CN104332479B - A kind of miniature GaAs battery of laser power supply - Google Patents

A kind of miniature GaAs battery of laser power supply Download PDF

Info

Publication number
CN104332479B
CN104332479B CN201310308779.9A CN201310308779A CN104332479B CN 104332479 B CN104332479 B CN 104332479B CN 201310308779 A CN201310308779 A CN 201310308779A CN 104332479 B CN104332479 B CN 104332479B
Authority
CN
China
Prior art keywords
gaas
layer
battery
power supply
laser power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201310308779.9A
Other languages
Chinese (zh)
Other versions
CN104332479A (en
Inventor
梁存宝
杜永超
肖志斌
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cetc Blue Sky Technology Co ltd
Tianjin Hengdian Space Power Source Co ltd
Original Assignee
TIANJIN HENGDIAN SPACE POWER SOURCE Co Ltd
CETC 18 Research Institute
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TIANJIN HENGDIAN SPACE POWER SOURCE Co Ltd, CETC 18 Research Institute filed Critical TIANJIN HENGDIAN SPACE POWER SOURCE Co Ltd
Priority to CN201310308779.9A priority Critical patent/CN104332479B/en
Publication of CN104332479A publication Critical patent/CN104332479A/en
Application granted granted Critical
Publication of CN104332479B publication Critical patent/CN104332479B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy

Landscapes

  • Photovoltaic Devices (AREA)

Abstract

The present invention relates to a kind of miniature GaAs battery of laser power supply, including the series connection all-in-one-piece battery of plural number, it is characterized in:The P N N P reef knot epitaxial structure that p GaAs reef knot layer, i GaAs non-doped layer, n GaAs cushion, n GaAs Window layer, n GaAs base layer, p GaAs emission layer, p GaAs Window layer and the heavily doped layer of p GaAs that described sub- battery includes growing successively from bottom to top on substrate is constituted.The present invention is by extending the P N N P reef knot epitaxial structure of PN and NP formation outside face on gaas substrates, substrate and p GaAs reef knot layer is made to define reversed bias voltage, serve the effect of current cut-off, solve the problems, such as that the physical isolation between element cell causes bottom leakage current, effectively reduce the leakage current of battery bottom, and epitaxial layer is very thin, overall dimensions are 2.2 × 2.2mm, are suitable for laser power supply.

