CN104349608A - 一种印制电路板背钻的处理方法及印制电路板 - Google Patents
一种印制电路板背钻的处理方法及印制电路板 Download PDFInfo
- Publication number
- CN104349608A CN104349608A CN201310334584.1A CN201310334584A CN104349608A CN 104349608 A CN104349608 A CN 104349608A CN 201310334584 A CN201310334584 A CN 201310334584A CN 104349608 A CN104349608 A CN 104349608A
- Authority
- CN
- China
- Prior art keywords
- hole
- circuit board
- printed circuit
- aperture
- back drill
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09845—Stepped hole, via, edge, bump or conductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0242—Cutting around hole, e.g. for disconnecting land or Plated Through-Hole [PTH] or for partly removing a PTH
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310334584.1A CN104349608B (zh) | 2013-08-02 | 2013-08-02 | 一种印制电路板背钻的处理方法及印制电路板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310334584.1A CN104349608B (zh) | 2013-08-02 | 2013-08-02 | 一种印制电路板背钻的处理方法及印制电路板 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104349608A true CN104349608A (zh) | 2015-02-11 |
CN104349608B CN104349608B (zh) | 2017-07-28 |
Family
ID=52504108
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310334584.1A Active CN104349608B (zh) | 2013-08-02 | 2013-08-02 | 一种印制电路板背钻的处理方法及印制电路板 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN104349608B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106793509A (zh) * | 2016-12-23 | 2017-05-31 | 奥士康科技股份有限公司 | 一种可改善堵孔的背钻方法 |
JP2020145332A (ja) * | 2019-03-07 | 2020-09-10 | 日立化成株式会社 | 印刷配線板および印刷配線板の製造方法 |
CN111954395A (zh) * | 2020-07-30 | 2020-11-17 | 生益电子股份有限公司 | 一种局部孔壁厚导电层的印制电路板及其制备方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101643903A (zh) * | 2009-09-08 | 2010-02-10 | 深南电路有限公司 | Pcb板阶梯孔成型方法 |
CN201805621U (zh) * | 2010-04-19 | 2011-04-20 | 深南电路有限公司 | 一种pcb板结构 |
CN102523699A (zh) * | 2011-12-15 | 2012-06-27 | 深圳崇达多层线路板有限公司 | 一种pcb背钻孔的树脂塞孔装置及方法 |
CN103002674A (zh) * | 2012-09-03 | 2013-03-27 | 杭州华三通信技术有限公司 | 一种pcb板背钻的方法及pcb板通孔结构 |
-
2013
- 2013-08-02 CN CN201310334584.1A patent/CN104349608B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101643903A (zh) * | 2009-09-08 | 2010-02-10 | 深南电路有限公司 | Pcb板阶梯孔成型方法 |
CN201805621U (zh) * | 2010-04-19 | 2011-04-20 | 深南电路有限公司 | 一种pcb板结构 |
CN102523699A (zh) * | 2011-12-15 | 2012-06-27 | 深圳崇达多层线路板有限公司 | 一种pcb背钻孔的树脂塞孔装置及方法 |
CN103002674A (zh) * | 2012-09-03 | 2013-03-27 | 杭州华三通信技术有限公司 | 一种pcb板背钻的方法及pcb板通孔结构 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106793509A (zh) * | 2016-12-23 | 2017-05-31 | 奥士康科技股份有限公司 | 一种可改善堵孔的背钻方法 |
JP2020145332A (ja) * | 2019-03-07 | 2020-09-10 | 日立化成株式会社 | 印刷配線板および印刷配線板の製造方法 |
CN111954395A (zh) * | 2020-07-30 | 2020-11-17 | 生益电子股份有限公司 | 一种局部孔壁厚导电层的印制电路板及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
CN104349608B (zh) | 2017-07-28 |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: 100871 room 808, founder building, Zhongguancun, 298 Chengfu Road, Haidian District, Beijing Patentee after: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee after: CHONGQING FOUNDER HI-TECH ELECTRONIC Inc. Patentee after: PKU FOUNDER INFORMATION INDUSTRY GROUP CO.,LTD. Address before: 100871 room 808, founder building, Zhongguancun, 298 Chengfu Road, Haidian District, Beijing Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: CHONGQING FOUNDER HI-TECH ELECTRONIC Inc. Patentee before: FOUNDER INFORMATION INDUSTRY HOLDINGS Co.,Ltd. |
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CP01 | Change in the name or title of a patent holder | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220913 Address after: 3007, Hengqin international financial center building, No. 58, Huajin street, Hengqin new area, Zhuhai, Guangdong 519031 Patentee after: New founder holdings development Co.,Ltd. Patentee after: CHONGQING FOUNDER HI-TECH ELECTRONIC Inc. Address before: 100871 room 808, founder building, Zhongguancun, 298 Chengfu Road, Haidian District, Beijing Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: CHONGQING FOUNDER HI-TECH ELECTRONIC Inc. Patentee before: PKU FOUNDER INFORMATION INDUSTRY GROUP CO.,LTD. |
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TR01 | Transfer of patent right |