CN104527157A - Composite material used for integrated circuit lead frame and manufacturing method thereof - Google Patents
Composite material used for integrated circuit lead frame and manufacturing method thereof Download PDFInfo
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- CN104527157A CN104527157A CN201410851968.5A CN201410851968A CN104527157A CN 104527157 A CN104527157 A CN 104527157A CN 201410851968 A CN201410851968 A CN 201410851968A CN 104527157 A CN104527157 A CN 104527157A
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- element layer
- constituent element
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/08—Interconnection of layers by mechanical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
The invention discloses a composite material used for an integrated circuit lead frame and a manufacturing method of the composite material, and belongs to the technical field of composite materials. The composite material comprises three component layers of a sandwich structure, the first component layer and the third component layer are iron-nickel alloys which are namely FeNi42, and the second component layer is a copper alloy. The composite material comprises, by volume, 12-18% of the first component layer, 64-76% of the second component layer and 12-18% of the third component layer and has the advantages that an expansion coefficient matched with that of a silicon chip is obtained, tensile strength matched with that of the silicon chip is achieved, the cost is lowered by above 15% compared with that of a composite material using FeNi42 alloys, the high strength is achieved, and a high extend rate is achieved.
Description
Technical field
The invention belongs to technical field of composite materials, particularly a kind of circuit lead frame composite and manufacture method thereof.
Background technology
Blaster fuse frame material is the indispensable material of modern electronics industry.The development of blaster fuse frame material roughly experienced by Fe-Ni-Co kovar alloy to FeNi
42alloy, then the three phases arriving copper alloy, the pluses and minuses of three kinds of materials are in table 1.Along with the development of information technology, integrated circuit is to miniaturized, microminiaturized and sheet future development, and this has higher requirement to the performance of blaster fuse frame material.Namely there is high intensity, high electric conductivity, good thermal conductivity and with silicon (3.5 × 10
-6/ DEG C) good matching.
Table 1 three kinds of blaster fuse frame materials compare
Desirable blaster fuse frame material and electronic package material will meet 6 characteristics: 1, heat-conductivity conducting will be got well, can by silicon operationally produced heat distribute in time; 2, lower thermal coefficient of expansion to be had, good matching, weldability, heat resistance and oxidative resistance; 3, will have enough intensity, rigidity and mouldability, general tensile strength is greater than 450MPa, and percentage elongation is greater than 4%; 4, flatness will be got well, and residual stress is little.5, easy punch press process; 6, cost is as far as possible low, to meet the demand of large-scale commercial application.
Along with the development of material, particularly blaster fuse frame material requirement is more and more higher, and single FeNi alloy or Cu alloy are difficult to the requirement meeting material, and therefore composite has entered into the visual field of people for lead frame.The eighties, Texas ,Usa instrument company developed copper-clad stainless steel blaster fuse frame material, it is at ferrite 430 stainless steel two sides compound high purity copper, its Thickness Ratio is 10% bronze medal 80%430 stainless steel 10% bronze medal, in material, stainless thickness is thicker, the intensity of material is higher, but thermal conductivity is only 98.7W/ (mK), the coefficient of expansion is higher is 11.3 × 10
-6/ DEG C, production cost is higher.Changsha mining and metallurgy research institute patent of invention " composite material for lead wire frame ", patent of invention number is CN 1041151C, adopt Cu/Q195/Cu tri-layers of compound, Thickness Ratio is: Cu:Q195:Cu=10 ~ 15%:70 ~ 80%:10 ~ 15%, thermal conductivity after compound reaches 186W/ (mK), but the coefficient of expansion is elevated to 12.4 × 10
-6/ DEG C; And be produced by hot compound, the uniformity of material is poor, lumber recovery is low.Therefore need to develop a kind of novel cheap, the better composite of performance, to meet the demand of lead frame to material.
Summary of the invention
The object of the present invention is to provide a kind of circuit lead frame composite and manufacture method thereof, solve existing material property used for lead frame and the problem such as the coefficient of expansion does not mate.
A kind of circuit lead frame composite, comprises three constituent element layers, and become sandwich structure, the first constituent element layer and third element layer are iron-nickel alloy, i.e. FeNi
42, the second constituent element layer is copper alloy.By volume percentage allocation is: the first constituent element layer accounts for 12 ~ 18%, and the second constituent element layer accounts for 64 ~ 76%, and third element layer accounts for 12 ~ 18%.
Preferred volume percentage is: the first constituent element layer accounts for 15%, and the second constituent element layer accounts for 70%, and third element layer accounts for 15%.
A preparation method for circuit lead frame composite, concrete steps and parameter as follows:
1, the first constituent element layer that volume ratio is 12 ~ 18% is prepared, the material blank of the second constituent element layer of 64 ~ 76% and the third element layer of 12 ~ 18%;
2, blank is carried out compound by composite rolling mill, compound drafts is 50 ~ 80%;
3, carry out diffusion annealing with bell furnace or continuous annealing furnace, make compound interface in conjunction with firm.
