CN104332432B - One kind patch wax apparatus and its processing method - Google Patents
One kind patch wax apparatus and its processing method Download PDFInfo
- Publication number
- CN104332432B CN104332432B CN201410546463.8A CN201410546463A CN104332432B CN 104332432 B CN104332432 B CN 104332432B CN 201410546463 A CN201410546463 A CN 201410546463A CN 104332432 B CN104332432 B CN 104332432B
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- CN
- China
- Prior art keywords
- chip
- rubber cushion
- wax
- flat rubber
- seal ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
Abstract
Wax apparatus is pasted the present invention relates to one kind, including rotatable ceramic disk, it is provided with above the ceramic disk under moveable flat rubber cushion, the flat rubber cushion and is fixedly installed vaccum seal ring, the vaccum seal ring side is provided with multiple vacuum holes, the vacuum hole connects one end of vacuum tube, and the other end of the vacuum tube is connected with vavuum pump, and valve is additionally provided with the vacuum tube, the present invention uses and vacuumizes mode, make chip uniform force, it is to avoid wafer breakage, improve yield rate；Vacuum mode extracts air in sealing ring, ensures that wax is fitted completely with chip, it is to avoid bubble phenomenon occurs in chip patch wax, thoroughly removes the bubble occurred during chip patch ceroplastic, it is ensured that wafer flatness, improves wafer yield；It is adapted to thin slice technique, it is ensured that the thickness accuracy of chip.
Description
Technical field
The present invention relates to one kind patch wax apparatus and its processing method, belong to semiconductor wafer patch wax polishing field.
Background technology
, need to be by heating, waxing paster, three steps of lower wax, chip before patch wax in semicon industry chip patch ceroplastic
After ceramic disk wax melts in patch ceroplastic, chip need to be somewhat compacted, be easy to the surface of chip to cover waxing, i.e. chip comprehensively and paste
Wax.Chip is uniformly distributed in ceramic disk periphery, and conventional wafer pastes ceroplastic by the way of air bag patch wax.Ceramic disk waxing fusing
Chip is placed on wax afterwards, air bag is placed in chip top, chip is slowly compacted by air bag in the presence of cylinder thrust, is easy to wax
Uniform covering wafer surface.But, air bag is hemispherical, is that air bag bottommost first contacts chip, and center wafer portion first
Stress is maximum, easily causes broken wafers；After wax fusing, when promoting air bag compacting chip using cylinder pressure, wafer periphery air
Bubble can be produced in wafer surface by easily causing in waxing bubble, compacting wafer process；Therefore, gasbag-type patch wax mode is unfavorable for crystalline substance
Piece pastes wax yield rate, increases entreprise cost.
The content of the invention
The technical problem to be solved in the present invention is：To overcome above mentioned problem, there is provided a kind of patch wax of use vacuum drawn dress
Put and its processing method.
The technical solution adopted for the present invention to solve the technical problems is：
It is provided with and can be moved in three dimensions above one kind patch wax apparatus, including rotatable ceramic disk, the ceramic disk
Vaccum seal ring is fixedly installed under dynamic flat rubber cushion, the flat rubber cushion, the vaccum seal ring side is provided with multiple vacuum
Hole, the vacuum hole connects one end of vacuum tube, and the other end of the vacuum tube is connected with vavuum pump, also set on the vacuum tube
It is equipped with valve, the diameter 1 ± 0.5cm bigger than chip of the vaccum seal ring, the height of the vaccum seal ring is 500 ± 50 μ
m。
Preferably, it is fixedly connected on the upside of the flat rubber cushion with the piston rod top of cylinder.
Preferably, the diameter of the flat rubber cushion is identical with the sealing ring size.
Preferably, the central point on the downside of the ceramic disk connects the output end of turn drive motor.
A kind of processing method using patch wax apparatus described above, comprises the following steps：
(1) when the wax placed on the ceramic disk melts to form the cured layer of one layer of liquid, chip is gently placed in said wax layer
On；
(2) the flat rubber cushion is moved down, and the vaccum seal ring is covered all chip；
(3) valve on the vacuum tube is opened, is vacuumized using the vavuum pump, takes the sky of the wafer periphery away
Gas, forms vacuum space；
(4) while vacuumizing, the flat rubber cushion continues to move downward, and flat rubber cushion is fitted completely with chip, makes crystalline substance
Piece is fully contacted with wax layer；
(5) the flat rubber cushion drives the vaccum seal ring to move upwards after 2-4 seconds；
(6) turn drive motor drives one station of ceramic disc spins, next chip is placed in the vaccum seal ring
Under, repeat step (1)-(5).
