CN104332548A - 白光led制作工艺 - Google Patents

白光led制作工艺 Download PDF

Info

Publication number
CN104332548A
CN104332548A CN201310307997.0A CN201310307997A CN104332548A CN 104332548 A CN104332548 A CN 104332548A CN 201310307997 A CN201310307997 A CN 201310307997A CN 104332548 A CN104332548 A CN 104332548A
Authority
CN
China
Prior art keywords
white
manufacturing process
light led
led manufacturing
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201310307997.0A
Other languages
English (en)
Inventor
不公告发明人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN201310307997.0A priority Critical patent/CN104332548A/zh
Publication of CN104332548A publication Critical patent/CN104332548A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Luminescent Compositions (AREA)

Abstract

为了解决LED封装偏色的问题，本发明提供了一种白光LED制作工艺。适用于LED封装技术领域。本发明是由以下工艺方法构成：（1）取适用的荧光粉与胶水；（2）将荧光粉与胶水按0.55～0.65：1的重量比均匀混合；（3）将步骤（2）所得物质涂覆在发光二极管晶片上；（4）烘干、封装。本发明具有工艺先进、涂覆效果好、出光不偏色等优点。

Description

白光LED制作工艺
技术领域
本发明涉及LED白光制作工艺，适用于LED封装技术领域。
背景技术
LED（发光二极管,light -EmittingDiodc）是一类可直接将电能转化为可见光和辐射能的发光器件，是未来光源的首选，具有工作电压低，耗电量小，发光效率高，发光响应短，光色纯，结构牢固，抗冲击，性能稳定，重量轻、体积小等优良特性。而传统LED封装总是偏色，其主要原因是荧光粉与胶水的混合比例不当。因此，人们希望有一种新的封装方法能够解决这个问题。
发明内容
为了解决LED封装偏色的问题，本发明提供了一种白光LED制作工艺。
本发明解决其技术问题的技术方案是由以下工艺方法构成：
（1）取适用的荧光粉与胶水；
（2）将荧光粉与胶水按0.55～0.65：1的重量比均匀混合；
（3）将步骤（2）所得物质涂覆在发光二极管晶片上；
（4）烘干、封装。
本发明具有工艺先进、涂覆效果好、出光不偏色等优点。
具体实施方式
示例：将本发明运用在1W大功率白光LED光源的制作上。
首先将6克yag荧光粉，10g白光胶水进行充分混合均匀，然后用点涂的方法覆在晶片表面上，接着，将涂覆后的晶片放进烘箱，在130℃的温度常压状态下烘烤1小时，取出封装。即制得不偏色的白光LED光源。

Claims (1)

1.白光LED制作工艺，它是由（1）取适用的荧光粉与胶水，（2）将荧光粉与胶水按0.55～0.65：1的重量比混合，且搅拌均匀，（3）将步骤（2）所得物质涂覆在发光二极管晶片上，（4）烘干、封装的工艺组成，其特征在于步骤（2）：荧光粉与胶水的重量比为0.55～0.65：1。
CN201310307997.0A 2013-07-22 2013-07-22 白光led制作工艺 Pending CN104332548A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310307997.0A CN104332548A (zh) 2013-07-22 2013-07-22 白光led制作工艺

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310307997.0A CN104332548A (zh) 2013-07-22 2013-07-22 白光led制作工艺

Publications (1)

Publication Number Publication Date
CN104332548A true CN104332548A (zh) 2015-02-04

Family

ID=52407239

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310307997.0A Pending CN104332548A (zh) 2013-07-22 2013-07-22 白光led制作工艺

Country Status (1)

Country Link
CN (1) CN104332548A (zh)

Similar Documents

Publication Publication Date Title
CN104310784A (zh) 一种量子点led发光玻璃及其制备方法
CN106972092B (zh) 一种高发光效率的量子点白光led及其制备方法
CN102800794A (zh) 一种光学波长转换器件以及在白光发光器件的应用
CN109004071A (zh) 一种量子点led发光器件的封装结构
CN201514957U (zh) 一种暖白光led
CN105810780A (zh) 一种白光led芯片的制备方法
CN107910426A (zh) 一种磁性荧光粉复合材料及其平面涂覆方法
CN107785476B (zh) 一种白光led用荧光玻璃薄膜及其制备方法
CN207009474U (zh) 一种多层封装的量子点led结构
CN206650075U (zh) 一种可调色温的贴片式led封装体
CN103151434B (zh) 一种改善led封装荧光粉分布均匀性的方法
CN105244427A (zh) 一种新型白光led荧光膜以及基于荧光膜的led
CN103094461B (zh) 光学波长转换组件、其制备方法及白光发光装置
CN104332548A (zh) 白光led制作工艺
CN103333687B (zh) 一种无机光致发光材料及其制备方法
CN203787466U (zh) Led封装结构
CN106374026A (zh) Led白光制作工艺
CN101308884A (zh) 大功率白光led制作工艺
CN201964166U (zh) 一种使用荧光粉隔离技术的led灯
CN105789419B (zh) 一种白光led芯片的制备方法
CN107763568A (zh) 一种关于led远程激发荧光粉层的制备方法
CN101877376B (zh) 有机发光材料包覆的发光二极管及其制作方法
CN103560182A (zh) 一种GaN基低色温高显色白光LED制备方法
CN203103340U (zh) 蓝光led搭配静电喷涂荧光罩的封装结构
CN203242665U (zh) 一种蓝光led二次激发转换白光灯具

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20150204