CN104488358A - Bake processing system - Google Patents
Bake processing system Download PDFInfo
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- CN104488358A CN104488358A CN201380039479.3A CN201380039479A CN104488358A CN 104488358 A CN104488358 A CN 104488358A CN 201380039479 A CN201380039479 A CN 201380039479A CN 104488358 A CN104488358 A CN 104488358A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
Abstract
A bake processing system (100) comprises: vacuum bake devices (VB) (1) which carry out firing, under pressure less than or equal to atmospheric pressure, on organic material film which is formed upon substrates (S) by an external inkjet printing device (IJ) (200); conveyance devices (11) which convey the substrates (S) to the vacuum bake devices (VB) (1); conveyance chambers (TR) (10) which house the conveyance devices (11) and are capable of evacuation; load-lock chambers (LL) (20) which are configured to be switchable between an atmospheric pressure state and a vacuum state; and a conveyance device (31) which is deployed on a substrate conveyance path between the inkjet printing device (IJ) (200) and the load-lock devices (LL) (20), and carries out a handoff of the substrates (S).
Description
Technical field
The present invention relates to one and cure treatment system, it can be used in such as in the manufacture process of organic EL element, carrying out curing of organic material film.
Background technology
Organic EL (Electro Luminescence) element is a kind of light-emitting component, it utilizes the luminescence of the organic compound produced because of circulating current, is the structure of the duplexer (being referred to as " EL layer " by this duplexer below) accompanying multiple organic functions film between pair of electrodes.At this, EL layer has such as from the structure that anode-side is laminated according to the order such as " hole transporting layer/luminescent layer/electron supplying layer ", " hole injection layer/hole transporting layer/luminescent layer/electron supplying layer " or " hole injection layer/hole transporting layer/luminescent layer/electron supplying layer/electron injecting layer ".
By according to every one deck on substrate evaporation, coating organic material, thus form EL layer.When forming high-precision fine pattern, thinking and utilizing ink-jet printing process to be favourable as coating process.
The organic material film on substrate is printed on because containing a large amount of solvents, therefore, need drying process to remove this solvent via ink-jet printing process.In addition, in order to remove in organic material film residual high boiling solvent and to the organic functions film change forming EL layer, need to cure process in hypoxic atmosphere, such as with heating temperatures 1 hours of 160 DEG C ~ about 250 DEG C.
As the manufacturing installation utilizing ink-jet printing process to form EL layer, in order to boost productivity, propose a kind of manufacturing installation (such as patent documentation 1, Japanese Unexamined Patent Publication 2003-142260 publication) being configured with hole injection layer apparatus for coating, hole injection layer drying device, more than one luminescent layer apparatus for coating and more than one luminescent layer drying device by transfer unit continuously.
In addition, in the formation of EL layer that make use of ink-jet printing process, in order to reach joint space-efficient object, also proposed a kind of can be coated with all kinds for the formation of EL layer ink Multihead-type ink discharge device and carry out being configured with between device that drying cures the manufacturing installation (such as patent documentation 2, Japanese Unexamined Patent Publication 2007-265715 publication) of base board delivery device.
In manufacturing installation disclosed in above-mentioned patent documentation 1,2, when curing process, in order to make to become hypoxic atmosphere in device, import N
2organic material film on one side on heated substrates.But, need the time of an about hours owing to curing process, therefore need a large amount of N
2, the reason that the cost becoming organic EL manufacturing process increases.Especially in recent years, length maximize more than 2 meters of such substrates, the internal volume that therefore there is curing range increases, N
2consumption increases such problem.
Summary of the invention
The invention provides a kind of when to ink-jet printing process, the organic material film be printed on large substrate cures process, can low cost and carry out process efficiently cure treatment system.
Treatment system of curing of the present invention comprises:
Curing range, it is for carrying out roasting with the pressure below atmospheric pressure to the organic material film utilizing inkjet-printing device to be formed on substrate;
1st conveying device, it is for carrying substrate to above-mentioned curing range;
Conveying chamber, it can be evacuated, and is disposed adjacent with above-mentioned curing range, for holding above-mentioned 1st conveying device;
Load-lock, consists of and is disposed adjacent with above-mentioned conveying chamber, can switch between atmospheric pressure state and vacuum state; And
2nd conveying device, it is configured at the part between above-mentioned inkjet-printing device and above-mentioned load-lock in substrate transport path, for this substrate transport path at least partially in carry out the handing-over of substrate.
Cure in treatment system of the present invention, above-mentioned curing range also can have:
Heating plate, it is for heating aforesaid substrate;
Multiple movable pin, it is arranged in the mode that can give prominence to relative to the surface of above-mentioned heating plate or submerge, for the state support aforesaid substrate separated with substrate and the surface of above-mentioned heating plate during heating aforesaid substrate.In this case, between the surface of preferred above-mentioned heating plate and substrate be located at interval at more than 0.1mm and in the scope of below 10mm.
Treatment system of curing of the present invention also can be that above-mentioned curing range is connected with exhaust apparatus, for the pressure adjusting in this curing range being more than 133Pa and below 66500Pa carry out roasting.In this case, preferably non-active gas imported in above-mentioned curing range and carry out roasting.
Cure in treatment system of the present invention, above-mentioned load-lock also can have:
Coldplate, it is for cooling the aforesaid substrate of the inside being contained in this load-lock; And
Multiple movable pin, it is arranged in the mode that can give prominence to relative to the surface of above-mentioned coldplate or submerge, for during cooling base with the state support aforesaid substrate that substrate and the surface of above-mentioned coldplate separate.In this case, between the surface of preferred above-mentioned coldplate and substrate be located at interval at more than 0.1mm and in the scope of below 10mm.
Treatment system of curing of the present invention also can be that above-mentioned load-lock is connected with exhaust apparatus, for the pressure adjusting in this load-lock being more than 400Pa and cooling aforesaid substrate below atmospheric pressure.
Cure in treatment system of the present invention, preferably, above-mentioned load-lock also plays function as the decompression dry device organic material film be formed on the substrate of the inside being contained in above-mentioned load-lock being carried out to drying under reduced pressure.
Treatment system of curing of the present invention also can be also comprise decompression dry device, and this decompression dry device is dry for the organic material film making to utilize inkjet-printing device and be formed on substrate.
