CN104488358B - Bakee the manufacture method of the duplexer of the organic functions film of processing system and organic EL element - Google Patents
Bakee the manufacture method of the duplexer of the organic functions film of processing system and organic EL element Download PDFInfo
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- CN104488358B CN104488358B CN201380039479.3A CN201380039479A CN104488358B CN 104488358 B CN104488358 B CN 104488358B CN 201380039479 A CN201380039479 A CN 201380039479A CN 104488358 B CN104488358 B CN 104488358B
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- 238000000034 method Methods 0.000 title claims description 84
- 238000004519 manufacturing process Methods 0.000 title description 28
- 230000006870 function Effects 0.000 title description 16
- 239000000758 substrate Substances 0.000 claims abstract description 196
- 239000011368 organic material Substances 0.000 claims abstract description 41
- 238000007641 inkjet printing Methods 0.000 claims abstract description 33
- 230000008569 process Effects 0.000 claims description 76
- 238000010438 heat treatment Methods 0.000 claims description 43
- 238000001816 cooling Methods 0.000 claims description 28
- 238000001035 drying Methods 0.000 claims description 25
- 230000006837 decompression Effects 0.000 claims description 21
- 238000005401 electroluminescence Methods 0.000 description 34
- 239000007789 gas Substances 0.000 description 31
- 238000002347 injection Methods 0.000 description 12
- 239000007924 injection Substances 0.000 description 12
- 230000015572 biosynthetic process Effects 0.000 description 10
- 239000002904 solvent Substances 0.000 description 10
- 230000033228 biological regulation Effects 0.000 description 9
- 230000007246 mechanism Effects 0.000 description 9
- 230000007423 decrease Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 238000006073 displacement reaction Methods 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- 230000008676 import Effects 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 206010021143 Hypoxia Diseases 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000001146 hypoxic effect Effects 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- 239000003507 refrigerant Substances 0.000 description 3
- 230000018199 S phase Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 238000004020 luminiscence type Methods 0.000 description 2
- 238000007726 management method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 241000196324 Embryophyta Species 0.000 description 1
- 240000006829 Ficus sundaica Species 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
- 238000012800 visualization Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Bakeing processing system (100) to include: vacuum(-)baking device ((VB) 1), it carries out roasting for the organic material film being formed on substrate (S) to the inkjet-printing device ((IJ) 200) outside utilizing with atmospheric pressure pressure below；Conveyer device (11), it is for carrying substrate (S) to vacuum(-)baking device ((VB) 1)；Conveying chamber ((TR) 10), it can be evacuated, and is used for accommodating conveyer device (11)；Load-lock ((LL) 20), consists of and can switch between atmospheric pressure state and vacuum state；And conveyer device (31), what it was configured in substrate transport path is positioned at the part between inkjet-printing device ((IJ) 200) and load-lock ((LL) 20), is used for carrying out the handing-over of substrate (S).
Description
Technical field
The present invention relates to a kind of baking processing system, it can be used in such as in the manufacture of organic EL element
Journey carries out the baking of organic material film.
Background technology
Organic EL (Electro Luminescence) element is a kind of light-emitting component, and it utilizes because of flow-thru electrode
The luminescence of the organic compound flowed and produce, is the layer accompanying multiple organic functions film between pair of electrodes
The structure of stack (below this duplexer being referred to as " EL layer ").Here, EL layer has such as from sun
Side, pole is according to " hole transporting layer/luminescent layer/electron supplying layer ", " hole injection layer/hole transporting layer/luminescence
Layer/electron supplying layer " or " hole injection layer/hole transporting layer/luminescent layer/electron supplying layer/electronics injects
Layer " etc. the structure that is laminated of order.
By being deposited with on substrate according to each layer, be coated with organic material, thus form EL layer.In shape
In the case of becoming high-precision fine pattern, it is believed that utilizing ink-jet printing process is favourable as coating process
's.
The organic material film that is printed upon on substrate via ink-jet printing process because containing substantial amounts of solvent, because of
This, need drying process to remove this solvent.Additionally, in order to remove residual in organic material film
High boiling solvent and to constitute EL layer organic functions film change, need in hypoxic atmosphere, such as with
The temperature of 160 DEG C～about 250 DEG C heats the baking of about 1 hour and processes.
As the manufacture device utilizing ink-jet printing process to form EL layer, in order to improve productivity ratio, it is proposed that
One is configured with hole injection layer apparatus for coating continuously by transfer unit, hole injection layer is dried dress
Put, more than one luminescent layer apparatus for coating and the manufacture device (example of more than one luminescent layer drying device
Such as patent documentation 1, Japanese Unexamined Patent Publication 2003-142260 publication).
Additionally, in the formation of EL layer that make use of ink-jet printing process, in order to reach to save space-efficient purpose,
Also proposed a kind of Multihead-type ink discharge device at the ink that can be coated with all kinds for forming EL layer
And it is dried manufacture device (the such as patent literary composition being configured with base board delivery device between the device of baking
Offer 2, Japanese Unexamined Patent Publication 2007-265715 publication).
In above-mentioned patent documentation 1,2 disclosed manufacture device, when baking processes, in making device
Become hypoxic atmosphere, import N2While the organic material film added on hot substrate.But, owing to bakeing
Process the time needing about about one hour, it is therefore desirable to substantial amounts of N2, become organic EL manufacturing process
Cost increase a reason.The most in recent years, length is large-scale more than 2 meters of such substrates
Change, therefore there is the internal volume increase of curing range, N2Consumption increases such problem.
Summary of the invention
The present invention provides a kind of and is entering the organic material film being printed upon on large substrate with ink-jet printing process
In the case of row baking processes, it is possible to low cost and the baking processing system processed efficiently.
The baking processing system of the present invention includes:
Curing range, it is used for atmospheric pressure pressure below utilizing inkjet-printing device to be formed at substrate
On organic material film carry out roasting；
1st conveyer device, it is for carrying substrate to above-mentioned curing range；
Conveying chamber, it can be evacuated, and is disposed adjacent with above-mentioned curing range, is used for accommodating the above-mentioned 1st
Conveyer device；
Load-lock, consists of and is disposed adjacent with above-mentioned conveying chamber, it is possible at atmospheric pressure state and
Switch between vacuum state；And
2nd conveyer device, what it was configured in substrate transport path be positioned at above-mentioned inkjet-printing device and upper
State the part between load-lock, for this substrate transport path at least some of in carry out base
The handing-over of plate.
In the baking processing system of the present invention, above-mentioned curing range can also have:
Heating plate, it is used for heating aforesaid substrate；
Multiple movable pins, it is can set in the way of highlighting relative to the surface of above-mentioned heating plate or submerge
Put, for heating the period separate state support in surface with substrate Yu above-mentioned heating plate of aforesaid substrate
Aforesaid substrate.In such a situation it is preferred to being located at interval between the surface of above-mentioned heating plate and substrate
In the scope of more than 0.1mm and below 10mm.
The baking processing system of the present invention can also be that above-mentioned curing range is connected with exhaust apparatus, is used for
Pressure in this curing range is adjusted to more than 133Pa and below 66500Pa and carries out roasting.This
In the case of, carry out roasting in preferably non-active gas being imported above-mentioned curing range.