Description

A kind of miniature GaAs battery of laser power supply
Technical field
The invention belongs to photoelectric conversion technique field, the miniature GaAs battery of more particularly to a kind of laser power supply.
Background technology
Laser power supply miniature GaAs battery is the battery being generated electricity as energy of light source using laser.Because laser is frequency Respond the light source of best Single wavelength, and sunlight is full spectrum, the laser power supply miniature GaAs electricity of thus like unit area The electric current that pond produces is far longer than the electric current of sun laser energy supply battery generation, defines stable high current effect, and laser supplies Can miniature GaAs battery also have small volume, lightweight, be not subject to radio wave and electromagnetic interference, safe the features such as;Currently, laser Energy supply miniature GaAs battery primarily as the driving power supply of MEMS (MEMS), and electric power, radio communication, medical treatment, Each field such as Aero-Space has a wide range of applications.
At present, laser power supply miniature GaAs battery primary structure be connect on the GaAs substrate of spot size area multiple Sub- battery;Due to being cascaded structure, have the characteristics that open-circuit voltage is high, but there is a problem of that bottom leakage current is big, therefore simultaneously Significantly reduce the using effect of laser power supply miniature GaAs battery.Bottom in order to reduce laser power supply miniature GaAs battery is leaked Electric current, the method for employing is to increase the thickness of each grown layer in GaAs epitaxial structure mostly, is especially to increase the thickness of cushion (reaching 10 μm~20 μm), achieves the effect reducing battery bottom leakage current;But because the laser power supply that the method is made is micro- Type GaAs battery epitaxy layer thickness is big (reaching 18 μ~28 μm), and not only epitaxial growth is complicated, high cost, and increased battery The difficulty of post-production technique.
Content of the invention
The present invention provides a kind of thickness of thin, epitaxial growth and overall electricity for solving technical problem present in known technology Pond processing technology is simple, low cost, and a kind of little laser power supply miniature GaAs battery of battery bottom leakage current.
The present invention adopts the technical scheme that:
A kind of miniature GaAs battery of laser power supply, including the series connection all-in-one-piece battery of plural number, is characterized in:Described son P-GaAs reef knot layer that battery includes growing successively from bottom to top on substrate, i-GaAs non-doped layer, n-GaAs buffering The P- that layer, n-GaAs Window layer, n-GaAs base layer, p-GaAs emission layer, p-GaAs Window layer and the heavily doped layer of p-GaAs are constituted N-N-P reef knot epitaxial structure;The Top electrode of sub- battery is formed on the heavily doped layer of p-GaAs, and the bottom electrode of sub- battery is formed on lower electrode area Domain, described lower pole region is to remove the heavily doped layer of part p-GaAs, p-GaAs Window layer, p- in P-N-N-P reef knot epitaxial structure The n-GaAs cushion that GaAs emission layer, n-GaAs base layer and n-GaAs Window layer are exposed;The isolation channel exposing substrate is formed Between the lower electrode arrangement and adjacent upper electrode arrangement of a sub- battery.
The present invention can also adopt the following technical scheme that:
The one that described Top electrode is Top electrode gold lower floor, Top electrode silver layer is deposited with Top electrode gold upper strata.
Described bottom electrode is bottom electrode gold lower floor, bottom electrode germanium layer, bottom electrode silver layer are deposited with bottom electrode gold upper strata Integrally.
The spun gold that the sub- battery strings of described plural number join together welds as interconnecting electrode.
Constitute the cell area of the battery boundary line besieged city 2.2mm × 2.2mm of the substrate perimeter of miniature GaAs battery.
The present invention has the advantages and positive effects that:
1st, the present invention, by extending the P-N-N-P reef knot epitaxial structure of PN and NP formation outside face on gaas substrates, makes lining Bottom and p-GaAs reef knot layer define reversed bias voltage, serve the effect of current cut-off, solve physics between element cell every From the problem causing bottom leakage current, effectively reduce the leakage current of battery bottom, and epitaxial layer is very thin, thickness is only 9 μm Hereinafter, reduce the difficulty of the techniques such as later stage corrosion isolation, and effectively increase epitaxially grown quality.
2nd, present invention employs spun gold welding interconnecting electrode, without PI glue isolation technology, not only avoid electrode interconnection short circuit, And process is simple, effectively reduce the manufacturing cost of product.
Brief description
Fig. 1 is laser power supply of the present invention miniature GaAs battery main view section expanded schematic diagram;
Fig. 2 is laser power supply of the present invention miniature GaAs battery plan shape schematic diagram;
Fig. 3 is laser power supply of the present invention miniature GaAs cell I-V electric performance test curve chart.
