CN104518309B - 阶梯式弹簧接触件 - Google Patents

阶梯式弹簧接触件 Download PDF

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Publication number
CN104518309B
CN104518309B CN201410756152.4A CN201410756152A CN104518309B CN 104518309 B CN104518309 B CN 104518309B CN 201410756152 A CN201410756152 A CN 201410756152A CN 104518309 B CN104518309 B CN 104518309B
Authority
CN
China
Prior art keywords
coil
spring contacts
staged spring
staged
pitch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201410756152.4A
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English (en)
Chinese (zh)
Other versions
CN104518309A (zh
Inventor
A·维尔纳
G·弗劳内
D·H·威尔斯马
A·勒金德尔
R·E·曼德维尔
S·R·陈
E·梅代罗斯
M·奈尔森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sensata Technologies Inc
Original Assignee
Sensata Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sensata Technologies Inc filed Critical Sensata Technologies Inc
Publication of CN104518309A publication Critical patent/CN104518309A/zh
Application granted granted Critical
Publication of CN104518309B publication Critical patent/CN104518309B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00—Coils
    • H01F5/04—Arrangements of electric connections to coils, e.g. leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/15—Pins, blades or sockets having separate spring member for producing or increasing contact pressure
    • H01R13/17—Pins, blades or sockets having separate spring member for producing or increasing contact pressure with spring member on the pin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/28—Clamped connections, spring connections
    • H01R4/48—Clamped connections, spring connections utilising a spring, clip, or other resilient member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/28—Clamped connections, spring connections
    • H01R4/48—Clamped connections, spring connections utilising a spring, clip, or other resilient member
    • H01R4/4854—Clamped connections, spring connections utilising a spring, clip, or other resilient member using a wire spring
    • H01R4/4863—Coil spring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connecting Device With Holders (AREA)
  • Multi-Conductor Connections (AREA)
CN201410756152.4A 2013-09-06 2014-09-05 阶梯式弹簧接触件 Active CN104518309B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201361874626P 2013-09-06 2013-09-06
US61/874,626 2013-09-06
US201461984942P 2014-04-28 2014-04-28
US61/984,942 2014-04-28

Publications (2)

Publication Number Publication Date
CN104518309A CN104518309A (zh) 2015-04-15
CN104518309B true CN104518309B (zh) 2018-09-04

Family

ID=51453701

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410756152.4A Active CN104518309B (zh) 2013-09-06 2014-09-05 阶梯式弹簧接触件

Country Status (5)

Country Link
US (1) US9312610B2 (enExample)
EP (1) EP2846415B1 (enExample)
JP (1) JP6249910B2 (enExample)
KR (1) KR102268501B1 (enExample)
CN (1) CN104518309B (enExample)

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US9312610B2 (en) * 2013-09-06 2016-04-12 Sensata Technologies, Inc. Stepped spring contact
EP3112830B1 (en) 2015-07-01 2018-08-22 Sensata Technologies, Inc. Temperature sensor and method for the production of a temperature sensor
KR101735741B1 (ko) 2015-11-05 2017-05-16 대양전기공업 주식회사 항아리형 스프링과 상기 스프링이 고정되는 안착홀이 형성된 pcb기판이 구비된 센서
JP6706494B2 (ja) 2015-12-14 2020-06-10 センサータ テクノロジーズ インコーポレーテッド インターフェース構造
US10428716B2 (en) 2016-12-20 2019-10-01 Sensata Technologies, Inc. High-temperature exhaust sensor
US10502641B2 (en) 2017-05-18 2019-12-10 Sensata Technologies, Inc. Floating conductor housing
JP7134785B2 (ja) * 2018-08-24 2022-09-12 キヤノン株式会社 画像形成装置に用いられる電気接点バネ、電気接点部材および画像形成装置
DE102018123995A1 (de) * 2018-09-28 2020-04-02 Knorr-Bremse Systeme für Nutzfahrzeuge GmbH Kontaktiereinrichtung zum elektrischen Kontaktieren einer Leiterplatte mit einem Spulenkörper für ein Magnetventil für eine Bremseinrichtung für ein Fahrzeug, Magnetventil mit einer Kontaktiereinrichtung und Verfahren zum Herstellen einer Kontaktiereinrichtung
DE102018123993B4 (de) * 2018-09-28 2022-05-25 Knorr-Bremse Systeme für Nutzfahrzeuge GmbH Kontaktiereinrichtung zum elektrischen Kontaktieren einer Stromführungseinrichtung mit einem Modul für ein Fahrzeugsystem für ein Fahrzeug, Kontaktvorrichtung mit einer Kontaktiereinrichtung und Verfahren zum Herstellen einer Kontaktiereinrichtung
DE102018123994B4 (de) * 2018-09-28 2022-05-25 Knorr-Bremse Systeme für Nutzfahrzeuge GmbH Kontaktiervorrichtung zum federbaren Kontaktieren einer Platine mit einem Kontaktelement für eine Magnetspule oder einen Sensor für ein Fahrzeugsystem, Fahrzeugsystem mit einer Kontaktiervorrichtung und Verfahren zum Herstellen einer Kontaktiervorrichtung
JP7566494B2 (ja) * 2020-05-28 2024-10-15 株式会社日本マイクロニクス 電気的接触子及び電気的接触子の製造方法
DE102020208960A1 (de) * 2020-07-17 2022-01-20 Robert Bosch Gesellschaft mit beschränkter Haftung Kontaktieranordnung und Geräteanordnung