In the baking processing system of the present invention, above-mentioned load-lock can also have:
Coldplate, it is for cooling down the aforesaid substrate of the inside being contained in this load-lock；And
Multiple movable pins, it is can set in the way of highlighting relative to the surface of above-mentioned coldplate or submerge
Put, for cooling substrate period with substrate with the surface of above-mentioned coldplate separate state support above-mentioned
Substrate.In such a situation it is preferred to be located at interval at 0.1mm between the surface of above-mentioned coldplate and substrate
Above and in the scope of below 10mm.
The baking processing system of the present invention can also be that above-mentioned load-lock is connected with exhaust apparatus,
For the pressure in this load-lock being adjusted to below more than 400Pa and atmospheric pressure and cooling down above-mentioned
Substrate.
In the baking processing system of the present invention, it is preferred that above-mentioned load-lock is also as to shape
Organic material film on the substrate of the inside that Cheng Yu is contained in above-mentioned load-lock carries out drying under reduced pressure
Decompression dry device function.
The baking processing system of the present invention can also be also to include decompression dry device, and this drying under reduced pressure fills
Put for making the organic material film utilizing inkjet-printing device to be formed on substrate be dried.
In the baking processing system of the present invention, it is also possible to be, above-mentioned curing range accommodates many for simultaneously
Open substrate and process.
In the baking processing system of the present invention, it is also possible to be, above-mentioned load-lock is for holding simultaneously
Receive multiple substrates.
In the baking processing system of the present invention, it is also possible to be, above-mentioned 1st conveyer device is for above-mentioned
Carry multiple substrates between curing range and above-mentioned load-lock simultaneously.
In the baking processing system of the present invention, it is also possible to be, it is adjacent to configure multiple with above-mentioned conveying chamber
Above-mentioned curing range.In this case, it is also possible to be, by above-mentioned conveying chamber, above-mentioned loading interlocking dress
Put and three above-mentioned curing ranges constitute a unit, and above-mentioned 2nd conveyer device is for multiple
Said units carries out the conveying of aforesaid substrate.
Use the baking processing system of the present invention, in the manufacturing process of organic EL element, it is possible to press down
N processed2Consumption figure, continuously and high production rate ground carries out the dried for forming EL layer and connects
The baking got off processes.Therefore, the present invention is used, it is possible to increase the life of the manufacturing process of organic EL element
Productivity.
Accompanying drawing explanation
Fig. 1 is the top view of the outline of the baking processing system of the 1st embodiment representing the present invention.
Fig. 2 is the horizontal cross of the major part representing Fig. 1.
Fig. 3 A is the sectional view for vacuum(-)baking device is described.
Fig. 3 B is the sectional view of another state for vacuum(-)baking device is described.
Fig. 3 C is the sectional view of the variation for vacuum(-)baking device is described.
Fig. 4 A is the sectional view for load-lock is described.
Fig. 4 B is the sectional view of another state for load-lock is described.
Fig. 4 C is the sectional view of the variation for load-lock is described.
Fig. 5 is the flow chart of the outline of the manufacturing process representing organic EL element.
Fig. 6 is the top view of the outline of the baking processing system of the 2nd embodiment representing the present invention.
Detailed description of the invention
It follows that referring to the drawings embodiments of the present invention are illustrated.
[the 1st embodiment]
Fig. 1 is the top view of the baking processing system 100 roughly representing the 1st embodiment, and Fig. 2 is Fig. 1
The horizontal cross of major part (unit).Bakee processing system 100 can be preferred for
The manufacture process of organic el display utilizes inkjet-printing device (IJ) 200 inkjet printing of outside
The baking of organic material film processes.Bakee processing system 100 to include: vacuum(-)baking device (VB) 1,
It is for being formed at substrate with atmospheric pressure pressure below to the inkjet-printing device (IJ) 200 outside utilizing
Organic material film on S carries out roasting；Conveyer device 11 (with reference to Fig. 2), it is as the 1st conveyer device,
For substrate S is carried to vacuum(-)baking device (VB) 1；And conveying chamber (TR) 10, it can be taken out
Become vacuum, be disposed adjacent with vacuum(-)baking device 1, be used for accommodating conveyer device 11.Additionally, at baking
Reason system 100 also includes: load-lock (LL) 20, consists of and conveying chamber (TR) 10 phase
Adjacent setting, it is possible to switch between atmospheric pressure state and vacuum state；And conveyer device 31, its conduct
2nd conveyer device, be configured in substrate transport path is positioned at inkjet-printing device (IJ) 200 and loads
Part between interlock (LL) 20, this substrate transport path at least some of in carry out substrate
The handing-over of S.
<structure of a unit>
In bakeing processing system 100, the link of multiple large-scale plants forms a list for overlooking cross
Unit, this multiple gathering of unit and constitute baking processing system 100.Baking illustrated in Fig. 1 processes system
System 100 comprises four unit 101A, 101B, 101C and 101D.One unit is true in having three
Empty 10, load-lock (LL) 20 of curing range (VB) 1, conveying chamber (TR)
Multicell structure.Central part at unit is configured with conveying chamber (TR) 10, with its three side phases
It is configured with three for substrate S being bakeed the vacuum(-)baking device (VB) that (roasting) processes adjacently
1.Additionally, be adjacent to be configured with load-lock with the remaining side of conveying chamber (TR) 10
(LL)20。
Conveying chamber (TR) 10, load-lock (LL) 20 and three vacuum(-)baking devices (VB)
1 is all configured to maintain its inner space the reduced atmosphere (vacuum state) of regulation.
It is each configured with that there is opening and closing between conveying chamber (TR) 10 and each vacuum(-)baking device (VB) 1
The gate-valve device GV1 of function.Additionally, at conveying chamber (TR) 10 and load-lock (LL) 20
Between be configured with gate-valve device GV2.Gate-valve device GV1, GV2 in off position under seal airtightly each
Individual device, and make connection between device can transfer substrate S in the on-state.Additionally, loading
It is also configured with gate-valve device GV3 between interlock (LL) 20 and the conveyer device 31 of air atmosphere,
Seal load-lock (LL) 20 under closed mode airtightly, and can add in the on-state
Substrate S is transferred in carrying interlock (LL) 20 and between the conveyer device 31 of air atmosphere.
<vacuum(-)baking device>
Three vacuum(-)baking devices (VB) 1 are identical structure.As in figure 2 it is shown, each vacuum is dried
Roasting device (VB) 1 has the heating plate 3 for adding hot substrate S.It is formed with multiple through in heating plate 3
Hole 3a, is inserted with the back side with substrate S in this through hole 3a and abuts and support the movable pin 5 of this substrate S.
The detailed configuration of vacuum(-)baking device (VB) 1 is aftermentioned.
