CN104733480B - 用于高动态范围图像传感器的图像传感器像素 - Google Patents
用于高动态范围图像传感器的图像传感器像素 Download PDFInfo
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- CN104733480B CN104733480B CN201410074474.0A CN201410074474A CN104733480B CN 104733480 B CN104733480 B CN 104733480B CN 201410074474 A CN201410074474 A CN 201410074474A CN 104733480 B CN104733480 B CN 104733480B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
- H01L27/14605—Structural or functional details relating to the position of the pixel elements, e.g. smaller pixel elements in the center of the imager compared to pixel elements at the periphery
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
- H01L27/14607—Geometry of the photosensitive area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
- H01L27/1461—Pixel-elements with integrated switching, control, storage or amplification elements characterised by the photosensitive area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
- H01L27/14612—Pixel-elements with integrated switching, control, storage or amplification elements involving a transistor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14641—Electronic components shared by two or more pixel-elements, e.g. one amplifier shared by two pixel elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14645—Colour imagers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
Description
Claims (6)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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CN201710719097.5A CN107644885B (zh) | 2013-12-19 | 2014-03-03 | 用于高动态范围图像传感器的图像传感器像素 |
CN201710719643.5A CN107611150B (zh) | 2013-12-19 | 2014-03-03 | 用于高动态范围图像传感器的图像传感器像素 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/135,066 | 2013-12-19 | ||
US14/135,066 US9324759B2 (en) | 2013-12-19 | 2013-12-19 | Image sensor pixel for high dynamic range image sensor |
Related Child Applications (2)
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CN201710719097.5A Division CN107644885B (zh) | 2013-12-19 | 2014-03-03 | 用于高动态范围图像传感器的图像传感器像素 |
CN201710719643.5A Division CN107611150B (zh) | 2013-12-19 | 2014-03-03 | 用于高动态范围图像传感器的图像传感器像素 |
Publications (2)
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CN104733480A CN104733480A (zh) | 2015-06-24 |
CN104733480B true CN104733480B (zh) | 2018-01-23 |
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CN201710719097.5A Active CN107644885B (zh) | 2013-12-19 | 2014-03-03 | 用于高动态范围图像传感器的图像传感器像素 |
CN201710719643.5A Active CN107611150B (zh) | 2013-12-19 | 2014-03-03 | 用于高动态范围图像传感器的图像传感器像素 |
CN201410074474.0A Active CN104733480B (zh) | 2013-12-19 | 2014-03-03 | 用于高动态范围图像传感器的图像传感器像素 |
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CN201710719097.5A Active CN107644885B (zh) | 2013-12-19 | 2014-03-03 | 用于高动态范围图像传感器的图像传感器像素 |
CN201710719643.5A Active CN107611150B (zh) | 2013-12-19 | 2014-03-03 | 用于高动态范围图像传感器的图像传感器像素 |
Country Status (4)
Country | Link |
---|---|
US (3) | US9324759B2 (zh) |
CN (3) | CN107644885B (zh) |
HK (1) | HK1207473A1 (zh) |
TW (3) | TWI587494B (zh) |
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US9305949B2 (en) | 2013-11-01 | 2016-04-05 | Omnivision Technologies, Inc. | Big-small pixel scheme for image sensors |
US9324759B2 (en) | 2013-12-19 | 2016-04-26 | Omnivision Technologies, Inc. | Image sensor pixel for high dynamic range image sensor |