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0616394A1 (en) * 1993-03-16 1994-09-21 Hewlett-Packard Company Method and system for producing electrically interconnected circuits
US6313523B1 (en) * 1999-10-28 2001-11-06 Hewlett-Packard Company IC die power connection using canted coil spring
EP2390641A2 (en) * 2010-05-27 2011-11-30 Sensata Technologies, Inc. Pressure Sensor

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EP0616395B1 (en) * 1993-03-16 1997-09-10 Hewlett-Packard Company Method and system for producing electrically interconnected circuits
JP4409114B2 (ja) 1999-03-12 2010-02-03 日本発條株式会社 導電性接触子アセンブリ
US6341962B1 (en) * 1999-10-29 2002-01-29 Aries Electronics, Inc. Solderless grid array connector
JP2002170617A (ja) 2000-12-04 2002-06-14 Yokowo Co Ltd コイルばねコネクタ
JP2003100375A (ja) 2001-09-26 2003-04-04 Yokowo Co Ltd スプリングコネクタ
US6776668B1 (en) * 2003-08-01 2004-08-17 Tyco Electronics Corporation Low profile coaxial board-to-board connector
JP3881682B2 (ja) * 2004-09-14 2007-02-14 ユニテクノ株式会社 両端変位型コンタクトプローブ
JP2007073441A (ja) * 2005-09-08 2007-03-22 Matsushita Electric Works Ltd 導電性接触子および導電性接触子アセンブリ
TWM344664U (en) * 2008-04-07 2008-11-11 Hon Hai Prec Ind Co Ltd Electrical contact
US7695285B2 (en) * 2008-05-29 2010-04-13 Yokowo Co., Ltd. Spring connector and connector
JP5166176B2 (ja) * 2008-09-04 2013-03-21 スリーエム イノベイティブ プロパティズ カンパニー 電子デバイス用ソケット
JP5291585B2 (ja) * 2008-11-07 2013-09-18 株式会社日本マイクロニクス 接触子及び電気的接続装置
JP5187188B2 (ja) 2008-12-26 2013-04-24 富士通株式会社 半導体集積回路パッケージの設置方法及び電子部品の製造方法
US8263879B2 (en) * 2009-11-06 2012-09-11 International Business Machines Corporation Axiocentric scrubbing land grid array contacts and methods for fabrication
US8129624B2 (en) * 2010-05-27 2012-03-06 Sensata Technologies, Inc. Pressure sensor
US8758067B2 (en) * 2010-06-03 2014-06-24 Hsio Technologies, Llc Selective metalization of electrical connector or socket housing
JP5698030B2 (ja) * 2011-02-28 2015-04-08 株式会社エンプラス コンタクトピン及び電気部品用ソケット
US8919656B2 (en) * 2011-06-02 2014-12-30 Key Systems, Inc. Memory button mount
DE102011085856A1 (de) * 2011-11-07 2013-05-08 Robert Bosch Gmbh Vorrichtung zur elektrischen Kontaktierung von Elektronikeinheiten
US8373430B1 (en) * 2012-05-06 2013-02-12 Jerzy Roman Sochor Low inductance contact probe with conductively coupled plungers
JP5933728B2 (ja) 2012-09-14 2016-06-15 日本発條株式会社 パワーモジュール用接続端子およびパワーモジュール用接続端子群
US9312610B2 (en) * 2013-09-06 2016-04-12 Sensata Technologies, Inc. Stepped spring contact

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0616394A1 (en) * 1993-03-16 1994-09-21 Hewlett-Packard Company Method and system for producing electrically interconnected circuits
US6313523B1 (en) * 1999-10-28 2001-11-06 Hewlett-Packard Company IC die power connection using canted coil spring
EP2390641A2 (en) * 2010-05-27 2011-11-30 Sensata Technologies, Inc. Pressure Sensor

Also Published As

Publication number Publication date
CN104518309A (zh) 2015-04-15
JP2015057775A (ja) 2015-03-26
EP2846415A1 (en) 2015-03-11
EP2846415A8 (en) 2016-03-16
EP2846415B1 (en) 2018-07-18
US9312610B2 (en) 2016-04-12
US20150072543A1 (en) 2015-03-12
JP6249910B2 (ja) 2017-12-20
KR20150028746A (ko) 2015-03-16
KR102268501B1 (ko) 2021-06-23

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