<conveyer device and the 1st conveyer device>
It is configured with the conveyer device 11 as the 1st conveyer device at conveying chamber (TR) 10.This conveyer device
11 include: clamp forks 13a and clamp forks 13b, and it is arranged on two-layer ground such as up and down；Support 15, its with
The mode that clamp forks 13a, 13b can be made to pass in and out, keep out of the way and rotate supports this clamp forks 13a, 13b；
And drive mechanism (diagram is omitted), it is used for driving this support 15.Conveyer device 11 is according to supporting
The rotation in portion 15 and clamp forks 13a, the turnover of 13b and keep out of the way and can be at three vacuum(-)baking devices
(VB) conveying substrate S between 1 and load-lock (LL) 20.Clamp forks 13a, 13b are configured to
Can separately conveying substrate S.
<load-lock>
As in figure 2 it is shown, load-lock (LL) 20 has the coldplate 21 for cooling down substrate S.Cold
But it is formed with multiple through hole 21a on plate 21, this through hole 21a is inserted with the back side with substrate S and supports
Connect and support the movable pin 23 of this substrate S.Additionally, the upper surface at coldplate 21 is provided with the spray of multiple gas
Portal 21b.The detailed configuration of load-lock (LL) 20 is aftermentioned.
<the 2nd conveyer device>
As it is shown in figure 1, be provided with for each between unit 101A, 101B and unit 101C, 101D
The conveyer device 31 of load-lock (LL) 20 conveying substrate S.This conveyer device 31 includes: forked
Part 33a and clamp forks 33b, it is arranged on two-layer ground such as up and down；Support 35, it is can make clamp forks
The mode that 33a, 33b pass in and out, keep out of the way and rotate supports this clamp forks 33a, 33b；Drive mechanism (figure
Show omission), it is used for driving this support 35；And guide rail 37.Support 35 moves along guide rail 37,
Can carry between four unit 101A, 101B, 101C, 101D and between buffer table 41
Substrate S.
<buffer table>
The baking processing system 100 of Fig. 1 has buffering in the position that conveyer device 31 can join substrate S
Platform 41.Buffer table 41 is to bakee processing system 100 and outside device, such as inkjet-printing device 200
Between join substrate S time interim storeroom.Buffer table 41 is separated with compartment of terrain setting be provided with for inciting somebody to action
Multiple substrates S remains a pair abutment wall 43 of multilamellar.A pair abutment wall 43 be configured to they
Gap is inserted clamp forks 33a of comb teeth-shaped of conveyer device 31,33b.
<control portion>
As shown in Figures 1 and 2, each constituting portion bakeing processing system 100 is configured to control portion 50 even
Connect and controlled by control portion 50.Control portion 50 include having the controller 51 of CPU, user interface 52 and
Storage part 53.Controller 51 has computer function, in bakeing processing system 100, and overall control example
Such as vacuum(-)baking device (VB) 1, load-lock (LL) 20, conveyer device 11, conveyer device
31 each constituting portion such as grade.User interface 52 by process management personnel in order to manage baking processing system 100 and
The keyboard of the input operation etc. carrying out instructing, visualization display bakee the operational situation of processing system 100
Display etc. are constituted.Storage part 53 is preserved and have recorded for getting off realization in the control of controller 51
The control program (software) of various process of execution, treatment conditions data etc. in bakeing processing system 100
Fabrication procedures.User interface 52 and storage part 53 are connected to controller 51.
Further, as required, recall arbitrarily from storage part 53 according to the instruction etc. from user interface 52
Fabrication procedures is also performed by controller 51, thus under the control of controller 51, carries out bakeing processing system
Desired process in 100.The fabrication procedures such as described control program, treatment conditions data can utilize place
In being stored in the storage medium of embodied on computer readable, such as CD-ROM, hard disk, floppy disk, flash memory etc.
The fabrication procedures of state.Or, it is also possible to transmit at any time from other device by such as special circuit and join
Machine utilizes.
Vacuum(-)baking device (VB) is structurally and functionally
It follows that with reference to Fig. 3 A, Fig. 3 B and Fig. 3 C to the structure of vacuum(-)baking device (VB) 1 and
Effect is described in detail.Fig. 3 A, Fig. 3 B are cuing open of the vacuum(-)baking device for single sheet type is described
View.Fig. 3 A represent make movable pin 5 increase and movable pin 5 and conveyer device 11 clamp forks 13a (or
Clamp forks 13b) between carry out the state of handing-over of substrate S.Fig. 3 B represents that the state from Fig. 3 A makes movably
The state that pin 5 declines and utilizes heating plate 3 to heat substrate S.
Vacuum(-)baking device (VB) 1 is by constituting, including diapire 1a, top by evacuated pressure vessel
Wall 1c and four sidewall 1b.Sidewall 1b is provided with gas introduction part 2a for importing non-active gas
And exhaust portion 2b.Being configured to, gas introduction part 2a is connected with non-active gas source 61, it is possible to vacuum
Such as N is imported in curing range (VB) 12, the non-active gas such as Ar.Msy be also constructed to, exhaust portion
2b is connected with exhaust apparatus 63, by drive this exhaust apparatus 63 and can be by vacuum(-)baking device (VB)
Pressure in 1 is vented to several Pa.Additionally, be provided with on sidewall 1b for by substrate S-phase for device
Interior input, the peristome 2c of output.
As it has been described above, be configured with heating plate 3 in the inside of vacuum(-)baking device (VB) 1.Heating plate 3 by
Not shown pillar supporting, is fixed on diapire 1a.Omissions of detail part, but heating plate 3 is such as resistance
The heater of heated type, or utilize the mode of heating of thermostat (Japanese: チ ラ), by by power supply
65 are set to out (ON) and are heated to the temperature of regulation.
Heating plate 3 is formed multiple through hole 3a, is inserted with for supporting base in this through hole 3a
The movable pin 5 of plate S.Each movable pin 5 is fixed on a lift component 67.Lift component 67 is had example
If the lifting drive division 69 of ball screw framework etc. is can support in the way of upper and lower displacement.At lift component
Between 67 and diapire 1a, to be configured with such as corrugated tube 68 in the way of each movable pin 5, it is ensured that
Air-tightness around through hole 3a.Drive lifting drive division 69, make lift component 67 and multiple movable pin
5 oscilaltion displacements such that it is able to the heating location shown in the delivery position shown in Fig. 3 A and Fig. 3 B it
Between adjust substrate S height and position.Additionally, make the mechanism of substrate S lifting displacement be not limited to the mechanism of diagram.
The characteristic of EL layer is had an impact by known baking conditions, baking environment.Such as, when bakeing, if
Produce non-uniform temperature in the face of substrate S, then the characteristic of the organic EL element in the face of substrate S is sometimes
Deviation can be produced.Additionally, when bakeing, the organic material from substrate S in large quantities such as solvent, moisture
Film volatilizees.Therefore, if removing the most rapidly these volatile ingredients in vacuum(-)baking device (VB) 1,
The most likely produce the harmful effect such as oxidized grade of the organic functions film after bakeing.Especially in order to improve life
Produce efficiency and in the case of multiple substrate S being carried out baking process simultaneously, in order to not by from other substrates S
The impact of the composition evaporated, preferably rapidly carries out the aerofluxus in vacuum(-)baking device (VB) 1.
If the management of these baking conditions, baking environment is abundant not, then can become as organic el display
Cause during use and show the bad reasons such as uneven.