Cure in treatment system of the present invention, also can be, above-mentioned curing range be used for holding multiple substrates simultaneously and goes forward side by side row relax.
Cure in treatment system of the present invention, also can be, above-mentioned load-lock be used for holding multiple substrates simultaneously.
Cure in treatment system of the present invention, also can be, above-mentioned 1st conveying device be used for carrying multiple substrates between above-mentioned curing range and above-mentioned load-lock simultaneously.
Cure in treatment system of the present invention, also can be, be adjacent to configure multiple above-mentioned curing range with above-mentioned conveying chamber.In this case, also can be form a unit by above-mentioned conveying chamber, above-mentioned load-lock and three above-mentioned curing ranges, and above-mentioned 2nd conveying device be used for the conveying multiple said units being carried out to aforesaid substrate.
Adopt and of the present inventionly cure treatment system, in the manufacturing process of organic EL element, can N be suppressed
2consumption figure, continuously and high production rate ground carry out for the formation of EL layer drying process and ensuingly cure process.Therefore, adopt the present invention, the productivity ratio of the manufacturing process of organic EL element can be improved.
Accompanying drawing explanation
Fig. 1 is the vertical view curing the outline for the treatment of system representing the 1st execution mode of the present invention.
Fig. 2 is the horizontal cross of the major part representing Fig. 1.
Fig. 3 A is the cutaway view for illustration of vacuum(-)baking device.
Fig. 3 B is the cutaway view of another state for illustration of vacuum(-)baking device.
Fig. 3 C is the cutaway view of the variation for illustration of vacuum(-)baking device.
Fig. 4 A is the cutaway view for illustration of load-lock.
Fig. 4 B is the cutaway view of another state for illustration of load-lock.
Fig. 4 C is the cutaway view of the variation for illustration of load-lock.
Fig. 5 is the flow chart of the outline of the manufacturing process representing organic EL element.
Fig. 6 is the vertical view curing the outline for the treatment of system representing the 2nd execution mode of the present invention.
Embodiment
Next, with reference to accompanying drawing, embodiments of the present invention are described.
[the 1st execution mode]
Fig. 1 is the vertical view curing treatment system 100 roughly representing the 1st execution mode, and Fig. 2 is the horizontal cross of the major part (unit) of Fig. 1.That cures that treatment system 100 can be preferred for utilizing the organic material film of outside inkjet-printing device (IJ) 200 inkjet printing in the manufacture process of OLED display cures process.Cure treatment system 100 to comprise: vacuum(-)baking device (VB) 1, it is for carrying out roasting with the pressure below atmospheric pressure to the organic material film utilizing outside inkjet-printing device (IJ) 200 to be formed on substrate S; Conveying device 11 (with reference to Fig. 2), it is as the 1st conveying device, for being carried to vacuum(-)baking device (VB) 1 by substrate S; And conveying chamber (TR) 10, it can be evacuated, and is disposed adjacent with vacuum(-)baking device 1, for holding conveying device 11.In addition, cure treatment system 100 and also comprise: load-lock (LL) 20, consist of and be disposed adjacent with conveying chamber (TR) 10, can switch between atmospheric pressure state and vacuum state; And conveying device 31, it is as the 2nd conveying device, be configured at the part be positioned between inkjet-printing device (IJ) 200 and load-lock (LL) 20 in substrate transport path, this substrate transport path at least partially in carry out the handing-over of substrate S.
The structure > of a < unit
Curing in treatment system 100, multiple large-scale plant links and forms a unit for overlooking cross, multiple the gathering of this unit and form and cure treatment system 100.Curing in treatment system 100 illustrated in Fig. 1 comprises four unit 101A, 101B, 101C and 101D.A unit is in the multicell structure with three vacuum(-)baking devices (VB), 1, conveying chamber (TR), 10, load-lock (LL) 20.Be configured with conveying chamber (TR) 10 at the central portion of unit, be adjacent to be configured with three for curing the vacuum(-)baking device (VB) 1 that (roasting) processes to substrate S with its three sides.In addition, be adjacent to be configured with load-lock (LL) 20 with a remaining side of conveying chamber (TR) 10.
Conveying chamber (TR) 10, load-lock (LL) 20 and three vacuum(-)baking devices (VB) 1 are all configured to the reduced atmosphere (vacuum state) that its inner space can be maintained regulation.
The gate-valve device GV1 with opening and closing function is configured with respectively between conveying chamber (TR) 10 and each vacuum(-)baking device (VB) 1.In addition, between conveying chamber (TR) 10 and load-lock (LL) 20, gate-valve device GV2 is configured with.Gate-valve device GV1, GV2 in off position under seal each device airtightly, and make in the on-state between device be communicated with and substrate S can be transferred.In addition, also gate-valve device GV3 is configured with between load-lock (LL) 20 and the conveying device 31 of air atmosphere, seal load-lock (LL) 20 in off position airtightly, and substrate S can be transferred in load-lock (LL) 20 and between the conveying device 31 of air atmosphere in the on-state.
< vacuum(-)baking device >
Three vacuum(-)baking devices (VB) 1 are identical structure.As shown in Figure 2, each vacuum(-)baking device (VB) 1 has the heating plate 3 for heated substrates S.Heating plate 3 is formed with multiple through hole 3a, is inserted with in this through hole 3a and abuts with the back side of substrate S and support the movable pin 5 of this substrate S.The detailed configuration of vacuum(-)baking device (VB) 1 is aftermentioned.
< conveying device and the 1st conveying device >
The conveying device 11 as the 1st conveying device is configured with at conveying chamber (TR) 10.This conveying device 11 comprises: clamp forks 13a and clamp forks 13b, and it is such as upper and lower is arranged two-layerly; Support 15, its so that clamp forks 13a, 13b can be made to pass in and out, to keep out of the way and the mode that rotates supports this clamp forks 13a, 13b; And driving mechanism (diagram is omitted), it is for driving this support 15.Conveying device 11 according to the turnover of the rotation of support 15 and clamp forks 13a, 13b and keep out of the way and can between three vacuum(-)baking devices (VB) 1 and load-lock (LL) 20 conveying substrate S.Clamp forks 13a, 13b are configured to can separately conveying substrate S.
