CN104363718A - 软硬结合电路板的生产方法 - Google Patents
软硬结合电路板的生产方法 Download PDFInfo
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- CN104363718A CN104363718A CN201410724809.9A CN201410724809A CN104363718A CN 104363718 A CN104363718 A CN 104363718A CN 201410724809 A CN201410724809 A CN 201410724809A CN 104363718 A CN104363718 A CN 104363718A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201410724809.9A CN104363718B (zh) | 2014-12-04 | 2014-12-04 | 软硬结合电路板的生产方法 |
Applications Claiming Priority (1)
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CN201410724809.9A CN104363718B (zh) | 2014-12-04 | 2014-12-04 | 软硬结合电路板的生产方法 |
Publications (2)
Publication Number | Publication Date |
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CN104363718A true CN104363718A (zh) | 2015-02-18 |
CN104363718B CN104363718B (zh) | 2017-05-17 |
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CN201410724809.9A Active CN104363718B (zh) | 2014-12-04 | 2014-12-04 | 软硬结合电路板的生产方法 |
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CN (1) | CN104363718B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105050325A (zh) * | 2015-07-03 | 2015-11-11 | 深圳市景旺电子股份有限公司 | 一种刚挠结合板铣板的方法 |
CN108449880A (zh) * | 2018-04-08 | 2018-08-24 | 珠海市凯诺微电子有限公司 | 柔性线路板覆盖膜贴合方法 |
CN113411961A (zh) * | 2021-06-11 | 2021-09-17 | 金禄电子科技股份有限公司 | 软硬结合线路板及其制备方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7220131B1 (en) * | 2005-12-20 | 2007-05-22 | Xerox Corporation | Electromechanical device having a plurality of bundles of fibers for interconnecting two planar surfaces |
CN101076227A (zh) * | 2006-05-18 | 2007-11-21 | 施汉忠 | 软硬结合线路板采用热固胶压合方法 |
CN102548247A (zh) * | 2012-01-16 | 2012-07-04 | 惠州市蓝微电子有限公司 | 一种软硬结合板制造方法 |
CN103687346A (zh) * | 2013-11-18 | 2014-03-26 | 广州兴森快捷电路科技有限公司 | 刚挠结合线路板及其制备方法 |
-
2014
- 2014-12-04 CN CN201410724809.9A patent/CN104363718B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7220131B1 (en) * | 2005-12-20 | 2007-05-22 | Xerox Corporation | Electromechanical device having a plurality of bundles of fibers for interconnecting two planar surfaces |
CN101076227A (zh) * | 2006-05-18 | 2007-11-21 | 施汉忠 | 软硬结合线路板采用热固胶压合方法 |
CN102548247A (zh) * | 2012-01-16 | 2012-07-04 | 惠州市蓝微电子有限公司 | 一种软硬结合板制造方法 |
CN103687346A (zh) * | 2013-11-18 | 2014-03-26 | 广州兴森快捷电路科技有限公司 | 刚挠结合线路板及其制备方法 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105050325A (zh) * | 2015-07-03 | 2015-11-11 | 深圳市景旺电子股份有限公司 | 一种刚挠结合板铣板的方法 |
CN108449880A (zh) * | 2018-04-08 | 2018-08-24 | 珠海市凯诺微电子有限公司 | 柔性线路板覆盖膜贴合方法 |
CN108449880B (zh) * | 2018-04-08 | 2020-12-25 | 珠海市凯诺微电子有限公司 | 柔性线路板覆盖膜贴合方法 |
CN113411961A (zh) * | 2021-06-11 | 2021-09-17 | 金禄电子科技股份有限公司 | 软硬结合线路板及其制备方法 |
CN113411961B (zh) * | 2021-06-11 | 2023-09-26 | 金禄电子科技股份有限公司 | 软硬结合线路板及其制备方法 |
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CN104363718B (zh) | 2017-05-17 |
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Address after: 413000 Changchun Industrial Park, Ziyang District, Hunan, Yiyang Patentee after: AOSHIKANG TECHNOLOGY Co.,Ltd. Address before: 413000 Changchun Industrial Park, Ziyang District, Hunan, Yiyang Patentee before: Hunan aoshikang Polytron Technologies Inc. |
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Address after: 413000 Changchun Industrial Park, Ziyang District, Hunan, Yiyang Patentee after: Hunan aoshikang Polytron Technologies Inc. Address before: 413001 Changchun Industrial Park, Ziyang District, Hunan, Yiyang Patentee before: AOSHIKANG TECHNOLOGY (YIYANG) Co.,Ltd. |