As shown in Figure 3 B, on the heating location after making substrate S decline, vacuum(-)baking device (VB) 1
Power supply 65 is set to out (ON), and what substrate S utilized heating plate 3 adds hot baked.Now, drive
Exhaust apparatus 63, thus the pressure in vacuum(-)baking device (VB) 1 is vented to below atmospheric pressure,
In more than preferably 133Pa (1Torr) and 66500Pa (500Torr) scope below.Like this,
Baking process is carried out with becoming vacuum state such that it is able to will be from making vacuum(-)baking device (VB) 1
The volatile ingredient of organic material film is rapidly vented to outside device, and, even if not using substantial amounts of non-live
Property gas also be able to prevent the organic material film oxidation that is printed upon the surface of substrate S.
Moreover it is preferred that during bakeing, substrate S not surface with heating plate 3 contacts, by can
Under the state that untie-sell 5 carries, substrate S is with in the scope of such as more than 0.1mm and below 10mm
It is spaced the surface with heating plate 3 to separate.Generally by hot air circulation mode, heating plate mode, far infrared
Modes etc. add the mode of hot substrate S as baking in processing.Wherein, from can efficiently and uniformly add hot radical
From the viewpoint of plate S is such, preferably heating plate.But, along with the maximization of substrate S, because of heating
And the warpage of the substrate S produced also becomes big, the heating hence with common heating plate is difficult to maintain substrate S
Face in uniformity.Therefore, in the present embodiment, not by direct for substrate S during baking processes
It is placed in the surface of heating plate 3 but makes substrate S separate with the surface of heating plate 3.Thus, though substrate S
Warpage is produced, it is also possible in the face of substrate S, realize uniform heat treated due to heating.
Additionally, in the present embodiment, during bakeing, it is also possible to from non-active gas source 61 to vacuum
Such as N is imported in curing range (VB) 12, the non-active gas such as Ar, He.Import non-active gas,
It is thus possible to improve the substrate S efficiency of heating surface under vacuum.
Fig. 3 C represents the outline cross section of vacuum(-)baking device (VB) 1A of variation.True shown in Fig. 3 C
Empty curing range (VB) 1A is batch type, it is possible to accommodates two substrate S simultaneously and carries out baking process.
In fig. 3 c, the reference identical to the structure mark identical with Fig. 3 A, Fig. 3 B, omit movable pin 5
Elevating mechanism, the diagram of power supply of heating plate 3.As shown in Figure 3 C, multiple substrates S is configured to multilamellar
And carry out baking process in the lump such that it is able to improve the productivity ratio bakeing processing system 100, additionally it is possible to joint
The about installation space of device.Additionally, the number carrying out the substrate S of baking process is not limited to two simultaneously
, it is also possible to it is more than three.
Configure the true of the such as single sheet type shown in Fig. 3 A, Fig. 3 B in addition it is also possible to upper and lower multilayer laminatedly
Empty curing range (VB) 1 replaces batch type.
Load-lock (LL) is structurally and functionally
It follows that with reference to Fig. 4 A, Fig. 4 B and Fig. 4 C to the structure of load-lock (LL) 20 and
Effect is described in detail.Fig. 4 A, Fig. 4 B are the section views of the load-lock for single sheet type is described
Figure.The load-lock (LL) 20 of present embodiment is except having as vacuum load lock device
Outside function, also there is the function that substrate S carries out cooling process, further have being formed at base
Organic material film on plate S carries out the function of drying under reduced pressure process.Fig. 4 A represent make movable pin 23 increase and
The state of the handing-over of substrate S is carried out between movable pin 23 and clamp forks 13a (or clamp forks 13b).Figure
4B represents that the state from Fig. 4 A makes movable pin 23 decline and utilizes coldplate 21 to cool down substrate S
State or the organic material film on substrate S is carried out the state of drying under reduced pressure.
Load-lock (LL) 20 by can evacuated pressure vessel constitute, including diapire 20a,
Roof 20c and four sidewall 20b.Roof 20c is provided with and leads for the gas importing non-active gas
Enter portion 20d.Sidewall 20b is provided with exhaust portion 20e.Additionally, exhaust portion can also be located on diapire 20a.
Gas introduction part 20d is configured to be connected with non-active gas source 71, it is possible to load-lock (LL)
Such as N is imported in 202, the non-active gas such as Ar, He.Additionally, exhaust portion 20e is configured to fill with aerofluxus
Put 73 connections, by drive this exhaust apparatus 73 and can be by the pressure in load-lock (LL) 20
Decompression exhaust is to tens of about Pa or 0.1Pa.Additionally, be provided with on sidewall 20b relative to each other for
By substrate S-phase for peristome 2f, 2g of inputting in device, exporting.
As it has been described above, be configured with coldplate 21 in the inside of load-lock (LL) 20.Coldplate 21
It is fixed on diapire 20a.In the inside of coldplate 21, there is refrigerant flow path 21c.It is configured to, from cold-producing medium
Source 75 supplies arbitrary cold-producing medium to this refrigerant flow path 21c and makes refrigerant cycle such that it is able to make cold
But the overall cooling of plate 21.Cold (the Japanese: バ ッ Network Network of the back of the body is made additionally, have in the inside of coldplate 21
リ Application グ) gas be detained gas delay portion 21d.This gas delay portion 21d be formed at coldplate
Multiple gas squit hole 21b connection of the upper surface of 21.Additionally, gas delay portion 21d uses with back of the body cold air
Gas source 76 connect.
Additionally, be formed with multiple through hole 21a on coldplate 21, in this through hole 21a, it is inserted with use
Movable pin 23 in supporting substrates S.Each movable pin 23 is fixed on a lift component 77.Lift component
77 are had the lifting drive division 79 of such as ball screw framework etc. can support in the way of upper and lower displacement.
Between lift component 77 and diapire 20a, to be configured with such as ripple in the way of each movable pin 23
Pipe 78, it is ensured that the air-tightness around through hole 21a.Drive lifting drive division 79, make lift component 77
And multiple movable pin 23 oscilaltion displacement such that it is able at the delivery position shown in Fig. 4 A and Fig. 4 B
The height and position of substrate S is adjusted between shown down position.Additionally, make the mechanism of substrate S lifting displacement
It is not limited to the mechanism of diagram.
At the down position shown in Fig. 4 B, from cryogen source 75 the supply system cryogen, substrate S is utilized
The cooling of coldplate 21.Now, drive exhaust apparatus 73, thus by load-lock (LL) 20
In pressure be vented to more than below atmospheric pressure, preferably 400Pa (3Torr) and atmospheric pressure with
Under scope in.Like this, cool down with becoming vacuum state in making load-lock (LL) 20,
It is thus possible to prevent from being printed upon the organic material film oxidation on the surface of substrate S.
Moreover it is preferred that during cooling, substrate S not surface with coldplate 21 contacts, at quilt
Under the state that movable pin 23 carries, substrate S is with in the scope of such as more than 0.1mm and below 10mm
The surface of interval and coldplate 21 separate.In this case, more preferably spray from multiple gases
Hole 21b supplies the back of the body cold air such as such as He to the rear side of substrate S separate with the surface of coldplate 21.Picture
So, in the load-lock (LL) 20 of present embodiment, during cooling processes, not by base
Plate S is directly placed in the surface of coldplate 21, it is possible to utilize the supply of back of the body cold air to cool down.Cause
This, it is possible to increase the cooling effectiveness of substrate S, it is possible to uniformly and promptly cool down in the face of substrate S.