The beneficial effects of the invention are as follows：The present invention is simple in construction, using mode is vacuumized, makes chip uniform force, it is to avoid
Wafer breakage, improves yield rate；Vacuum mode extracts wafer periphery air, it is to avoid bubble phenomenon occurs in chip patch wax, ensures brilliant
Piece is fitted completely with wax, thoroughly removes the bubble that occurs during chip patch ceroplastic, it is ensured that wafer flatness, improve chip into
Product rate；It is adapted to all wafers Wax enhancement, particularly thin slice technique.
Brief description of the drawings
The present invention is further described with reference to the accompanying drawings and examples.
Fig. 1 is the front view of one embodiment of the invention；
Fig. 2 is the sectional view of vaccum seal ring of the present invention.
Marked in figure：1- ceramic disks, the cured layers of 2-, 3- chips, 4- vaccum seal rings, the flat rubber cushions of 5-, 6- cylinders, 7- vacuum
Pump, 8- vacuum tubes, 41- vacuum holes.
Embodiment
In conjunction with the accompanying drawings, the present invention is further explained in detail.These accompanying drawings are simplified schematic diagram, only with
Illustration illustrates the basic structure of the present invention, therefore it only shows the composition relevant with the present invention.
A kind of patch wax apparatus of the present invention as shown in Figure 1, including rotatable ceramic disk 1, the ceramic disk 1 are used
The existing method that turns is rotated, and the top of the ceramic disk 1 is provided with the flat rubber cushion 5 moved in three dimensions, described flat
The movement of rubber cushion 5 is controllable accurate movement, and the motion of three dimensions can be realized by conventional X-axis, Y-axis and Z axis guide rail,
Vaccum seal ring 4 is fixedly installed under the flat rubber cushion 5, the side of vaccum seal ring 4 is provided with multiple vacuum holes 41, such as schemed
Shown in 2, the vacuum hole 41 connects one end of vacuum tube 8, and the other end of the vacuum tube 8 is connected with vavuum pump 7, vavuum pump 7
For will be vacuumized in vaccum seal ring 4, valve is additionally provided with the vacuum tube 8, the size of the vaccum seal ring 4 can root
According to the size design of chip 3, its diameter is than the big 1 ± 0.5cm of diameter of corresponding chip 3, and the dimensions of chip 3 is existing known
Technology, the height of the vaccum seal ring 4 is 500 ± 50 μm, and in compacting, the vaccum seal ring 4 can be complete by chip 3
Cover.
In preferred embodiments, the upside of flat rubber cushion 5 is fixedly connected with the piston rod top of cylinder 6, passes through gas
Flat rubber cushion 5 described in the extension and contraction control of cylinder 6 is moved up and down, but is not limited to use cylinder 6.
In preferred embodiments, the diameter of the flat rubber cushion 5 and the same size of sealing ring.
In preferred embodiments, the central point of the downside of ceramic disk 1 connects the output end of turn drive motor.
A kind of processing method using patch wax apparatus described above, comprises the following steps：
(1) the very thin cured layer 2 of one layer of liquid will be preferably formed after the wax placed on the ceramic disk 1 melts, then by crystalline substance
Piece 3 is placed in said wax layer；
(2) the flat rubber cushion 5 is moved down, and cylinder 6 described in use preferably promotes the flat rubber cushion 5 to move down, and makes
The vaccum seal ring 4 covers all chip 3；
(3) valve on the vacuum tube 8 is opened, is vacuumized, is taken away around the chip 3 using the vavuum pump 7
Air, forms vacuum space；
(4) while vacuumizing, the flat rubber cushion 5 continues to move downward, and flat rubber cushion 5 is fitted completely with chip 3, makes
Chip 3 is fully contacted with wax layer；
(5) waxing of chip 3 process is extremely short, about 2~4 seconds, and the flat rubber cushion 5 drives the vaccum seal ring 4 motion upwards；
(6) turn drive motor drives ceramic disk 1 to rotate a station, next chip 3 is affixed on the wax of fusing and puts
In under the vaccum seal ring 4, repeat step (1)-(5).
Using the above-mentioned desirable embodiment according to the present invention as enlightenment, by above-mentioned description, relevant staff is complete
Various changes and amendments can be carried out without departing from the scope of the technological thought of the present invention' entirely.The technology of this invention
Property scope is not limited to the content on specification, it is necessary to its technical scope is determined according to right.
