CN104377290A - 发光二极体及发光二极体的导线架 - Google Patents

发光二极体及发光二极体的导线架 Download PDF

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CN104377290A
CN104377290A CN201310356633.1A CN201310356633A CN104377290A CN 104377290 A CN104377290 A CN 104377290A CN 201310356633 A CN201310356633 A CN 201310356633A CN 104377290 A CN104377290 A CN 104377290A
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李忠义
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An annotation technology (China) Limited company
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I-CHIUN PRECISION ELECTRIC INDUSTRY (CHINA) Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L2224/4809Loop shape
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4911Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires

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Abstract

一种发光二极体及发光二极体的导线架,包括一导电架体以及一绝缘凹杯。导电架体包含打线区块和双晶片配设区块,打线区块与双晶片配设区块之间彼此间隔;绝缘凹杯形成于导电架体上且同时框围住双晶片配设区块和打线区块,绝缘凹杯具有出光区域和侧开口,侧开口开设于绝缘凹杯对应于出光区域的侧面,且侧开口连通于出光区域。藉此,以具有扩大讯号收讯角度的功效,并因为能够一次封装至少二晶片,以具有组装不复杂且整体结构不致变大的功效。

Description

发光二极体及发光二极体的导线架
技术领域
本发明与导线架有关,特别是关于一种封装有至少两晶片的发光二极体、以及此等发光二极体的导线架。
背景技术
现有发光二极体除了封装有LED晶片而据以发出光线,还另外封装有一光感测晶片,以增加可感测光线的功能,提升发光二极体的价值。
惟,目前皆将LED晶片和光感测晶片个别独立封装,容易发生组装趋于复杂,且整体结构较大的问题,确有必要加以改善。
发明内容
本发明的目的在于提供一种能扩大讯号收讯角度、能一次封装至少二晶片的发光二极体及发光二极体的导线架。
为达上述目的,本发明提供一种发光二极体的导线架,包括:一导电架体,包含一打线区块和一双晶片配设区块,该打线区块与该双晶片配设区块之间彼此间隔;以及一绝缘凹杯,形成于该导电架体上且同时框围住该双晶片配设区块和该打线区块,该绝缘凹杯具有一出光区域和一侧开口,该侧开口开设于该绝缘凹杯对应于该出光区域的侧面,该侧开口连通于该出光区域。
本发明另提供一种发光二极体,包括:一导线架,包含一导电架体和一绝缘凹杯,该导电架体包含一打线区块和一双晶片配设区块,该打线区块与该双晶片配设区块之间彼此间隔;该绝缘凹杯形成于该导电架体上且同时框围住该双晶片配设区块和该打线区块,该绝缘凹杯具有一出光区域和一侧开口,该侧开口开设于该绝缘凹杯对应于该出光区域的侧面,该侧开口连通于该出光区域;一晶片组,包含同时电性配设于该双晶片配设区块的一LED晶片和一感测晶片,该LED晶片和该感测晶片的同一电极系皆电性连接于该打线区块;以及一封装胶体,封装于该绝缘凹杯的该出光区域内。
相较于先前技术,本发明具有以下功效:藉由增设侧开口,以具有扩大讯号收讯角度的功效;藉由绝缘凹杯同时框围住双晶片配设区块和打线区块,因此在灌胶封装时能一次封装二晶片,并因为能够一次封装而具有组装不复杂且整体结构不致变大的功效。
附图说明
图1:为本发明导线架于一视角时的立体图。
图2:为本发明导线架于另一视角时的立体图。
图3:为本发明导线架的俯视图。
图4:为本发明导线架的剖视图。
图5:为本发明导线架电性配设有晶片时的俯视图。
图6:为本发明依据图5的剖视图。
图7:为本发明在导线架封装有封装胶体的发光二极体俯视图。
图8:为本发明导线架的另一实施例立体图。
具体实施方式
为了能够更进一步了解本发明的特征、特点和技术内容,请参阅以下有关本发明的详细说明与附图,惟所附图式仅提供参考与说明用,非用以限制本发明。
本发明提供一种发光二极体及发光二极体的导线架,如图7所示,为在导线架100电性配设至少两晶片并封装有封装胶体600而形成一发光二极体。
如图1~图4所示,为本发明导线架100的立体图、俯视图和剖视图。导线架100包括一导电架体1以及一绝缘凹杯2。
导电架体1包含一双晶片配设区块11和一打线区块12,于本实施例中,导电架体1还包含一单晶片配设区块13,打线区块12与单晶片配设区块13彼此间隔且前后并排设置,使打线区块12和单晶片配设区块13共同组合成导电架体1的第一架体(未标示符号),至于双晶片配设区块11则再与第一架体彼此间隔且左右并排设置,换言之,双晶片配设区块11即为导电架体1的第二架体(未标示符号)。