As it has been described above, in the present embodiment, additionally it is possible to by load-lock (LL) 20 for organic
The dried of material membrane.In the case of utilizing load-lock (LL) 20 withering,
When substrate S is carry by movable pin 23, with the scope of such as more than 0.1mm and below 10mm
Interior interval keeps substrate S dividually with the surface of coldplate 21.Further, from non-active gas source
71 to the non-active gas of load-lock (LL) 20 supply ormal weight, by driving aerofluxus to fill
Put 73 and the pressure in load-lock (LL) 20 is vented to the vacuum of regulation, such as
Below 0.1Pa.In such manner, it is possible at the drying under reduced pressure of solvent in the organic material film removed on substrate S
Reason utilizes load-lock (LL) 20.
As it has been described above, in the baking processing system 100 of present embodiment, except by load-lock
(LL) 20 as the function of the loadlock of the switching switched between atmospheric pressure state and vacuum state
Outside, additionally it is possible to the function as vacuum cooling unit, and then can also be as decompression dry device
And function.It is being carried out continuously the switching of atmospheric pressure state and vacuum state, cold thus, it is possible to improve
But productivity ratio when process and dried, and simplify the apparatus structure of system, also a saving dress
The installation space put.
On the other hand, Fig. 4 C represents the outline cross section of load-lock (LL) 20A of variation.Figure
Load-lock (LL) 20A shown in 4C is batch type, it is possible to accommodates two substrate S simultaneously and goes forward side by side
Row cooling process, drying under reduced pressure process.In figure 4 c, to the structure mark identical with Fig. 4 A, Fig. 4 B
Identical reference, omits the elevating mechanism of movable pin 23, cryogen source, the importing machine of back of the body cold air
The diagram of structure etc..As shown in Figure 4 C, multiple substrates S it is configured to multilamellar and accommodates in the lump, carrying out air
Switching between pressure condition and vacuum state, and carry out cooling process, drying under reduced pressure process such that it is able to
Improve the productivity ratio bakeing processing system 100 further, additionally it is possible to the significantly installation space of saver.
Additionally, the number carrying out the substrate S of baking process is not limited to two simultaneously, it is also possible to be three with
On.
Configure adding of the such as single sheet type shown in Fig. 4 A, Fig. 4 B in addition it is also possible to upper and lower multilayer laminatedly
Carry interlock (LL) 20 and replace batch type.
It follows that the action to bakeing processing system 100 as constructed as above illustrates.First, as
Last stage, the inkjet-printing device (IJ) 200 outside utilization is printed with on substrate S with the pattern of regulation
Machine material membrane.The conveyer device 201 utilizing the inkjet-printing device (IJ) 200 being attached to outside will print
The substrate S organic material film exports and is positioned in the abutment wall 43 of buffer table 41.Drive conveyer device
Clamp forks 33a (or clamp forks 33b) of 31 and make its substrate S received on this buffer table 41 that retreats.
It follows that when opening the gate valve GV3 of atmospheric side, substrate S is joined from conveyer device 31
Movable pin 23 to load-lock (LL) 20.
After making clamp forks 33a (or clamp forks 33b) keep out of the way, the substrate 3 on movable pin 23 is made to decline,
And closing gate valve GV3.Afterwards, by aerofluxus in load-lock (LL) 20, inner pressure relief is arrived
The vacuum of regulation.Now, by aerofluxus in load-lock (LL) 20 while regulating pressure,
It is thus possible to implement to remove the dried of the solvent contained in organic material film.In this dried operation
In, it is also possible in load-lock (LL) 20, import non-active gas.
It follows that make the substrate S on movable pin 23 rise to delivery position, and open conveying chamber (TR)
Gate valve GV2 between 10 and load-lock (LL) 20.Then, the forked of conveyer device 11 is utilized
Part 13a (or clamp forks 13b) receives the substrate S being housed inside load-lock (LL) 20.
It follows that utilize clamp forks 13a (clamp forks 13b) of conveyer device 11, opening gate valve GV1
State under any input substrate S in three vacuum(-)baking devices (VB) 1 substrate S is transferred to
Have been raised to the movable pin 5 of delivery position.It follows that closing gate valve GV1, movable pin 5 is made to decline and adjust
Interval between the surface of joint and heating plate 3, with rated condition to base in vacuum(-)baking device (VB) 1
Plate S implements baking and processes.For making organic material film to the organic functions film change used in organic EL
Stoving temperature the most such as more than 250 DEG C and less than 300 DEG C scope in, bakee the time preferred
It it is such as about 1 hour.During baking processes, preferably by vacuum(-)baking device (VB) 1
It is depressurized to below atmospheric pressure.Furthermore it is preferred that while supply nonactive in vacuum(-)baking device (VB) 1
Gas is while carrying out baking process.Baking processes an end, turns on gate valve GV1, makes on movable pin 5
Rise, substrate S is handed off to from movable pin 5 clamp forks 13a (or clamp forks 13b) of conveyer device 11, from
Substrate S is exported by vacuum(-)baking device (VB) 1.
Then, by substrate S with path input load-lock (LL) 20 contrary to the above.Bakee
Substrate S after process is in the state being heated, therefore, it is possible in load-lock (LL) 20
Carry out cooling process.Cooling process in, make the movable pin 23 of load-lock (LL) 20 decline and
Adjust and coldplate 21 between interval and keep the stipulated time.During cooling processes, from coldplate 21
Gas squit hole 21b is to the back side of substrate S supply back of the body cold air such that it is able to improve cooling effectiveness, it is possible to
Uniform cooling process is carried out in the face of substrate S.Cooling one end, just makes load-lock (LL)
Pressure in 20 rises to atmospheric pressure.Then, open gate valve GV3, and again make on movable pin 23
Substrate S rises to delivery position, by conveyer device 31, substrate S returns to such as buffer table 41.In order to
Carry out utilizing the formation process of the ensuing organic material film of inkjet-printing device (IJ) 200, outside
Other operation, exports substrate S from bakeing processing system 100.
In above-mentioned operation, additionally it is possible to carry in the lump and process multiple substrates S simultaneously.Such as, utilize
Conveyer device 31 and conveyer device 11 carry multiple such as two substrate S simultaneously, and loading are interlocked
Device (LL) 20 and vacuum(-)baking device (VB) 1 are such as set to as shown in Fig. 3 C, Fig. 4 C
Batch type or be configured to multilamellar such that it is able to improve production efficiency.
[being applied to the application examples of the manufacturing process of organic EL element]
In the manufacture of organic EL element, between the anode and cathode, formed as EL layer multiple organic
Functional membrane.The baking processing system 100 of present embodiment is for the organic EL element of arbitrary stepped construction
Manufacture all can apply.Here, as EL layer, enumerate manufacture and have that " hole injection layer/hole is defeated
Send layer/luminescent layer/electron supplying layer/electron injecting layer " the situation of organic EL element, baking is processed system
Concrete process step in system 100 illustrates.
