CN104388216A - Electronic element cleaning agent and preparation method thereof - Google Patents

Electronic element cleaning agent and preparation method thereof Download PDF

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Publication number
CN104388216A
CN104388216A CN201410647244.9A CN201410647244A CN104388216A CN 104388216 A CN104388216 A CN 104388216A CN 201410647244 A CN201410647244 A CN 201410647244A CN 104388216 A CN104388216 A CN 104388216A
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China
Prior art keywords
agent
electronic component
electronic element
cleaning agent
fatty alcohol
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Withdrawn
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CN201410647244.9A
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Chinese (zh)
Inventor
禹胜林
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Wuxi Nuist Weather Sensor Network Technology Co Ltd
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Wuxi Nuist Weather Sensor Network Technology Co Ltd
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Priority to CN201410647244.9A priority Critical patent/CN104388216A/en
Publication of CN104388216A publication Critical patent/CN104388216A/en
Withdrawn legal-status Critical Current

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Abstract

The invention relates to an electronic element cleaning agent and a preparation method thereof. The electronic element cleaning agent comprises the following components in percentage by weight: 20-30% of fatty alcohol polyoxyethylene, 3-12% of diethanol amine, 3-8% of organic phosphoric acid, 3-6% of tripropylene glycol monomethyl ether, 1-5% of rust inhibitor, 1-3% of penetrating agent, 0.5-1.5% of PH regulator and the balance of deionized water. The preparation method comprises the steps of preparing all the components according to the weight ratio; sequentially placing the fatty alcohol polyoxyethylene, diethanol amine, organic phosphoric acid, tripropylene glycol monomethyl ether and deionized water into a stirrer to mix, heating to 40 DEG C, and uniformly stirring all the components; and then, adding the rust inhibitor, the penetrating agent and the PH regulator to stir for 10-15 minutes. The electronic element cleaning agent is capable of rapidly dissolving and clearing various kinds of dirt and impurities attached on an electronic element, incapable of generating new ionic pollution, free of corrosion to the electronic element and good in cleaning effect.