JP6408372B2 (ja) * | 2014-03-31 | 2018-10-17 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像装置及びその駆動制御方法、並びに、電子機器 |
JP6808623B2 (ja) * | 2015-07-08 | 2021-01-06 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像素子および駆動方法、並びに電子機器 |
JP2017054966A (ja) * | 2015-09-10 | 2017-03-16 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法および半導体装置 |
CN109155827B (zh) * | 2016-03-16 | 2021-04-23 | Bae系统成像解决方案有限公司 | 高动态范围成像传感器阵列 |
CN106331434B (zh) * | 2016-09-05 | 2019-09-06 | 深圳安芯微电子有限公司 | 图像处理装置与方法 |
CN108024075B (zh) * | 2016-10-28 | 2019-10-11 | 原相科技股份有限公司 | 全局快门高动态范围像素及影像传感器 |
US9888185B1 (en) * | 2016-12-20 | 2018-02-06 | Omnivision Technologies, Inc. | Row decoder for high dynamic range image sensor using in-frame multi-bit exposure control |
CN107426472A (zh) * | 2017-06-01 | 2017-12-01 | 深圳市矽旺半导体有限公司 | 宽动态范围图像传感器系统及其实现方法 |
US10334191B1 (en) * | 2018-03-02 | 2019-06-25 | Omnivision Technologies, Inc. | Pixel array with embedded split pixels for high dynamic range imaging |
CN110324540A (zh) * | 2019-06-10 | 2019-10-11 | 芯盟科技有限公司 | 一种图像传感器、图像传感器的形成方法及电子设备 |
US11212457B2 (en) * | 2020-05-28 | 2021-12-28 | Omnivision Technologies, Inc. | High dynamic range CMOS image sensor design |
CN111866414B (zh) * | 2020-07-15 | 2021-08-20 | 大连理工大学 | 高动态图像传感器像素结构及时序控制方法 |
CN112563299B (zh) * | 2020-12-10 | 2023-03-24 | 成都微光集电科技有限公司 | Cmos图像传感器及其制备方法 |
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US9305949B2 (en) | 2013-11-01 | 2016-04-05 | Omnivision Technologies, Inc. | Big-small pixel scheme for image sensors |
US9324759B2 (en) | 2013-12-19 | 2016-04-26 | Omnivision Technologies, Inc. | Image sensor pixel for high dynamic range image sensor |
-
2013
- 2013-12-19 US US14/135,066 patent/US9324759B2/en active Active
-
2014
- 2014-03-03 CN CN201710719097.5A patent/CN107644885B/zh active Active
- 2014-03-03 CN CN201710719643.5A patent/CN107611150B/zh active Active
- 2014-03-03 CN CN201410074474.0A patent/CN104733480B/zh active Active
- 2014-03-27 TW TW105112857A patent/TWI587494B/zh active
- 2014-03-27 TW TW105112856A patent/TWI591812B/zh active
- 2014-03-27 TW TW103111546A patent/TWI549275B/zh active
-
2015
- 2015-08-19 HK HK15108035.3A patent/HK1207473A1/zh unknown
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2016
- 2016-03-02 US US15/059,196 patent/US9608019B2/en active Active
- 2016-03-02 US US15/059,182 patent/US9711546B2/en active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7863647B1 (en) * | 2007-03-19 | 2011-01-04 | Northrop Grumman Systems Corporation | SiC avalanche photodiode with improved edge termination |
Also Published As
Publication number | Publication date |
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US20160181296A1 (en) | 2016-06-23 |
CN107611150B (zh) | 2019-07-12 |
US9324759B2 (en) | 2016-04-26 |
TW201526213A (zh) | 2015-07-01 |
CN107644885B (zh) | 2019-05-31 |
TWI591812B (zh) | 2017-07-11 |
US9608019B2 (en) | 2017-03-28 |
TW201628181A (zh) | 2016-08-01 |
HK1207473A1 (zh) | 2016-01-29 |
CN104733480A (zh) | 2015-06-24 |
US9711546B2 (en) | 2017-07-18 |
TW201628182A (zh) | 2016-08-01 |
US20160181297A1 (en) | 2016-06-23 |
CN107611150A (zh) | 2018-01-19 |
US20150179695A1 (en) | 2015-06-25 |
CN107644885A (zh) | 2018-01-30 |
TWI587494B (zh) | 2017-06-11 |
TWI549275B (zh) | 2016-09-11 |
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