CN104517979B - 具有紧挨存储栅极的双自对准植入物的图像传感器像素单元 - Google Patents
具有紧挨存储栅极的双自对准植入物的图像传感器像素单元 Download PDFInfo
- Publication number
- CN104517979B CN104517979B CN201410009345.3A CN201410009345A CN104517979B CN 104517979 B CN104517979 B CN 104517979B CN 201410009345 A CN201410009345 A CN 201410009345A CN 104517979 B CN104517979 B CN 104517979B
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- China
- Prior art keywords
- semiconductor substrate
- implanted
- transistor
- grid
- pixel cell
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- 239000007943 implant Substances 0.000 title abstract description 52
- 239000000758 substrate Substances 0.000 claims abstract description 73
- 239000004065 semiconductor Substances 0.000 claims abstract description 71
- 125000006850 spacer group Chemical group 0.000 claims abstract description 34
- 238000003384 imaging method Methods 0.000 claims description 20
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 6
- 229920005591 polysilicon Polymers 0.000 claims description 6
- 238000009792 diffusion process Methods 0.000 claims description 5
- 238000007667 floating Methods 0.000 claims description 5
- 238000009825 accumulation Methods 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 4
- 239000002019 doping agent Substances 0.000 claims description 4
- 238000002513 implantation Methods 0.000 claims description 2
- 230000003111 delayed effect Effects 0.000 description 11
- 239000013078 crystal Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000005096 rolling process Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 208000024754 bloodshot eye Diseases 0.000 description 1
- 210000000746 body region Anatomy 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 201000005111 ocular hyperemia Diseases 0.000 description 1
- 230000005622 photoelectricity Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14654—Blooming suppression
- H01L27/14656—Overflow drain structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
- H01L27/14612—Pixel-elements with integrated switching, control, storage or amplification elements involving a transistor
- H01L27/14614—Pixel-elements with integrated switching, control, storage or amplification elements involving a transistor having a special gate structure
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
Description
Claims (23)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/038,336 | 2013-09-26 | ||
US14/038,336 US8933494B1 (en) | 2013-09-26 | 2013-09-26 | Image sensor pixel cell having dual self-aligned implants next to storage gate |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104517979A CN104517979A (zh) | 2015-04-15 |
CN104517979B true CN104517979B (zh) | 2017-10-03 |
Family
ID=52247752
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410009345.3A Active CN104517979B (zh) | 2013-09-26 | 2014-01-09 | 具有紧挨存储栅极的双自对准植入物的图像传感器像素单元 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8933494B1 (zh) |
CN (1) | CN104517979B (zh) |
HK (1) | HK1209234A1 (zh) |
TW (1) | TWI523214B (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9419044B2 (en) * | 2014-04-17 | 2016-08-16 | Omnivision Technologies, Inc. | Image sensor pixel having storage gate implant with gradient profile |
US20160099283A1 (en) * | 2014-10-03 | 2016-04-07 | Omnivision Technologies, Inc. | Photosensor with channel region having center contact |
US9484370B2 (en) | 2014-10-27 | 2016-11-01 | Omnivision Technologies, Inc. | Isolated global shutter pixel storage structure |
US9491386B2 (en) * | 2014-12-03 | 2016-11-08 | Omnivision Technologies, Inc. | Floating diffusion reset level boost in pixel cell |
US9930281B2 (en) | 2016-01-20 | 2018-03-27 | Semiconductor Components Industries, Llc | Image sensors having photodiode regions implanted from multiple sides of a substrate |
US11916095B2 (en) | 2018-04-16 | 2024-02-27 | Sony Semiconductor Solutions Corporation | Imaging device and method of manufacturing imaging device |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101640209A (zh) * | 2008-08-01 | 2010-02-03 | 索尼株式会社 | 固体摄像器件、其制造方法以及摄像装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8089036B2 (en) | 2009-04-30 | 2012-01-03 | Omnivision Technologies, Inc. | Image sensor with global shutter and in pixel storage transistor |
US8298853B2 (en) * | 2010-08-10 | 2012-10-30 | International Business Machines Corporation | CMOS pixel sensor cells with poly spacer transfer gates and methods of manufacture |
JP5508356B2 (ja) * | 2011-07-26 | 2014-05-28 | シャープ株式会社 | 固体撮像装置およびその駆動方法、固体撮像装置の製造方法、並びに電子情報機器 |
TWI467751B (zh) * | 2011-12-12 | 2015-01-01 | Sony Corp | A solid-state imaging device, a driving method of a solid-state imaging device, and an electronic device |
KR20130085228A (ko) | 2012-01-19 | 2013-07-29 | 삼성전자주식회사 | 이미지 센서, 이의 동작 방법, 및 이를 포함하는 휴대용 장치 |
-
2013
- 2013-09-26 US US14/038,336 patent/US8933494B1/en active Active
- 2013-12-23 TW TW102147810A patent/TWI523214B/zh active
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2014
- 2014-01-09 CN CN201410009345.3A patent/CN104517979B/zh active Active
-
2015
- 2015-10-08 HK HK15109844.2A patent/HK1209234A1/zh unknown
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101640209A (zh) * | 2008-08-01 | 2010-02-03 | 索尼株式会社 | 固体摄像器件、其制造方法以及摄像装置 |
Also Published As
Publication number | Publication date |
---|---|
TWI523214B (zh) | 2016-02-21 |
HK1209234A1 (zh) | 2016-03-24 |
CN104517979A (zh) | 2015-04-15 |
US8933494B1 (en) | 2015-01-13 |
TW201513327A (zh) | 2015-04-01 |
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