Description

A kind of electronic component cleaning agent and preparation method
Technical field
The present invention relates to a kind of electronic component cleaning agent and preparation method, belong to sanitising agent technical field.
Background technology
Along with the fast development of world's electronics and information industry, the electronic component industry development as electronics and information industry basis is also rapidly abnormal.Electronic component is just entering the components and parts epoch of new generation based on new electronic component, it will replace traditional components and parts substantially, electronic devices and components require to be main improvement by original the miniaturization for adaptation complete machine and novel process thereof, become to meet digital technique, to develop the characteristic requirements proposed be master to microelectronics, and be the complete satisfied industrialized development stage.Electronic component is the basis of composition electronic product, and it is study that the kind of the electronic component that understanding is conventional, properity also can correctly be selected, grasp the basic of electronic technology.Conventional electronic component has: resistance, electric capacity, inductance, potentiometer, transformer, triode, diode, IC etc., with regard to mounting means, can be divided into conventional mounting (also known as through hole dress and DIP) and the large class of surface mounting two at present.
Clean-out system solvent is a very large category, of a great variety, comprises inorganic cleaning and the large class of organic washing two.Briefly, organic clear numerous agent is exactly the clean-out system made containing carbon compound, and inorganic clear numerous agent is exactly the clean-out system that carbon-free compound is made, and therefore they belong to inorganics in the difference of organic washing agent and inorganic clean-out system.
Water is most important clean-out system, has the irreplaceable function and position of other any clean-out system.Common water is easy to obtain from occurring in nature, and water has very strong solvency power and dispersion force.But the surface tension of water is large, in use need to add tensio-active agent, to reduce surface tension, increase surface moist.In general industry cleaning, acid, the proportioning of alkali and water is more common, and some metal washes with water and will add rust-preventive agent.Aq. type clean-out system is mixed with by tensio-active agent (as sodium alkyl benzene sulfonate, sodium alkyl sulfate) and various auxiliary agent (as tripoly phosphate sodium STPP), auxiliary, during dirt on washes surface, the surface tension of the aqueous solution can be reduced, improve the material of clean effect.Solid detergent, liquid washing agent is divided into by product appearance form.Solid detergent output is maximum, claims washing powder traditionally, comprises finely powdered, particulate state and hollow bead shape etc.Also have between detergent paste therebetween, also claim washing cream.All kinds of synthetic detergent has different production technique, wherein complicated with solid detergent.Countries in the world generally produce hollow bead shape solid detergent, adopt high tower spray drying method, and its master operation has Pulp preparation, spraying dry, wind to send aging and packaging.Liquid washing agent manufactures easy, only need by tensio-active agent, auxiliary agent and other additives, and treated water, sends into mixing machine and carries out mixing.
Half aq. type clean-out system is also accurate aq. type clean-out system, forms as alcohols, organic hydrocarbon etc. by high boiling solvent and promoting agent etc.Usually containing 5% one 20% moisture, generally nonflammable, but heat cleaning time water-content control improper, may combustion phenomena be produced.Half aq. type cleaning has washed with solvent that some are different, and its Cleaning principle peels off to remove, instead of dissolving.In order to prevent the greasy dirt peeled off to be attached in cleaned material, scavenging solution will circulate continuously, and increases water-and-oil separator again.Partly wash usual cleaning performance fine, but running cost is higher, waste liquid can not regenerate recovery, reuses, containing COD(chemical oxygen demand) higher, need to carry out wastewater treatment.Half aq. type clean-out system adsorbs the novel detergent product of the medicament that various auxiliary agent synthesizes by fine particulate weakly alkaline, the active abrasive particle of natural interface is adopted to be raw material, coordinating multiple actives and sterilant, rumbling compound, that the green technology such as agent and unique bright factor high-tech is seen through in import is formulated, is a kind of multi-functional, efficient comprehensive Environment protection cleaning care products.Be the decontamination product of Modern New, clean effect is unique, and purposes is wide, is free from side effects to human body skin.By active abrasive particle be help with abrasive particle in pollute containing all kinds of serious tough stains more thoroughly can be removed fast with slight soft friction during unique cleaning agent matching purge.The dirt such as black dirt, heavy oil dirt, cement scale, spackling dirt, coin marking, rust deposite, gluing matter, tea stain, drink stain, glue hammering, leather shoes scratch, obstinate wax stain, aluminium trace, wooden trace, grid trace, watermark, footwear print, ink print, environmental protection, do not damage brick face, do not hinder hand.
Leaning solvent refers to water-fast organic solvent.Leaning solvent is made up of varsol, halogenated hydrocarbon solvent, alcoholic solvent, ether solvent, ketones solvent, esters solvent, phenol solvent, mixed solvent.
The clean-out system of electronic component in the market, mostly cleaning performance is bad, and some clean-out systems also have nitrites objectionable impurities, harm environment and people healthy; Because it is higher to the requirement of scavenging solution, there is higher requirement to its corrodibility and cleaning speed, can not should cause damage to electronics again to electronic component Rapid Cleaning.Therefore, develop and a kind ofly novel have environmental hazard low, cleaning performance is excellent, and the clean-out system less to electronic component infringement, has become the problem of those skilled in the art's solution too impatient to wait.
Chinese invention patent specification sheets CN 103555474 A is so a kind of electronic devices and components clean-out system openly.This electronic devices and components clean-out system composition and weight ratio are petroleum hydrocarbon 3 parts, emulsifying agent part, Dipropylene glycol mono-n-butyl Ether 2 parts, 3 parts, 3-methoxyl group-3-methyl isophthalic acid-butanols, 2-aminoethyle alcohol 2 parts, boric acid MEA ester 6 parts, phenylformic acid diethanolamine 5 parts, molybdic acid diethanolamine 1 part, 5 parts, tensio-active agent, water glass 5 parts, thanomin 1 part, ionized water 15 parts.The clean-out system of this invention can remove the residual of tin cream on steel mesh and misprint plate and glue fast, and free from extraneous odour and corrodibility, the danger of not blasting and burning, can not produce steel mesh and wiring board and damage.With the addition of the rust remover such as phenylformic acid diethanolamine or molybdic acid diethanolamine, on the basis of the greasy dirt on clean metal part, can also derusting rust-proofing.But this clean-out system for chip cleaning performance be not fine.