绝缘凹杯2形成于导电架体1上,以在导电架体1上成型有如图所示的环绕壁体,环绕壁体则同时框围住双晶片配设区块11和打线区块12。绝缘凹杯2具有一出光区域20和一侧开口23,其中,绝缘凹杯2对应于出光区域20的侧面即开设有这个侧开口23,这个侧开口23还连通于出光区域20。于本实施例中,如图1~图4(甚至是图6、7)所示,绝缘凹杯2包含彼此相对的二第一墙板21和连接于二第一墙板21的一端之间的一第二墙板22,二第一墙板21的另一端则具有彼此相向二勾部211,前述侧开口23则形成于二勾部211之间,藉由此二勾部211,以使绝缘凹杯2在灌胶时能够被二勾部211勾住而不会轻易自侧开口23流出。
此外,打线区块12和单晶片配设区块13的一端略凸出于绝缘凹杯2的周围24(见图3),且双晶片配设区块11亦有略凸出于周围24的部分(见图3),以做为电性接脚之用。
藉此以组成本发明的导线架100,此时,请搭配图5、6所示,若在双晶片配设区块11电性配设有一LED晶片3和一感测晶片4,则能同时具有:可利用LED晶片3发出光线的功能、以及可利用感测晶片4感测通讯讯号或感测光强度的功能,再加上开设于绝缘凹杯2的侧开口23,以使感测晶片4具有更大的收讯角度;当然,若能让感测晶片4靠近于侧开口23,LED晶片3相对远离于侧开口23,则收讯效果更佳。此外,还能利用绝缘凹杯2同时框围住双晶片配设区块11和打线区块12,以在进行封装时能一次封装二晶片(此二晶片可同时电性配设于双晶片配设区块11上)。
在实施上,可在单晶片配设区块13上电性配设有一齐纳二极体晶片5(见图5),以具有防止EMI(Electromagnetic Interference,电磁干扰)的功效。此外,LED晶片3、感测晶片4和齐纳二极体晶片5的负电极皆以打线方式电性连接于打线区块12。
较佳者,如图4所示,本发明导线架100中,双晶片配设区块11(即前述的第二架体)的厚度大于打线区块12及单晶片配设区块13(即前述的第一架体)的厚度,藉以提升散热性,有利于感测晶片4、特别是LED晶片3的散热。至于如何加厚双晶片配设区块11的厚度,举例而言,可利用至少二片体彼此叠加而成。
再者,双晶片配设区块11还可延伸有至少一延伸段111,此延伸段111则具有天线的作用,以让讯号的收讯效果更佳。于本实施例中,双晶片配设区块11延伸有二延伸段111,且延伸段111凸出于绝缘凹杯2的周围24,以利于讯号的接收。
三者,如图2所示,双晶片配设区块11的二相对边还各开设有一凹部112,以在成型绝缘凹杯2时,能让绝缘凹杯2对应嵌入于二凹部112内,进而使导电架体1与绝缘凹杯2之间具有较佳的咬合强度。
如图7所示,为本发明发光二极体于封装后的俯视图,发光二极体包括前述的导线架100、一晶片组300以及一封装胶体600。
如图5、6所示,晶片组300包含同时电性配设于双晶片配设区块11的LED晶片3和感测晶片4,于本实施例中,晶片组300还包含有电性配设于单晶片配设区块13的齐纳二极体晶片5,LED晶片3、感测晶片4和齐纳二极体晶片5的负电极皆以打线方式电性连接于打线区块12。其中,感测晶片4用以感测通讯讯号或用以感测光强度,本发明并未限定。
封装胶体600封装于绝缘凹杯2的出光区域20内,如图5所示,且由于绝缘凹杯2同时框围住双晶片配设区块11和打线区块12,甚至还同时框围住单晶片配设区块13,因此在灌胶封装时能将LED晶片3、感测晶片4和齐纳二极体晶片5予以一次封装,并因为能够一次封装而具有组装不复杂且整体结构不致变大的功效。
再者,藉由分别设于二第一墙板21的二勾部211,以使绝缘凹杯2在灌胶时,能让还未凝固的封装胶体600被二勾部211勾住而不会轻易自侧开口23流出。
此外,绝缘凹杯2除了可以是如图1~图7所示的型态,还可以是其它亦开设有侧开口23a的型态,如图8所示本发明导线架100a的另一实施例(亦具有让感测晶片4具有更大收讯角度的功效),绝缘凹杯2a包含一第一墙板21和一第二墙板22,第二墙板22的一端垂接于第一墙板21的一端,使绝缘凹杯2a形成一L形结构,侧开口23a则形成于第一墙板21的另一端与第二墙板22的另一端之间,较佳者还可在第一墙板21的另一端设有一勾部211,侧开口23a则形成于勾部211与第二墙板22的另一端之间。
综上所述,本发明相较于先前技术具有以下功效:藉由侧开口23或23a,以具有扩大讯号收讯角度的功效,例如能使感测晶片4具有更大的收讯角度;再者,藉由绝缘凹杯2同时框围住双晶片配设区块11和打线区块12,甚至还同时框围住单晶片配设区块13,因此在灌胶封装时能将LED晶片3、感测晶片4和齐纳二极体晶片5予以一次封装,并因为能够一次封装而具有组装不复杂且整体结构不致变大的功效。
此外,本发明还具有其它功效:可藉由勾部211,以使绝缘凹杯2在灌胶时能够被勾住而不会轻易自侧开口23流出;藉由齐纳二极体晶片5,以具有防止EMI的功效;藉由加厚双晶片配设区块11的厚度,以提升散热性;藉由凸出于绝缘凹杯2的周围24的延伸段111,以让讯号的收讯效果更佳;藉由凹部112,以使导电架体1与绝缘凹杯2之间具有较佳的咬合强度。
以上所述者,仅为本发明的较佳可行实施例而已,非因此即局限本发明的专利范围,举凡运用本发明说明书及图式内容所为的等效结构变化,均理同包含于本发明的权利范围内,合予陈明。

