CN104422950B - 一种阵列晶体模块及其加工方法 - Google Patents
一种阵列晶体模块及其加工方法 Download PDFInfo
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- CN104422950B CN104422950B CN201310426359.0A CN201310426359A CN104422950B CN 104422950 B CN104422950 B CN 104422950B CN 201310426359 A CN201310426359 A CN 201310426359A CN 104422950 B CN104422950 B CN 104422950B
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- 239000013078 crystal Substances 0.000 title claims abstract description 439
- 238000003672 processing method Methods 0.000 title claims abstract description 34
- 210000001161 mammalian embryo Anatomy 0.000 claims abstract description 5
- 238000010168 coupling process Methods 0.000 claims description 22
- 238000005859 coupling reaction Methods 0.000 claims description 22
- 239000011521 glass Substances 0.000 claims description 20
- 230000008878 coupling Effects 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 19
- 238000012545 processing Methods 0.000 claims description 19
- 230000003287 optical effect Effects 0.000 claims description 13
- 239000003292 glue Substances 0.000 claims description 9
- 239000002178 crystalline material Substances 0.000 claims description 3
- 238000010422 painting Methods 0.000 claims 1
- 238000001514 detection method Methods 0.000 abstract description 18
- 230000035945 sensitivity Effects 0.000 abstract description 11
- 238000013461 design Methods 0.000 description 9
- 238000004806 packaging method and process Methods 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000005622 photoelectricity Effects 0.000 description 3
- 238000002600 positron emission tomography Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 230000002123 temporal effect Effects 0.000 description 3
- 230000008021 deposition Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000011133 lead Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000009897 systematic effect Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000002835 absorbance Methods 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000009206 nuclear medicine Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/20—Measuring radiation intensity with scintillation detectors
- G01T1/202—Measuring radiation intensity with scintillation detectors the detector being a crystal
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/20—Measuring radiation intensity with scintillation detectors
- G01T1/2002—Optical details, e.g. reflecting or diffusing layers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/20—Measuring radiation intensity with scintillation detectors
- G01T1/2018—Scintillation-photodiode combinations
- G01T1/20187—Position of the scintillator with respect to the photodiode, e.g. photodiode surrounding the crystal, the crystal surrounding the photodiode, shape or size of the scintillator
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14658—X-ray, gamma-ray or corpuscular radiation imagers
- H01L27/14663—Indirect radiation imagers, e.g. using luminescent members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14685—Process for coatings or optical elements
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- High Energy & Nuclear Physics (AREA)
- Molecular Biology (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Toxicology (AREA)
- Measurement Of Radiation (AREA)
- Conversion Of X-Rays Into Visible Images (AREA)
Abstract
Description
Claims (27)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310426359.0A CN104422950B (zh) | 2013-09-08 | 2013-09-08 | 一种阵列晶体模块及其加工方法 |