Chinese invention patent specification sheets CN 101368132 A openly so a kind of low-surface tensity circuit chip detergent.This low-surface tensity circuit chip detergent, comprise permeate agent, PH conditioning agent, tensio-active agent, solubilizing agent and pure water, wherein the weight percent of oxygenant is 1% to 5%, the weight percent of PH conditioning agent is 2% to 10%, the weight percent of solubilizing agent is 5% to 10%, the weight percent of tensio-active agent is 1% to 10%, and all the other are pure water; It is alkaline aqueous solution clean-out system, and good to the inhibition of circuit chip surface cleaning tension force, corrodibility is little, not etching apparatus, and not fragile circuit chip is surperficial, is convenient to the treatment and discharge of discarded scavenging solution, meets the requirement of environment protection.But this flocculation agent is not fine for the treatment effect of sewage.But this clean-out system for chip cleaning performance be not fine.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of electronic component cleaning agent and preparation method, this electronic component cleaning agent can dissolve rapidly remove be attached on electronic component various dirt and impurity, do not produce new ionic soil, corrosion-free to electronic component, cleaning performance is good.
In order to solve the problems of the technologies described above, a kind of electronic component cleaning agent of the present invention, by weight percentage, comprise following component: polyoxyethylene fatty alcohol 20%-30%, diethanolamine 3%-12%, organic phosphoric acid 3%-8%, tripropylene glycol methyl ether 3%-6%, rust-preventive agent 1%-5%, permeate agent 1%-3%, PH conditioning agent 0.5%-1.5%, all the other compositions are deionized water.
Described rust-preventive agent is SA.
Described permeate agent is selected from the one in lauryl alcohol, oleic acid, mentha camphor.
Described PH conditioning agent is boric acid.
The preparation method of described electronic component cleaning agent, according to weight proportion, each composition is configured, polyoxyethylene fatty alcohol, diethanolamine, organic phosphoric acid, tripropylene glycol methyl ether, deionized water are put into agitator successively mix, be heated to 40 degree, stir, then add rust-preventive agent, permeate agent, PH conditioning agent stirring 10-15 minute.
Adopt this electronic component cleaning agent to have the following advantages: this clean-out system can dissolve rapidly remove be attached on electronic component various dirt and impurity, do not produce new ionic soil, corrosion-free to electronic component, cleaning performance is good.Add rust-preventive agent, electronic component can be prevented by corrosion; Add the osmotic efficiency that permeate agent can strengthen polyoxyethylene fatty alcohol, the two synergy; Add the potential of hydrogen that pH value conditioning agent can regulate sanitising agent.
Embodiment
Electronic component cleaning agent, by weight percentage, comprises following component: polyoxyethylene fatty alcohol 20%-30%, diethanolamine 3%-12%, organic phosphoric acid 3%-8%, tripropylene glycol methyl ether 3%-6%, rust-preventive agent 1%-5%, permeate agent 1%-3%, PH conditioning agent 0.5%-1.5%, all the other compositions are deionized water.
Described rust-preventive agent is SA.
Described permeate agent is selected from the one in lauryl alcohol, oleic acid, mentha camphor.
Described PH conditioning agent is boric acid.
The preparation method of described electronic component cleaning agent, according to weight proportion, each composition is configured, polyoxyethylene fatty alcohol, diethanolamine, organic phosphoric acid, tripropylene glycol methyl ether, deionized water are put into agitator successively mix, be heated to 40 degree, stir, then add rust-preventive agent, permeate agent, PH conditioning agent stirring 10-15 minute.
Embodiment 1:
According to weight percent, take 20% polyoxyethylene fatty alcohol respectively, 3% diethanolamine, 3% organic phosphoric acid, 3% tripropylene glycol methyl ether, 1% rust-preventive agent, 1% permeate agent .5%PH conditioning agent, all the other compositions are deionized water.
According to weight proportion, each composition is configured, polyoxyethylene fatty alcohol, diethanolamine, organic phosphoric acid, tripropylene glycol methyl ether, deionized water are put into agitator successively mix, be heated to 40 degree, stir, then add rust-preventive agent, permeate agent, PH conditioning agent stirring 10-15 minute.
Embodiment 2:
According to weight percent, take 23% polyoxyethylene fatty alcohol respectively, 5% diethanolamine, 4% organic phosphoric acid, 4% tripropylene glycol methyl ether, 2% rust-preventive agent, 2% permeate agent, 0.8%PH conditioning agent, all the other compositions are deionized water.
According to weight proportion, each composition is configured, polyoxyethylene fatty alcohol, diethanolamine, organic phosphoric acid, tripropylene glycol methyl ether, deionized water are put into agitator successively mix, be heated to 40 degree, stir, then add rust-preventive agent, permeate agent, PH conditioning agent stirring 10-15 minute.
Embodiment 3:
According to weight percent, take 20% polyoxyethylene fatty alcohol respectively, 7% diethanolamine, organic 5% phosphoric acid, 5% tripropylene glycol methyl ether, 3% rust-preventive agent, 2% permeate agent, 1%PH conditioning agent, all the other compositions are deionized water.
According to weight proportion, each composition is configured, polyoxyethylene fatty alcohol, diethanolamine, organic phosphoric acid, tripropylene glycol methyl ether, deionized water are put into agitator successively mix, be heated to 40 degree, stir, then add rust-preventive agent, permeate agent, PH conditioning agent stirring 10-15 minute.
Embodiment 4:
According to weight percent, take 28% polyoxyethylene fatty alcohol respectively, 10% diethanolamine, 6% organic phosphoric acid, 5% tripropylene glycol methyl ether, 4% rust-preventive agent, 2% permeate agent, 1.3%PH conditioning agent, all the other compositions are deionized water.
According to weight proportion, each composition is configured, polyoxyethylene fatty alcohol, diethanolamine, organic phosphoric acid, tripropylene glycol methyl ether, deionized water are put into agitator successively mix, be heated to 40 degree, stir, then add rust-preventive agent, permeate agent, PH conditioning agent stirring 10-15 minute.
Embodiment 5:
According to weight percent, take 30% polyoxyethylene fatty alcohol respectively, 12% diethanolamine, 8% organic phosphoric acid, 6% tripropylene glycol methyl ether, 5% rust-preventive agent, 3% permeate agent, 1.5%PH conditioning agent, all the other compositions are deionized water.
According to weight proportion, each composition is configured, polyoxyethylene fatty alcohol, diethanolamine, organic phosphoric acid, tripropylene glycol methyl ether, deionized water are put into agitator successively mix, be heated to 40 degree, stir, then add rust-preventive agent, permeate agent, PH conditioning agent stirring 10-15 minute.
Cleaning performance test is carried out to embodiment 1-5 and comparative example 1-2 gained electronic component cleaning agent, the results are shown in Table 1:
Table 1
Embodiment 1 Embodiment 2 Embodiment 3 Embodiment 4 Embodiment 5 Example 1 relatively Example 2 relatively
Cleaning rate 89.1% 90.2% 91.2% 92.4% 93.0% 85.2% 81.5%
As seen from the above table, the present invention can dissolve rapidly remove be attached on electronic component various dirt and impurity, do not produce new ionic soil, corrosion-free to electronic component, cleaning performance is good.
The technical characteristic described in detail is not had to be prior art in the application.Above-described embodiment is the principle of illustrative the application and effect thereof only, but not for limiting the application.Any person skilled in the art scholar all under the spirit and category of the application, can modify above-described embodiment or changes.Therefore, have in art and usually know that the knowledgeable modifies or changes not departing from all equivalences completed under the spirit and technological thought that the application discloses, must be contained by the claim of the application.

