CN104347569A - Plastic packaging type IPM of built-in DBC substrate - Google Patents
Plastic packaging type IPM of built-in DBC substrate Download PDFInfo
- Publication number
- CN104347569A CN104347569A CN201310312246.8A CN201310312246A CN104347569A CN 104347569 A CN104347569 A CN 104347569A CN 201310312246 A CN201310312246 A CN 201310312246A CN 104347569 A CN104347569 A CN 104347569A
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- CN
- China
- Prior art keywords
- dbc substrate
- free end
- ipm
- lead frame
- built
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The invention discloses a plastic packaging type IPM of a built-in DBC substrate. The plastic packaging type IPM comprises lead frames respectively arranged at the two opposite sides of the IPM, each lead frame is provided with two free ends, i.e., a first free end and a second free end respectively, each first free end extends to the outside of the IPM, each second free end is arranged inside the IPM and is in contact with the DBC substrate, the top portion of each second free end is provided with a clamping pin for buckling the DBC substrate, the DBC substrate is buckled between the two free ends of the two oppositely arranged lead frames, and the DBC substrate is disposed below the clamping pins. According to the plastic packaging type IPM of the built-in DBC substrate, disclosed by the invention, the complex procedures of solder coating, DBC substrate attaching and high-temperature welding in a conventional process are avoided, the production efficiency and qualified rate of products are improved, and the production cost is decreased.
Description
Technical field
The present invention relates to Intelligent Power Module field, particularly relate to a kind of plastic sealed IPM of built-in DBC substrate.
Background technology
Plastic sealed IPM(Intelligent Power Module, Intelligent Power Module), be the Novel control module that igbt chip and drive circuit, control circuit and overcurrent, under-voltage, short circuit, the protective circuit such as overheated are integrated in one.It is a kind of complexity, advanced power model, automatically can realize overcurrent, under-voltage, short circuit and the complicated protection function such as overheated, thus have intelligent characteristic.Simultaneously it has the advantages such as low cost, miniaturization, highly reliable, easy use, and be widely used in the fields such as frequency-conversion domestic electric appliances, inverter, Industry Control, Social benefit and economic benefit is very considerable.
For plastic sealed IPM, its inside is made up of lead frame 1 ' and chip.Some IPM also include DBC substrate 2 ', as shown in Figure 1, usually need welded together to DBC substrate 2 ' and lead frame 1 ' for the IPM including DBC substrate 2 ' structure, thus complete the fixing and electrical connection of DBC substrate 2 ' and lead frame 1 '.
At present in plastic sealed IPM module institute's extensive use be by solder, lead frame 1 ' and DBC substrate 2 ' are welded, come fixing in IPM of DBC substrate 2 ' and the fixing and electrical connection between them.
By the technique that the welding of DBC substrate is a more complicated on the lead frames, need utilization equipment to be coated in by solder on DBC substrate, again DBC substrate and lead frame are sticked together and put into soldering furnace afterwards and heat.Due to the electrical connection of each pin and DBC substrate will be ensured after lead frame and the welding of DBC substrate, therefore, to ensure that all pins of lead frame all will be at grade when welding, and coordinate frock to be fixed each pin, ensure that each pin fully welds, there is not rosin joint, operating procedure is complicated, be difficult to control, reduce production efficiency.
In view of the above-mentioned problems in the prior art, be necessary that the fixed mode of the DBC substrate to existing plastic sealed IPM is optimized, to ensure that on the basis that each pin of lead frame obtains fully connecting, operating procedure is simplified, and enhances productivity.
Summary of the invention
The problem that the present invention solves is to provide a kind of plastic sealed IPM of built-in DBC substrate, and obtain at each pin of the lead frame ensureing described plastic sealed IPM on the basis of fully connection, operating procedure is simplified, and enhances productivity.