< load-lock >
As shown in Figure 2, load-lock (LL) 20 has the coldplate 21 for heated substrates S.Coldplate 21 is formed with multiple through hole 21a, is inserted with in this through hole 21a and abuts with the back side of substrate S and support the movable pin 23 of this substrate S.In addition, multiple gas squit hole 21b is provided with at the upper surface of coldplate 21.The detailed configuration of load-lock (LL) 20 is aftermentioned.
< the 2nd conveying device >
As shown in Figure 1, at unit 101A, 101B be provided with between unit 101C, 101D for the conveying device 31 to each load-lock (LL) 20 conveying substrate S.This conveying device 31 comprises: clamp forks 33a and clamp forks 33b, and it is such as upper and lower is arranged two-layerly; Support 35, its so that clamp forks 33a, 33b can be made to pass in and out, to keep out of the way and the mode that rotates supports this clamp forks 33a, 33b; Driving mechanism (diagram is omitted), it is for driving this support 35; And guide rail 37.Support 35 moves along guide rail 37, can between four unit 101A, 101B, 101C, 101D and between buffer table 41 conveying substrate S.
< buffer table >
Fig. 1 cures treatment system 100 and can have buffer table 41 to the position that conveying device 31 joins substrate S.Buffer table 41 is interim storeroom when joining substrate S between the device curing treatment system 100 and outside, such as inkjet-printing device 200.Buffer table 41 is separated with compartment of terrain and erects a pair abutment wall 43 be provided with for multiple substrates S being remained multilayer.A pair abutment wall 43 is configured to clamp forks 33a, the 33b that can insert the comb teeth-shaped of conveying device 31 in their gap.
< control part >
As shown in Figures 1 and 2, each constituting portion of curing treatment system 100 is configured to be connected with control part 50 and controlled by control part 50.Control part 50 comprises controller 51, user interface 52 and the storage part 53 with CPU.Controller 51 has computer function, is curing in treatment system 100, and entirety controls each constituting portion such as such as vacuum(-)baking device (VB) 1, load-lock (LL) 20, conveying device 11, conveying device 31.User interface 52 by process management personnel in order to manage cure treatment system 100 and carry out the keyboard of the input operation of instruction etc., display etc. that the operational situation for the treatment of system 100 is cured in visual display forms.The fabrication procedures that have recorded for get off in the control of controller 51 control program (software), treatment conditions data etc. that realize in the various process of curing execution in treatment system 100 is preserved in storage part 53.User interface 52 and storage part 53 are connected to controller 51.
Further, as required, recall arbitrary fabrication procedures from storage part 53 according to instruction from user interface 52 etc. and performed by controller 51, thus under the control of controller 51, carrying out the process of curing the expectation in treatment system 100.The fabrication procedures such as described control program, treatment conditions data can utilize the fabrication procedures of the state being in storage medium, the such as CD-ROM, hard disk, floppy disk, flash memory etc. that are stored in embodied on computer readable.Or, also can transmit and online utilization at any time from other device by such as special circuit.
The structure of < vacuum(-)baking device (VB) and effect >
Next, with reference to Fig. 3 A, Fig. 3 B and Fig. 3 C, the structure of vacuum(-)baking device (VB) 1 and effect are described in detail.Fig. 3 A, Fig. 3 B are the cutaway views of the vacuum(-)baking device for illustration of single sheet type.Fig. 3 A represents makes movable pin 5 rise and between movable pin 5 and the clamp forks 13a (or clamp forks 13b) of conveying device 11, carry out the state of the handing-over of substrate S.Fig. 3 B represents to be made movable pin 5 decline from the state of Fig. 3 A and utilizes the state that heating plate 3 couples of substrate S heat.
Vacuum(-)baking device (VB) 1, by forming by evacuated pressure vessel, comprises diapire 1a, a roof 1c and four sidewall 1b.Sidewall 1b is provided with the gas introduction part 2a for importing non-active gas and exhaust portion 2b.Be configured to, gas introduction part 2a is connected with non-active gas source 61, can import such as N in vacuum(-)baking device (VB) 1
2, the non-active gas such as Ar.Can also be configured to, exhaust portion 2b is connected with exhaust apparatus 63, the pressure in vacuum(-)baking device (VB) 1 can be vented to several Pa by driving this exhaust apparatus 63.In addition, sidewall 1b is provided with for by substrate S-phase in device input, export peristome 2c.
As mentioned above, heating plate 3 is had in the internal configurations of vacuum(-)baking device (VB) 1.Heating plate 3, by not shown pillar supporting, is fixed on diapire 1a.Omissions of detail part, but heating plate 3 is the heater of such as electric resistor heating type, or utilize the mode of heating of thermostat (Japanese: チ ラ ー), be heated to the temperature of regulation by power supply 65 is set to out (ON).
Heating plate 3 is formed multiple through hole 3a, in this through hole 3a, is inserted with the movable pin 5 for supporting substrates S.Each movable pin 5 is fixed on a lift component 67.Lift component 67 by the lifting drive division 69 with such as ball screw framework etc. can the mode of upper and lower displacement support.Between lift component 67 and diapire 1a, to be configured with such as bellows 68 around the mode of each movable pin 5, ensure that the air-tightness around through hole 3a.Drive lifting drive division 69, make lift component 67 and multiple movable pin 5 oscilaltion displacement, thus the height and position of substrate S can be adjusted between the heating location shown in the delivery position shown in Fig. 3 A and Fig. 3 B.In addition, the mechanism making substrate S be elevated displacement is not limited to illustrated mechanism.
Known baking conditions, cure the characteristic of environment on EL layer and have impact.Such as, when curing, if produce non-uniform temperature in the face of substrate S, then the characteristic of the organic EL element in the face of substrate S produces deviation sometimes.In addition, when curing, solvent, moisture etc. volatilize in large quantities from the organic material film substrate S.Therefore, if do not remove these volatile ingredients rapidly in vacuum(-)baking device (VB) 1, then likely produce the harmful effect of the oxidized grade of the organic functions film after curing.Especially when curing process to multiple substrate S to enhance productivity simultaneously, in order to not be subject to the impact of the composition evaporated from other substrates S, the exhaust in vacuum(-)baking device (VB) 1 is preferably promptly carried out.If these baking conditions, the management of curing environment are abundant not, then can become to cause when using as OLED display and show the bad reason such as uneven.
