CN104353669B - 一种高性能金包铜键合微丝的制备方法 - Google Patents

一种高性能金包铜键合微丝的制备方法 Download PDF

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CN104353669B
CN104353669B CN201410461599.9A CN201410461599A CN104353669B CN 104353669 B CN104353669 B CN 104353669B CN 201410461599 A CN201410461599 A CN 201410461599A CN 104353669 B CN104353669 B CN 104353669B
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姜雁斌
谢建新
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University of Science and Technology Beijing USTB
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Abstract

一种金包铜键合微丝及其制备方法。金包铜键合微丝由芯线铜与包覆层金复合而成，键合微丝直径为10～50μm，横断面金包覆层面积比为10～30%。其制备步骤为：采用直径为5～30mm的无氧铜杆为芯材，采用反向凝固法制备金包铜复合线坯；将复合线坯进行多道次孔型轧制和/或拉拔加工至直径为3～8mm的线材，轧制速度为10～200m/min，单道次断面缩减率为10～50%，或拉拔速度为5～50m/min，单道次断面缩减率为10～30%；然后对轧制和/或拉拔加工的复合线材进行粗拉拔、精拉拔加工成键合微丝。拉拔过程中可施加中间退火，退火温度为100～400℃，退火时间为10～60 min。本发明材料包覆层致密、厚度均匀、界面结合强度高，加工性能优异，不易断头、断丝且制备工艺流程短，成材率高，生产成本低。

