CN104470218A - Inward-shrinking glue reinforcing sheet production device - Google Patents
Inward-shrinking glue reinforcing sheet production device Download PDFInfo
- Publication number
- CN104470218A CN104470218A CN201410708853.0A CN201410708853A CN104470218A CN 104470218 A CN104470218 A CN 104470218A CN 201410708853 A CN201410708853 A CN 201410708853A CN 104470218 A CN104470218 A CN 104470218A
- Authority
- CN
- China
- Prior art keywords
- glue
- unit
- steel band
- location hole
- laser cutter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
Abstract
The invention discloses an inward-shrinking glue reinforcing sheet production device and relates to the technical field of flexible printed circuit board processing. The device comprises a glue-coated steel strap conveying unit, a laser cutter, a waste reeling unit and a product punching unit. A glue-coated steel strap is continuously conveyed through the glue-coated steel strap conveying unit, the laser cutter is aligned with the glued face of the glue-coated steel strap and used for cutting forming glue pieces and a locating hole, the waste reeling unit is located behind the laser cutter and used for reeling waste of the forming glue pieces, the product punching unit is located on the rear side of the waste reeling unit and provided with a guide column and cutters, the guide column is used for being inserted in the locating hole of the glue-coated steel strap for guidance, and the cutters are used for cutting the glue-coated steel strap into the shape of products.
Description
Technical field
The present invention relates to flexible PCB processing technique field, particularly one inside contracts glue reinforcing chip process units.
Background technology
The raw manufacturer of flexible PCB is for the glue stain consideration reduced because the glue that overflows produces, need reinforcing chip to become and entirely inside contract glue or locally inside contract plastic structure, but the manufacture craft of such reinforcing chip all quite poor efficiency at present, glue and steel disc need to process respectively, and then both are fitted, and this process need drop into more manpower go make, integral production efficiency is lower.Thus a kind of mode of production of energy raising efficiency is needed.
Summary of the invention
The technical problem to be solved in the present invention is: existing to inside contract glue reinforcing chip production link more, the problem that production efficiency is not high.
For solving the problems of the technologies described above, the invention provides one and inside contracting glue reinforcing chip process units, comprising: cover glue steel band supply unit, laser cutter, waste material rolling unit and the die-cut unit of product;
The described glue steel band supply unit that covers continues conveying and covers glue steel band; The surface with glue of glue steel band is covered, for cutting out shaping glue and location hole described in described laser cutter aligning; After described waste material rolling unit is positioned at described laser cutter, for the waste material of glue shaping described in rolling; The die-cut unit of described product is positioned on rear side of described waste material rolling unit, and is provided with lead and cutting knife, and described lead, for covering the location hole of glue steel band described in inserting, carries out correcting; Described cutting knife is used for the described glue steel band that covers to punch out product design.
Preferably, also comprise location hole cleaning unit, after described location hole cleaning unit is positioned at described laser cutter, before the die-cut unit of described product, and aim at described location hole, described location hole cleaning unit can discharge high velocity air.
This inside contracts glue reinforcing chip process units and can adopt and cover glue steel band as raw materials for production, and directly, the reinforcing chip that inside contracts of continuous seepage plastic emitting, avoid and need die-cut steel band and glue the process of again fitting respectively in the past, thus production efficiency is higher.
Accompanying drawing explanation
Fig. 1 is the structural representation inside contracting glue reinforcing chip process units of the present invention.
Fig. 2 is the vertical view covering glue steel band of the present invention.
Embodiment
Below in conjunction with drawings and Examples, the specific embodiment of the present invention is described in further detail.Following examples for illustration of the present invention, but are not used for limiting the scope of the invention.
As depicted in figs. 1 and 2 cover glue steel band cover replacing device, comprising: cover the die-cut unit 4 of glue steel band supply unit 1, laser cutter 2, waste material rolling unit 3 and product.
Cover glue steel band supply unit 1 to continue conveying and cover glue steel band 101; Laser cutter 2 aims at the surface with glue covering glue steel band 101, for cutting out shaping glue 201 and location hole 202; After waste material rolling unit 3 is positioned at laser cutter 2, for the waste material of the shaping glue 201 of rolling; The die-cut unit 4 of product is positioned on rear side of waste material rolling unit 3, and is provided with lead 401 and cutting knife 402, and lead 401, for inserting the location hole 202 covering glue steel band 101, carries out correcting; Cutting knife 401 punches out reinforcing chip finished product 403 for covering glue steel band 101.
In order to the waste material in location hole 202 thoroughly can be cleaned out, this device also comprises location hole cleaning unit 6, after location hole cleaning unit 6 is positioned at described laser cutter 2, before the die-cut unit 4 of product, and aim at location hole 202, location hole cleaning unit 6 can discharge high velocity air, is washed away by the waste material in location hole 202.
This device controls to cover the operating frequency of the conveying step pitch of glue steel band 101, dead time, the cutting speed of laser cutter 2 and duration, the die-cut unit 4 of product by control unit.
The specification of laser cutter 2 can adopt wavelength 10.6um in addition, more than 99.95% High Purity Nitrogen, the laser generator of 3000W.