As shown in Figure 3 B, on the heating location after making substrate S decline, power supply 65 is set to out (ON) by vacuum(-)baking device (VB) 1, and what utilize heating plate 3 to substrate S adds hot baked.Now, drive exhaust apparatus 63, thus the pressure in vacuum(-)baking device (VB) 1 is vented to more than below atmospheric pressure, preferably 133Pa (1Torr) and in 66500Pa (500Torr) scope below.Like this, make to carry out with becoming vacuum state in vacuum(-)baking device (VB) 1 curing process, thus the volatile ingredient from organic material film promptly can be discharged to outside device, further, even if do not use a large amount of non-active gas that the organic material film on the surface being printed on substrate S also can be prevented to be oxidized.
In addition, preferably, curing period, substrate S not with the surface contact of heating plate 3, under the state that carry by movable pin 5, substrate S separates with the surface of the interval in the scope of such as more than 0.1mm and below 10mm with heating plate 3.Usually using hot air circulation mode, heating plate mode, far infrared mode etc. as the mode of curing heated substrates S in process.Wherein, from the viewpoint of can efficiently and homogeneous heating substrate S is such, preferably heating plate.But along with the maximization of substrate S, the warpage of the substrate S produced because of heating also becomes large, the heating of common heating plate is therefore utilized to be difficult to the uniformity maintained in the face of substrate S.Therefore, in the present embodiment, during curing process, substrate S is not directly placed in the surface of heating plate 3 but substrate S is separated with the surface of heating plate 3.Thus, even if substrate S produces warpage due to heating, also uniform heat treated can be realized in the face of substrate S.
In addition, in the present embodiment, curing period, also such as N can be imported from non-active gas source 61 in vacuum(-)baking device (VB) 1
2, the non-active gas such as Ar, He.Import non-active gas, thus the substrate S efficiency of heating surface under vacuum can be improved.
Fig. 3 C represents the outline cross section of vacuum(-)baking device (VB) 1A of variation.Vacuum(-)baking device (VB) 1A shown in Fig. 3 C is batch type, can hold two substrate S simultaneously and carry out curing process.In fig. 3 c, identical Reference numeral is marked to the structure identical with Fig. 3 A, Fig. 3 B, omit the diagram of the elevating mechanism of movable pin 5, the power supply of heating plate 3.As shown in Figure 3 C, multiple substrates S is configured to multilayer and carries out curing process in the lump, thus the productivity ratio of curing treatment system 100 can be improved, can also the installation space of saveall.In addition, the number simultaneously carrying out the substrate S curing process is not defined as two, can be more than three yet.
In addition, also the vacuum(-)baking device (VB) 1 of the single sheet type of upper and lower multilayer laminated ground configuration as shown in Fig. 3 A, Fig. 3 B batch type can be replaced.
The structure of < load-lock (LL) and effect >
Next, with reference to Fig. 4 A, Fig. 4 B and Fig. 4 C, the structure of load-lock (LL) 20 and effect are described in detail.Fig. 4 A, Fig. 4 B are the cutaway views of the load-lock for illustration of single sheet type.The load-lock (LL) 20 of present embodiment is except having the function as vacuum load lock device, also there is the function of substrate S being carried out to cooling processing, also there is the function of the organic material film be formed on substrate S being carried out to drying under reduced pressure process further.Fig. 4 A represents makes movable pin 23 rise and between movable pin 23 and clamp forks 13a (or clamp forks 13b), carry out the state of the handing-over of substrate S.Fig. 4 B represents to be made movable pin 23 decline from the state of Fig. 4 A and utilizes the state that coldplate 21 couples of substrate S cool or the state of the organic material film substrate S being carried out to drying under reduced pressure.
Load-lock (LL) 20, by forming by evacuated pressure vessel, comprises diapire 20a, a roof 20c and four sidewall 20b.Roof 20c is provided with the gas introduction part 20d for importing non-active gas.Sidewall 20b is provided with exhaust portion 20e.In addition, exhaust portion also can be located on diapire 20a.Gas introduction part 20d is configured to be connected with non-active gas source 71, can import such as N in load-lock (LL) 20
2, the non-active gas such as Ar, He.In addition, exhaust portion 20e is configured to be connected with exhaust apparatus 73, the pressure in load-lock (LL) 20 can be vented to tens of about Pa or 0.1Pa by driving this exhaust apparatus 73.In addition, sidewall 20b relative to each other is provided with for by substrate S-phase in device input, export peristome 2f, 2g.
As mentioned above, coldplate 21 is had in the internal configurations of load-lock (LL) 20.Coldplate 21 is fixed on diapire 20a.In the inside of coldplate 21, there is refrigerant flow path 21c.Be configured to, supply arbitrary cold-producing medium from cryogen source 75 to this refrigerant flow path 21c and make refrigerant circulation, thus the cooling of coldplate 21 entirety can be made.In addition, there is in the inside of coldplate 21 the gas delay portion 21d that the gas of the back of the body cold (Japanese: バ ッ ク ク ー リ Application グ) is detained.This gas delay portion 21d is communicated with multiple gas squit hole 21b of the upper surface being formed at coldplate 21.In addition, gas delay portion 21d with the back of the body cold air with gas source 76 be connected.
In addition, coldplate 21 is formed with multiple through hole 21a, in this through hole 21a, is inserted with the movable pin 23 for supporting substrates S.Each movable pin 23 is fixed on a lift component 77.Lift component 77 by the lifting drive division 79 with such as ball screw framework etc. can the mode of upper and lower displacement support.Between lift component 77 and diapire 20a, to be configured with such as bellows 78 around the mode of each movable pin 23, ensure that the air-tightness around through hole 21a.Drive lifting drive division 79, make lift component 77 and multiple movable pin 23 oscilaltion displacement, thus the height and position of substrate S can be adjusted between the down position shown in the delivery position shown in Fig. 4 A and Fig. 4 B.In addition, the mechanism making substrate S be elevated displacement is not limited to illustrated mechanism.
