)

1.一种配置涂胶显影机内工艺模块数量及机器人速度的方法，其特征在于，根据目标产能确立机台的工艺时间参数TP，设计机台内各个工艺处理模块的工艺处理周期时间参数与晶圆传递机器人的工艺传递周期时间参数，使得三个时间参数趋于一致。
2.根据权利要求1所述的配置涂胶显影机内工艺模块数量及机器人速度的方法，其特征在于，所述根据目标产能确立机台的工艺时间参数TP=3600/目标产能。
3.根据权利要求1所述的配置涂胶显影机内工艺模块数量及机器人速度的方法，其特征在于，所述涂胶显影机内各个工艺处理模块的工艺处理周期时间参数Tn=（模块工艺处理时间+模块工艺辅助时间）/模块数量。
4.根据权利要求3所述的配置涂胶显影机内工艺模块数量及机器人速度的方法，其特征在于，所述涂胶显影机内各个工艺处理模块的工艺处理周期时间参数Tn通过配置模块数量，使得Tn与TP的差值最小。
5.根据权利要求1所述的配置涂胶显影机内工艺模块数量及机器人速度的方法，其特征在于，所述涂胶显影机内各个晶圆传递机器人的工艺传递周期时间参数Tr=两个工艺处理模块之间的晶圆传递时间×需要机器人传递晶圆服务的工艺模块种类数量。
6.根据权利要求5所述的配置涂胶显影机内工艺模块数量及机器人速度的方法，其特征在于，所述涂胶显影机内各个晶圆传递机器人的工艺传递周期时间参数Tr通过配置两个工艺处理模块之间的晶圆传递时间，使得Tn与TP的差值最小。
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109254504A (zh) * 2017-07-14 2019-01-22 沈阳芯源微电子设备有限公司 一种可扩展连接多台光刻机的涂胶显影设备系统
CN109800023A (zh) * 2017-11-10 2019-05-24 沈阳芯源微电子设备股份有限公司 一种涂胶设备参数配置系统及其设计方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106611730B (zh) * 2017-01-11 2019-09-27 积高电子(无锡)有限公司 一种图像传感器封装过程中的清洗机及清洗工艺

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080051930A1 (en) * 2006-07-10 2008-02-28 Oh Hilario L Scheduling method for processing equipment
US20090098298A1 (en) * 2007-10-12 2009-04-16 Tokyo Electron Limited Coater/developer, method of coating and developing resist film, and computer readable storing medium
CN101615561A (zh) * 2008-06-25 2009-12-30 沈阳芯源微电子设备有限公司 涂胶显影设备的工艺墙
CN101615562A (zh) * 2008-06-25 2009-12-30 沈阳芯源微电子设备有限公司 新型结构的涂胶显影设备
CN103199032A (zh) * 2012-01-04 2013-07-10 沈阳芯源微电子设备有限公司 一种集束式结构的涂胶显影设备

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080051930A1 (en) * 2006-07-10 2008-02-28 Oh Hilario L Scheduling method for processing equipment
US20090098298A1 (en) * 2007-10-12 2009-04-16 Tokyo Electron Limited Coater/developer, method of coating and developing resist film, and computer readable storing medium
CN101615561A (zh) * 2008-06-25 2009-12-30 沈阳芯源微电子设备有限公司 涂胶显影设备的工艺墙
CN101615562A (zh) * 2008-06-25 2009-12-30 沈阳芯源微电子设备有限公司 新型结构的涂胶显影设备
CN103199032A (zh) * 2012-01-04 2013-07-10 沈阳芯源微电子设备有限公司 一种集束式结构的涂胶显影设备

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109254504A (zh) * 2017-07-14 2019-01-22 沈阳芯源微电子设备有限公司 一种可扩展连接多台光刻机的涂胶显影设备系统
CN109254504B (zh) * 2017-07-14 2021-11-09 沈阳芯源微电子设备股份有限公司 一种可扩展连接多台光刻机的涂胶显影设备系统
CN109800023A (zh) * 2017-11-10 2019-05-24 沈阳芯源微电子设备股份有限公司 一种涂胶设备参数配置系统及其设计方法

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