Fig. 5 represents the outline of the manufacturing process of organic EL element.In this example, organic EL element utilizes
The operation manufacture of STEP (step) 1～STEP8.In STEP1, substrate S utilizes and is such as deposited with
Methods etc. form anode (pixel electrode) with the pattern of regulation.Next in STEP2, between anode
Form the partition wall (bank) formed by insulant.Such as photosensitive polyimide resin can be used contour
Molecular material is as the insulant for forming partition wall.
It follows that in STEP3, form hole injection layer on the anode formed by STEP1.First
First, use inkjet-printing device (IJ) 200 to print on the anode marked off by each partition wall and become empty
The organic material of the material of cave input layer.Processing system 100 is bakeed to printing like this it follows that use
The organic material film gone out carries out drying under reduced pressure process and the baking in an atmosphere removed for solvent successively
Roasting processes, thus forms hole injection layer.
It follows that in STEP4, form cavity conveying on the hole injection layer formed by STEP3
Layer.First, use inkjet-printing device (IJ) 200 to print on hole injection layer and become cavity conveying
The organic material of the material of layer.In bakeing processing system 100, to the organic material printed like this
Film carries out processing for the drying under reduced pressure that solvent is removed and vacuum(-)baking process successively, thus forms hole
Transfer layer.
It follows that in STEP5, form luminescent layer on the hole transporting layer formed by STEP4.
First, use inkjet-printing device (IJ) 200 to print on hole transporting layer and become the material of luminescent layer
Organic material.In bakeing processing system 100, the organic material film printed like this is entered successively
Row processes for the drying under reduced pressure that solvent is removed and vacuum(-)baking processes, thus forms luminescent layer.Additionally,
In the case of luminescent layer is made up of multiple layers, repeat the above.
It follows that utilize such as vapour deposition method, sequentially form on luminescent layer electron supplying layer (STEP6),
Electron injecting layer (STEP7) and negative electrode (STEP8), thus obtain organic EL element.
In the manufacturing process of such organic EL element, bakeing processing system 100 can be preferably applied to
STEP3 (formation hole injection layer), STEP4 (formation hole transporting layer) and STEP5 (are formed and send out
Photosphere).That is, use inkjet-printing device (IJ) 200, print the last stage of each layer, the most organic material
After material film, in load-lock (LL) 20, carry out drying under reduced pressure process, it follows that in vacuum
In curing range (VB) 1, STEP3 (formation hole injection layer) under atmospheric pressure can bakee
Processing, STEP4 (formation hole transporting layer) and STEP5 (formation luminescent layer) is under vacuum
Baking process can be carried out.
As it has been described above, bakee processing system 100 by using, thus in the manufacturing process of organic EL element
In, it is possible to continuously high production rate and carry out the drying under reduced pressure for forming EL layer expeditiously and process and bakee
Process.Especially, in above-mentioned STEP4 (formation hole transporting layer), STEP5 (formation luminescent layer),
Need in order to avoid the oxidation of organic material under hypoxic atmosphere, carry out baking process, it is therefore preferable that make
Vacuum(-)baking process is carried out with bakeing processing system 100.In this case, processing system 100 is being bakeed
In, in vacuum(-)baking device (VB) 1 and load-lock (LL) 20, it is able to maintain that vacuum atmosphere
Ground enforcement vacuum(-)baking continuously processes and the drying under reduced pressure of its last stage processes, therefore, it is possible to seek to improve life
Produce efficiency.Additionally, in bakeing processing system 100, in load-lock (LL) 20, except
Switching vacuum/atmospheric pressure, also carries out drying under reduced pressure process and cooling processes, so also being able to saver
Installation space.
[the 2nd embodiment]
It follows that the baking processing system of the 2nd embodiment of the present invention is illustrated with reference to Fig. 6.Figure
6 is the top view of baking processing system 100A being diagrammatically denoted by the 2nd embodiment.The 1st embodiment party
In the baking processing system 100 of formula, it is configured to carry out drying under reduced pressure in load-lock (LL) 20
Process.On the other hand, in baking processing system 100A of present embodiment, with load-lock
(LL) 20 phases are provided with the special decompression dry device (VD) for carrying out drying under reduced pressure process independently
210.It follows that to say centered by the distinctive points of the baking processing system 100 of the 1st embodiment
Bright, in baking processing system 100A of present embodiment, to the structure mark identical with the 1st embodiment
Note identical reference, omit the description.
As shown in Figure 6, bakee processing system 100A to include: vacuum(-)baking device (VB) 1, it is used for
With atmospheric pressure pressure below, the inkjet-printing device (IJ) 200 outside utilizing is formed on substrate S
Organic material film carries out roasting；Conveyer device 11 (with reference to Fig. 2), it, as the 1st conveyer device, is used for
Substrate S is transported to vacuum(-)baking device (VB) 1；Conveying chamber (TR) 10, it can be evacuated,
It is disposed adjacent with vacuum(-)baking device 1, is used for accommodating conveyer device 11；And load-lock (LL)
20, consist of and be disposed adjacent with conveying chamber (TR) 10, it is possible to atmospheric pressure state and vacuum state it
Between switch.Include additionally, bakee processing system 100A: the 2nd conveyer device 31, it is defeated that it is configured at substrate
Send the portion being positioned between inkjet-printing device (IJ) 200 and load-lock (LL) 20 in path
Point, at least some of in this substrate transport path, carry out the handing-over of substrate S；With multiple decompressions
Drying device (VD) 210, its be arranged at inkjet-printing device (IJ) the 200 and the 2nd conveyer device 31 it
Between.
<decompression dry device>
Decompression dry device (VD) 210 is known structure, therefore omits detailed description, and it includes
Such as: processing container, it can be evacuated；Workbench, it is mounting substrate in reason container in this place
S；Exhaust apparatus, it is for being exhausted in this process container；Peristome, it is for by substrate S
Relative to inputting in this process container, exporting；And gate valve, it is used for this peristome of opening and closing.In this reality
Executing in mode, two decompression dry devices (VD) 210 in pairs, are provided with total totally four drying under reduced pressure dresses
Put (VD) 210.
<conveyer device>
As shown in Figure 6, between decompression dry device (VD) 210, it is provided with for dry to each decompression
3rd conveyer device 221 of dry device (VD) 210 conveying substrate S.This conveyer device 221 includes: forked
Part 223a and clamp forks 223b, it is arranged on two-layer ground such as up and down；Support 225, it is can make fork
The mode that shape part 223a, 223b pass in and out, keep out of the way and rotate supports this clamp forks 223a, 223b；Drive
Mechanism's (diagram is omitted), it is used for driving this support 225；And guide rail 227.Support 225 along
Guide rail 227 moves, it is possible between four decompression dry devices (VD) 210 and with buffer table 41A,
Conveying substrate S between 41B.
<buffer table>
Baking processing system 100A of Fig. 6 has two in the position that conveyer device 221 can join substrate S
Individual buffer table 41A, 41B.Wherein a buffer table 41A be bakee processing system 100 and outside device,
Such as join interim storeroom during substrate S between inkjet-printing device 200.Another buffer table 41B be
Bakee when joining substrate S between conveyer device 221 and the conveyer device 31 in processing system 100A is interim
Storeroom.The structure of buffer table 41A, 41B is identical with the 1st embodiment.
