CN104561901A - 一种掺铊的碘化铯复合薄膜及其制备方法 - Google Patents

一种掺铊的碘化铯复合薄膜及其制备方法 Download PDF

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CN104561901A
CN104561901A CN201310499469.XA CN201310499469A CN104561901A CN 104561901 A CN104561901 A CN 104561901A CN 201310499469 A CN201310499469 A CN 201310499469A CN 104561901 A CN104561901 A CN 104561901A
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cesium iodide
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刘光辉
刘茜
周真真
费凡
魏钦华
杨华
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Shanghai Institute of Ceramics of CAS
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    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
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    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
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Abstract

本发明公开了一种掺铊的碘化铯复合薄膜及其制备方法,所述的复合薄膜是由铜薄膜层、掺铊的碘化铯薄膜层和防潮保护膜层在基材上自下至上依次涂置而成;所述复合薄膜的制备可利用现有的镀膜技术在基材上依次涂镀铜薄膜层、掺铊的碘化铯薄膜层和防潮保护膜层。研究表明:本发明制备的复合薄膜,由于金属Cu薄膜与CsI:Tl薄膜发生了高效的金属等离子体增强发光效应,使得复合薄膜在400-450nm的蓝光波段,发光强度与未加入金属Cu薄膜层相比最高增强85倍以上;该复合薄膜所具有的较强的蓝光发射特性,有望在LED等光电子领域获得应用。

