CN104470219A - Production equipment for glue indentation reinforced panel - Google Patents

Production equipment for glue indentation reinforced panel Download PDF

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Publication number
CN104470219A
CN104470219A CN201410708855.XA CN201410708855A CN104470219A CN 104470219 A CN104470219 A CN 104470219A CN 201410708855 A CN201410708855 A CN 201410708855A CN 104470219 A CN104470219 A CN 104470219A
Authority
CN
China
Prior art keywords
described
glue
cutter
die
adhesive tape
Prior art date
Application number
CN201410708855.XA
Other languages
Chinese (zh)
Inventor
王中飞
Original Assignee
苏州米达思精密电子有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 苏州米达思精密电子有限公司 filed Critical 苏州米达思精密电子有限公司
Priority to CN201410708855.XA priority Critical patent/CN104470219A/en
Publication of CN104470219A publication Critical patent/CN104470219A/en

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0058Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0195Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound

Abstract

The invention discloses production equipment for a glue indentation reinforced panel, and relates to the technical field of flexible circuit board processing. The production equipment comprises a die cutting glue punching unit, a steel strip punching unit, a gluing unit and a product punching unit. The die cutting glue punching unit is provided with a first cutter used for hole forming and glue forming of adhesive tape and a material collecting mechanism used for removing waste materials. The adhesive tape continuously penetrates through the first cutter. The steel strip punching unit is provided with a second cutter used for hole forming of a steel strip, and the steel strip continuously penetrates through the second cutter. The gluing unit is provided with a pair of compression rollers with a first guide column, and the adhesive tape and the steel strip both penetrate through the gluing unit and are attached to each other to form a glue-coated steel strip. The product punching unit is provided with a third cutter used for punching the outlines of products and a second guide column. The glue-coated steel strip penetrates through the product punching unit.

Description

A kind of glue inside contracts the production equipment of reinforcing chip

Technical field

The present invention relates to flexible PCB processing technique field, particularly a kind of glue inside contracts the production equipment of reinforcing chip.

Background technology

The raw manufacturer of flexible PCB is for the glue stain consideration reduced because the glue that overflows produces, need reinforcing chip to become and entirely inside contract glue or locally inside contract plastic structure, but the manufacture craft of such reinforcing chip all quite poor efficiency at present, when glue and steel disc laminating, once can only cover the reinforcing chip of glue some, glue can not be covered continuously, and need drop into more manpower go make.Thus need a kind of can raising efficiency and guaranteed quality cover glue continuously inside contract reinforcement steel disc production method.

Summary of the invention

The technical problem to be solved in the present invention is: glue inside contracts the not high problem of reinforcing chip production efficiency at present.

For solving the problems of the technologies described above, the invention provides the production equipment that a kind of glue inside contracts reinforcing chip, comprising: the die-cut unit of cross cutting glue, the die-cut unit of steel band, laminating unit and the die-cut unit of product;

The die-cut unit of described cross cutting glue is provided with the first cutter of hole forming for adhesive tape and gum forming, and for removing the receiving mechanism of waste material, described adhesive tape continuously passes through described first cutter; The die-cut unit of described steel band is provided with the second cutter of the hole forming for steel band, and described steel band continuously passes through described second cutter; Described laminating unit is provided with the pressure roller of a pair band first lead, and described adhesive tape and described steel band are all bonded to each other through described laminating unit, are formed and cover glue steel band; The die-cut unit of described product is provided with the 3rd cutter for punching products profile and the second lead, described in cover glue steel band through the die-cut unit of described product.

Preferably, described a pair pressure roller is a rubber roller and a hot-pressing roller, and described hot-pressing roller is provided with the first lead.

Preferably, the first cutter of the die-cut unit of described cross cutting glue is hobboing cutter.

Preferably, described receiving mechanism comprises nip rolls and material receiving roller, and after described nip rolls is positioned at described first cutter, and push down described adhesive tape, described material receiving roller continues the waste material of adhesive tape described in rolling.

This production equipment can inside contract reinforcing chip by continuous production glue, and without the need to dropping into a large amount of manpower, production efficiency significantly improves.

Accompanying drawing explanation

Fig. 1 is the structural representation that glue of the present invention inside contracts reinforcing chip production equipment.

Embodiment

Below in conjunction with drawings and Examples, the specific embodiment of the present invention is described in further detail.Following examples for illustration of the present invention, but are not used for limiting the scope of the invention.

Glue as shown in Figure 1 inside contracts the production equipment of reinforcing chip, comprising: the die-cut unit of cross cutting glue, the die-cut unit of steel band, laminating unit and the die-cut unit of product.

