CN104538369A - Single substrate packaging structure - Google Patents
Single substrate packaging structure Download PDFInfo
- Publication number
- CN104538369A CN104538369A CN201410783215.5A CN201410783215A CN104538369A CN 104538369 A CN104538369 A CN 104538369A CN 201410783215 A CN201410783215 A CN 201410783215A CN 104538369 A CN104538369 A CN 104538369A
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- CN
- China
- Prior art keywords
- pad
- single layer
- layer substrate
- encapsulating structure
- substrate encapsulating
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention relates to a single substrate packaging structure which comprises a bonding pad, copper columns and a green oil layer. The lower surface of the bonding pad and at least a part of surfaces of the copper columns are coated with the green oil layer, and the green oil layer is used for enabling the relative position of the bonding pad and the copper columns to be fixed. By means of the single substrate packaging structure, the resistance of the bonding pad is increased when pull force or thrust force transmitted from solder balls is exerted on the bonding pad, and the bonding pad can be effectively prevented from falling off.
Description
Technical field
The present invention relates to the packaging technology in a kind of semiconductor production, particularly a kind of single layer substrate encapsulating structure.
Background technology
In traditional single layer substrate manufacture process, as shown in Figure 1, pad 1 Direct Electroplating on Copper Foil 2, then pressing glass fibre 3 around pad 1.This structure, bottom pad 1 after encapsulation etch process (eroding copper foil layer), all can expose, only have the copper post of pad 1 both sides to be combined with glass fibre 3.When pad 1 is subject to external force collision, the as easy as rolling off a log tin ball 7 that is inconjunction with of pad 1 comes off (as shown in Figure 2 and Figure 3).
Summary of the invention
Provide hereinafter about brief overview of the present invention, to provide about the basic comprehension in some of the present invention.Should be appreciated that this general introduction is not summarize about exhaustive of the present invention.It is not that intention determines key of the present invention or pith, and nor is it intended to limit the scope of the present invention.Its object is only provide some concept in simplified form, in this, as the preorder in greater detail discussed after a while.
A main purpose of the present invention is to provide a kind of single layer substrate encapsulating structure, and when tin ball can be avoided at least to a certain extent to come off, the situation that pad comes off thereupon occurs.
According to an aspect of the present invention, a kind of single layer substrate encapsulating structure, comprises pad, copper post and green oil layer;
Described green oil layer be coated in the lower surface of described pad and described copper post at least partially on the surface, fix for making the relative position of described pad and described copper post.
Adopt single layer substrate encapsulating structure of the present invention, adding the resistance of pad when being subject to the next pulling force of tin ball transmission or thrust, effectively can prevent Pad off.
Accompanying drawing explanation
Below with reference to the accompanying drawings illustrate embodiments of the invention, above and other objects, features and advantages of the present invention can be understood more easily.Parts in accompanying drawing are just in order to illustrate principle of the present invention.In the accompanying drawings, same or similar technical characteristic or parts will adopt same or similar Reference numeral to represent.
Fig. 1 is the schematic diagram of existing single layer substrate encapsulating structure;
Fig. 2, Fig. 3 are the schematic diagram of existing single layer substrate encapsulating structure Pad off process;
Fig. 4 is the structure chart of a kind of execution mode of single layer substrate encapsulating structure of the present invention;
Fig. 5 is the flow chart of the single layer substrate packaging technology of a kind of execution mode forming single layer substrate encapsulating structure of the present invention.
Embodiment
With reference to the accompanying drawings embodiments of the invention are described.The element described in an accompanying drawing of the present invention or a kind of execution mode and feature can combine with the element shown in one or more other accompanying drawing or execution mode and feature.It should be noted that for purposes of clarity, accompanying drawing and eliminate expression and the description of unrelated to the invention, parts known to persons of ordinary skill in the art and process in illustrating.
See Fig. 4, it is the structure chart of a kind of execution mode of single layer substrate encapsulating structure of the present invention.
In the present embodiment, single layer substrate encapsulating structure comprises pad 1, copper post (not shown) and green oil layer 4.
Green oil layer 4 be coated in the lower surface of pad 1 and copper post at least partially on the surface, fix with the relative position of copper post for making pad 1.