It follows that the action to baking processing system 100A configured as described illustrates.First,
As the last stage, beat on substrate S with the pattern of regulation in outside inkjet-printing device (IJ) 200
Print organic material film.The substrate S that have printed organic material film is attached to the inkjet-printing device (IJ) of outside
The conveyer device 201 of 200 exports, and is positioned in the abutment wall 43 of buffer table 41A.Drive conveyer device 221
Clamp forks 223a (or clamp forks 223b) and make its substrate S received on this buffer table 41A that retreats.
It follows that when opening gate valve, substrate S is handed off to drying under reduced pressure dress from conveyer device 221
Put the workbench (diagram is omitted) of (VD) 210.
It follows that close the gate valve of decompression dry device (VD) 210, to decompression dry device (VD)
It is exhausted in 210, by the vacuum of inner pressure relief to regulation such that it is able to implement to remove organic material
The dried of the solvent comprised in film.Additionally, in dried operation, it is also possible to drying under reduced pressure
Device (VD) 210 imports non-active gas.
After dried terminates, open the gate valve of decompression dry device (VD) 210, utilize conveying
Device 221 is by substrate S transfer to the abutment wall 43 of buffer table 41B.Drive the clamp forks of conveyer device 31
33a (or clamp forks 33b) and make its substrate S received on this buffer table 41B that retreats.It follows that
Open under the state of gate valve GV3 of atmospheric side, be handed off to load interlocking from conveyer device 31 by substrate S
The movable pin 23 of device (LL) 20.
After making clamp forks 33a (or clamp forks 33b) keep out of the way, the substrate S on movable pin 23 is made to decline,
And closing gate valve GV3.Afterwards, by aerofluxus in load-lock (LL) 20, inner pressure relief is arrived
The vacuum of regulation.
It follows that make the substrate S on movable pin 23 rise to delivery position, and open conveying chamber (TR)
Gate valve GV2 between 10 and load-lock (LL) 20.Then, the forked of conveyer device 11 is utilized
Part 13a (or clamp forks 13b) receives the substrate S being housed inside load-lock (LL) 20.
It follows that utilize clamp forks 13a (clamp forks 13b) of conveyer device 11, opening gate valve GV1
State under any input substrate S in three vacuum(-)baking devices (VB) 1 substrate S is transferred to
Have been raised to the movable pin 5 of delivery position.It follows that closing gate valve GV1, movable pin 5 is made to decline and adjust
Interval between the surface of joint and heating plate 3, with rated condition to base in vacuum(-)baking device (VB) 1
Plate S implements baking and processes.For making organic material film to the organic functions film change used in organic EL
Stoving temperature the most such as more than 250 DEG C and less than 300 DEG C scope in, bakee the time preferred
It it is such as about 1 hour.During baking processes, preferably by vacuum(-)baking device (VB) 1
It is depressurized to below atmospheric pressure.Furthermore it is preferred that while supply nonactive in vacuum(-)baking device (VB) 1
Gas is while carrying out baking process.Baking processes an end, turns on gate valve GV1, makes on movable pin 5
Rise, substrate S is handed off to from movable pin 5 clamp forks 13a (or clamp forks 13b) of conveyer device 11, from
Substrate S is exported by vacuum(-)baking device (VB) 1.
Then, by substrate S with path input load-lock (LL) 20 contrary to the above.Bakee
Substrate S after process is in the state being heated, therefore, it is possible in load-lock (LL) 20
Carry out cooling process.Cooling process in, make the movable pin 23 of load-lock (LL) 20 decline and
Adjust and coldplate 21 between interval and keep the stipulated time.During cooling processes, from coldplate 21
Gas squit hole 21b is to the back side of substrate S supply back of the body cold air such that it is able to improve cooling effectiveness, it is possible to
Uniform cooling process is carried out in the face of substrate S.Cooling processes an end, just makes load-lock
(LL) pressure of 20 rises to atmospheric pressure.Then, open gate valve GV3, and again make movable pin 23
On substrate S rise to delivery position, by conveyer device 31, substrate S returned to such as buffer table 41B.
Further, use conveyer device 221 by substrate S to buffer table 41A transfer.In order to carry out utilizing inkjet printing
The formation process of the ensuing organic material film of device (IJ) 200, other outside operation, by substrate
S is from bakeing the output of processing system 100A.
In above-mentioned operation, additionally it is possible to carry in the lump and process multiple substrates S simultaneously.Such as, utilize
Conveyer device 221, conveyer device 31 and conveyer device 11 carry multiple such as two substrate S simultaneously, and
And by decompression dry device (VD) 210, load-lock (LL) 20 and vacuum(-)baking device (VB)
1 is such as set to batch type as shown in Fig. 3 C, Fig. 4 C or is configured to multilamellar such that it is able to improve raw
Produce efficiency.
Other structure and the effect of present embodiment are identical with the 1st embodiment.
In detail embodiments of the present invention are illustrated with the purpose illustrated above, but the present invention is also
It is not limited to above-mentioned embodiment, it is possible to various deformation.Such as, the manufacturing process of organic EL element does not limits
Operation illustrated in Fig. 5, even if such as EL layer has from anode-side according to " hole transporting layer/luminescent layer
/ electron supplying layer ", the order stacking such as " hole injection layer/hole transporting layer/luminescent layer/electron supplying layer " and
In the case of the structure become, the baking processing system 100 of the present invention, 100A can be applied too.
Additionally, the baking processing system 100 shown in Fig. 1, Fig. 6, the structure of 100A, layout are only
Illustrate, the configuration of vacuum(-)baking device (VB) 1, decompression dry device (VD) 210 etc., number etc.
Can suitably change.
This international application requires to go out to be willing to based in Japanese Patent filed in 25 days July in 2012
The priority of No. 2012-164541, refers to the application by the entire disclosure of which.
Claims (23)
1. a baking processing system, wherein,
This baking processing system includes:
Curing range, it is used for atmospheric pressure pressure below utilizing inkjet-printing device to be formed at substrate
On organic material film carry out roasting；
1st conveyer device, it is for carrying aforesaid substrate to above-mentioned curing range；
Conveying chamber, it can be evacuated, and is disposed adjacent with above-mentioned curing range, is used for accommodating the above-mentioned 1st
Conveyer device；
Load-lock, consists of and is disposed adjacent with above-mentioned conveying chamber, it is possible at atmospheric pressure state and
Switch between vacuum state；And
2nd conveyer device, what it was configured in substrate transport path be positioned at above-mentioned inkjet-printing device and upper
State the part between load-lock, for this substrate transport path at least some of in carry out
State the handing-over of substrate,
Wherein, above-mentioned load-lock has:
Coldplate, it is for cooling down the aforesaid substrate of the inside being contained in this load-lock；And
Multiple movable pins, it is can set in the way of highlighting relative to the surface of above-mentioned coldplate or submerge
Put, for cooling down the period separate state in surface with aforesaid substrate Yu above-mentioned coldplate of aforesaid substrate
Supporting aforesaid substrate.