The die-cut unit of cross cutting glue is provided with the first cutter 2 of hole forming for adhesive tape 1 and gum forming, and for removing the receiving mechanism of waste material.First cutter 2 is specially hobboing cutter, and adhesive tape 1 continuously passes through the first cutter 2, goes out blob of viscose and the location hole of requirement shape through the first cutter 2 punch forming.Receiving mechanism comprises nip rolls 3 and material receiving roller 4, and after nip rolls 3 is positioned at the first cutter 2, and push down adhesive tape 1, material receiving roller 3 continues the waste material of coiled adhesive tape 1.

The die-cut unit of steel band is provided with the second cutter 6 of the hole forming for steel band 5, and steel band 5 continuously passes through the second cutter 6, and punches out location hole.

Laminating unit is provided with the pressure roller of a pair band first lead, and one of them is rubber roller 7, and another is hot-pressing roller 8, and hot-pressing roller 8 is provided with the first lead 801.Adhesive tape 1 and steel band 5 all through laminating unit bonded to each other, are formed and cover glue steel band 9.During laminating, the first lead 801 inserts the location hole of adhesive tape 1 and the location hole of steel band 5, and two kinds of location holes are overlapped.

The die-cut unit of product is provided with the 3rd cutter 10 and the second lead 11 for punching products profile, and cover glue steel band 9 and continuously pass through the die-cut unit of product, insert correcting position in location hole by the second lead 11, then the 3rd cutter 10 punches out product design.

First cutter 2, the 3rd cutter 10 and the second lead 11 need Aided design, namely the position of the gum forming cutter of the first cutter 2 need with its hole forming cutter for positioning datum, and the position of the 3rd cutter 10 need with the second lead 11 for positioning datum, when reality is fitted, these two positioning datums can overlap.In addition, the die-cut profile of the 3rd cutter 10 should be greater than the die-cut profile of the first cutter 2, the 3rd cutter 10 not so can be made to be die-cut to cross cutting glue, do not reach the effect that glue inside contracts.

The production stage of this production equipment is:

Step one, the adhesive tape 1 of lasting conveying the first cutter 2 is punched out cross cutting glue profile and adhesive tape location hole, after waste material removes waste material by receiving mechanism, adhesive tape 1 is delivered to laminating unit;

Step 2, the steel band 5 of lasting conveying punched out location hole with the second cutter 6 after, steel band 5 is delivered to laminating unit;

Steel band 5 and adhesive tape 1 are fitted by step 3, laminating unit, and location hole aligns mutually, is formed and covers glue steel band 9, and be delivered to the die-cut unit of product;

The die-cut unit of step 4, product the second lead 11 carries out correcting to covering glue steel band 9, and the 3rd cutter 10 punches out product design, forms product material volume 12;

The waste material that step 5, removal are covered on glue steel band 9, obtains glue and inside contracts reinforcing chip winding.

This production equipment can inside contract reinforcing chip by continuous production glue, and without the need to dropping into a large amount of manpower, production efficiency significantly improves.

Above execution mode is only for illustration of the present invention; and be not limitation of the present invention; the those of ordinary skill of relevant technical field; without departing from the spirit and scope of the present invention; can also make a variety of changes and modification; therefore all equivalent technical schemes also belong to category of the present invention, and scope of patent protection of the present invention should be defined by the claims.

Claims (4)

1. glue inside contracts a production equipment for reinforcing chip, it is characterized in that, comprising: the die-cut unit of cross cutting glue, the die-cut unit of steel band, laminating unit and the die-cut unit of product;
The die-cut unit of described cross cutting glue is provided with the first cutter of hole forming for adhesive tape and gum forming, and for removing the receiving mechanism of waste material, described adhesive tape continuously passes through described first cutter; The die-cut unit of described steel band is provided with the second cutter of the hole forming for steel band, and described steel band continuously passes through described second cutter; Described laminating unit is provided with the pressure roller of a pair band first lead, and described adhesive tape and described steel band are all bonded to each other through described laminating unit, are formed and cover glue steel band; The die-cut unit of described product is provided with the 3rd cutter for punching products profile and the second lead, described in cover glue steel band through the die-cut unit of described product.
2. glue as claimed in claim 1 inside contracts the production equipment of reinforcing chip, and it is characterized in that, described a pair pressure roller is a rubber roller and a hot-pressing roller, and described hot-pressing roller is provided with the first lead.
3. glue as claimed in claim 1 inside contracts the production equipment of reinforcing chip, and it is characterized in that, the first cutter of the die-cut unit of described cross cutting glue is hobboing cutter.
4. glue as claimed in claim 1 inside contracts the production equipment of reinforcing chip, it is characterized in that, described receiving mechanism comprises nip rolls and material receiving roller, after described nip rolls is positioned at described first cutter, and push down described adhesive tape, described material receiving roller continues the waste material of adhesive tape described in rolling.
CN201410708855.XA 2014-11-28 2014-11-28 Production equipment for glue indentation reinforced panel CN104470219A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410708855.XA CN104470219A (en) 2014-11-28 2014-11-28 Production equipment for glue indentation reinforced panel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410708855.XA CN104470219A (en) 2014-11-28 2014-11-28 Production equipment for glue indentation reinforced panel