In figure:1st, the heavily doped layer of p-GaAs, 2, p-GaAs Window layer, 3, p-GaAs emission layer, 4, n-GaAs base layer, 5, n- GaAs Window layer, 6, n-GaAs cushion, 7, i-GaAs non-doped layer, 8, p-GaAs reef knot layer, 9, substrate, 10, Top electrode, 11st, Top electrode gold lower floor, 12, Top electrode silver layer, 13, Top electrode gold upper strata, 14, bottom electrode, 15, bottom electrode gold lower floor, 16, Bottom electrode germanium layer, 17, bottom electrode silver layer, 18, bottom electrode gold upper strata, 19, isolation channel, 20, interconnecting electrode, 21, battery boundary line, 22nd, isolate trench bottom, 23, lower pole region.
Specific embodiment
For content of the invention, feature and effect of the present invention can be further appreciated that, hereby enumerate following examples, and coordinate accompanying drawing Describe in detail as follows:
A kind of miniature GaAs battery of laser power supply, including the series connection all-in-one-piece battery of plural number;
The innovative point of the present invention includes:
Described sub- battery includes p-GaAs reef knot layer 8, the i-GaAs undoped growing successively from bottom to top on substrate 9 Layer 7, n-GaAs cushion 6, n-GaAs Window layer 5, n-GaAs base layer 4, p-GaAs emission layer 3, p-GaAs Window layer 2 and p- The P-N-N-P reef knot epitaxial structure that the heavily doped layer of GaAs 1 is constituted;The Top electrode 10 of sub- battery is formed on the heavily doped layer of p-GaAs, son electricity The bottom electrode 14 in pond is formed on lower pole region 23, and described lower pole region is to remove part p- in P-N-N-P reef knot epitaxial structure The n-GaAs that the heavily doped layer of GaAs, p-GaAs Window layer, p-GaAs emission layer, n-GaAs base layer and n-GaAs Window layer are exposed delays Rush layer;P-N-N-P reef knot epitaxial structure below described Top electrode and the n-GaAs cushion below bottom electrode, i-GaAs is non-mixes There is isolation channel 19, the substrate exposing in isolation channel is as isolation trench bottom 22 between diamicton, p-GaAs reef knot layer.
The innovative point of the present invention also includes:
The one that described Top electrode is Top electrode gold lower floor 11, Top electrode silver layer 12 is deposited with Top electrode gold upper strata 13.
Described bottom electrode be bottom electrode gold lower floor 15, bottom electrode germanium layer 16, bottom electrode silver layer 17 and bottom electrode gold upper strata 18 The one being deposited with.
The spun gold that the sub- battery strings of described plural number join together welds as interconnecting electrode 20.
Constitute the cell area of the battery boundary line 21 besieged city 2.2mm × 2.2mm of the substrate perimeter of miniature GaAs battery.
The manufacturing process of the miniature GaAs battery of laser power supply of the present invention:
Step 1, preparing substrate
From diameter 100mm, 300 μm of thickness, be radially offset from 2 ° of Semi-insulating GaAs material as shown in Figure 1 grow outer Prolong the GaAs substrate of layer;
Step 2, reef knot grown epitaxial layer
Using vapor phase epitaxial growth (MOVPE) technology, growth thickness successively from bottom to top above GaAs substrate in step 1 P-GaAs reef knot layer for 0.3 μm, 0.1 μm of i-GaAs non-doped layer, 2 μm of n-GaAs cushion,N-GaAs Window layer, 3 μm of n-GaAs base layer, 1 μm of p-GaAs emission layer, 2 μm of p-GaAs Window layer, 0.2 μm of p-GaAs weight Mix layer;Form P-N-N-P reef knot epitaxial layer;
Step 3, the sub- battery of making
(1) photoetching isolation channel figure
After the completion of step 2, GaAs substrate is placed in glue spreader, the heavily doped layer of p-GaAs applies last layer glue thick 5 μm with On BP218 positive photo glue, less than 1000 revs/min of rotating speed whirl coating, after spin coating, 90 DEG C of drying glues 30 minutes;Use litho machine With 20mW/cm2Exposure 12 seconds, room temperature environment 1%NaOH solution development 35 seconds, with 110 DEG C of post bakes of TR baking oven 30 minutes; The area being a battery with 2.2mm × 2.2mm, is made by lithography on the heavily doped layer of p-GaAs of diameter 100mm area with reticle Multiple battery isolation channel figure as shown in Figure 2;
(2) wet etching isolation channel
In the figure of the isolation channel that (1) step 3 makes by lithography, use volume ratio citric acid saturated solution successively:H2O2=5:1 conduct Citric acid corrosion corrosion 3 minutes, removes the heavily doped layer of p-GaAs, deionized water rinsing falls citric acid corrosive liquid;With dense HCL corrosion 1 minute, remove p-GaAs Window layer, deionized water rinsing falls dense HCL corrosive liquid;Corrode corrosion 6 minutes with citric acid, remove P-GaAs emission layer and n-GaAs base layer, deionized water rinsing falls citric acid corrosive liquid;Corroded 1 minute with dense HCL, remove n- GaAs Window layer, deionized water rinsing falls dense HCL corrosive liquid;With citric acid corrode corrosion 4min, remove n-GaAs cushion, I-GaAs non-doped layer and p-GaAs reef knot layer, deionized water rinsing falls citric acid corrosive liquid, until exposing GaAs substrate conduct Isolation trench bottom, each cell area is corroded and six uniform isolation channels shown in Fig. 2, in each cell area of GaAs substrate every Six casting lug thereons separating out are as six sub- batteries;
Step 4, making bottom electrode
(1) the figure of photoetching lower pole region