For solving the problem, present invention is disclosed a kind of plastic sealed IPM of built-in DBC substrate, comprise the lead frame being arranged at the relative both sides of described IPM respectively, described lead frame has two free ends, be respectively the first free end and the second free end, described first free end extends to the outside of described IPM, described second free end is arranged at described IPM inside and contacts with described DBC substrate, the top of described second free end contacts with described DBC substrate, and the top of described second free end is provided with the card base for DBC substrate described in buckle, described DBC base board fastener is between the second free end of two lead frames be oppositely arranged, and described DBC substrate is positioned at the below of described card base.
Preferably, between the summit of described card base and the summit of the upper surface of the second free end of described lead frame for straight line is connected.
Preferably, between the summit of described card base and the summit of the upper surface of the second free end of described lead frame for oblique line is connected.
Preferably, described card base is shaped in the top of the second free end of described lead frame.
Compared with prior art, the present invention has the following advantages: the plastic sealed IPM of disclosed built-in DBC substrate, comprise the lead frame being arranged at the relative both sides of described IPM respectively, described lead frame has two free ends, be respectively the first free end and the second free end, described first free end extends to the outside of described IPM, described second free end is arranged at described IPM inside and contacts with described DBC substrate, the top of described second free end contacts with described DBC substrate, and the top of described second free end is provided with the card base for DBC substrate described in buckle, described DBC base board fastener is between the second free end of two lead frames be oppositely arranged, and described DBC substrate is positioned at the below of described card base.The top of the second free end at described lead frame is provided with card base, can by described DBC substrate like a cork buckle be fixed between two lead frames being oppositely arranged, the complicated process of eliminate in traditional handicraft and be coated with solder, pasting DBC substrate, high-temperature soldering, improve production efficiency and the qualification rate of product, reduce production cost.
Accompanying drawing explanation
Fig. 1 is the fixed structure of DBC substrate in prior art;
Fig. 2 is the fixed structure of DBC substrate in the preferred embodiment of the present invention;
Fig. 3 is the enlarged diagram of the fixed structure of DBC substrate in the preferred embodiment of the present invention.
Wherein: 1 ', lead frame; 2 ', DBC substrate; 1, lead frame; 11, the first free end; 12, the second free end; 2, DBC substrate; 3, card base.
Embodiment
As shown in Figure 1, at present in plastic sealed IPM module institute's extensive use be by solder, lead frame and DBC substrate are welded, complete fixing in IPM of DBC substrate and the electrical connection between them.By the technique that the welding of DBC substrate is a more complicated on the lead frames, need utilization equipment to be coated in by solder on DBC substrate, again DBC substrate and lead frame are sticked together and put into soldering furnace afterwards and heat.Due to the electrical connection of each pin and DBC substrate will be ensured after lead frame and the welding of DBC substrate, therefore, to ensure that all pins of lead frame all will be at grade when welding, and coordinate frock to be fixed each pin, ensure that each pin fully welds, there is not rosin joint, operating procedure is complicated, be difficult to control, reduce production efficiency.
In view of the above-mentioned problems in the prior art, a kind of plastic sealed IPM of built-in DBC substrate, comprise the lead frame being arranged at the relative both sides of described IPM respectively, described lead frame has two free ends, be respectively the first free end and the second free end, described first free end extends to the outside of described IPM, described second free end is arranged at described IPM inside and contacts with described DBC substrate, the top of described second free end contacts with described DBC substrate, and the top of described second free end is provided with the card base for DBC substrate described in buckle, described DBC base board fastener is between the second free end of two lead frames be oppositely arranged, and described DBC substrate is positioned at the below of described card base.
Preferably, between the summit of described card base and the summit of the upper surface of the second free end of described lead frame for straight line is connected.
Preferably, between the summit of described card base and the summit of the upper surface of the second free end of described lead frame for oblique line is connected.
Preferably, described card base is shaped in the top of the second free end of described lead frame.