In one embodiment, copper post can be etched by pressing Copper Foil (see 2 ' in Fig. 1) and be formed.Pad 1 is formed at the upper surface of pressing Copper Foil 2 ', and the upper surface fluid-tight engagement of the lower surface of pad 1 and pressing Copper Foil 2 '.Copper post be etching pressing Copper Foil 2 ' make pad 1 lower surface expose completely after remainder.
In one embodiment, single layer substrate encapsulating structure of the present invention can also comprise glass fibre 3.Glass fibre 3 is pressed on around the pad upper surface relative with pad lower surface.
Single layer substrate encapsulating structure of the present invention also comprises tin ball, and it can be welded in the lower surface of pad 1.
Preferably, pad 1 also can be provided with the connecting portion 5 for being connected with external device (ED) 6.In one embodiment, this connecting portion 5 can be through hole.
Fig. 5 be the packaging technology forming single layer substrate encapsulating structure of the present invention a kind of flow chart of execution mode
Composition graphs 4, Fig. 5 are described in detail.
In the present embodiment, single layer substrate packaging technology can comprise:
S10: form pad 1 at the upper surface of pressing Copper Foil 2 ', make the upper surface fluid-tight engagement of pad 1 lower surface and pressing Copper Foil 2; Such as, the mode of plating or pressing can be adopted to form pad 1 at the upper surface of pressing Copper Foil 2 '.
S20: copper post is exposed in pressing Copper Foil 2 ' etching formation, pad 1 lower surface is exposed completely;
S30: in the formation green oil layer at least partially 4 of the edge of pad 1 lower surface and copper post.
Because green oil layer 4 can block pad 1 lower surface, thus pad 1 is fixed with the relative position of copper post, and then the effect of support is played to pad 1.
Preferably, single layer substrate packaging technology can also comprise:
S40: pressing glass fibre 3 around pad 1 upper surface relative with pad 1 lower surface.
As a kind of execution mode, can also comprise after step S30:
S50: implant tin ball (not shown) at pad 1 lower surface.
As a kind of execution mode, the mode of plating can be adopted green oil layer 4 to be formed in pad lower surface and copper post at least partially.
As a kind of execution mode, single layer substrate packaging technology can also comprise:
S60: the connecting portion 5 being used for being connected with external device (ED) is set on pad 1.Such as, the through hole for being connected with chip 6 can be offered on pad.
Adopt single layer substrate encapsulating structure of the present invention, adding the resistance of pad when being subject to the next pulling force of tin ball transmission or thrust, effectively can prevent Pad off.
Above some embodiments of the present invention are described in detail.As one of ordinary skill in the art can be understood, whole or any step of method and apparatus of the present invention or parts, can in the network of any computing equipment (comprising processor, storage medium etc.) or computing equipment, realized with hardware, firmware, software or their combination, this is that those of ordinary skill in the art use their basic programming skill just can realize when understanding content of the present invention, therefore need not illustrate at this.
In equipment of the present invention and method, obviously, each parts or each step reconfigure after can decomposing, combine and/or decomposing.These decompose and/or reconfigure and should be considered as equivalents of the present invention.Also it is pointed out that the step performing above-mentioned series of processes can order naturally following the instructions perform in chronological order, but do not need necessarily to perform according to time sequencing.Some step can walk abreast or perform independently of one another.Simultaneously, above in the description of the specific embodiment of the invention, the feature described for a kind of execution mode and/or illustrate can use in one or more other execution mode in same or similar mode, combined with the feature in other execution mode, or substitute the feature in other execution mode.
Should emphasize, term " comprises/comprises " existence referring to feature, key element, step or assembly when using herein, but does not get rid of the existence or additional of one or more further feature, key element, step or assembly.
Although described the present invention and advantage thereof in detail, be to be understood that and can have carried out various change when not exceeding the spirit and scope of the present invention limited by appended claim, substituting and conversion.And the scope of the application is not limited only to the specific embodiment of process, equipment, means, method and step described by specification.One of ordinary skilled in the art will readily appreciate that from disclosure of the present invention, can use perform the function substantially identical with corresponding embodiment described herein or obtain and its substantially identical result, existing and that will be developed in the future process, equipment, means, method or step according to the present invention.Therefore, appended claim is intended to comprise such process, equipment, means, method or step in their scope.