Claims (10)

1.一种发光二极体的导线架,其特征在于包括:
一导电架体,包含一打线区块和一双晶片配设区块,该打线区块与该双晶片配设区块之间彼此间隔;以及
一绝缘凹杯,形成于该导电架体上且同时框围住该双晶片配设区块和该打线区块,该绝缘凹杯具有一出光区域和一侧开口,该侧开口开设于该绝缘凹杯对应于该出光区域的侧面,该侧开口连通于该出光区域。
2.如权利要求1所述的发光二极体的导线架,其特征在于,该导电架体进一步包含一单晶片配设区块,该单晶片配设区块、该双晶片配设区块以及该打线区块之间彼此间隔且并排设置,该单晶片配设区块电性配设有一齐纳二极体晶片,该齐纳二极体晶片的一电极电性连接于该打线区块。
3.如权利要求2所述的发光二极体的导线架,其特征在于,该双晶片配设区块的厚度大于该单晶片配设区块及该打线区块的厚度。
4.如权利要求1所述的发光二极体的导线架,其特征在于,该导电架体的该双晶片配设区块延伸有至少一延伸段,该至少一延伸段凸出于该绝缘凹杯的周围。
5.如权利要求1所述的发光二极体的导线架,其特征在于,该绝缘凹杯包含彼此相对的二第一墙板和连接于该二第一墙板的一端之间的一第二墙板,该二第一墙板的另一端则具有彼此相向二勾部,该侧开口形成于该二勾部之间。
6.如权利要求1所述的发光二极体的导线架,其特征在于,该绝缘凹杯包含一第一墙板和一第二墙板,该第二墙板的一端垂接于该第一墙板的一端,该绝缘凹杯形成一L形结构,该第一墙板的另一端具有一勾部,该侧开口形成于该勾部与该第二墙板的另一端之间。
7.一种具有如权利要求1~6任一项所述导线架的发光二极体,其特征在于包括:
一导线架,包含一导电架体和一绝缘凹杯,
该导电架体包含一打线区块和一双晶片配设区块,该打线区块与该双晶片配设区块之间彼此间隔;
该绝缘凹杯形成于该导电架体上且同时框围住该双晶片配设区块和该打线区块,该绝缘凹杯具有一出光区域和一侧开口,该侧开口开设于该绝缘凹杯对应于该出光区域的侧面,该侧开口连通于该出光区域;
一晶片组,包含同时电性配设于该双晶片配设区块的一LED晶片和一感测晶片,该LED晶片和该感测晶片的同一电极皆电性连接于该打线区块;以及
一封装胶体,封装于该绝缘凹杯的该出光区域内。
8.如权利要求7所述的发光二极体,其特征在于,该感测晶片靠近于该侧开口,该LED晶片则相对远离于该侧开口。
9.如权利要求7所述的发光二极体,其特征在于,该感测晶片为一用以感测通讯讯号的感测晶片。
10.如权利要求7所述的发光二极体,其特征在于,该感测晶片为一用以感测光强度的感测晶片。
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JP2000068530A (ja) * 1998-08-24 2000-03-03 Nec Corp 光送受信モジュール
CN101101944A (zh) * 2006-07-07 2008-01-09 Lg电子株式会社 用于安装发光器件的辅助底座和发光器件封装
US20110175119A1 (en) * 2010-01-15 2011-07-21 Kim Deung Kwan Light emitting apparatus and lighting system
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