CN104362103B - 封装装置和封装方法 - Google Patents

封装装置和封装方法 Download PDF

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Publication number
CN104362103B
CN104362103B CN201410641094.0A CN201410641094A CN104362103B CN 104362103 B CN104362103 B CN 104362103B CN 201410641094 A CN201410641094 A CN 201410641094A CN 104362103 B CN104362103 B CN 104362103B
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CN
China
Prior art keywords
substrate
adsorption piece
sealing
electromagnet
packaging system
Prior art date
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Active
Application number
CN201410641094.0A
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English (en)
Chinese (zh)
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CN104362103A (zh
Inventor
高昕伟
王丹
洪瑞
孔超
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
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BOE Technology Group Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to CN201410641094.0A priority Critical patent/CN104362103B/zh
Publication of CN104362103A publication Critical patent/CN104362103A/zh
Priority to US14/892,414 priority patent/US9673356B2/en
Priority to PCT/CN2015/076708 priority patent/WO2016074437A1/zh
Priority to EP15839058.3A priority patent/EP3220412B1/de
Application granted granted Critical
Publication of CN104362103B publication Critical patent/CN104362103B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H10K71/421—Thermal treatment, e.g. annealing in the presence of a solvent vapour using coherent electromagnetic radiation, e.g. laser annealing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Electroluminescent Light Sources (AREA)
CN201410641094.0A 2014-11-13 2014-11-13 封装装置和封装方法 Active CN104362103B (zh)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN201410641094.0A CN104362103B (zh) 2014-11-13 2014-11-13 封装装置和封装方法
US14/892,414 US9673356B2 (en) 2014-11-13 2015-04-16 Packaging device and packaging method
PCT/CN2015/076708 WO2016074437A1 (zh) 2014-11-13 2015-04-16 封装装置和封装方法
EP15839058.3A EP3220412B1 (de) 2014-11-13 2015-04-16 Verkapselungsvorrichtung und -verfahren

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410641094.0A CN104362103B (zh) 2014-11-13 2014-11-13 封装装置和封装方法

Publications (2)

Publication Number Publication Date
CN104362103A CN104362103A (zh) 2015-02-18
CN104362103B true CN104362103B (zh) 2017-03-15

Family

ID=52529354

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410641094.0A Active CN104362103B (zh) 2014-11-13 2014-11-13 封装装置和封装方法

Country Status (4)

Country Link
US (1) US9673356B2 (de)
EP (1) EP3220412B1 (de)
CN (1) CN104362103B (de)
WO (1) WO2016074437A1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104362103B (zh) 2014-11-13 2017-03-15 京东方科技集团股份有限公司 封装装置和封装方法
CN104362259B (zh) 2014-11-17 2017-02-22 京东方科技集团股份有限公司 发光二极管显示面板及其封装方法
CN105154830B (zh) 2015-09-06 2017-04-19 京东方科技集团股份有限公司 一种固定方法和蒸镀方法
CN108123066B (zh) * 2016-11-29 2019-11-26 上海微电子装备（集团）股份有限公司 封装预压紧结构和方法以及基于磁性材料的激光封装装置
US10340481B2 (en) * 2017-08-17 2019-07-02 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Manufacturing method of OLED display panel
CN107342371B (zh) * 2017-08-25 2019-03-22 上海天马有机发光显示技术有限公司 有机发光显示面板及其制作方法、有机发光显示装置
CN108389981A (zh) * 2018-04-11 2018-08-10 武汉华星光电半导体显示技术有限公司 Oled显示面板及其制作方法
CN108538763B (zh) * 2018-04-24 2020-05-15 京东方科技集团股份有限公司 一种加热组件、封装装置和封装方法
CN209390507U (zh) * 2018-11-05 2019-09-13 京东方科技集团股份有限公司 外壳及电子设备
CN109712920B (zh) * 2019-02-21 2024-03-19 安徽晶格尔电子有限公司 一种二极管装模装置
CN112133734B (zh) * 2020-09-29 2022-08-30 湖北长江新型显示产业创新中心有限公司 显示面板及显示装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2384314Y (zh) * 1999-07-15 2000-06-21 张志林 有多层密封的有机薄膜电致发光元件
CN103681763A (zh) * 2012-09-24 2014-03-26 乐金显示有限公司 有机发光显示装置
CN204167262U (zh) * 2014-11-13 2015-02-18 京东方科技集团股份有限公司 封装装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007013001A2 (en) * 2005-07-27 2007-02-01 Philips Intellectual Property & Standards Gmbh Light-emitting device with a sealing integrated driver circuit
US7632715B2 (en) * 2007-01-05 2009-12-15 Freescale Semiconductor, Inc. Method of packaging semiconductor devices
US20090203283A1 (en) * 2008-02-07 2009-08-13 Margaret Helen Gentile Method for sealing an electronic device
KR101097317B1 (ko) * 2009-11-18 2011-12-21 삼성모바일디스플레이주식회사 유기 발광 디스플레이 장치
KR101030000B1 (ko) 2009-12-10 2011-04-20 삼성모바일디스플레이주식회사 프릿 실링 시스템 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
CN101807667B (zh) * 2010-03-18 2011-11-16 电子科技大学 一种有机光电子器件的封装装置及其封装方法
CN102244020A (zh) * 2011-06-20 2011-11-16 江苏长电科技股份有限公司 复合材料引线框封装方法及其封装模具结构
CN103187541B (zh) 2011-12-28 2017-05-17 上海大学 Oled器件封装夹持装置
CN103258971B (zh) * 2013-04-27 2016-02-03 上海和辉光电有限公司 显示元件的封装方法及其装置
CN104362103B (zh) * 2014-11-13 2017-03-15 京东方科技集团股份有限公司 封装装置和封装方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2384314Y (zh) * 1999-07-15 2000-06-21 张志林 有多层密封的有机薄膜电致发光元件
CN103681763A (zh) * 2012-09-24 2014-03-26 乐金显示有限公司 有机发光显示装置
CN204167262U (zh) * 2014-11-13 2015-02-18 京东方科技集团股份有限公司 封装装置

Also Published As

Publication number Publication date
CN104362103A (zh) 2015-02-18
US20160284942A1 (en) 2016-09-29
EP3220412A1 (de) 2017-09-20
EP3220412A4 (de) 2018-08-15
EP3220412B1 (de) 2021-08-04
US9673356B2 (en) 2017-06-06
WO2016074437A1 (zh) 2016-05-19

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