Description

一种高性能金包铜键合微丝的制备方法
技术领域
本发明涉及一种双金属层状复合丝材的制备方法，特别是提供了一种金包铜键合微丝及其高效制备方法。
背景技术
随着电子信息技术的高速发展，半导体器件和集成电路的封装朝着多引线化、高度集成化、小型化和低成本方向发展，对键合丝的经济技术指标提出越来越高的要求。金包铜键合微丝是一种高性能新型键合材料，不仅具有键合金丝优异的压焊性能、抗氧化和耐腐蚀性能，还具有键合铜丝优异的力学性能和导电导热性能、更低的密度与更低的成本，作为键合金丝的替代材料，在半导体器件和集成电路的高密度封装等方面具有广阔的应用前景。
已经公开报道的金包铜键合微丝的制备方法是采用电镀法在冷加工成形的直径为15～75μm的铜丝表面镀上金层，然后通过气氛保护扩散退火制备满足使用要求的金包铜键合微丝[Uno Tomoh iro, Yamamoto Yukihiro. Bonding wire for semiconductordevice. JP, 2007123597 [ P]. 2007. 05.17；赵碎孟，周钢，薛子夜. 一种防氧化的铜基键合丝的制备工艺. 中国发明专利，申请号：CN201110317098.X，公开日：2012.1.18]。但是电镀法存在的问题是：（1）镀层成分不纯、不致密、厚度不均导致镀层与铜芯同轴度不高；（2）镀层与铜芯的界面结合强度低；（3）工艺较为复杂、周期长；（4）电镀法环境负荷较大。
采用凝固或塑型成形的方法，制备金包铜复合线材，再通过拉丝制备复合微丝，是解决上述问题的有效途径之一。但由于金和铜塑性变形行为的差异，金包铜复合微丝（直径为10～50μm）在加工过程中易于在金铜界面处形成较大的应力集中，造成断头、断线等问题，导致复合微丝成材率低和生产成本过高。因此，选择合适的方法制备具有良好界面结合质量和优异冷加工性能的金包铜复合线坯，对高效率、低成本制备高性能金包铜键合微丝至关重要。
反向凝固复合技术是生产双金属复合材料一种有效的方法，具有高效率、低能耗、短流程等特点[李宝绵，许光明，崔建忠．反向凝固法生产H90-钢-H90复合带．中国有色金属学报，2007，17(4) : 505-510]，可用于制备两种金属熔点接近或芯材熔点高于包覆层的金属层状复合材料，并解决了传统凝固过程中包覆层金属可能出现的中心疏松、缩孔等问题，所制备的复合材料具有包覆层厚度均匀、致密，以及复合界面达到冶金结合、结合强度高等优点。
为此，本发明技术提出以无氧铜杆作为芯材，采用反向凝固方法制备金包覆层厚度均匀、致密以及复合界面结合强度高的金包铜复合线坯，然后进行多道次孔型轧制和/或拉拔加工制备复合微丝，是一种高性能金包铜键合微丝的高效率、低成本制备新方法。
发明内容
本发明目的在于以无氧铜杆为芯材，采用反向凝固法制备高质量金包铜复合线坯，结合后续冷加工（轧制、拉拔）制备金包铜键合微丝，不仅可以解决目前工艺制备的金包铜键合微丝包覆金层厚度不均匀、致密度和界面结合强度低的问题，而且可以简化工艺，提高成材率，降低生产成本。
一种高性能金包铜键合微丝的制备方法，制备步骤如下：
(1)以直径为5～30mm无氧铜杆为芯材，采用反向凝固法制备金包铜复合线坯，直径为6～34mm，金层厚度为0.5～2mm；
(2)根据需要，将步骤（1）中的金包铜复合线坯进行多道次孔型轧制和/或拉拔，使复合线坯直径减小至3～8mm，所采用的轧制速度为10～200m/min，单道次断面缩减率为10～50%；所采用的拉拔速度为5～50m/min，单道次断面缩减率为10～30%；
(3)将步骤（2）制备的直径3～8mm金包铜复合线坯进行拉拔加工，使其直径减小至0.1～1mm，单道次断面缩减率为10～30%，拉拔速度为3～30m/min；
(4)将骤（3）制备的金包铜复合线材进行精拉拔加工至目标直径为10～50μm的金包铜键合微丝，拔速度为2～20m/min，单道次断面缩减率为5～15%。
所述的反向凝固法制备金包铜复合线坯是在感应加热器的作用下将坩埚中的金料熔化，熔化过程采用惰性气体（如高纯Ar气）保护，在开卷机构和收卷机构的驱动下将经过表面预处理的铜杆连续通过金液，金液在铜杆的表面进行凝固，形成金包铜复合线坯。工艺参数：金液温度为1100～1250℃，铜线直径为5～30mm，牵引速度为0.5～2m/min。
根据材料最终性能或后续加工的需要可在步骤（3）和（4）中施加中间退火，退火温度为100～400℃，退火时间为10～60min。
本发明制备的金包铜键合微丝由芯丝铜和包覆层金复合而成，微丝直径为10～50μm，金包覆层面积比为10～30%，金层厚度均匀分布，金铜界面结合质量良好、强度高。
本发明的优点在于：
(1)采用反向凝固法制备高质量金包铜复合线坯，具有表面质量好、金包覆层厚度均匀、组织致密、金/铜界面达到冶金结合等优点，界面结合强度高，有利于提高金和铜冷加工变形协调性，提高复合微丝的拉拔加工性能。
(2)所制备的金包铜键合微丝直径可达10～50μm，金层厚度均匀分布，金层的包覆面积比为10～30%可调，金和铜的界面结合质量高，包覆层致密、厚度均匀，可满足在半导体器件和集成电路高密度封装用键合丝的使用要求。
(3)采用反向凝固法制备金包铜复合线坯，结合后续冷加工（轧制、拉拔）制备金包铜键合微丝，工艺简单，提高了成材率，降低了生产成本。
具体实施方式
实施例1：直径为50μm金包铜键合微丝的制备。
(1)以直径为20mm无氧铜杆为芯材，采用反向凝固法制备金包铜复合线坯，线坯直径为22mm，金包覆层厚度为1mm，断面金包覆层面积比为17.4%，金液温度为1200℃，牵引速度为1m/min；
(2)将步骤（1）制备的金包铜复合线坯进行9道次孔型轧制，使复合线坯直径减小至6mm，单道次断面缩减率为20～50%，轧制速度为50m/min，各道次断面缩减率随总变形程度增大逐渐减小；
(3)对步骤（2）轧制后的线材进行24道次拉拔加工，使复合线材直径减小至0.1mm，单道次断面缩减率为10～40%，拉拔速度为10～30m/min；
(4)对步骤（3）拉拔后的线材进行精拉拔加工至直径为50μm的金包铜键合微丝，单道次断面缩减率为5～20%，拉拔速度为5～10m/min，道次断面缩减率随总变形程度增大逐渐减小；
(5)在步骤（4）的加工过程中，当多道次拉拔总变形量达到95%时，对金包铜复合微丝进行中间退火，退火温度为350℃，退火时间为30min。
实施例2：直径为30μm金包铜复合微丝的制备。
(1)以直径为16mm无氧铜杆为芯材，采用反向凝固法制备金包铜复合线坯，复合线坯直径为17mm，金包覆层厚度为0.5mm，断面金包覆层面积比为11.4%，金液温度为1180℃，牵引速度为1.2m/min；
(2)将步骤（1）制备的金包铜复合线坯进行7道次孔型轧制，使复合线坯直径减小至4mm，单道次断面缩减率为25～45%，轧制速度为50m/min，各道次断面缩减率随总变形程度增大逐渐减小；
(3)对步骤（2）轧制后的线材经过22道次的拉拔加工，使复合线材直径减小至0.1mm，单道次断面缩减率为10～40%，拉拔速度为10～30m/min；
(4)对步骤（3）拉拔后的线材进行精拉拔加工至直径为30μm的金包铜键合微丝，其中，丝材直径在70～100μm时，单道次断面缩减率为5～20%，拉拔速度为5～10m/min；丝材直径在30～70μm时，单道次断面缩减率为5～10%，拉拔速度为3～10m/min；各道次断面缩减率随总变形程度增大逐渐减小；
(5)在步骤（4）的加工过程中，当多道次拉拔总变形量达到95%时，对金包铜复合微丝进行中间退火，退火温度为300℃，退火时间为30min。
实施例3：直径为20μm金包铜复合微丝的制备。
(1)以直径为12mm无氧铜杆为芯材，采用反向凝固法制备金包铜复合线坯，复合线坯直径为13mm，金包覆层厚度为0.5mm，断面金包覆层面积比为14.8%，金液温度为1150℃，牵引速度为1.5m/min；
(2)将步骤（1）制备的金包铜复合线坯进行6道次孔型轧制，使复合线坯直径减小至4mm，单道次断面缩减率为25～45%，轧制速度为50m/min，各道次断面缩减率随总变形程度增大逐渐减小；
(3)对步骤（2）轧制后的线材经过22道次的拉拔加工，使复合线材直径减小至0.1mm，单道次断面缩减率为10～40%，拉拔速度为10～30m/min；
(4)对步骤（3）拉拔后的线材进行精拉拔加工至直径为20μm的金包铜键合微丝，其中，丝材直径在50～100μm时，单道次断面缩减率为5～20%，拉拔速度为5～10m/min；丝材直径在20～50μm时，单道次断面缩减率为5～10%，拉拔速度为3～8m/min；各道次断面缩减率随总变形程度增大逐渐减小；
(5)在步骤（4）的加工过程中，当多道次拉拔总变形量达到95%时，对金包铜复合微丝进行中间退火，退火温度为300℃，退火时间为30min。