The operation process of this device is:
Step one, cover glue steel band supply unit 1 conveying cover glue steel band 101, laser cutter 2 cuts out shaping glue 201;
The waste material of step 2, the shaping glue 201 of waste material rolling unit 3 rolling, hole cleaning unit 6 clear up the waste material of location hole 202;
The die-cut unit of step 3, product 4 is die-cut covers glue steel band 101, obtains and inside contracts glue reinforcing chip finished product 404.
This inside contracts glue reinforcing chip process units and can adopt and cover glue steel band as raw materials for production, and directly, the reinforcing chip that inside contracts of continuous seepage plastic emitting, avoid and need die-cut steel band and glue the process of again fitting respectively in the past, thus production efficiency is higher.
Above execution mode is only for illustration of the present invention; and be not limitation of the present invention; the those of ordinary skill of relevant technical field; without departing from the spirit and scope of the present invention; can also make a variety of changes and modification; therefore all equivalent technical schemes also belong to category of the present invention, and scope of patent protection of the present invention should be defined by the claims.
Claims (2)
1. inside contract a glue reinforcing chip process units, it is characterized in that, comprising: cover glue steel band supply unit, laser cutter, waste material rolling unit and the die-cut unit of product;
The described glue steel band supply unit that covers continues conveying and covers glue steel band; The surface with glue of glue steel band is covered, for cutting out shaping glue and location hole described in described laser cutter aligning; After described waste material rolling unit is positioned at described laser cutter, for the waste material of glue shaping described in rolling; The die-cut unit of described product is positioned on rear side of described waste material rolling unit, and is provided with lead and cutting knife, and described lead, for covering the location hole of glue steel band described in inserting, carries out correcting; Described cutting knife is used for the described glue steel band that covers to punch out product design.
2. inside contract glue reinforcing chip process units as claimed in claim 1, it is characterized in that, also comprise location hole cleaning unit, after described location hole cleaning unit is positioned at described laser cutter, before the die-cut unit of described product, and aim at described location hole, described location hole cleaning unit can discharge high velocity air.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410708853.0A CN104470218A (en) | 2014-11-28 | 2014-11-28 | Inward-shrinking glue reinforcing sheet production device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410708853.0A CN104470218A (en) | 2014-11-28 | 2014-11-28 | Inward-shrinking glue reinforcing sheet production device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104470218A true CN104470218A (en) | 2015-03-25 |
Family
ID=52915358
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410708853.0A Pending CN104470218A (en) | 2014-11-28 | 2014-11-28 | Inward-shrinking glue reinforcing sheet production device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104470218A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104925505A (en) * | 2015-06-10 | 2015-09-23 | 苏州米达思精密电子有限公司 | Reinforcing panel automatically feeding and positioning method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006203097A (en) * | 2005-01-24 | 2006-08-03 | Matsushita Electric Ind Co Ltd | Apparatus and method for sticking tape |
| CN103517563A (en) * | 2013-10-16 | 2014-01-15 | 镇江华印电路板有限公司 | Flexible printed circuit board reinforcement steel piece pasting method |
| KR101383826B1 (en) * | 2013-03-22 | 2014-04-10 | 이권택 | Manufacturing apparatus for assistance tape of flexible printed circuit board |
| CN103747620A (en) * | 2013-12-31 | 2014-04-23 | 苏州米达思精密电子有限公司 | Preparation method of local binderless reinforce panel |
| CN203748115U (en) * | 2013-12-31 | 2014-07-30 | 苏州米达思精密电子有限公司 | Pressing mechanism for continuously filling through holes on flexible carriers |
| CN204272505U (en) * | 2014-11-28 | 2015-04-15 | 苏州米达思精密电子有限公司 | One inside contracts glue reinforcing chip process units |
-
2014
- 2014-11-28 CN CN201410708853.0A patent/CN104470218A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006203097A (en) * | 2005-01-24 | 2006-08-03 | Matsushita Electric Ind Co Ltd | Apparatus and method for sticking tape |
| KR101383826B1 (en) * | 2013-03-22 | 2014-04-10 | 이권택 | Manufacturing apparatus for assistance tape of flexible printed circuit board |
| CN103517563A (en) * | 2013-10-16 | 2014-01-15 | 镇江华印电路板有限公司 | Flexible printed circuit board reinforcement steel piece pasting method |
| CN103747620A (en) * | 2013-12-31 | 2014-04-23 | 苏州米达思精密电子有限公司 | Preparation method of local binderless reinforce panel |
| CN203748115U (en) * | 2013-12-31 | 2014-07-30 | 苏州米达思精密电子有限公司 | Pressing mechanism for continuously filling through holes on flexible carriers |
| CN204272505U (en) * | 2014-11-28 | 2015-04-15 | 苏州米达思精密电子有限公司 | One inside contracts glue reinforcing chip process units |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104925505A (en) * | 2015-06-10 | 2015-09-23 | 苏州米达思精密电子有限公司 | Reinforcing panel automatically feeding and positioning method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150325 |
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| RJ01 | Rejection of invention patent application after publication |