Description

一种掺铊的碘化铯复合薄膜及其制备方法
技术领域
本发明涉及一种掺铊的碘化铯复合薄膜及其制备方法,属于发光材料技术领域。
背景技术
众所周知,掺铊的碘化铯(CsI:Tl)薄膜材料因其具有较好的发光特性,作为闪烁薄膜材料在高能物理,X射线成像屏以及光阴极等领域中获得了广泛应用,但是,往往需要高达几百微米的厚度,成本较高。现有技术中的较薄的(几百纳米量级)CsI:Tl薄膜材料的发光强度有限,使其在很多领域的应用受到了限制,如需要蓝光的领域。同时,可发蓝光的氮化镓材料由于其生产成本较高,使研究者们已经开始寻找新的材料替代它。
发明内容
针对现有技术存在的上述问题和需求,本发明的目的是提供一种掺铊的碘化铯复合薄膜及其制备方法,以提高CsI:Tl薄膜的发光强度,使其可应用于蓝光领域。
为实现上述发明目的,本发明采用的技术方案如下:
一种掺铊的碘化铯复合复合薄膜,是由铜薄膜层、掺铊的碘化铯薄膜层和防潮保护膜层在基材上自下至上依次涂置而成。
作为一种优选方案,所述掺铊的碘化铯薄膜层与铜薄膜层的厚度比为10~30:1。
作为一种优选方案,所述掺铊的碘化铯薄膜层的厚度为200~300纳米。
本发明所述的掺铊的碘化铯复合薄膜的制备方法,是采用包括离子束溅射法、真空蒸镀法和真空磁控溅射法的现有镀膜方法在基材上依次涂镀铜薄膜层、掺铊的碘化铯薄膜层和防潮保护膜层。
作为一种优选方案,所述的离子束溅射法包括如下步骤:先以铜板、掺铊的碘化铯单晶和二氧化硅陶瓷靶为靶材,在基材上依次沉积出铜薄膜层和掺铊的碘化铯薄膜层,再以防潮保护膜材料为靶材,在掺铊的碘化铯薄膜层上沉积出防潮保护膜层。
作为进一步优选方案,所述基材为石英或单晶硅片。
作为进一步优选方案,所述防潮保护膜材料选自二氧化钛、二氧化硅、氮化硅、硅的氮氧化物中的任意一种。
作为进一步优选方案,所述铜薄膜的沉积速率为0.02~0.5纳米/秒。
研究表明:本发明所制备的复合薄膜,由于金属Cu薄膜与CsI:Tl薄膜发生了高效的金属等离子体增强发光效应,使得复合薄膜在400-450nm的蓝光波段,发光强度与未加入金属Cu薄膜层相比最高增强85倍以上;该复合薄膜所具有的较强的蓝光发射特性,有望在LED等光电子领域获得应用。
附图说明
图1为本发明所提供的掺铊的碘化铯复合薄膜的结构示意图;
图2为CsI:Tl薄膜在引入Cu薄膜层前后光致发光谱对比图;
图3为采用不同厚度的Cu薄膜层对Cu/CsI:Tl薄膜结构的光致发光谱。
图中:1、基材;2、Cu薄膜层;3、Tl:CsI薄膜层;4、防潮保护膜层。
具体实施方式
下面结合具体实施例,进一步阐述本发明。应理解,这些实施例仅用于说明本发明而不用于限制本发明的范围。
本发明所述的掺铊的碘化铯复合薄膜的结构如图1所示,由图1可见:所述的复合薄膜是由铜薄膜层2、掺铊的碘化铯薄膜层3和防潮保护膜层4在基材1上自下至上依次涂置而成。
各实施例中的离子束溅射的方法都是本领域中通用的方法,故不再赘述。
实施例1
一、将Si片用纯水冲洗两遍,再放入酒精中超声清洗10min,取出自然晾干备用;
二、用铜板作靶材,采用离子束溅射的方法,以0.02-0.5nm/s的速率在Si片上沉积出厚度为10nm的铜薄膜层;
三、再用市售的CsI:Tl单晶作靶材,用离子束溅射的方法在铜薄膜层表面沉积出厚度为300nm的CsI:Tl膜层;
四、最后用SiO2为靶材,用离子束溅射的方法在CsI:Tl膜层表面沉积出厚度为50nm的防潮保护膜。
本实施例制备的样品记为1#,发光性能如图3所示。
对比例1
其方法与实施例1相同,只是在制备过程中没有加金属铜,所得样品记为0#。
实施例2
一、将Si片用纯水冲洗两遍,再放入丙酮中超声清洗10min,取出自然晾干备用;
二、用铜板作靶材,采用离子束溅射的方法,以0.02-0.5nm/s的速率在Si片上沉积出厚度为20nm的铜薄膜层;
三、再用市售的CsI:Tl单晶作靶材,用离子束溅射的方法在铜薄膜层表面沉积出厚度为300nm的CsI:Tl膜层;
四、最后用SiO2陶瓷靶为靶材,用离子束溅射的方法在CsI:Tl膜层表面沉积出厚度为50nm的防潮保护膜。
本实施例制备的样品记为2#,发光性能如图3所示。
实施例3
一、将石英片用纯水冲洗两遍,再放入丙酮中超声清洗10min,取出自然晾干备用;
二、用铜板作靶材,采用离子束溅射的方法,以0.02-0.5nm/s的速率在石英片上沉积出厚度为30nm的铜薄膜层;
三、再用市售的CsI:Tl单晶作靶材,用离子束溅射的方法在铜薄膜层表面沉积出厚度为300nm的CsI:Tl膜层;
四、最后用SiO2陶瓷靶为靶材,用离子束溅射的方法在CsI:Tl膜层表面沉积出厚度为50nm的防潮保护膜。
本实施例制备的样品记为3#,发光性能如图3所示。
实施例4:
一、将石英片用纯水冲洗两遍,再放入丙酮中超声清洗10min,取出自然晾干备用;
二、用铜板作靶材,采用离子束溅射的方法,以0.02-0.5nm/s的速率在石英片上沉积出厚度为60nm的铜薄膜层;
三、再用市售的CsI:Tl单晶作靶材,用离子束溅射的方法在铜薄膜层表面沉积出厚度为300nm的CsI:Tl膜层;
四、最后用SiO2陶瓷靶为靶材,用离子束溅射的方法在CsI:Tl膜层表面沉积出厚度为50nm的防潮保护膜。
本实施例制备的样品记为4#,发光性能如图3所示。
将0#、1#、2#、3#和4#样品用F4600(日立)荧光光谱仪,在436nm(286nm激发)波段的发光强度测试光致发光谱,结果如图3所示:当引入10nm厚度的Cu薄膜层后,复合薄膜的发光强度提高约45倍;当引入20nm厚度的Cu薄膜层后,复合薄膜的发光强度提高约85倍;当引入30nm厚度的Cu薄膜层后,复合薄膜的发光强度提高约52倍;当引入60nm厚度的Cu薄膜层后,复合薄膜的发光强度提高仅3.5倍,可见,Cu薄膜层厚度必需限制在一定范围才能实现发光显著增强的效果。
最后有必要在此说明的是:以上实施例只用于对本发明的技术方案作进一步详细地说明,不能理解为对本发明保护范围的限制,本领域的技术人员根据本发明的上述内容作出的一些非本质的改进和调整均属于本发明的保护范围。