Claims (3)

1.一种高性能金包铜键合微丝的制备方法，其特征在于制备步骤如下：
(1)以直径为5～30mm无氧铜杆为芯材，采用反向凝固法制备金包铜复合线坯，直径为6～34mm，金层厚度为0.5～2mm；
(2)根据需要，将步骤(1)中的金包铜复合线坯进行多道次孔型轧制和/或拉拔，使复合线坯直径减小至3～8mm，所采用的轧制速度为10～200m/min，单道次断面缩减率为10～50％；所采用的拉拔速度为5～50m/min，单道次断面缩减率为10～30％；
(3)将步骤(2)制备的直径3～8mm金包铜复合线坯进行拉拔加工，使其直径减小至0.1～1mm，单道次断面缩减率为10～30％，拉拔速度为3～30m/min；
(4)将骤(3)制备的金包铜复合线材进行精拉拔加工至目标直径为10～50μm的金包铜键合微丝，拉拔速度为2～20m/min，单道次断面缩减率为5～15％；
所述的反向凝固法制备金包铜复合线坯是在感应加热器的作用下将坩埚中的金料熔化，熔化过程采用惰性气体保护，在开卷机构和收卷机构的驱动下将经过表面预处理的铜杆连续通过金液，金液在铜杆的表面进行凝固，形成金包铜复合线坯；工艺参数：金液温度为1100～1250℃，铜线直径为5～30mm，牵引速度为0.5～2m/min。
2.如权利要求1所述一种高性能金包铜键合微丝的制备方法，其特征在于根据材料最终性能或后续加工的需要在步骤(3)和(4)中施加中间退火，退火温度为100～400℃，退火时间为10～60min。
3.如权利要求1所述一种高性能金包铜键合微丝的制备方法，其特征在于制备的金包铜键合微丝由芯丝铜和包覆层金复合而成，金包覆层面积比为10～30％。
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