Claims (5)

1. an electronic component cleaning agent, it is characterized in that: by weight percentage, comprise following component: polyoxyethylene fatty alcohol 20%-30%, diethanolamine 3%-12%, organic phosphoric acid 3%-8%, tripropylene glycol methyl ether 3%-6%, rust-preventive agent 1%-5%, permeate agent 1%-3%, PH conditioning agent 0.5%-1.5%, all the other compositions are deionized water.
2. according to electronic component cleaning agent according to claim 1, it is characterized in that: described rust-preventive agent is SA.
3. according to electronic component cleaning agent according to claim 1, it is characterized in that: described permeate agent is selected from the one in lauryl alcohol, oleic acid, mentha camphor.
4. according to electronic component cleaning agent according to claim 1, it is characterized in that: described PH conditioning agent is boric acid.
5. the preparation method of an electronic component cleaning agent as claimed in claim 1, it is characterized in that: according to weight proportion, each composition is configured, polyoxyethylene fatty alcohol, diethanolamine, organic phosphoric acid, tripropylene glycol methyl ether, deionized water are put into agitator successively mix, be heated to 40 degree, stir, then add rust-preventive agent, permeate agent, PH conditioning agent stirring 10-15 minute.
CN201410647244.9A 2014-11-14 2014-11-14 Electronic element cleaning agent and preparation method thereof Withdrawn CN104388216A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112342096A (en) * 2020-10-27 2021-02-09 深圳市帕克威乐新材料有限公司 Solid cleaning agent and application and use method thereof
CN116286200A (en) * 2022-12-20 2023-06-23 江苏芯诺半导体科技有限公司 Formula and preparation process of cleaning agent for semiconductor silicon wafer cutting slice

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112342096A (en) * 2020-10-27 2021-02-09 深圳市帕克威乐新材料有限公司 Solid cleaning agent and application and use method thereof
CN116286200A (en) * 2022-12-20 2023-06-23 江苏芯诺半导体科技有限公司 Formula and preparation process of cleaning agent for semiconductor silicon wafer cutting slice

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