At the down position shown in Fig. 4 B, from cryogen source 75 the supply system cryogen, substrate S is utilized to the cooling of coldplate 21.Now, drive exhaust apparatus 73, thus the pressure in load-lock (LL) 20 is vented to more than below atmospheric pressure, preferably 400Pa (3Torr) and in scope below atmospheric pressure.Like this, make to cool with becoming vacuum state in load-lock (LL) 20, thus the organic material film on the surface being printed on substrate S can be prevented to be oxidized.
In addition, preferably, during cooling, substrate S not with the surface contact of coldplate 21, under the state that carry by movable pin 23, substrate S separates with the surface of the interval in the scope of such as more than 0.1mm and below 10mm with coldplate 21.In this case, the rear side of the substrate S more preferably separated to the surface with coldplate 21 from multiple gas squit hole 21b supplies such as He etc. and carries on the back cold air.Like this, in the load-lock (LL) 20 of present embodiment, during cooling processing, substrate S is not directly placed in the surface of coldplate 21, the supply of back of the body cold air can be utilized and cool.Therefore, it is possible to improve the cooling effectiveness of substrate S, can in the face of substrate S evenly and promptly cool.
As mentioned above, in the present embodiment, can also by the drying process of load-lock (LL) 20 for organic material film.Utilizing in the withering situation of load-lock (LL) 20, under the state that substrate S is carry by movable pin 23, the interval with such as more than 0.1mm and in the scope of below 10mm and the surface of coldplate 21 keep substrate S dividually.And, while supply the non-active gas of ormal weight to load-lock (LL) 20 from non-active gas source 71, such as, while the pressure in load-lock (LL) 20 is vented to by driving exhaust apparatus 73 vacuum degree of regulation, below 0.1Pa.Like this, load-lock (LL) 20 can be utilized in the drying under reduced pressure process of removing the solvent in the organic material film on substrate S.
As mentioned above, cure in treatment system 100 in present embodiment, except using load-lock (LL) 20 except the function of loadlock of carrying out the switching switched between atmospheric pressure state and vacuum state, function can also be played as vacuum cooling unit, and then function can also be played as decompression dry device.Thus, the productivity ratio when the switching carrying out atmospheric pressure state and vacuum state continuously, cooling processing and drying process can be improved, and simplify the apparatus structure of system, also a saving the installation space of device.
On the other hand, Fig. 4 C represents the outline cross section of load-lock (LL) 20A of variation.Load-lock (LL) 20A shown in Fig. 4 C is batch type, can hold two substrate S simultaneously and carry out cooling processing, drying under reduced pressure process.In figure 4 c, identical Reference numeral is marked to the structure identical with Fig. 4 A, Fig. 4 B, omit the diagram of introducing mechanism etc. of the elevating mechanism of movable pin 23, cryogen source, back of the body cold air.As shown in Figure 4 C, multiple substrates S be configured to multilayer and hold in the lump, carry out the switching between atmospheric pressure state and vacuum state, and carry out cooling processing, drying under reduced pressure process, thus the productivity ratio of curing treatment system 100 can be improved further, can also the installation space of significantly saveall.In addition, the number simultaneously carrying out the substrate S curing process is not defined as two, can be more than three yet.
In addition, also the load-lock (LL) 20 of the single sheet type of upper and lower multilayer laminated ground configuration as shown in Fig. 4 A, Fig. 4 B batch type can be replaced.
Next, the action of curing treatment system 100 is as constructed as above described.First, as the last stage, utilize outside inkjet-printing device (IJ) 200 on substrate S, to print organic material film with the pattern of regulation.The conveying device 201 being attached to outside inkjet-printing device (IJ) 200 is utilized to be exported by the substrate S printing organic material film and be positioned in the abutment wall 43 of buffer table 41.Drive the clamp forks 33a (or clamp forks 33b) of conveying device 31 and make it retreat to receive the substrate S on this buffer table 41.Next, under the state of gate valve GV3 opening atmospheric side, substrate S is handed off to the movable pin 23 of load-lock (LL) 20 from conveying device 31.
Making after clamp forks 33a (or clamp forks 33b) keeps out of the way, to make the substrate 3 on movable pin 23 decline, and closing gate valve GV3.Afterwards, by exhaust in load-lock (LL) 20, by the vacuum degree of inner pressure relief to regulation.Now, by exhaust in load-lock (LL) 20 while regulate pressure, thus the drying process of removing the solvent contained in organic material film can be implemented.In this dry treatment process, also can import non-active gas in load-lock (LL) 20.
Next, make the substrate S on movable pin 23 rise to delivery position, and open the gate valve GV2 between conveying chamber (TR) 10 and load-lock (LL) 20.Then, the clamp forks 13a of conveying device 11 (or clamp forks 13b) is utilized to receive the substrate S being housed inside load-lock (LL) 20.
Next, utilize the clamp forks 13a (clamp forks 13b) of conveying device 11, under the state opening gate valve GV1, substrate S is transferred to the movable pin 5 rising to delivery position to any input substrate S in three vacuum(-)baking devices (VB) 1.Next, closing gate valve GV1, movable pin 5 is declined and regulate and heating plate 3 surface between interval, in vacuum(-)baking device (VB) 1 with rated condition to substrate S implement cure process.For making organic material film to the stoving temperature preferably such as more than 250 DEG C and in the scope of less than 300 DEG C, cure time preferably such as 1 hours of the organic functions film change be used in organic EL.During curing process, preferably reduce pressure in vacuum(-)baking device (VB) 1 below atmospheric pressure.In addition, preferably to supply non-active gas in vacuum(-)baking device (VB) 1 while carry out curing process.Cure process one end, just open gate valve GV1, make movable pin 5 increase, substrate S is handed off to the clamp forks 13a (or clamp forks 13b) of conveying device 11 from movable pin 5, from vacuum(-)baking device (VB) 1, substrate S is exported.
Then, substrate S is inputted load-lock (LL) 20 with path contrary to the above.Cure the substrate S after process to be in by warmed-up state, therefore, it is possible to carry out cooling processing in load-lock (LL) 20.In cooling processing, the movable pin 23 of load-lock (LL) 20 is declined and adjusts and interval between coldplate 21 keep the stipulated time.During cooling processing, carry on the back cold air from the gas squit hole 21b of coldplate 21 to the back side supply of substrate S, thus can cooling effectiveness be improved, uniform cooling processing can be carried out in the face of substrate S.Cooling one terminates, and just makes pressure increase in load-lock (LL) 20 to atmospheric pressure.Then, open gate valve GV3, and again make the substrate S on movable pin 23 rise to delivery position, by conveying device 31, substrate S is turned back to such as buffer table 41.In order to carry out the formation process of the ensuing organic material film utilizing inkjet-printing device (IJ) 200, other outside operation, substrate S is exported from curing treatment system 100.
