CN104342080B - 粘接剂组合物、电路连接材料、电路连接结构体及粘接剂片材 - Google Patents

粘接剂组合物、电路连接材料、电路连接结构体及粘接剂片材 Download PDF

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Publication number
CN104342080B
CN104342080B CN201410363049.3A CN201410363049A CN104342080B CN 104342080 B CN104342080 B CN 104342080B CN 201410363049 A CN201410363049 A CN 201410363049A CN 104342080 B CN104342080 B CN 104342080B
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Prior art keywords
circuit
free
circuit connection
radical polymerised
mass parts
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CN201410363049.3A
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Chinese (zh)
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CN104342080A (zh
Inventor
中泽孝
饭岛由佑
川端泰典
荒武典仁
藤绳贡
松田和也
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Lishennoco Co ltd
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Hitachi Chemical Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/04—Homopolymers or copolymers of ethene
    • C09J123/08—Copolymers of ethene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J151/08—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/06—Polyurethanes from polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Wire Bonding (AREA)
CN201410363049.3A 2013-07-26 2014-07-28 粘接剂组合物、电路连接材料、电路连接结构体及粘接剂片材 Active CN104342080B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013155691A JP6123547B2 (ja) 2013-07-26 2013-07-26 回路接続材料、回路接続構造体、回路接続構造体の製造方法、接着剤組成物、及び接着剤シート
JP2013-155691 2013-07-26

Publications (2)

Publication Number Publication Date
CN104342080A CN104342080A (zh) 2015-02-11
CN104342080B true CN104342080B (zh) 2019-03-08

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Country Status (3)

Country Link
JP (1) JP6123547B2 (ja)
KR (1) KR102261617B1 (ja)
CN (1) CN104342080B (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6864505B2 (ja) * 2016-06-24 2021-04-28 日東電工株式会社 加熱接合用シート及びダイシングテープ付き加熱接合用シート
JP7330768B2 (ja) 2018-06-06 2023-08-22 デクセリアルズ株式会社 接続体の製造方法、接続方法

Citations (4)

* Cited by examiner, † Cited by third party
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CN101538348A (zh) * 2008-03-18 2009-09-23 日本化药株式会社 使用具有阻燃性的反应性化合物的活性能量射线固化型树脂组合物及其固化物
CN101688099A (zh) * 2007-08-08 2010-03-31 日立化成工业株式会社 粘接剂组合物、膜状粘接剂和电路部件的连接结构
CN101802118A (zh) * 2007-09-19 2010-08-11 日立化成工业株式会社 粘接剂组合物和连接体
CN102449095A (zh) * 2010-07-26 2012-05-09 日立化成工业株式会社 粘接剂组合物、连接结构体、连接结构体的制造方法以及粘接剂组合物的应用

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JP2610900B2 (ja) 1987-10-27 1997-05-14 ソニーケミカル 株式会社 熱硬化型異方性導電接着シート及びその製造方法
WO1998044067A1 (en) * 1997-03-31 1998-10-08 Hitachi Chemical Company, Ltd. Circuit connecting material, and structure and method of connecting circuit terminal
KR100925361B1 (ko) * 1999-10-22 2009-11-09 소니 케미카루 앤드 인포메이션 디바이스 가부시키가이샤 저온 경화형 이방성 도전 접속재료
JP4590732B2 (ja) 2000-12-28 2010-12-01 日立化成工業株式会社 回路接続材料及びそれを用いた回路板の製造方法、回路板
JP2002348026A (ja) * 2001-05-25 2002-12-04 Sanyo Electric Co Ltd 薄片搬送装置ならびにその利用装置
JP2003013028A (ja) * 2001-06-29 2003-01-15 Sekisui Chem Co Ltd アクリル系粘着剤組成物及び粘着テープ
JP4995403B2 (ja) * 2002-05-02 2012-08-08 スリーエム イノベイティブ プロパティズ カンパニー アクリル系熱伝導性組成物形成用組成物、熱伝導性シート並びにその製造方法
US7083895B2 (en) 2004-09-01 2006-08-01 Kodak Polychrome Graphics Llc Adhesion promoting ingredients for on-press developable lithographic printing plate precursors
KR100973398B1 (ko) * 2007-05-23 2010-07-30 히다치 가세고교 가부시끼가이샤 접착제 조성물, 회로 접속 구조체 및 반도체 장치
KR100929593B1 (ko) * 2007-09-20 2009-12-03 제일모직주식회사 이방 도전성 접착 조성물 및 그를 포함하는 이방 도전성 필름
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KR102152473B1 (ko) * 2011-12-16 2020-09-04 히타치가세이가부시끼가이샤 접착제 조성물, 필름상 접착제, 접착 시트, 접속 구조체 및 접속 구조체의 제조 방법

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CN101688099A (zh) * 2007-08-08 2010-03-31 日立化成工业株式会社 粘接剂组合物、膜状粘接剂和电路部件的连接结构
CN101802118A (zh) * 2007-09-19 2010-08-11 日立化成工业株式会社 粘接剂组合物和连接体
CN101538348A (zh) * 2008-03-18 2009-09-23 日本化药株式会社 使用具有阻燃性的反应性化合物的活性能量射线固化型树脂组合物及其固化物
CN102449095A (zh) * 2010-07-26 2012-05-09 日立化成工业株式会社 粘接剂组合物、连接结构体、连接结构体的制造方法以及粘接剂组合物的应用

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Publication number Publication date
JP2015025074A (ja) 2015-02-05
KR20150013044A (ko) 2015-02-04
JP6123547B2 (ja) 2017-05-10
KR102261617B1 (ko) 2021-06-04
CN104342080A (zh) 2015-02-11

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Address after: Tokyo, Japan

Patentee after: Lishennoco Co.,Ltd.

Address before: Tokyo, Japan

Patentee before: HITACHI CHEMICAL Co.,Ltd.