Baking processing system the most according to claim 1, wherein,
Above-mentioned curing range has:
Heating plate, it is used for heating aforesaid substrate；
Multiple movable pins, it is can set in the way of highlighting relative to the surface of above-mentioned heating plate or submerge
Put, for heating the period separate state in surface with aforesaid substrate Yu above-mentioned heating plate of aforesaid substrate
Supporting aforesaid substrate.
Baking processing system the most according to claim 2, wherein,
It is located at interval at more than 0.1mm and below 10mm between surface and the aforesaid substrate of above-mentioned heating plate
In the range of.
Baking processing system the most according to claim 2, wherein,
Above-mentioned curing range is connected with exhaust apparatus, for being adjusted to by the pressure in this curing range
More than 133Pa and below 66500Pa also carry out roasting.
Baking processing system the most according to claim 4, wherein,
Roasting is carried out in non-active gas is imported above-mentioned curing range.
Baking processing system the most according to claim 1, wherein,
It is located at interval at more than 0.1mm and below 10mm between surface and the aforesaid substrate of above-mentioned coldplate
In the range of.
Baking processing system the most according to claim 1, wherein,
Above-mentioned load-lock is connected with exhaust apparatus, for being adjusted by the pressure in this load-lock
Whole for below more than 400Pa and atmospheric pressure and cool down aforesaid substrate.
Baking processing system the most according to claim 1, wherein,
Above-mentioned load-lock is also as to being formed at the inside that is contained in above-mentioned load-lock
Above-mentioned organic material film on aforesaid substrate carries out the decompression dry device function of drying under reduced pressure.
Baking processing system the most according to claim 1, wherein,
This baking processing system also includes decompression dry device, and it is used for making to utilize above-mentioned inkjet-printing device
The above-mentioned organic material film being formed on aforesaid substrate is dried.
Baking processing system the most according to claim 1, wherein,
Above-mentioned curing range is used for accommodating multiple aforesaid substrates simultaneously and processing.
11. baking processing systems according to claim 10, wherein,
Above-mentioned load-lock accommodates multiple aforesaid substrates for simultaneously.
12. baking processing systems according to claim 11, wherein,
Above-mentioned 1st conveyer device is for the most defeated between above-mentioned curing range and above-mentioned load-lock
Give multiple aforesaid substrates.
13. baking processing systems according to claim 1, wherein,
It is adjacent to be configured with multiple above-mentioned curing range with above-mentioned conveying chamber.
14. baking processing systems according to claim 13, wherein,
A list is constituted by above-mentioned conveying chamber, above-mentioned load-lock and multiple above-mentioned curing range
Unit, and above-mentioned 2nd conveyer device for carrying out the conveying of aforesaid substrate to multiple said units.
15. 1 kinds of baking processing systems, wherein,
This baking processing system includes:
Decompression dry device, it is for the organic material film utilizing inkjet-printing device to be formed on substrate
Carry out drying under reduced pressure process；
Curing range, it roasts after processing at above-mentioned drying under reduced pressure under non-active gas atmosphere
Burn；
1st conveyer device, it is for carrying aforesaid substrate to above-mentioned curing range；
Conveying chamber, it is disposed adjacent with above-mentioned curing range, is used for accommodating above-mentioned 1st conveyer device；
Load-lock, consists of and is disposed adjacent with above-mentioned conveying chamber, it is possible at atmospheric pressure state and
Switch between vacuum state；And
2nd conveyer device, what it was configured in substrate transport path be positioned at above-mentioned decompression dry device and upper
State the part between load-lock, for this substrate transport path at least some of in carry out
State the handing-over of substrate.
16. baking processing systems according to claim 15, wherein,
Above-mentioned curing range has:
Heating plate, it is used for heating aforesaid substrate；
Multiple movable pins, it is can set in the way of highlighting relative to the surface of above-mentioned heating plate or submerge
Put, for heating the period separate state in surface with aforesaid substrate Yu above-mentioned heating plate of aforesaid substrate
Supporting aforesaid substrate.
17. baking processing systems according to claim 16, wherein,
It is located at interval at more than 0.1mm and below 10mm between surface and the aforesaid substrate of above-mentioned heating plate
In the range of.
18. baking processing systems according to claim 16, wherein,
Above-mentioned curing range is connected with exhaust apparatus, for being adjusted to by the pressure in this curing range
More than 133Pa and below 66500Pa also carry out roasting.
19. baking processing systems according to claim 15, wherein,
Above-mentioned load-lock has:
Coldplate, it is for cooling down the aforesaid substrate of the inside being contained in this load-lock；And
Multiple movable pins, it is can set in the way of highlighting relative to the surface of above-mentioned coldplate or submerge
Put, for cooling down the period separate state in surface with aforesaid substrate Yu above-mentioned coldplate of aforesaid substrate
Supporting aforesaid substrate.
20. baking processing systems according to claim 19, wherein,
It is located at interval at more than 0.1mm and below 10mm between surface and the aforesaid substrate of above-mentioned coldplate
In the range of.
21. baking processing systems according to claim 19, wherein,
Above-mentioned load-lock is connected with exhaust apparatus, for being adjusted by the pressure in this load-lock
Whole for below more than 400Pa and atmospheric pressure and cool down aforesaid substrate.
22. baking processing systems according to claim 15, wherein,
Above-mentioned curing range is used for accommodating multiple aforesaid substrates simultaneously and processing.
23. baking processing systems according to claim 22, wherein,
Above-mentioned load-lock accommodates multiple aforesaid substrates for simultaneously.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610591115.1A CN106206378B (en) | 2012-07-25 | 2013-06-11 | Decompression drying device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012164541A JP6181358B2 (en) | 2012-07-25 | 2012-07-25 | Baking process system and method for producing laminate of organic functional film of organic EL element |
| JP2012-164541 | 2012-07-25 | ||
| PCT/JP2013/066044 WO2014017194A1 (en) | 2012-07-25 | 2013-06-11 | Bake processing system |
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| CN201610591115.1A Division CN106206378B (en) | 2012-07-25 | 2013-06-11 | Decompression drying device |
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| CN104488358B true CN104488358B (en) | 2016-08-17 |
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| CN201380039479.3A Expired - Fee Related CN104488358B (en) | 2012-07-25 | 2013-06-11 | Bakee the manufacture method of the duplexer of the organic functions film of processing system and organic EL element |
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| JP (1) | JP6181358B2 (en) |
| KR (1) | KR101663005B1 (en) |
| CN (2) | CN106206378B (en) |
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| WO (1) | WO2014017194A1 (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| TWI584426B (en) | 2017-05-21 |
| TW201419467A (en) | 2014-05-16 |
| JP2014026764A (en) | 2014-02-06 |
| CN106206378B (en) | 2020-12-01 |
| CN104488358A (en) | 2015-04-01 |
| KR20150038252A (en) | 2015-04-08 |
| WO2014017194A1 (en) | 2014-01-30 |
| KR101663005B1 (en) | 2016-10-06 |
| JP6181358B2 (en) | 2017-08-16 |
| CN106206378A (en) | 2016-12-07 |
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