Claims (8)

1.一种掺铊的碘化铯复合薄膜,其特征在于:所述的复合薄膜是由铜薄膜层、掺铊的碘化铯薄膜层和防潮保护膜层在基材上自下至上依次涂置而成。
2.如权利要求1所述的碘化铯复合薄膜,其特征在于:所述掺铊的碘化铯薄膜层与铜薄膜层的厚度比为10~30:1。
3.如权利要求1或2所述的碘化铯复合薄膜,其特征在于:所述掺铊的碘化铯薄膜层的厚度为200~300纳米。
4.一种如权利要求1所述的掺铊的碘化铯复合薄膜的制备方法,其特征在于:采用包括离子束溅射法、真空蒸镀法和真空磁控溅射法的现有镀膜方法在基材上依次涂镀铜薄膜层、掺铊的碘化铯薄膜层和防潮保护膜层。
5.如权利要求4所述的制备方法,其特征在于,所述的离子束溅射法包括如下步骤:先以铜板、掺铊的碘化铯单晶和二氧化硅陶瓷靶为靶材,在基材上依次沉积出铜薄膜层和掺铊的碘化铯薄膜层,再以SiO2为靶材,在掺铊的碘化铯薄膜层上沉积防潮保护膜层。
6.如权利要求5所述的制备方法,其特征在于:所述基材为石英或单晶硅片。
7.如权利要求5所述的制备方法,其特征在于:所述防潮保护膜材料选自二氧化钛、二氧化硅、氮化硅和硅的氮氧化物中的任意一种。
8.如权利要求5所述的制备方法,其特征在于:所述铜薄膜的沉积速率为0.02~0.5纳米/秒。
CN201310499469.XA 2013-10-22 2013-10-22 一种掺铊的碘化铯复合薄膜及其制备方法 Pending CN104561901A (zh)

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JP2020537288A (ja) * 2017-10-10 2020-12-17 ケーエルエー コーポレイション シリコン電子エミッタデザイン
WO2019075113A1 (en) * 2017-10-10 2019-04-18 Kla-Tencor Corporation SILICON ELECTRON EMITTING STRUCTURES
JP7072059B2 (ja) 2017-10-10 2022-05-19 ケーエルエー コーポレイション シリコン電子エミッタデザイン
US10607806B2 (en) 2017-10-10 2020-03-31 Kla-Tencor Corporation Silicon electron emitter designs
CN108342688A (zh) * 2018-03-19 2018-07-31 电子科技大学 一种掺铊碘化铯复合薄膜及其制备方法
CN108396296A (zh) * 2018-03-19 2018-08-14 电子科技大学 一种x射线成像探测用微米级掺铊碘化铯转换屏的制备方法
US10714295B2 (en) 2018-09-18 2020-07-14 Kla-Tencor Corporation Metal encapsulated photocathode electron emitter
CN112673448A (zh) * 2018-09-18 2021-04-16 科磊股份有限公司 金属囊封光电阴极电子发射器
JP2022501772A (ja) * 2018-09-18 2022-01-06 ケーエルエー コーポレイション 金属封入光電陰極電子エミッタ
WO2020060954A1 (en) * 2018-09-18 2020-03-26 Kla Corporation Metal encapsulated photocathode electron emitter
JP7185772B2 (ja) 2018-09-18 2022-12-07 ケーエルエー コーポレイション 金属封入光電陰極電子エミッタ
TWI800681B (zh) * 2018-09-18 2023-05-01 美商科磊股份有限公司 電子發射器、用於形成其之方法、用於操作其之方法及電子束工具

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