EP13893179.5A EP3043193B1 (en) | 2013-09-08 | 2013-11-14 | Crystal-array module and fabrication method thereof |
HUE13893179A HUE045601T2 (hu) | 2013-09-08 | 2013-11-14 | Kristályrács modul és eljárás annak elõállítására |
PCT/CN2013/087119 WO2015032130A1 (zh) | 2013-09-08 | 2013-11-14 | 一种阵列晶体模块及其加工方法 |
US14/916,699 US9599726B2 (en) | 2013-09-08 | 2013-11-14 | Array crystal module and fabrication method thereof |
JP2016539390A JP6397027B2 (ja) | 2013-09-08 | 2013-11-14 | アレイ結晶モジュール及びその加工方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310426359.0A CN104422950B (zh) | 2013-09-08 | 2013-09-08 | 一种阵列晶体模块及其加工方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104422950A CN104422950A (zh) | 2015-03-18 |
CN104422950B true CN104422950B (zh) | 2017-10-24 |
Family
ID=52627746
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310426359.0A Active CN104422950B (zh) | 2013-09-08 | 2013-09-08 | 一种阵列晶体模块及其加工方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9599726B2 (zh) |
EP (1) | EP3043193B1 (zh) |
JP (1) | JP6397027B2 (zh) |
CN (1) | CN104422950B (zh) |
HU (1) | HUE045601T2 (zh) |
WO (1) | WO2015032130A1 (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6671839B2 (ja) * | 2014-10-07 | 2020-03-25 | キヤノン株式会社 | 放射線撮像装置及び撮像システム |
CN106501838B (zh) * | 2015-09-08 | 2019-08-27 | 中国科学院高能物理研究所 | 一种辐射探测器的光导及其制备方法、辐射探测器 |
CN106646582A (zh) * | 2016-09-13 | 2017-05-10 | 沈阳东软医疗系统有限公司 | 一种pet检测器及其制作方法 |
CN113260881A (zh) | 2019-01-08 | 2021-08-13 | 纽约州立大学研究基金会 | 拟柱体光导 |
US11275182B2 (en) * | 2020-04-22 | 2022-03-15 | GE Precision Healthcare LLC | Systems and methods for scintillators having reflective inserts |
Citations (7)
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JPH0511060A (ja) * | 1990-01-29 | 1993-01-19 | General Electric Co <Ge> | 2次元モザイク状シンチレ―シヨン検出装置 |
JP2004354343A (ja) * | 2003-05-30 | 2004-12-16 | Shimadzu Corp | 放射線検出器 |
CN1673773A (zh) * | 2004-03-26 | 2005-09-28 | 株式会社岛津制作所 | 辐射检测器及其制造方法 |
JP2007078567A (ja) * | 2005-09-15 | 2007-03-29 | Shimadzu Corp | 放射線検出器およびその製造方法 |
CN101073019A (zh) * | 2004-12-09 | 2007-11-14 | 皇家飞利浦电子股份有限公司 | 具有相互作用深度灵敏度的像素化探测器 |
CN102129082A (zh) * | 2010-12-23 | 2011-07-20 | 苏州瑞派宁科技有限公司 | 一种锥形闪烁晶体模块及其加工方法 |
CN203414599U (zh) * | 2013-09-08 | 2014-01-29 | 苏州瑞派宁科技有限公司 | 一种阵列晶体模块 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58153190A (ja) | 1982-03-09 | 1983-09-12 | Toshiba Corp | 放射線検出器 |
JPS58216973A (ja) | 1982-06-11 | 1983-12-16 | Toshiba Corp | 放射線検出器ブロツク |
US5059800A (en) * | 1991-04-19 | 1991-10-22 | General Electric Company | Two dimensional mosaic scintillation detector |
JP2547908B2 (ja) * | 1991-10-02 | 1996-10-30 | 浜松ホトニクス株式会社 | 放射線検出装置 |
DE69837429T2 (de) * | 1997-02-10 | 2007-12-06 | The University of Alberta, Simon Fraser University, the Univ. of Victoria, the Univ. of British Columbia, carrying on as Triumf, Vancouver | Unterteilter szintillationsdetektor zur feststellung der koordinaten von photoneninteraktionen |
US6552348B2 (en) * | 1999-12-14 | 2003-04-22 | Regents Of The University Of California | Apparatus and method for breast cancer imaging |
JP3975091B2 (ja) | 2002-02-12 | 2007-09-12 | 浜松ホトニクス株式会社 | 放射線検出器 |
JP2003240857A (ja) | 2002-02-19 | 2003-08-27 | Shimadzu Corp | 放射線検出器 |
WO2006097882A2 (en) | 2005-03-16 | 2006-09-21 | Philips Intellectual Property & Standards Gmbh | X-ray detector with in-pixel processing circuits |
US20090242774A1 (en) | 2006-04-04 | 2009-10-01 | Shimadzu Corporation | Radiation detector |