The plastic sealed IPM of disclosed built-in DBC substrate, comprise the lead frame being arranged at the relative both sides of described IPM respectively, described lead frame has two free ends, be respectively the first free end and the second free end, described first free end extends to the outside of described IPM, described second free end is arranged at described IPM inside and contacts with described DBC substrate, the top of described second free end contacts with described DBC substrate, and the top of described second free end is provided with the card base for DBC substrate described in buckle, described DBC base board fastener is between the second free end of two lead frames be oppositely arranged, and described DBC substrate is positioned at the below of described card base.The top of the second free end at described lead frame is provided with card base, can by described DBC substrate like a cork buckle be fixed between two lead frames being oppositely arranged, the complicated process of eliminate in traditional handicraft and be coated with solder, pasting DBC substrate, high-temperature soldering, improve production efficiency and the qualification rate of product, reduce production cost.
Below in conjunction with accompanying drawing, the technical scheme in the embodiment of the present invention is described in detail.
As shown in Figure 2, present invention is disclosed a kind of plastic sealed IPM of built-in DBC substrate, comprise the lead frame 1 being arranged at the relative both sides of IPM respectively, lead frame 1 has two free ends, be respectively the first free end 11 and the second free end 12, first free end 11 extends to the outside of IPM, and the second free end 12 is arranged at IPM inside and contacts with DBC substrate 2.
Can clearly be found out by Fig. 1, in order to be satisfied with the requirement of conventional bonding technique, DBC substrate 2 ' is arranged at the below of lead frame 1 ', and DBC substrate 2 ' and lead frame 1 ' partly overlap.
And in a preferred embodiment of the invention, incorporated by reference to Fig. 3, the top of the second free end 12 contacts with DBC substrate 2 (namely DBC substrate 2 partly overlaps with lead frame 1 is non-), and the top of the second free end 12 is provided with the card base 3 for buckle DBC substrate 2, DBC substrate 2 is snapped between the second free end 12 of two lead frames 1 be oppositely arranged, and DBC substrate 2 is positioned at the below of card base 3.Setting like this, not only can fix transverse direction and the lengthwise position of DBC substrate 2 like a cork, thus ensure that the electrical connection of DBC substrate 2 and lead frame 1, and eliminate in traditional handicraft the complicated process being coated with solder, pasting DBC substrate, high-temperature soldering, improve production efficiency and the qualification rate of product, reduce production cost.
Further, between the summit of card base 3 and the summit of the upper surface of the second free end 12 of lead frame 1 for straight line is connected.Setting like this, DBC substrate 2 can be snapped between two card bases 3 smoothly.
Further, between the summit of card base 3 and the summit of the upper surface of the second free end 12 of lead frame 1 for oblique line is connected.Setting like this, during practical operation, can be snapped in DBC substrate 2 smoothly between two card bases 3 without the need to deliberately aiming at, improve the production efficiency of product.
In order to increase the steadiness of card base 3, card base 3 is shaped in the top of the second free end 12 of lead frame 1.Because lead frame 1 is as the chip carrier of integrated circuit, it is a kind of electrical connection realizing chip internal circuits exit and outer lead by means of bonding material (gold thread, aluminum steel, copper cash), form the key structure part of electric loop, therefore the card base 3 be integrally formed with lead frame 1 has certain elasticity, has good clamping action to DBC substrate 2.
The plastic sealed IPM of disclosed built-in DBC substrate, comprise the lead frame 1 being arranged at the relative both sides of IPM respectively, lead frame 1 has two free ends, be respectively the first free end 11 and the second free end 12, first free end 11 extends to the outside of IPM, second free end 12 is arranged at IPM inside and contacts with DBC substrate 2, the top of the second free end 12 contacts with DBC substrate 2, and the top of the second free end 12 is provided with the card base 3 for buckle DBC substrate 2, DBC substrate 2 is snapped between the second free end 12 of two lead frames 1 be oppositely arranged, and DBC substrate 2 is positioned at the below of card base 3.The top of the second free end 12 at lead frame 1 is provided with card base 3, can by DBC substrate 2 like a cork buckle be fixed between two lead frames 1 being oppositely arranged, the complicated process of eliminate in traditional handicraft and be coated with solder, pasting DBC substrate, high-temperature soldering, improve production efficiency and the qualification rate of product, reduce production cost.