In above-mentioned operation, can also carry in the lump and process multiple substrates S simultaneously.Such as, utilize conveying device 31 and conveying device 11 to carry multiple such as two substrate S simultaneously, and load-lock (LL) 20 and vacuum(-)baking device (VB) 1 are such as set to batch type or are configured to multilayer as shown in Fig. 3 C, Fig. 4 C, thus can enhance productivity.
[being applied to the application examples of the manufacturing process of organic EL element]
In the manufacture of organic EL element, between the anode and cathode, multiple organic functions film is formed as EL layer.The curing treatment system 100 and all can apply for the manufacture of the organic EL element of arbitrary stepped construction of present embodiment.At this, as EL layer, exemplify manufacture and have the situation of the organic EL element of " hole injection layer/hole transporting layer/luminescent layer/electron supplying layer/electron injecting layer ", the concrete treatment step cured in treatment system 100 is described.
Fig. 5 represents the outline of the manufacturing process of organic EL element.In this example, organic EL element utilizes the operation manufacture of STEP (step) 1 ~ STEP8.In STEP1, substrate S utilize such as vapour deposition method etc. form anode (pixel electrode) with the pattern of regulation.Next, in STEP2, between anode, the partition wall (bank) formed by insulant is formed.The macromolecular materials such as such as photosensitive polyimide resin can be used as the insulating material for the formation of partition wall.
Next, in STEP3, on the anode formed by STEP1, form hole injection layer.First, use inkjet-printing device (IJ) 200 on the anode marked off by each partition wall, print the organic material becoming the material of hole input layer.Next, use cure treatment system 100 to the organic material film printed like this carry out successively for removal of solvents drying under reduced pressure process and in an atmosphere cure process, thus formed hole injection layer.
Next, in STEP4, on the hole injection layer formed by STEP3, form hole transporting layer.First, use inkjet-printing device (IJ) 200 on hole injection layer, print the organic material becoming the material of hole transporting layer.Curing in treatment system 100, drying under reduced pressure process for removal of solvents and vacuum(-)baking process are being carried out successively to the organic material film printed like this, thus forming hole transporting layer.
Next, in STEP5, on the hole transporting layer formed by STEP4, form luminescent layer.First, use inkjet-printing device (IJ) 200 on hole transporting layer, print the organic material becoming the material of luminescent layer.Curing in treatment system 100, drying under reduced pressure process for removal of solvents and vacuum(-)baking process are being carried out successively to the organic material film printed like this, thus forming luminescent layer.In addition, when luminescent layer is made up of multiple layer, above-mentioned process is repeated.
Next, utilize such as vapour deposition method, on luminescent layer, form electron supplying layer (STEP6), electron injecting layer (STEP7) and negative electrode (STEP8) successively, thus obtain organic EL element.
In the manufacturing process of such organic EL element, cure treatment system 100 and can be preferably applied to STEP3 (formation hole injection layer), STEP4 (formation hole transporting layer) and STEP5 (formation luminescent layer).Namely, use inkjet-printing device (IJ) 200, after the last stage, the i.e. organic material film that print each layer, drying under reduced pressure process is carried out in load-lock (LL) 20, next, in vacuum(-)baking device (VB) 1, STEP3 (formation hole injection layer) under atmospheric pressure can carry out curing process, and STEP4 (formation hole transporting layer) and STEP5 (formation luminescent layer) can carry out curing process under vacuum.
As mentioned above, cure treatment system 100 by using, thus in the manufacturing process of organic EL element, can continuously high production rate and carry out expeditiously for the formation of EL layer drying under reduced pressure process and cure process.Especially, in above-mentioned STEP4 (formation hole transporting layer), STEP5 (formation luminescent layer), in order to avoid organic material oxidation and need to carry out curing under hypoxic atmosphere process, therefore, preferably use and cure treatment system 100 and carry out vacuum(-)baking process.In this case, curing in treatment system 100, the drying under reduced pressure process that vacuum atmosphere ground implements vacuum(-)baking process and its last stage continuously can be maintained, therefore, it is possible to seek to enhance productivity in vacuum(-)baking device (VB) 1 and load-lock (LL) 20.In addition, curing in treatment system 100, in load-lock (LL) 20, except switching vacuum/atmospheric pressure, also carrying out drying under reduced pressure process and cooling processing, so also can the installation space of saveall.
[the 2nd execution mode]
Next, be described with reference to the treatment system of curing of Fig. 6 to the 2nd execution mode of the present invention.Fig. 6 is the vertical view curing treatment system 100A diagrammatically representing the 2nd execution mode.Curing in treatment system 100 of the 1st execution mode, be configured to carry out drying under reduced pressure process in load-lock (LL) 20.On the other hand, curing in treatment system 100A in present embodiment, being provided with the special decompression dry device (VD) 210 for carrying out drying under reduced pressure process independently with load-lock (LL) 20 phase.Next, by with the distinctive points of curing treatment system 100 of the 1st execution mode centered by be described, cure in treatment system 100A in present embodiment, identical Reference numeral marked to the structure identical with the 1st execution mode, omits the description.
As shown in Figure 6, cure treatment system 100A and comprise: vacuum(-)baking device (VB) 1, it is for carrying out roasting with the pressure below atmospheric pressure to the organic material film utilizing outside inkjet-printing device (IJ) 200 to be formed on substrate S; Conveying device 11 (with reference to Fig. 2), it is as the 1st conveying device, for substrate S is transported to vacuum(-)baking device (VB) 1; Conveying chamber (TR) 10, it can be evacuated, and is disposed adjacent with vacuum(-)baking device 1, for holding conveying device 11; And load-lock (LL) 20, consist of and be disposed adjacent with conveying chamber (TR) 10, can switch between atmospheric pressure state and vacuum state.In addition, cure treatment system 100A to comprise: the 2nd conveying device 31, it is configured at the part be positioned between inkjet-printing device (IJ) 200 and load-lock (LL) 20 in substrate transport path, for this substrate transport path at least partially in carry out the handing-over of substrate S; With multiple decompression dry device (VD) 210, it is arranged between inkjet-printing device (IJ) the 200 and the 2nd conveying device 31.