Claims (2)
1. one kind patch wax apparatus, it is characterised in that including rotatable ceramic disk, being provided with above the ceramic disk can be three
Vaccum seal ring is fixedly installed under the flat rubber cushion of dimension space movement, the flat rubber cushion, the vaccum seal ring side is provided with
Multiple vacuum holes, the vacuum hole connects one end of vacuum tube, and the other end of the vacuum tube is connected with vavuum pump, the vacuum
Valve, the diameter 1 ± 0.5cm bigger than chip of the vaccum seal ring are additionally provided with pipe, the height of the vaccum seal ring is
500±50μm；It is fixedly connected on the upside of the flat rubber cushion with the piston rod top of cylinder；Wax is placed on the ceramic disk；One is brilliant
Piece is placed in the liquid wax layer of fusing；The diameter of the flat rubber cushion is identical with the sealing ring size；On the downside of the ceramic disk
Central point connect turn drive motor output end.
2. the processing method of wax apparatus is pasted described in a kind of use claim 1, it is characterised in that comprise the following steps：
(1) when the wax placed on the ceramic disk melts to form the cured layer of one layer of liquid, chip is gently placed in said wax layer；
(2) the flat rubber cushion is moved down, and the vaccum seal ring is covered all chip；
(3) valve on the vacuum tube is opened, is vacuumized using the vavuum pump, takes the air of the wafer periphery, shape away
Into vacuum space；
(4) while vacuumizing, the flat rubber cushion continues to move downward, and flat rubber cushion is fitted completely with chip, make chip with
Wax layer is fully contacted；
(5) the flat rubber cushion drives the vaccum seal ring to move upwards after 2-4 seconds；
(6) turn drive motor drives one station of ceramic disc spins, next chip is placed under the vaccum seal ring, weight
Multiple step (1)-(5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410546463.8A CN104332432B (en) | 2014-10-15 | 2014-10-15 | One kind patch wax apparatus and its processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410546463.8A CN104332432B (en) | 2014-10-15 | 2014-10-15 | One kind patch wax apparatus and its processing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104332432A CN104332432A (en) | 2015-02-04 |
| CN104332432B true CN104332432B (en) | 2017-09-01 |
Family
ID=52407137
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410546463.8A Active CN104332432B (en) | 2014-10-15 | 2014-10-15 | One kind patch wax apparatus and its processing method |
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| Country | Link |
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| CN (1) | CN104332432B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105399344B (en) * | 2015-12-07 | 2018-05-04 | 上海现代先进超精密制造中心有限公司 | The method that paraffin bubble-free is bonded flat glass |
| CN107452643B (en) * | 2016-05-31 | 2020-11-13 | 弘塑科技股份有限公司 | Substrate flattening apparatus and semiconductor manufacturing method using the same |
| CN110340801B (en) * | 2019-07-15 | 2020-09-15 | 浙江光特科技有限公司 | High-step substrate wafer wax pasting method |
| CN110400771B (en) * | 2019-07-15 | 2021-09-17 | 浙江光特科技有限公司 | Method for sticking wax on three-inch wafer |
| CN116453984B (en) * | 2023-06-19 | 2023-08-18 | 通威微电子有限公司 | Wax pasting fixing device and wax pasting fixing method for wafers with different sizes |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4316757A (en) * | 1980-03-03 | 1982-02-23 | Monsanto Company | Method and apparatus for wax mounting of thin wafers for polishing |
| CN204118045U (en) * | 2014-10-15 | 2015-01-21 | 易德福 | A kind of novel subsides wax apparatus |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63198351A (en) * | 1987-02-13 | 1988-08-17 | Mitsubishi Electric Corp | Adhesion of semiconductor wafer |
-
2014
- 2014-10-15 CN CN201410546463.8A patent/CN104332432B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4316757A (en) * | 1980-03-03 | 1982-02-23 | Monsanto Company | Method and apparatus for wax mounting of thin wafers for polishing |
| CN204118045U (en) * | 2014-10-15 | 2015-01-21 | 易德福 | A kind of novel subsides wax apparatus |
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| Publication number | Publication date |
|---|---|
| CN104332432A (en) | 2015-02-04 |
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Effective date of registration: 20151202 Address after: 344000 Jiangxi city of Fuzhou province high tech Zone gold Ni Road No. 198 incubator Park A7 building 3 floor Applicant after: JIANGXI DEYI SEMICONDUCTOR TECHNOLOGY CO., LTD. Address before: 100000 Beijing city Haidian District Shangyuan village of 3 homes and 2003 Graduate School of Mechatronics Applicant before: Yi Defu |
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