CN104427780B - 贴片机的控制方法以及贴片机的操作系统 - Google Patents
贴片机的控制方法以及贴片机的操作系统 Download PDFInfo
- Publication number
- CN104427780B CN104427780B CN201410037492.1A CN201410037492A CN104427780B CN 104427780 B CN104427780 B CN 104427780B CN 201410037492 A CN201410037492 A CN 201410037492A CN 104427780 B CN104427780 B CN 104427780B
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- China
- Prior art keywords
- chip mounter
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000000034 method Methods 0.000 title claims description 28
- 238000009434 installation Methods 0.000 claims abstract description 123
- 230000007704 transition Effects 0.000 claims description 14
- 230000004069 differentiation Effects 0.000 claims description 3
- 238000011900 installation process Methods 0.000 claims description 3
- 238000010521 absorption reaction Methods 0.000 claims description 2
- 230000005611 electricity Effects 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- 238000007788 roughening Methods 0.000 claims 1
- 238000011017 operating method Methods 0.000 abstract description 13
- 238000010586 diagram Methods 0.000 description 7
- 230000008859 change Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000009941 weaving Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0015—Orientation; Alignment; Positioning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
Claims (20)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2013-0106672 | 2013-09-05 | ||
KR1020130106672A KR101892440B1 (ko) | 2013-09-05 | 2013-09-05 | 칩 마운터 운영 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104427780A CN104427780A (zh) | 2015-03-18 |
CN104427780B true CN104427780B (zh) | 2017-11-21 |
Family
ID=52975385
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410037492.1A Active CN104427780B (zh) | 2013-09-05 | 2014-01-26 | 贴片机的控制方法以及贴片机的操作系统 |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR101892440B1 (zh) |
CN (1) | CN104427780B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102119055B1 (ko) | 2015-09-25 | 2020-06-26 | 한화정밀기계 주식회사 | 칩 마운터 운영 방법 |
KR102149278B1 (ko) * | 2018-05-03 | 2020-08-28 | 한화정밀기계 주식회사 | 부품 실장기 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0358500A (ja) * | 1989-07-26 | 1991-03-13 | Shimadzu Corp | チップマウンタ |
JP3582653B2 (ja) * | 2001-05-17 | 2004-10-27 | 松下電器産業株式会社 | 部品実装順序最適化方法、その装置及び部品実装機 |
KR100651805B1 (ko) | 2004-12-30 | 2006-12-01 | 삼성테크윈 주식회사 | 부품 장착기의 장착 스텝 프로그램을 효율적으로디스플레이하는 방법 |
CN1956650A (zh) * | 2005-10-28 | 2007-05-02 | 鸿富锦精密工业(深圳)有限公司 | 贴片机供料器校正系统及方法 |
JP4943299B2 (ja) * | 2007-02-09 | 2012-05-30 | Juki株式会社 | 部品実装装置のフィーダ配置方法 |
JP5083103B2 (ja) | 2008-08-05 | 2012-11-28 | パナソニック株式会社 | 電子部品実装システムおよび電子部品実装システムにおける参照画面の表示方法 |
JP2011086681A (ja) * | 2009-10-13 | 2011-04-28 | Aica Kogyo Co Ltd | プリント基板の製造方法 |
CN102045963B (zh) * | 2010-12-28 | 2012-07-04 | 深南电路有限公司 | 等长金手指的镀金方法 |
CN102045956B (zh) * | 2010-12-28 | 2012-09-05 | 深南电路有限公司 | 等长金手指的镀金方法 |
KR20120102332A (ko) * | 2011-03-08 | 2012-09-18 | 삼성테크윈 주식회사 | 피더 위치 검색 방법 및 시스템 |
CN102427682B (zh) * | 2011-12-05 | 2014-04-02 | 深圳市五株科技股份有限公司 | 金手指电路板制作方法 |
-
2013
- 2013-09-05 KR KR1020130106672A patent/KR101892440B1/ko active IP Right Grant
-
2014
- 2014-01-26 CN CN201410037492.1A patent/CN104427780B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
KR20150028051A (ko) | 2015-03-13 |
CN104427780A (zh) | 2015-03-18 |
KR101892440B1 (ko) | 2018-08-28 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C53 | Correction of patent of invention or patent application | ||
CB02 | Change of applicant information |
Address after: Gyeongnam Changwon City, South Korea Applicant after: HANWHA TECHWIN Co.,Ltd. Address before: Gyeongnam Changwon City, South Korea Applicant before: Samsung Techwin Co.,Ltd. |
|
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: Free format text: CORRECT: APPLICANT; FROM: SAMSUNG TAI KEWEI CO., LTD. TO: HANWHA TECHWIN CO., LTD. |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: Gyeongnam Changwon City, South Korea Patentee after: HANWHA AEROSPACE Co.,Ltd. Address before: Gyeongnam Changwon City, South Korea Patentee before: HANWHA TECHWIN Co.,Ltd. |
|
CP01 | Change in the name or title of a patent holder | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20190411 Address after: Gyeongnam Changwon City, South Korea Patentee after: Hanwha Precision Machinery Co.,Ltd. Address before: Gyeongnam Changwon City, South Korea Patentee before: HANWHA AEROSPACE Co.,Ltd. |