After the completion of step 3, GaAs substrate is placed on glue spreader, the every six sub- cell p-GaAs weights made in step 3 Mix and more than 5 μm thick BP218 positive photo glue of last layer are applied on layer, less than 1000 revs/min of rotating speed whirl coating, after spin coating, 90 DEG C drying glue 30 minutes;With litho machine with 20mW/cm2Exposure 12 seconds, room temperature environment 1%NaOH solution development 35 seconds, use thermal resistance 110 DEG C of post bakes of formula baking oven 30 minutes, make the lower electricity of the evaporation bottom electrode shown in Fig. 2 on the heavily doped layer of p-GaAs by lithography with reticle The figure in polar region domain;
(2) wet etching goes out lower pole region
On the lower pole region figure that (1) step 4 makes by lithography, use volume ratio citric acid saturated solution successively:H2O2=5:1 work For citric acid corrosive liquid corrosive attack 3 minutes, get rid of the heavily doped layer of p-GaAs, deionized water rinsing falls citric acid corrosive liquid;With Dense HCL corrodes 1 minute, gets rid of p-GaAs Window layer, deionized water rinsing falls dense HCL corrosive liquid;Rotten with citric acid corrosive liquid Erosion 6 minutes, gets rid of p-GaAs emission layer and n-GaAs base layer, deionized water rinsing falls citric acid corrosive liquid;Rotten with dense HCL Erosion 1 minute, gets rid of n-GaAs Window layer to exposing n-GaAs cushion, deionized water rinsing falls dense HCL corrosive liquid, each electricity Pool area corrodes the lower pole region evaporation bottom electrode shown in Fig. 1;
(3) it is deposited with bottom electrode metal level
For preventing battery short circuit, isolation channel is filled PI glue, is more than 5 × 10 with vacuum-4The high vacuum coating unit of Pa, On the n-GaAs cushion in each sub- battery lower pole region according to the lower pole region shown in Fig. 2 from bottom to top according to Secondary evaporation thickness isBottom electrode gold lower floor,Bottom electrode germanium layer, 5 μm of bottom electrode silver layer and Bottom electrode gold upper strata, complete the manufacturing process of each sub- battery bottom electrode.
Step 5, making Top electrode
Gap filling PI glue between each sub- battery and its bottom electrode, is more than 5 × 10 with vacuum-4The fine vacuum of Pa Coater, makes the Top electrode figure shown in Fig. 2 with reticle by lithography on the heavily doped layer of p-GaAs of each sub- battery, according to Top electrode figure on the heavily doped layer of p-GaAs from bottom to top successively evaporation thickness beTop electrode gold lower floor, 5 μm Top electrode silver layer andTop electrode gold upper strata, complete the manufacturing process of each sub- battery Top electrode;
Step 6, welding interconnecting electrode
With a diameter of 25 μm of spun golds, the Top electrode of adjacent subcell in six sub- batteries and bottom electrode are welded, form five Individual gold thread interconnecting electrode, makes six sub- battery strings join together;
Step 7, evaporation antireflective coating
After the completion of step 6, GaAs substrate is put on the evaporation disc of high vacuum coating unit, by the titanium sesquioxide of 50g-60g It is respectively charged into crucible with the silicon monoxide of 80g-110g, crucible is placed on evaporation disc;Close the door for vacuum chamber of high vacuum coating unit, High vacuum coating unit is carried out with vacuum and is more than 5 × 10-4The evacuation of Pa, carries out 56n m thickness to battery integral surface priority Titanium sesquioxide evaporation and the silicon monoxide vapor deposition of 90nm thickness, battery integral surface forms antireflective coating;
Step 8, scribing
With scribing machine, the battery disk being deposited with after antireflective coating is carried out scribing along battery boundary line shown in Fig. 2, make Multiple 2.2mm × 2.2mm foursquare leakproof electric current ultra-thin micro GaAs battery, complete profile of the present invention be 2.2mm × 2.2mm, epitaxy layer thickness are the manufacture process of 9 μm of leakproof electric current ultra-thin micro GaAs battery.
The electric performance test of laser power supply miniature GaAs battery:
Whether the electric leakage being sized to reaction cell due to short circuit current and fill factor, curve factor is effectively controlled.Using sharp The laser power supply that the adjustable laser that optical wavelength 830nm, power are 600mW, fibre diameter is 1.8mm is prepared to the present invention is micro- Type GaAs battery carries out I-V electric performance test and battery bottom leakage testses, the test data as shown in table 1 and Fig. 3:Open circuit electricity Press as 6.5V, short circuit current reaches 47.2mA, fill factor, curve factor is 67%, and at maximum power point, magnitude of voltage reaches 5.4V.Experiment knot Fruit illustrates the battery that the present invention manufactures, and not only thickness of thin, epitaxial growth and integral battery door processing technology are simple, low cost, and Serve obvious effect to reducing battery bottom electric leakage.
Table 1 battery bottom leakage testses tables of data
Open-circuit voltage (V) Short circuit current (mA) Fill factor, curve factor (%) Magnitude of voltage (V) at maximum power point
6.5 47.2 67 5.4
Although being described to the preferred embodiments of the present invention above in conjunction with accompanying drawing, the invention is not limited in The specific embodiment stated, above-mentioned specific embodiment is only schematically, is not restricted, this area common Technical staff, under the enlightenment of the present invention, in the case of without departing from present inventive concept and scope of the claimed protection, also may be used To make a lot of forms, these belong within protection scope of the present invention.