To the above-mentioned explanation of the disclosed embodiments, professional and technical personnel in the field are realized or uses the present invention.To be apparent for those skilled in the art to the multiple amendment of these embodiments, General Principle as defined herein can without departing from the spirit or scope of the present invention, realize in other embodiments.Therefore, the present invention can not be restricted to these embodiments shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (4)
1. the plastic sealed IPM of a built-in DBC substrate, comprise the lead frame being arranged at the relative both sides of described IPM respectively, described lead frame has two free ends, be respectively the first free end and the second free end, described first free end extends to the outside of described IPM, described second free end is arranged at described IPM inside and contacts with described DBC substrate, it is characterized in that: the top of described second free end contacts with described DBC substrate, and the top of described second free end is provided with the card base for DBC substrate described in buckle, described DBC base board fastener is between the second free end of two lead frames be oppositely arranged, and described DBC substrate is positioned at the below of described card base.
2. the plastic sealed IPM of built-in DBC substrate according to claim 1, is characterized in that: for straight line is connected between the summit of described card base and the summit of the upper surface of the second free end of described lead frame.
3. the plastic sealed IPM of built-in DBC substrate according to claim 2, is characterized in that: for oblique line is connected between the summit of described card base and the summit of the upper surface of the second free end of described lead frame.
4. the plastic sealed IPM of the built-in DBC substrate according to 1 to 3 arbitrary claim, is characterized in that: described card base is shaped in the top of the second free end of described lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310312246.8A CN104347569B (en) | 2013-07-23 | 2013-07-23 | A kind of plastic sealed IPM of built-in DBC substrates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310312246.8A CN104347569B (en) | 2013-07-23 | 2013-07-23 | A kind of plastic sealed IPM of built-in DBC substrates |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104347569A true CN104347569A (en) | 2015-02-11 |
| CN104347569B CN104347569B (en) | 2017-09-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310312246.8A Active CN104347569B (en) | 2013-07-23 | 2013-07-23 | A kind of plastic sealed IPM of built-in DBC substrates |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106313422A (en) * | 2015-06-30 | 2017-01-11 | 西安永电电气有限责任公司 | Injection molding method for plastic encapsulated type IPM and plastic encapsulated type IPM |
| CN115206958A (en) * | 2022-09-16 | 2022-10-18 | 四川奥库科技有限公司 | IPM packaging system and method based on DBC/DPC substrate and lead frame |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202394862U (en) * | 2011-10-11 | 2012-08-22 | 深圳市威怡电气有限公司 | Power module |
| CN203038968U (en) * | 2012-11-27 | 2013-07-03 | 北京半导体照明科技促进中心 | LED illumination module |
-
2013
- 2013-07-23 CN CN201310312246.8A patent/CN104347569B/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106313422A (en) * | 2015-06-30 | 2017-01-11 | 西安永电电气有限责任公司 | Injection molding method for plastic encapsulated type IPM and plastic encapsulated type IPM |
| CN115206958A (en) * | 2022-09-16 | 2022-10-18 | 四川奥库科技有限公司 | IPM packaging system and method based on DBC/DPC substrate and lead frame |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104347569B (en) | 2017-09-29 |
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Address after: 710016 No. 15 Wenjingbei Road, Jingkai District, Xi'an City, Shaanxi Province Patentee after: Xi'an Zhongche Yongji Electric Co. Ltd. Address before: 710016 No. 15 Wenjingbei Road, Jingkai District, Xi'an City, Shaanxi Province Patentee before: Xi'an Yongdian Electric Co., Ltd. |