Summary of the invention
The technical problem to be solved in the present invention is: glue inside contracts the not high problem of reinforcing chip production efficiency at present.
For solving the problems of the technologies described above, the invention provides the automatic producing device that a kind of glue inside contracts reinforcing chip, comprising: the die-cut unit of cross cutting glue, the die-cut unit of steel band, laminating unit and the die-cut unit of product;
The die-cut unit of described cross cutting glue is provided with the first cutter of hole forming for adhesive tape and gum forming, and for removing the receiving mechanism of waste material, described adhesive tape continuously passes through described first cutter; The die-cut unit of described steel band is provided with the second cutter of the hole forming for steel band, and described steel band continuously passes through described second cutter;
Described laminating unit comprises heating platen, photoelectric sensor and is provided with the base plate of lift pin, described steel band and adhesive tape are between described heating platen and base plate, described photoelectric sensor aims at described steel band, when aliging with the hole of described steel band in the hole of described adhesive tape, described photoelectric sensor controls in described lift pin patchhole, and controlling described heating platen pressing, described adhesive tape and described steel band are formed and cover glue steel band;
The die-cut unit of described product is provided with the 3rd cutter for punching products profile and the second lead, described in cover glue steel band through the die-cut unit of described product.
Preferably, described lift pin realizes rising by the spring being located at bottom, realizes shrinking by belt pulley.
Preferably, the first cutter of the die-cut unit of described cross cutting glue is hobboing cutter.
Preferably, described receiving mechanism comprises nip rolls and material receiving roller, and after described nip rolls is positioned at described first cutter, and push down described adhesive tape, described material receiving roller continues the waste material of adhesive tape described in rolling.
This production equipment can inside contract reinforcing chip by continuous production glue, and without the need to dropping into a large amount of manpower, production efficiency significantly improves; And unit of fitting adopts the mode of optoelectronic induction that steel band can be made to align more exactly with the hole of adhesive tape, improves the quality of products.
Embodiment
Below in conjunction with drawings and Examples, the specific embodiment of the present invention is described in further detail.Following examples for illustration of the present invention, but are not used for limiting the scope of the invention.
Glue as shown in Figures 1 to 4 inside contracts the automatic producing device of reinforcing chip, comprising: the die-cut unit of cross cutting glue, the die-cut unit of steel band, laminating unit and the die-cut unit of product.
The die-cut unit of cross cutting glue is provided with the first cutter 2 of hole forming for adhesive tape 1 and gum forming, and for removing the receiving mechanism of waste material.First cutter 2 is specially hobboing cutter, and adhesive tape 1 continuously passes through the first cutter 2, goes out blob of viscose and the location hole of requirement shape through the first cutter 2 punch forming.Receiving mechanism comprises nip rolls 3 and material receiving roller 4, and after nip rolls 3 is positioned at the first cutter 2, and push down adhesive tape 1, material receiving roller 3 continues the waste material of coiled adhesive tape 1.
The die-cut unit of steel band is provided with the second cutter 6 of the hole forming for steel band 5, and steel band 5 continuously passes through the second cutter 6, and punches out location hole.
Laminating unit comprises heating platen 7, photoelectric sensor 8 and is provided with the base plate of lift pin 13, steel band 5 and adhesive tape 1 are between heating platen 7 and base plate 13, photoelectric sensor 8 aims at steel band 5, when the location hole of adhesive tape 1 aligns with the location hole of steel band 5, photoelectric sensor 8 controls in lift pin 13 patchhole, and controlling heating platen 7 pressing, adhesive tape 1 and steel band 5 are formed and cover glue steel band 9.
The structure of lift pin 13 is specially: bottom is provided with the spring 1301 being in compressive state, and thimble 13 and belt pulley 1302 link, and belt pulley 1302 rotates forward, and makes thimble 13 increase, and direction is rotated and then made thimble 13 decline.Whether photoelectric sensor 8 aligns according to location hole, controls the rotation direction of belt pulley 1302, if alignd, then belt pulley 1302 of leaving rotates forward under the effect of spring 1301, and lift pin rises from; If unjustified, then control belt pulley 1302 and rotate backward, lift pin declines, until the tractive effort of belt pulley 1302 is identical with the bounce of spring 1301.
The die-cut unit of product is provided with the 3rd cutter 10 and the second lead 11 for punching products profile, and cover glue steel band 9 and continuously pass through the die-cut unit of product, insert correcting position in location hole by the second lead 11, then the 3rd cutter 10 punches out product design.
First cutter 2, the 3rd cutter 10 and the second lead 11 need Aided design, namely the position of the gum forming cutter of the first cutter 2 need with its hole forming cutter for positioning datum, and the position of the 3rd cutter 10 need with the second lead 11 for positioning datum, when reality is fitted, these two positioning datums can overlap.In addition, the die-cut profile of the 3rd cutter 10 should be greater than the die-cut profile of the first cutter 2, the 3rd cutter 10 not so can be made to be die-cut to cross cutting glue, do not reach the effect that glue inside contracts.
The production stage of this production equipment is:
Step one, the adhesive tape 1 of lasting conveying the first cutter 2 is punched out cross cutting glue profile and adhesive tape location hole, after waste material removes waste material by receiving mechanism, adhesive tape 1 is delivered to laminating unit;
Step 2, the steel band 5 of lasting conveying punched out location hole with the second cutter 6 after, steel band 5 is delivered to laminating unit;
The photoelectric sensor 8 of step 3, laminating unit judges: whether the location hole of steel band 5 and adhesive tape 1 aligns, if alignd, steel band 5 and adhesive tape 1 is fitted, and is formed and covers glue steel band 9, and be delivered to the die-cut unit of product;
The die-cut unit of step 4, product the second lead 11 carries out correcting to covering glue steel band 9, and the 3rd cutter 10 punches out product design, forms product material volume 12;
The waste material that step 5, removal are covered on glue steel band 9, obtains glue and inside contracts reinforcing chip winding.
This production equipment can inside contract reinforcing chip by continuous production glue, and without the need to dropping into a large amount of manpower, production efficiency significantly improves; And unit of fitting adopts the mode of optoelectronic induction that steel band can be made to align more exactly with the hole of adhesive tape, improves the quality of products.
Above execution mode is only for illustration of the present invention; and be not limitation of the present invention; the those of ordinary skill of relevant technical field; without departing from the spirit and scope of the present invention; can also make a variety of changes and modification; therefore all equivalent technical schemes also belong to category of the present invention, and scope of patent protection of the present invention should be defined by the claims.