Publications (1)

Publication Number Publication Date
CN104470219A true CN104470219A (en) 2015-03-25

Family

ID=52915359

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410708855.XA CN104470219A (en) 2014-11-28 2014-11-28 Production equipment for glue indentation reinforced panel

Country Status (1)

Country Link
CN (1) CN104470219A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105505239A (en) * 2015-12-11 2016-04-20 苏州米达思精密电子有限公司 Rubberizing method of CBF glue
CN106231798A (en) * 2016-08-01 2016-12-14 苏州市东苏发五金粘胶制品有限公司 A kind of FPC stiffening plate inside contracts the processing technique of glue product

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63102394A (en) * 1986-10-20 1988-05-07 Matsushita Electric Ind Co Ltd Manufacture of flexible printed circuit
CN201491395U (en) * 2009-06-18 2010-05-26 苏州工业园区久泰精密电子有限公司 FPC die-cutting production system
US20110094676A1 (en) * 2008-01-28 2011-04-28 Tesa Se Method for cluing flexible circuit boards to polymer materials for partial or complete stiffening
CN203482499U (en) * 2013-08-23 2014-03-12 珠海华冠电子科技有限公司 Reinforcing and laminating machine for circuit boards
CN103731987A (en) * 2013-08-23 2014-04-16 珠海华冠电子科技有限公司 Circuit board reinforcing laminating machine
CN103747622A (en) * 2013-12-31 2014-04-23 苏州米达思精密电子有限公司 Pressing mechanism for filling up placing holes in rigid material
CN103747620A (en) * 2013-12-31 2014-04-23 苏州米达思精密电子有限公司 Preparation method of local binderless reinforce panel
CN203618231U (en) * 2013-11-12 2014-05-28 珠海元盛电子科技股份有限公司 Automatic gummed paper sticking machine
CN103987199A (en) * 2014-06-03 2014-08-13 歌尔声学股份有限公司 Full-automatic stiffening plate false sticking machine
CN204272504U (en) * 2014-11-28 2015-04-15 苏州米达思精密电子有限公司 A kind of glue inside contracts the production equipment of reinforcing chip

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63102394A (en) * 1986-10-20 1988-05-07 Matsushita Electric Ind Co Ltd Manufacture of flexible printed circuit
US20110094676A1 (en) * 2008-01-28 2011-04-28 Tesa Se Method for cluing flexible circuit boards to polymer materials for partial or complete stiffening
CN201491395U (en) * 2009-06-18 2010-05-26 苏州工业园区久泰精密电子有限公司 FPC die-cutting production system
CN203482499U (en) * 2013-08-23 2014-03-12 珠海华冠电子科技有限公司 Reinforcing and laminating machine for circuit boards
CN103731987A (en) * 2013-08-23 2014-04-16 珠海华冠电子科技有限公司 Circuit board reinforcing laminating machine
CN203618231U (en) * 2013-11-12 2014-05-28 珠海元盛电子科技股份有限公司 Automatic gummed paper sticking machine
CN103747622A (en) * 2013-12-31 2014-04-23 苏州米达思精密电子有限公司 Pressing mechanism for filling up placing holes in rigid material
CN103747620A (en) * 2013-12-31 2014-04-23 苏州米达思精密电子有限公司 Preparation method of local binderless reinforce panel
CN103987199A (en) * 2014-06-03 2014-08-13 歌尔声学股份有限公司 Full-automatic stiffening plate false sticking machine
CN204272504U (en) * 2014-11-28 2015-04-15 苏州米达思精密电子有限公司 A kind of glue inside contracts the production equipment of reinforcing chip

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105505239A (en) * 2015-12-11 2016-04-20 苏州米达思精密电子有限公司 Rubberizing method of CBF glue
CN106231798A (en) * 2016-08-01 2016-12-14 苏州市东苏发五金粘胶制品有限公司 A kind of FPC stiffening plate inside contracts the processing technique of glue product

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Application publication date: 20150325