CN104411737B - 具有低吸水性的低密度环氧组合物 - Google Patents

具有低吸水性的低密度环氧组合物 Download PDF

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Publication number
CN104411737B
CN104411737B CN201380020865.8A CN201380020865A CN104411737B CN 104411737 B CN104411737 B CN 104411737B CN 201380020865 A CN201380020865 A CN 201380020865A CN 104411737 B CN104411737 B CN 104411737B
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CN
China
Prior art keywords
coating
composition
goods
curable
epoxy resin
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201380020865.8A
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English (en)
Chinese (zh)
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CN104411737A (zh
Inventor
苏海勃·埃尔吉姆阿维
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3M Innovative Properties Co
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3M Innovative Properties Co
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Publication of CN104411737A publication Critical patent/CN104411737A/zh
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Publication of CN104411737B publication Critical patent/CN104411737B/zh
Expired - Fee Related legal-status Critical Current
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5026—Amines cycloaliphatic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • C08G59/60—Amines together with other curing agents with amides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/65—Additives macromolecular
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/70—Additives characterised by shape, e.g. fibres, flakes or microspheres
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249971—Preformed hollow element-containing
    • Y10T428/249974—Metal- or silicon-containing element

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Paints Or Removers (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN201380020865.8A 2012-04-20 2013-04-15 具有低吸水性的低密度环氧组合物 Expired - Fee Related CN104411737B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP12164857.0 2012-04-20
EP20120164857 EP2653486B1 (en) 2012-04-20 2012-04-20 Low density epoxy composition with low water uptake
PCT/US2013/036526 WO2013158517A1 (en) 2012-04-20 2013-04-15 Low density epoxy composition with low water uptake

Publications (2)

Publication Number Publication Date
CN104411737A CN104411737A (zh) 2015-03-11
CN104411737B true CN104411737B (zh) 2016-09-28

Family

ID=48227555

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380020865.8A Expired - Fee Related CN104411737B (zh) 2012-04-20 2013-04-15 具有低吸水性的低密度环氧组合物

Country Status (10)

Country Link
US (1) US20150118480A1 (enExample)
EP (1) EP2653486B1 (enExample)
JP (1) JP6224694B2 (enExample)
KR (1) KR20150015461A (enExample)
CN (1) CN104411737B (enExample)
BR (1) BR112014026156A2 (enExample)
CA (1) CA2870917A1 (enExample)
PL (1) PL2653486T3 (enExample)
PT (1) PT2653486E (enExample)
WO (1) WO2013158517A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3122015B2 (ja) 1995-08-03 2001-01-09 エヌケ−ケ−プラント建設株式会社 電気抵抗式溶融炉におけるメタルの処理方法
EP2818490B1 (en) 2013-06-28 2019-04-10 3M Innovative Properties Company Use of an epoxy resin-based composition as a filler honeycomb cells
FR3048972B1 (fr) * 2016-03-15 2018-04-06 Mbda France Materiau de leurrage ultrasonore, en particulier pour systeme d'arme
WO2020191579A1 (en) * 2019-03-25 2020-10-01 3M Innovative Properties Company Curable compositions, articles therefrom, and methods of making and using same
KR102190914B1 (ko) 2019-06-10 2020-12-28 한국생산기술연구원 중공형 필러가 혼합된 복합경화물 및 그 제조방법
JP7560155B2 (ja) * 2019-09-05 2024-10-02 詮達化学股▲フン▼有限公司 有機無機混合材料、その調製方法及び出発原料の調製方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0838499A1 (en) * 1996-10-28 1998-04-29 Minnesota Mining And Manufacturing Company Two-part low density curing epoxy composition and use thereof as void filler
CN1329651A (zh) * 1998-12-07 2002-01-02 卡尔·弗罗伊登伯格公司 粘结剂粉末
CN1332778A (zh) * 1998-12-28 2002-01-23 美国3M公司 密封剂组合物以及采用该组合物的密封剂制品
US20070293603A1 (en) * 2006-06-19 2007-12-20 Ashland Licensing And Intellectual Property Llc Epoxy adhesive composition and use thereof
CN101925652A (zh) * 2008-01-30 2010-12-22 Sika技术股份公司 耐冲洗热固化性环氧树脂粘合剂
CN102378772A (zh) * 2009-03-30 2012-03-14 3M创新有限公司 产生低放热量的环氧树脂基芯填料材料

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2383009A (en) * 2001-12-14 2003-06-18 Vantico Ag Method of making models
CN100404624C (zh) * 2003-02-24 2008-07-23 株式会社钟化 固化性组合物
JP2006328365A (ja) * 2005-04-28 2006-12-07 Sanyo Chem Ind Ltd 模型素材用盛り付け剤
CN101945953B (zh) * 2008-02-22 2012-11-28 旭硝子株式会社 固化性组合物

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0838499A1 (en) * 1996-10-28 1998-04-29 Minnesota Mining And Manufacturing Company Two-part low density curing epoxy composition and use thereof as void filler
CN1329651A (zh) * 1998-12-07 2002-01-02 卡尔·弗罗伊登伯格公司 粘结剂粉末
CN1332778A (zh) * 1998-12-28 2002-01-23 美国3M公司 密封剂组合物以及采用该组合物的密封剂制品
US20070293603A1 (en) * 2006-06-19 2007-12-20 Ashland Licensing And Intellectual Property Llc Epoxy adhesive composition and use thereof
CN101925652A (zh) * 2008-01-30 2010-12-22 Sika技术股份公司 耐冲洗热固化性环氧树脂粘合剂
CN102378772A (zh) * 2009-03-30 2012-03-14 3M创新有限公司 产生低放热量的环氧树脂基芯填料材料

Also Published As

Publication number Publication date
JP6224694B2 (ja) 2017-11-01
WO2013158517A1 (en) 2013-10-24
EP2653486B1 (en) 2014-12-03
US20150118480A1 (en) 2015-04-30
KR20150015461A (ko) 2015-02-10
PL2653486T3 (pl) 2015-04-30
BR112014026156A2 (pt) 2017-06-27
CN104411737A (zh) 2015-03-11
JP2015520782A (ja) 2015-07-23
PT2653486E (pt) 2015-02-17
EP2653486A1 (en) 2013-10-23
CA2870917A1 (en) 2013-10-24

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Granted publication date: 20160928

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CF01 Termination of patent right due to non-payment of annual fee