KR20150015461A - 수분 흡수가 낮은 저밀도 에폭시 조성물 - Google Patents

수분 흡수가 낮은 저밀도 에폭시 조성물 Download PDF

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Publication number
KR20150015461A
KR20150015461A KR1020147031954A KR20147031954A KR20150015461A KR 20150015461 A KR20150015461 A KR 20150015461A KR 1020147031954 A KR1020147031954 A KR 1020147031954A KR 20147031954 A KR20147031954 A KR 20147031954A KR 20150015461 A KR20150015461 A KR 20150015461A
Authority
KR
South Korea
Prior art keywords
curable composition
article
coating
composition
curing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
KR1020147031954A
Other languages
English (en)
Korean (ko)
Inventor
소하이브 엘기미아비
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 컴파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쓰리엠 이노베이티브 프로퍼티즈 컴파니 filed Critical 쓰리엠 이노베이티브 프로퍼티즈 컴파니
Publication of KR20150015461A publication Critical patent/KR20150015461A/ko
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5026—Amines cycloaliphatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • C08G59/60—Amines together with other curing agents with amides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/65—Additives macromolecular
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/70—Additives characterised by shape, e.g. fibres, flakes or microspheres
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249971—Preformed hollow element-containing
    • Y10T428/249974—Metal- or silicon-containing element

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Paints Or Removers (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020147031954A 2012-04-20 2013-04-15 수분 흡수가 낮은 저밀도 에폭시 조성물 Abandoned KR20150015461A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP20120164857 EP2653486B1 (en) 2012-04-20 2012-04-20 Low density epoxy composition with low water uptake
EP12164857.0 2012-04-20
PCT/US2013/036526 WO2013158517A1 (en) 2012-04-20 2013-04-15 Low density epoxy composition with low water uptake

Publications (1)

Publication Number Publication Date
KR20150015461A true KR20150015461A (ko) 2015-02-10

Family

ID=48227555

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147031954A Abandoned KR20150015461A (ko) 2012-04-20 2013-04-15 수분 흡수가 낮은 저밀도 에폭시 조성물

Country Status (10)

Country Link
US (1) US20150118480A1 (enExample)
EP (1) EP2653486B1 (enExample)
JP (1) JP6224694B2 (enExample)
KR (1) KR20150015461A (enExample)
CN (1) CN104411737B (enExample)
BR (1) BR112014026156A2 (enExample)
CA (1) CA2870917A1 (enExample)
PL (1) PL2653486T3 (enExample)
PT (1) PT2653486E (enExample)
WO (1) WO2013158517A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020251182A1 (ko) * 2019-06-10 2020-12-17 한국생산기술연구원 중공형 필러가 혼합된 복합경화물 및 그 제조방법

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3122015B2 (ja) 1995-08-03 2001-01-09 エヌケ−ケ−プラント建設株式会社 電気抵抗式溶融炉におけるメタルの処理方法
EP2818490B1 (en) 2013-06-28 2019-04-10 3M Innovative Properties Company Use of an epoxy resin-based composition as a filler honeycomb cells
FR3048972B1 (fr) * 2016-03-15 2018-04-06 Mbda France Materiau de leurrage ultrasonore, en particulier pour systeme d'arme
WO2020191579A1 (en) 2019-03-25 2020-10-01 3M Innovative Properties Company Curable compositions, articles therefrom, and methods of making and using same
WO2021042314A1 (zh) * 2019-09-05 2021-03-11 诠达化学股份有限公司 一种有机无机混成材料、其制备方法和其起始原料的制备方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0838499A1 (en) * 1996-10-28 1998-04-29 Minnesota Mining And Manufacturing Company Two-part low density curing epoxy composition and use thereof as void filler
DE19856254A1 (de) * 1998-12-07 2000-06-08 Freudenberg Carl Fa Klebstoffpulver
JP2000192013A (ja) * 1998-12-28 2000-07-11 Minnesota Mining & Mfg Co <3M> シ―ラント組成物及びそれを用いたシ―ラント物品
GB2383009A (en) * 2001-12-14 2003-06-18 Vantico Ag Method of making models
EP1598402B1 (en) * 2003-02-24 2012-05-02 Kaneka Corporation Curable compositions
JP2006328365A (ja) * 2005-04-28 2006-12-07 Sanyo Chem Ind Ltd 模型素材用盛り付け剤
US20070293603A1 (en) * 2006-06-19 2007-12-20 Ashland Licensing And Intellectual Property Llc Epoxy adhesive composition and use thereof
DE502008001517D1 (de) * 2008-01-30 2010-11-25 Sika Technology Ag Auswaschbeständige hitzehärtende Epoxidharzklebstoffe
WO2009104700A1 (ja) * 2008-02-22 2009-08-27 旭硝子株式会社 硬化性組成物
GB0905362D0 (en) * 2009-03-30 2009-05-13 3M Innovative Properties Co Fire resistant epoxy resin based core filler material developing low exothermic heat

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020251182A1 (ko) * 2019-06-10 2020-12-17 한국생산기술연구원 중공형 필러가 혼합된 복합경화물 및 그 제조방법
KR20200141315A (ko) 2019-06-10 2020-12-18 한국생산기술연구원 중공형 필러가 혼합된 복합경화물 및 그 제조방법

Also Published As

Publication number Publication date
CN104411737B (zh) 2016-09-28
CA2870917A1 (en) 2013-10-24
US20150118480A1 (en) 2015-04-30
PL2653486T3 (pl) 2015-04-30
CN104411737A (zh) 2015-03-11
PT2653486E (pt) 2015-02-17
EP2653486B1 (en) 2014-12-03
EP2653486A1 (en) 2013-10-23
BR112014026156A2 (pt) 2017-06-27
JP6224694B2 (ja) 2017-11-01
JP2015520782A (ja) 2015-07-23
WO2013158517A1 (en) 2013-10-24

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Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20141114

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20180413

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20190228

Patent event code: PE09021S01D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20191007

NORF Unpaid initial registration fee
PC1904 Unpaid initial registration fee