Batch annealing for be heated to 700 ~ 900 DEG C under vacuum or protective atmosphere, and insulation 1 ~ 4h, stove is as cold as and is less than 200 DEG C and comes out of the stove.
Continuous annealing furnace annealing process is under protective atmosphere, and annealing temperature is 800 DEG C ~ 1000 DEG C, and annealing speed is 0.5 ~ 2m/min.
4, composite strip is carried out finish rolling;
5, composite finished product is carried out straightening, pack after sub-cut being carried out to band according to actual requirement.
The invention has the advantages that:
1, this kind of composite has same silicon (3.5 × 10
-6/ DEG C) coefficient of expansion 4.0 ~ 4.7 × 10 that matches
-6/dEG C, tensile strength 620 ~ 680MPa, conductance can reach 47 ~ 63%IACS, thermal conductivity 130 ~ 150W/mK;
2, material cost is than using FeNi
42alloy reduces more than 15%.
3, composite has higher intensity and higher percentage elongation.
Accompanying drawing explanation
Fig. 1 is the structural scheme of mechanism of composite.Wherein, the first constituent element layer 1, second constituent element layer 2, third element layer 3.
Detailed description of the invention
Embodiment 1
The percent by volume that trilaminate material accounts for integral material is: the first constituent element layer accounts for 15%, and the second constituent element layer accounts for 70%, and third element layer accounts for 15%.
Adopt composite rolling mill to carry out compound, composite deformation amount is 70%, and the specification after compound is 1.2 × 220mm; Use nitrogen protection stove to anneal after compound, annealing temperature is 800 DEG C, temperature retention time 3 hours; stove is as cold as and is less than 200 DEG C and comes out of the stove; by the distance making the spacing between trilaminate material reach atom level after diffusion annealing, thus make the interface cohesion of trilaminate material firm, lamination does not occur.After compound, band passes through milling train cogging to 0.6 × 220mm; trimming 210mm; after trimming, steel band carries out hydrogen shield continuous annealing heat treatment; annealing temperature 900 DEG C, 2 meters per minute of annealing speed, it is cold rolling that the steel band after annealing carries out second time; cold rolling reduction 66.7%; be rolled into the steel band that 210mm is wide, 0.2mm is thick, then carry out straightening, trimming becomes 200mm.The performance that band has is: the coefficient of expansion 4.3 × 10
-6/ DEG C, tensile strength Rm is 648MPa, and conductance is 52%IACS, and thermal conductivity is 137W/mK.
Embodiment 2
The percent by volume that trilaminate material accounts for integral material is: the first constituent element layer accounts for 12%, and the second constituent element layer accounts for 76%, and third element layer accounts for 12%.
Adopt composite rolling mill to carry out compound, composite deformation amount is 65%, and the specification after compound is 1.4 × 220mm; Hydrogen shield continuous annealing furnace is adopted to carry out diffusion annealing after compound; annealing temperature is 900 DEG C, and 1 meter per minute of annealing speed, by the distance making the spacing between trilaminate material reach atom level after diffusion annealing; thus make the interface cohesion of trilaminate material firm, there is not lamination.After compound, band passes through milling train cogging to 1.2 × 220mm, trimming 210mm, after trimming, steel band carries out hydrogen shield continuous annealing heat treatment, annealing temperature 900 DEG C, 1.5 meters per minute of annealing speed, it is cold rolling that steel band after annealing carries out second time, cold rolling reduction 50%, be rolled into the steel band that 0.6mm is thick, steel band carries out hydrogen shield continuous annealing heat treatment, annealing temperature 900 DEG C, 2.0 meters per minute of annealing speed, it is cold rolling that steel band after annealing carries out third time, cold rolling reduction is 66.7%, be rolled into 210mm wide, the steel band that 0.1mm is thick, then straightening is carried out after rolling, trimming becomes 200mm.The performance that band has is: the coefficient of expansion 4.4 × 10
-6/ DEG C, tensile strength Rm=625MPa, conductance is 60%IACS, and thermal conductivity is 147W/mK.
Embodiment 3
The percent by volume that trilaminate material accounts for integral material is: the first constituent element layer accounts for 18%, and the second constituent element layer accounts for 64%, and third element layer accounts for 18%.