Claims (5)

1. the miniature GaAs battery of a kind of laser power supply, including the series connection all-in-one-piece battery of plural number it is characterised in that:Described son P-GaAs reef knot layer that battery includes growing successively from bottom to top on substrate, i-GaAs non-doped layer, n-GaAs cushion, The P-N-N- that n-GaAs Window layer, n-GaAs base layer, p-GaAs emission layer, p-GaAs Window layer and the heavily doped layer of p-GaAs are constituted P reef knot epitaxial structure;The Top electrode of sub- battery is formed on the heavily doped layer of p-GaAs, and the bottom electrode of sub- battery is formed on lower pole region, Described lower pole region is to remove the heavily doped layer of part p-GaAs, p-GaAs Window layer, p-GaAs in P-N-N-P reef knot epitaxial structure The n-GaAs cushion that emission layer, n-GaAs base layer and n-GaAs Window layer are exposed;The isolation channel exposing substrate is formed at one Between the lower electrode arrangement of sub- battery and adjacent upper electrode arrangement.
2. the miniature GaAs battery of laser power supply according to claim 1 it is characterised in that:Described Top electrode is Top electrode gold The one that lower floor, Top electrode silver layer are deposited with Top electrode gold upper strata.
3. the miniature GaAs battery of laser power supply according to claim 1 it is characterised in that:Described bottom electrode is bottom electrode gold The one that lower floor, bottom electrode germanium layer, bottom electrode silver layer are deposited with bottom electrode gold upper strata.
4. the miniature GaAs battery of laser power supply according to claim 1 it is characterised in that:Described plural sub- battery strings connection Integral spun gold welds as interconnecting electrode.
5. the miniature GaAs battery of laser power supply according to claim 1 it is characterised in that:Constitute the lining of miniature GaAs battery The cell area of the battery boundary line besieged city 2.2mm × 2.2mm around bottom.
CN201310308779.9A 2013-07-22 2013-07-22 A kind of miniature GaAs battery of laser power supply Active CN104332479B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310308779.9A CN104332479B (en) 2013-07-22 2013-07-22 A kind of miniature GaAs battery of laser power supply

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310308779.9A CN104332479B (en) 2013-07-22 2013-07-22 A kind of miniature GaAs battery of laser power supply

Publications (2)

Publication Number Publication Date
CN104332479A CN104332479A (en) 2015-02-04
CN104332479B true CN104332479B (en) 2017-03-08

Family

ID=52407177

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310308779.9A Active CN104332479B (en) 2013-07-22 2013-07-22 A kind of miniature GaAs battery of laser power supply

Country Status (1)

Country Link
CN (1) CN104332479B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106788238A (en) * 2017-02-10 2017-05-31 成都聚立汇信科技有限公司 A kind of photovoltaic and photothermal solar set composite

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030085379A (en) * 2002-04-30 2003-11-05 국방과학연구소 Pin diode and the method of manufacturing pin diode
WO2009101739A1 (en) * 2008-02-12 2009-08-20 Nec Corporation Surface-emitting laser and method for manufacturing the same
CN102184999A (en) * 2011-04-02 2011-09-14 中国科学院苏州纳米技术与纳米仿生研究所 NPN-structure-based laser photovoltaic cell and preparation process thereof
CN102651416A (en) * 2012-05-18 2012-08-29 中国科学院苏州纳米技术与纳米仿生研究所 Three-knot laminated GaAs laser photovoltaic battery and preparation method thereof
CN102651420A (en) * 2012-05-18 2012-08-29 中国科学院苏州纳米技术与纳米仿生研究所 Double-junction GaAs lamination laser photovoltaic cell and fabrication method thereof

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6864414B2 (en) * 2001-10-24 2005-03-08 Emcore Corporation Apparatus and method for integral bypass diode in solar cells

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030085379A (en) * 2002-04-30 2003-11-05 국방과학연구소 Pin diode and the method of manufacturing pin diode
WO2009101739A1 (en) * 2008-02-12 2009-08-20 Nec Corporation Surface-emitting laser and method for manufacturing the same
CN102184999A (en) * 2011-04-02 2011-09-14 中国科学院苏州纳米技术与纳米仿生研究所 NPN-structure-based laser photovoltaic cell and preparation process thereof
CN102651416A (en) * 2012-05-18 2012-08-29 中国科学院苏州纳米技术与纳米仿生研究所 Three-knot laminated GaAs laser photovoltaic battery and preparation method thereof
CN102651420A (en) * 2012-05-18 2012-08-29 中国科学院苏州纳米技术与纳米仿生研究所 Double-junction GaAs lamination laser photovoltaic cell and fabrication method thereof