Claims (6)
1. a single layer substrate encapsulating structure, is characterized in that, comprises pad, copper post and green oil layer;
Described green oil layer be coated in the lower surface of described pad and described copper post at least partially on the surface, fix for making the relative position of described pad and described copper post.
2. single layer substrate encapsulating structure according to claim 1, is characterized in that:
Described copper post is etched by pressing Copper Foil and is formed;
Described pad is formed at the upper surface of described pressing Copper Foil, and the upper surface fluid-tight engagement of the lower surface of described pad and described pressing Copper Foil;
Described copper post be etching described pressing Copper Foil make described pad lower surface expose completely after remainder.
3. single layer substrate encapsulating structure according to claim 1 and 2, is characterized in that, also comprise glass fibre;
Described glass fibre is pressed on around the pad upper surface relative with described pad lower surface.
4. single layer substrate encapsulating structure according to claim 1 and 2, is characterized in that, also comprises tin ball;
Described tin ball bonding is connected to the lower surface of described pad.
5. single layer substrate encapsulating structure according to claim 2, is characterized in that:
Described pad is provided with the connecting portion for being connected with external device (ED).
6. single layer substrate encapsulating structure according to claim 5, is characterized in that:
Described connecting portion is through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410783215.5A CN104538369A (en) | 2014-12-16 | 2014-12-16 | Single substrate packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410783215.5A CN104538369A (en) | 2014-12-16 | 2014-12-16 | Single substrate packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104538369A true CN104538369A (en) | 2015-04-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410783215.5A Pending CN104538369A (en) | 2014-12-16 | 2014-12-16 | Single substrate packaging structure |
Country Status (1)
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| CN (1) | CN104538369A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101712652A (en) * | 2008-10-02 | 2010-05-26 | 田村化研株式会社 | Novel imidazole compounds, surface treating agents, print circuit boards and a method of producing the same |
| US20100288541A1 (en) * | 2009-05-13 | 2010-11-18 | Advanced Semiconductor Engineering, Inc. | Substrate having single patterned metal layer, and package applied with the substrate , and methods of manufacturing of the substrate and package |
| CN101990365A (en) * | 2009-08-04 | 2011-03-23 | 东莞信浓马达有限公司 | Tin printed steel net and tin paste printing method |
| CN202262063U (en) * | 2011-09-22 | 2012-05-30 | 捷开通讯科技(上海)有限公司 | Circuit board structure and mobile terminal |
| CN103855123A (en) * | 2012-12-08 | 2014-06-11 | 上海祯显电子科技有限公司 | Substrate for encapsulating integrated circuit |
-
2014
- 2014-12-16 CN CN201410783215.5A patent/CN104538369A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101712652A (en) * | 2008-10-02 | 2010-05-26 | 田村化研株式会社 | Novel imidazole compounds, surface treating agents, print circuit boards and a method of producing the same |
| US20100288541A1 (en) * | 2009-05-13 | 2010-11-18 | Advanced Semiconductor Engineering, Inc. | Substrate having single patterned metal layer, and package applied with the substrate , and methods of manufacturing of the substrate and package |
| CN101990365A (en) * | 2009-08-04 | 2011-03-23 | 东莞信浓马达有限公司 | Tin printed steel net and tin paste printing method |
| CN202262063U (en) * | 2011-09-22 | 2012-05-30 | 捷开通讯科技(上海)有限公司 | Circuit board structure and mobile terminal |
| CN103855123A (en) * | 2012-12-08 | 2014-06-11 | 上海祯显电子科技有限公司 | Substrate for encapsulating integrated circuit |
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| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 226006 Jiangsu Province, Nantong City Chongchuan District Chongchuan Road No. 288 Applicant after: Tongfu Microelectronics Co., Ltd. Address before: 226006 Jiangsu Province, Nantong City Chongchuan District Chongchuan Road No. 288 Applicant before: Fujitsu Microelectronics Co., Ltd., Nantong |
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| COR | Change of bibliographic data | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150422 |
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| RJ01 | Rejection of invention patent application after publication |