< decompression dry device >
Decompression dry device (VD) 210 is known structure, therefore omits detailed description, and it comprises such as: container handling, and it can be evacuated; Workbench, it for loading substrate S in this container handling; Exhaust apparatus, it is for being exhausted in this container handling; Peristome, its for by substrate S-phase in this container handling input, export; And gate valve, it is for this peristome of opening and closing.In the present embodiment, two decompression dry devices (VD) 210 are paired, are provided with total totally four decompression dry devices (VD) 210.
< conveying device >
As shown in Figure 6, between decompression dry device (VD) 210, be provided with for the 3rd conveying device 221 to each decompression dry device (VD) 210 conveying substrate S.This conveying device 221 comprises: clamp forks 223a and clamp forks 223b, and it is such as upper and lower is arranged two-layerly; Support 225, its so that clamp forks 223a, 223b can be made to pass in and out, to keep out of the way and the mode that rotates supports this clamp forks 223a, 223b; Driving mechanism (diagram is omitted), it is for driving this support 225; And guide rail 227.Support 225 moves along guide rail 227, can between four decompression dry devices (VD) 210 and between buffer table 41A, 41B conveying substrate S.
< buffer table >
Fig. 6 cures treatment system 100A and can have two buffer tables 41A, 41B to the position that conveying device 221 joins substrate S.Wherein a buffer table 41A is interim storeroom when joining substrate S between the device curing treatment system 100 and outside, such as inkjet-printing device 200.Another buffer table 41B is interim storeroom when joining substrate S between the conveying device 221 of curing in treatment system 100A and conveying device 31.The structure of buffer table 41A, 41B is identical with the 1st execution mode.
Next, above-mentioned such action of curing treatment system 100A formed is described.First, as the last stage, in the inkjet-printing device (IJ) 200 of outside, on substrate S, print organic material film with the pattern of regulation.The conveying device 201 that the substrate S that have printed organic material film is attached to outside inkjet-printing device (IJ) 200 exports, and is positioned in the abutment wall 43 of buffer table 41A.Drive the clamp forks 223a (or clamp forks 223b) of conveying device 221 and make it retreat to receive the substrate S on this buffer table 41A.Next, under the state opening gate valve, substrate S is handed off to the workbench (diagram is omitted) of decompression dry device (VD) 210 from conveying device 221.
Next, close the gate valve of decompression dry device (VD) 210, be exhausted in decompression dry device (VD) 210, by the vacuum degree of inner pressure relief to regulation, thus the drying process of removing the solvent comprised in organic material film can be implemented.In addition, in dry treatment process, also non-active gas can be imported in decompression dry device (VD) 210.
After dry process terminates, open the gate valve of decompression dry device (VD) 210, utilize conveying device 221 by substrate S transfer in the abutment wall 43 of buffer table 41B.Drive the clamp forks 33a (or clamp forks 33b) of conveying device 31 and make it retreat to receive the substrate S on this buffer table 41B.Next, under the state of gate valve GV3 opening atmospheric side, substrate S is handed off to the movable pin 23 of load-lock (LL) 20 from conveying device 31.
After making clamp forks 33a (or clamp forks 33b) keep out of the way, the substrate S on movable pin 23 is declined, and closing gate valve GV3.Afterwards, by exhaust in load-lock (LL) 20, by the vacuum degree of inner pressure relief to regulation.
Next, make the substrate S on movable pin 23 rise to delivery position, and open the gate valve GV2 between conveying chamber (TR) 10 and load-lock (LL) 20.Then, the clamp forks 13a of conveying device 11 (or clamp forks 13b) is utilized to receive the substrate S being housed inside load-lock (LL) 20.
Next, utilize the clamp forks 13a (clamp forks 13b) of conveying device 11, under the state opening gate valve GV1, substrate S is transferred to the movable pin 5 rising to delivery position to any input substrate S in three vacuum(-)baking devices (VB) 1.Next, closing gate valve GV1, movable pin 5 is declined and regulate and heating plate 3 surface between interval, in vacuum(-)baking device (VB) 1 with rated condition to substrate S implement cure process.For making organic material film to the stoving temperature preferably such as more than 250 DEG C and in the scope of less than 300 DEG C, cure time preferably such as 1 hours of the organic functions film change be used in organic EL.During curing process, preferably reduce pressure in vacuum(-)baking device (VB) 1 below atmospheric pressure.In addition, preferably to supply non-active gas in vacuum(-)baking device (VB) 1 while carry out curing process.Cure process one end, just open gate valve GV1, make movable pin 5 increase, substrate S is handed off to the clamp forks 13a (or clamp forks 13b) of conveying device 11 from movable pin 5, from vacuum(-)baking device (VB) 1, substrate S is exported.
Then, substrate S is inputted load-lock (LL) 20 with path contrary to the above.Cure the substrate S after process to be in by warmed-up state, therefore, it is possible to carry out cooling processing in load-lock (LL) 20.In cooling processing, the movable pin 23 of load-lock (LL) 20 is declined and adjusts and interval between coldplate 21 keep the stipulated time.During cooling processing, carry on the back cold air from the gas squit hole 21b of coldplate 21 to the back side supply of substrate S, thus can cooling effectiveness be improved, uniform cooling processing can be carried out in the face of substrate S.Cooling processing one terminates, and just makes the pressure increase of load-lock (LL) 20 to atmospheric pressure.Then, open gate valve GV3, and again make the substrate S on movable pin 23 rise to delivery position, by conveying device 31, substrate S is turned back to such as buffer table 41B.Further, conveying device 221 is used by substrate S to buffer table 41A transfer.In order to carry out the formation process of the ensuing organic material film utilizing inkjet-printing device (IJ) 200, other outside operation, substrate S is exported from curing treatment system 100A.
In above-mentioned operation, can also carry in the lump and process multiple substrates S simultaneously.Such as, utilize conveying device 221, conveying device 31 and conveying device 11 to carry multiple such as two substrate S simultaneously, and decompression dry device (VD) 210, load-lock (LL) 20 and vacuum(-)baking device (VB) 1 be such as set to batch type as shown in Fig. 3 C, Fig. 4 C or be configured to multilayer, thus can enhance productivity.