Also Published As

Publication number Publication date
CN104332479A (en) 2015-02-04

Similar Documents

Publication Publication Date Title
TWI373848B (en) Method of fabricating solar device
CN107046027B (en) Perovskite and gallium arsenide hetero-integrated solar cell manufacturing method and cell
CN109273545A (en) A kind of production method of cadmium telluride diaphragm solar battery component
JP6338990B2 (en) Multi-junction solar cell
CN102709348B (en) A kind of Nanocrystalline/quandot dot sensitive silicon substrate battery piece and preparation method thereof
CN104332525B (en) The manufacture method of laser power supply miniature GaAs battery
TW201110200A (en) Solar cell defect passivation method
CN105762219B (en) Cuprous oxide-based multi-lamination heterojunction solar cell and preparation method thereof
CN103000709B (en) Back electrode, back electrode absorbing layer composite structure and solar cell
JP2010123916A (en) METHOD FOR FORMING GexSi1-x BUFFER LAYER OF SOLAR ENERGY CELL ON SILICON WAFER
JP6367940B2 (en) Manufacturing method of silicon wafer having composite structure
WO2018192199A1 (en) Multi-junction laminated laser photovoltaic cell and manufacturing method thereof
Baek et al. Characterization of optical absorption and photovoltaic properties of silicon wire solar cells with different aspect ratio
CN104332479B (en) A kind of miniature GaAs battery of laser power supply
CN107732014A (en) A kind of solar cell based on the inorganic build hetero-junction thin-film of ternary and preparation method thereof
CN103872179B (en) A kind of preparation method improving thin-film solar cells efficiency
CN203398114U (en) Ultrathin miniature GaAs cell with leakage current prevention
CN101459206A (en) Manufacturing process for high-efficiency multi-junction solar cell
CN102593198B (en) Manufacturing method of II-VI group laminating integrated nano photovoltaic device and
CN110165020A (en) One kind being based on CdS/SnO2Mix the efficient Sb of N-type layer2Se3Hull cell and preparation method thereof
CN102569495B (en) Method for doping solar wafer and doped wafer
CN111599881B (en) Single crystal cuprous oxide composite semiconductor nano generator and manufacturing method thereof
CN107887513A (en) A kind of solar cell based on ternary inorganic flat type hetero-junction thin-film and preparation method thereof
CN108231954A (en) A kind of preparation method of solar cell
KR101628957B1 (en) Patterned grid electrode and thin film solar cell using the same, and a method of manufacturing them

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20221116

Address after: Room 106-107, 109-136, 140-158, 201-252, Solar Cell and Controller Plant, No. 6, Huake 7th Road, Haitai, Huayuan Industrial Zone (outside the ring), Binhai New Area, Tianjin, 300384

Patentee after: TIANJIN HENGDIAN SPACE POWER SOURCE Co.,Ltd.

Patentee after: CETC Energy Co.,Ltd.

Address before: No. 6, Haitai Huake 7th Road, Huayuan Industrial Zone (outside the ring), Binhai New Area, Tianjin, 300384

Patentee before: TIANJIN HENGDIAN SPACE POWER SOURCE Co.,Ltd.

Patentee before: The 18th Research Institute of China Electronics Technology Group Corporation

CP01 Change in the name or title of a patent holder
CP01 Change in the name or title of a patent holder

Address after: Room 106-107, 109-136, 140-158, 201-252, Solar Cell and Controller Plant, No. 6, Huake 7th Road, Haitai, Huayuan Industrial Zone (outside the ring), Binhai New Area, Tianjin, 300384

Patentee after: TIANJIN HENGDIAN SPACE POWER SOURCE Co.,Ltd.

Patentee after: CETC Blue Sky Technology Co.,Ltd.

Address before: Room 106-107, 109-136, 140-158, 201-252, Solar Cell and Controller Plant, No. 6, Huake 7th Road, Haitai, Huayuan Industrial Zone (outside the ring), Binhai New Area, Tianjin, 300384

Patentee before: TIANJIN HENGDIAN SPACE POWER SOURCE Co.,Ltd.

Patentee before: CETC Energy Co.,Ltd.