Adopt composite rolling mill to carry out compound, composite deformation amount is 60%, and the specification after compound is 1.6 × 220mm; Use nitrogen protection stove to anneal after compound, annealing temperature is 700 DEG C, temperature retention time 4 hours; stove is as cold as and is less than 200 DEG C and comes out of the stove; by the distance making the spacing between trilaminate material reach atom level after diffusion annealing, thus make the interface cohesion of trilaminate material firm, lamination does not occur.After compound, band passes through milling train cogging to 1.2 × 220mm, trimming 210mm, after trimming, steel band carries out hydrogen shield continuous annealing heat treatment, annealing temperature 900 DEG C, 1.0 meters per minute of annealing speed, it is cold rolling that steel band after annealing carries out second time, cold rolling reduction 50%, be rolled into the steel band that 0.6mm is thick, steel band carries out hydrogen shield continuous annealing heat treatment, annealing temperature 900 DEG C, 2.0 meters per minute of annealing speed, it is cold rolling that steel band after annealing carries out third time, cold rolling reduction is 66.7%, be rolled into 210mm wide, the steel band that 0.1mm is thick, then straightening is carried out after rolling, trimming becomes 200mm.The performance that band has is: the coefficient of expansion 4.3 × 10
-6/ DEG C, tensile strength Rm=668MPa, conductance is 52%IACS, and thermal conductivity is 136W/mK.
Claims (5)
1. a circuit lead frame composite, is characterized in that, comprises three constituent element layers, and become sandwich structure, the first constituent element layer and third element layer are iron-nickel alloy FeNi42, and the second constituent element layer is copper alloy; By volume percentage allocation is: the first constituent element layer accounts for 12 ~ 18%, and the second constituent element layer accounts for 64 ~ 76%, and third element layer accounts for 12 ~ 18%.
2. composite according to claim 1, is characterized in that, described percent by volume is: the first constituent element layer accounts for 15%, and the second constituent element layer accounts for 70%, and third element layer accounts for 15%.
3. a preparation method for composite according to claim 1, concrete steps and parameter as follows:
1) the first constituent element layer that volume ratio is 12 ~ 18% is prepared, the material blank of the second constituent element layer of 64 ~ 76% and the third element layer of 12 ~ 18%;
2) blank is carried out compound by composite rolling mill, compound drafts is 50 ~ 80%;
3) diffusion annealing is carried out with bell furnace or continuous annealing furnace;
4) composite strip is carried out finish rolling;
5) composite finished product is carried out straightening, pack after sub-cut being carried out to band according to actual requirement.
4. preparation method according to claim 3, is characterized in that, described step 3) in batch annealing be under vacuum or protective atmosphere, be heated to 700 ~ 900 DEG C, insulation 1 ~ 4h, stove is as cold as and is less than 200 DEG C and comes out of the stove.
5. preparation method according to claim 3, is characterized in that, described step 3) in continuous annealing furnace annealing process be under protective atmosphere, annealing temperature is 800 DEG C ~ 1000 DEG C, and annealing speed is 0.5 ~ 2m/min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410851968.5A CN104527157A (en) | 2014-12-31 | 2014-12-31 | Composite material used for integrated circuit lead frame and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410851968.5A CN104527157A (en) | 2014-12-31 | 2014-12-31 | Composite material used for integrated circuit lead frame and manufacturing method thereof |
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| CN104527157A true CN104527157A (en) | 2015-04-22 |
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| CN201410851968.5A Pending CN104527157A (en) | 2014-12-31 | 2014-12-31 | Composite material used for integrated circuit lead frame and manufacturing method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105609347A (en) * | 2016-02-29 | 2016-05-25 | 邱炎新 | Anti-electromagnetic-interference high-voltage isolating switch mounting platform |
| CN112776432A (en) * | 2019-11-05 | 2021-05-11 | 宝武特种冶金有限公司 | Low-expansion high-thermal-conductivity composite metal material, and preparation method and application thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03179768A (en) * | 1989-12-01 | 1991-08-05 | Hitachi Metals Ltd | Lead frame member |
| CN1577825A (en) * | 2003-06-30 | 2005-02-09 | 新光电气工业株式会社 | Lead frame for semiconductor packages |
-
2014
- 2014-12-31 CN CN201410851968.5A patent/CN104527157A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03179768A (en) * | 1989-12-01 | 1991-08-05 | Hitachi Metals Ltd | Lead frame member |
| CN1577825A (en) * | 2003-06-30 | 2005-02-09 | 新光电气工业株式会社 | Lead frame for semiconductor packages |
Non-Patent Citations (1)
| Title |
|---|
| 中国冶金百科全书总编辑委员会《冶金建设》卷编辑委员会等: "《中国冶金百科全书 冶金建设（上）》", 31 January 1999, article "中国冶金百科全书 冶金建设（上）", pages: 462-464 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105609347A (en) * | 2016-02-29 | 2016-05-25 | 邱炎新 | Anti-electromagnetic-interference high-voltage isolating switch mounting platform |
| CN112776432A (en) * | 2019-11-05 | 2021-05-11 | 宝武特种冶金有限公司 | Low-expansion high-thermal-conductivity composite metal material, and preparation method and application thereof |
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Application publication date: 20150422 |