US20080073542A1 (en) * | 2006-09-22 | 2008-03-27 | Stefan Siegel | Light guide having a tapered geometrical configuration for improving light collection in a radiation detector |
JP2009025075A (ja) | 2007-07-18 | 2009-02-05 | Konica Minolta Medical & Graphic Inc | 放射線用シンチレータパネルおよびフラットパネルディテクター |
EP2265974B1 (en) | 2008-04-10 | 2015-06-17 | Koninklijke Philips N.V. | Modular multi-geometry pet system |
JP2010249672A (ja) | 2009-04-16 | 2010-11-04 | Toshiba Corp | ポジトロンct装置 |
CN101856236B (zh) | 2010-06-13 | 2012-07-04 | 苏州瑞派宁科技有限公司 | 一种应用适应性的正电子发射断层成像方法及装置 |
JP2012058170A (ja) | 2010-09-13 | 2012-03-22 | Konica Minolta Medical & Graphic Inc | シンチレータパネル |
CN102178542B (zh) | 2011-04-02 | 2012-09-26 | 苏州瑞派宁科技有限公司 | 一种可变结构的正电子发射断层成像机架 |
JP2012251978A (ja) | 2011-06-07 | 2012-12-20 | Fujifilm Corp | 放射線検出装置 |
-
2013
- 2013-09-08 CN CN201310426359.0A patent/CN104422950B/zh active Active
- 2013-11-14 EP EP13893179.5A patent/EP3043193B1/en active Active
- 2013-11-14 US US14/916,699 patent/US9599726B2/en active Active
- 2013-11-14 HU HUE13893179A patent/HUE045601T2/hu unknown
- 2013-11-14 JP JP2016539390A patent/JP6397027B2/ja active Active
- 2013-11-14 WO PCT/CN2013/087119 patent/WO2015032130A1/zh active Application Filing
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0511060A (ja) * | 1990-01-29 | 1993-01-19 | General Electric Co <Ge> | 2次元モザイク状シンチレ―シヨン検出装置 |
JP2004354343A (ja) * | 2003-05-30 | 2004-12-16 | Shimadzu Corp | 放射線検出器 |
CN1673773A (zh) * | 2004-03-26 | 2005-09-28 | 株式会社岛津制作所 | 辐射检测器及其制造方法 |
CN101073019A (zh) * | 2004-12-09 | 2007-11-14 | 皇家飞利浦电子股份有限公司 | 具有相互作用深度灵敏度的像素化探测器 |
CN101073019B (zh) * | 2004-12-09 | 2011-06-29 | 皇家飞利浦电子股份有限公司 | 具有相互作用深度灵敏度的像素化探测器 |
JP2007078567A (ja) * | 2005-09-15 | 2007-03-29 | Shimadzu Corp | 放射線検出器およびその製造方法 |
CN102129082A (zh) * | 2010-12-23 | 2011-07-20 | 苏州瑞派宁科技有限公司 | 一种锥形闪烁晶体模块及其加工方法 |
CN203414599U (zh) * | 2013-09-08 | 2014-01-29 | 苏州瑞派宁科技有限公司 | 一种阵列晶体模块 |
Also Published As
Publication number | Publication date |
---|---|
US9599726B2 (en) | 2017-03-21 |
JP2016537640A (ja) | 2016-12-01 |
WO2015032130A1 (zh) | 2015-03-12 |
EP3043193A4 (en) | 2017-03-22 |
JP6397027B2 (ja) | 2018-09-26 |
EP3043193B1 (en) | 2019-07-17 |
CN104422950A (zh) | 2015-03-18 |
US20160202361A1 (en) | 2016-07-14 |
EP3043193A1 (en) | 2016-07-13 |
HUE045601T2 (hu) | 2020-01-28 |
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Application publication date: 20150318 Assignee: Suzhou jinhesheng Holding Co.,Ltd. Assignor: RAYCAN TECHNOLOGY Co.,Ltd. (SUZHOU) Contract record no.: X2021320010051 Denomination of invention: An array crystal module and its processing method Granted publication date: 20171024 License type: Exclusive License Record date: 20211210 |
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Denomination of invention: An array crystal module and its processing method Effective date of registration: 20211210 Granted publication date: 20171024 Pledgee: Suzhou jinhesheng Holding Co.,Ltd. Pledgor: RAYCAN TECHNOLOGY Co.,Ltd. (SUZHOU) Registration number: Y2021320010544 |
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EC01 | Cancellation of recordation of patent licensing contract |
Assignee: Suzhou jinhesheng Holding Co.,Ltd. Assignor: RAYCAN TECHNOLOGY Co.,Ltd. (SUZHOU) Contract record no.: X2021320010051 Date of cancellation: 20221215 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20221214 Granted publication date: 20171024 Pledgee: Suzhou jinhesheng Holding Co.,Ltd. Pledgor: RAYCAN TECHNOLOGY Co.,Ltd. (SUZHOU) Registration number: Y2021320010544 |