Other structure of present embodiment and effect identical with the 1st execution mode.
In detail embodiments of the present invention are illustrated with illustrative object above, but the present invention is not limited to above-mentioned execution mode, can be variously out of shape.Such as, the manufacturing process of organic EL element is not defined as the operation illustrated in Fig. 5, even if such as EL layer has the structure be laminated according to the order such as " hole transporting layer/luminescent layer/electron supplying layer ", " hole injection layer/hole transporting layer/luminescent layer/electron supplying layer " from anode-side, can apply too and of the present inventionly cure treatment system 100,100A.
In addition, shown in Fig. 1, Fig. 6 cure treatment system 100, the structure of 100A, layout only illustrate, the configuration, number etc. of vacuum(-)baking device (VB) 1, decompression dry device (VD) 210 etc. can suitably be changed.
This International Application claim to be willing to the priority of No. 2012-164541 based on the Japanese Patent of applying on July 25th, 2012, and the full content of this application is referred to the application.
Claims (15)
1. cure a treatment system, wherein,
This cures treatment system and comprises:
Curing range, it is for carrying out roasting with the pressure below atmospheric pressure to the organic material film utilizing inkjet-printing device to be formed on substrate;
1st conveying device, it is for carrying aforesaid substrate to above-mentioned curing range;
Conveying chamber, it can be evacuated, and is disposed adjacent with above-mentioned curing range, for holding above-mentioned 1st conveying device;
Load-lock, consists of and is disposed adjacent with above-mentioned conveying chamber, can switch between atmospheric pressure state and vacuum state; And
2nd conveying device, it is configured at the part between above-mentioned inkjet-printing device and above-mentioned load-lock in substrate transport path, for this substrate transport path at least partially in carry out the handing-over of aforesaid substrate.
2. according to claim 1ly cure treatment system, wherein,
Above-mentioned curing range has:
Heating plate, it is for heating aforesaid substrate;
Multiple movable pin, it is arranged in the mode that can give prominence to relative to the surface of above-mentioned heating plate or submerge, for the state support aforesaid substrate separated with aforesaid substrate and the surface of above-mentioned heating plate during heating aforesaid substrate.
3. according to claim 2ly cure treatment system, wherein,
Between the surface of above-mentioned heating plate and aforesaid substrate be located at interval at more than 0.1mm and in the scope of below 10mm.
4. according to claim 2ly cure treatment system, wherein,
Above-mentioned curing range is connected with exhaust apparatus, for the pressure adjusting in this curing range being more than 133Pa and below 66500Pa carry out roasting.
5. according to claim 4ly cure treatment system, wherein,
Non-active gas is imported in above-mentioned curing range and carries out roasting.
6. according to claim 1ly cure treatment system, wherein,
Above-mentioned load-lock has:
Coldplate, it is for cooling the aforesaid substrate of the inside being contained in this load-lock; And
Multiple movable pin, it is arranged in the mode that can give prominence to relative to the surface of above-mentioned coldplate or submerge, for the state support aforesaid substrate separated with aforesaid substrate and the surface of above-mentioned coldplate during cooling aforesaid substrate.
7. according to claim 6ly cure treatment system, wherein,
Between the surface of above-mentioned coldplate and aforesaid substrate be located at interval at more than 0.1mm and in the scope of below 10mm.
8. according to claim 6ly cure treatment system, wherein,
Above-mentioned load-lock is connected with exhaust apparatus, for the pressure adjusting in this load-lock being more than 400Pa and cooling aforesaid substrate below atmospheric pressure.
9. according to claim 1ly cure treatment system, wherein,
Above-mentioned load-lock also plays function as the decompression dry device above-mentioned organic material film be formed on the aforesaid substrate of the inside being contained in above-mentioned load-lock being carried out to drying under reduced pressure.
10. according to claim 1ly cure treatment system, wherein,
This cures treatment system and also comprises decompression dry device, and it is dry for the above-mentioned organic material film making to utilize above-mentioned inkjet-printing device and be formed on aforesaid substrate.
11. according to claim 1ly cure treatment system, wherein,
Above-mentioned curing range is used for holding multiple aforesaid substrates simultaneously and goes forward side by side row relax.
12. according to claim 11ly cure treatment system, wherein,
Above-mentioned load-lock is used for holding multiple aforesaid substrates simultaneously.
13. according to claim 12ly cure treatment system, wherein,
Above-mentioned 1st conveying device is used for carrying multiple aforesaid substrates between above-mentioned curing range and above-mentioned load-lock simultaneously.
14. according to claim 1ly cure treatment system, wherein,
Be adjacent to be configured with multiple above-mentioned curing range with above-mentioned conveying chamber.
15. according to claim 14ly cure treatment system, wherein,
Form a unit by above-mentioned conveying chamber, above-mentioned load-lock and three above-mentioned curing ranges, and above-mentioned 2nd conveying device is used for the conveying multiple said units being carried out to aforesaid substrate.
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| CN201610591115.1A CN106206378B (en) | 2012-07-25 | 2013-06-11 | Decompression drying device |
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| JP2012-164541 | 2012-07-25 | ||
| JP2012164541A JP6181358B2 (en) | 2012-07-25 | 2012-07-25 | Baking process system and method for producing laminate of organic functional film of organic EL element |
| PCT/JP2013/066044 WO2014017194A1 (en) | 2012-07-25 | 2013-06-11 | Bake processing system |
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| CN108348954A (en) * | 2015-11-16 | 2018-07-31 | 科迪华公司 | The system and method for heat treatment for substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014017194A1 (en) | 2014-01-30 |
| KR20150038252A (en) | 2015-04-08 |
| JP2014026764A (en) | 2014-02-06 |
| CN106206378B (en) | 2020-12-01 |
| TWI584426B (en) | 2017-05-21 |
| KR101663005B1 (en) | 2016-10-06 |
| JP6181358B2 (en) | 2017-08-16 |
| TW201419467A (en) | 2014-05-16 |
| CN106206378A (en) | 2016-12-07 |
| CN104488358B (en) | 2016-08-17 |
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