CN106374026A - Led白光制作工艺 - Google Patents

Led白光制作工艺 Download PDF

Info

Publication number
CN106374026A
CN106374026A CN201510422137.0A CN201510422137A CN106374026A CN 106374026 A CN106374026 A CN 106374026A CN 201510422137 A CN201510422137 A CN 201510422137A CN 106374026 A CN106374026 A CN 106374026A
Authority
CN
China
Prior art keywords
manufacturing process
glue
led
light
white
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510422137.0A
Other languages
English (en)
Inventor
不公告发明人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN201510422137.0A priority Critical patent/CN106374026A/zh
Publication of CN106374026A publication Critical patent/CN106374026A/zh
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/501Wavelength conversion elements characterised by the materials, e.g. binder
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/505Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008Processes
    • H01L2933/0033Processes relating to semiconductor body packages
    • H01L2933/0041Processes relating to semiconductor body packages relating to wavelength conversion elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Luminescent Compositions (AREA)

Abstract

为了解决LED封装偏色的问题,本发明提供了一种白光LED制作工艺。适用于LED封装技术领域。本发明是由以下工艺方法构成:(1)取适用的荧光粉与胶水;(2)将荧光粉与胶水按0.55~0.65:1的重量比均匀混合;(3)将步骤(2)所得物质涂覆在发光二极管晶片上;(4)烘干、封装。本发明具有工艺先进、涂覆效果好、出光不偏色等优点。

Description

LED白光制作工艺
技术领域
本发明涉及LED白光制作工艺,适用于LED封装技术领域。
背景技术
LED(发光二极管,light -EmittingDiodc)是一类可直接将电能转化为可见光和辐射能的发光器件,是未来光源的首选,具有工作电压低,耗电量小,发光效率高,发光响应短,光色纯,结构牢固,抗冲击,性能稳定,重量轻、体积小等优良特性。而传统LED封装总是偏色,其主要原因是荧光粉与胶水的混合比例不当。因此,人们希望有一种新的封装方法能够解决这个问题。
发明内容
为了解决LED封装偏色的问题,本发明提供了一种白光LED制作工艺。
本发明解决其技术问题的技术方案是由以下工艺方法构成:
(1)取适用的荧光粉与胶水;
(2)将荧光粉与胶水按0.55~0.65:1的重量比均匀混合;
(3)将步骤(2)所得物质涂覆在发光二极管晶片上;
(4)烘干、封装。
本发明具有工艺先进、涂覆效果好、出光不偏色等优点。
具体实施方式
示例:将本发明运用在1W大功率白光LED光源的制作上。
首先将6克yag荧光粉,10g白光胶水进行充分混合均匀,然后用点涂的方法覆在晶片表面上,接着,将涂覆后的晶片放进烘箱,在130℃的温度常压状态下烘烤1小时,取出封装。即制得不偏色的白光LED光源。

Claims (1)

1.白光LED制作工艺,它是由(1)取适用的荧光粉与胶水,(2)将荧光粉与胶水按0.55~0.65:1的重量比混合,且搅拌均匀,(3)将步骤(2)所得物质涂覆在发光二极管晶片上,(4)烘干、封装的工艺组成,其特征在于步骤(2):荧光粉与胶水的重量比为0.55~0.65:1。
CN201510422137.0A 2015-07-20 2015-07-20 Led白光制作工艺 Pending CN106374026A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510422137.0A CN106374026A (zh) 2015-07-20 2015-07-20 Led白光制作工艺

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510422137.0A CN106374026A (zh) 2015-07-20 2015-07-20 Led白光制作工艺

Publications (1)

Publication Number Publication Date
CN106374026A true CN106374026A (zh) 2017-02-01

Family

ID=57879910

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510422137.0A Pending CN106374026A (zh) 2015-07-20 2015-07-20 Led白光制作工艺

Country Status (1)

Country Link
CN (1) CN106374026A (zh)

Similar Documents

Publication Publication Date Title
CN100508228C (zh) 一种白光led灯的制造方法及采用该方法的led灯
CN103123950A (zh) 一种led光源的封装结构及封装方法
CN109004071A (zh) 一种量子点led发光器件的封装结构
TW201613139A (en) LED light-emitting structure applicable to backlight source
CN105810780A (zh) 一种白光led芯片的制备方法
CN206163517U (zh) 一种透光面粗化的led器件
CN107785476B (zh) 一种白光led用荧光玻璃薄膜及其制备方法
CN109873070A (zh) 一种用于led照明的发光陶瓷及其制备方法和应用
CN204696115U (zh) 一种三基色白光led光源
CN103151434A (zh) 一种改善led封装荧光粉分布均匀性的方法
CN106374026A (zh) Led白光制作工艺
CN202938048U (zh) 一种透明陶瓷封装白光led球泡灯结构
CN203787466U (zh) Led封装结构
CN107384372A (zh) 一种led荧光粉组合物
CN204045589U (zh) 一种led-cob光源
CN201964166U (zh) 一种使用荧光粉隔离技术的led灯
CN104332548A (zh) 白光led制作工艺
CN107425110B (zh) 具有高辨识度的led光源
CN105789419B (zh) 一种白光led芯片的制备方法
CN101308884A (zh) 大功率白光led制作工艺
CN203103340U (zh) 蓝光led搭配静电喷涂荧光罩的封装结构
CN201893339U (zh) 一种集成式led光源
CN206194789U (zh) 一种芯片级封装led
CN104851956B (zh) 一种近紫外激发白光led光源
CN203910853U (zh) 一种smd led的封装结构

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20170201

WD01 Invention patent application deemed withdrawn after publication