CN104327364B - 一种具备防霉防潮抗菌功能的电缆料 - Google Patents
一种具备防霉防潮抗菌功能的电缆料 Download PDFInfo
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- CN104327364B CN104327364B CN201410696458.5A CN201410696458A CN104327364B CN 104327364 B CN104327364 B CN 104327364B CN 201410696458 A CN201410696458 A CN 201410696458A CN 104327364 B CN104327364 B CN 104327364B
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- 239000000463 material Substances 0.000 title claims abstract description 29
- 230000000844 anti-bacterial effect Effects 0.000 title claims abstract description 10
- 239000000843 powder Substances 0.000 claims abstract description 39
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims abstract description 27
- -1 polyethylene Polymers 0.000 claims abstract description 27
- 239000003822 epoxy resin Substances 0.000 claims abstract description 18
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 18
- IXPNQXFRVYWDDI-UHFFFAOYSA-N 1-methyl-2,4-dioxo-1,3-diazinane-5-carboximidamide Chemical compound CN1CC(C(N)=N)C(=O)NC1=O IXPNQXFRVYWDDI-UHFFFAOYSA-N 0.000 claims abstract description 13
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229920002101 Chitin Polymers 0.000 claims abstract description 13
- 229910021538 borax Inorganic materials 0.000 claims abstract description 13
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims abstract description 13
- 229910010271 silicon carbide Inorganic materials 0.000 claims abstract description 13
- 235000010413 sodium alginate Nutrition 0.000 claims abstract description 13
- 239000000661 sodium alginate Substances 0.000 claims abstract description 13
- 229940005550 sodium alginate Drugs 0.000 claims abstract description 13
- 235000010339 sodium tetraborate Nutrition 0.000 claims abstract description 13
- 239000004328 sodium tetraborate Substances 0.000 claims abstract description 13
- 239000004575 stone Substances 0.000 claims abstract description 13
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 claims abstract description 9
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims abstract description 9
- 229930185605 Bisphenol Natural products 0.000 claims abstract description 9
- 239000004593 Epoxy Substances 0.000 claims abstract description 9
- 239000004698 Polyethylene Substances 0.000 claims abstract description 9
- 235000014113 dietary fatty acids Nutrition 0.000 claims abstract description 9
- 239000004205 dimethyl polysiloxane Substances 0.000 claims abstract description 9
- 239000000194 fatty acid Substances 0.000 claims abstract description 9
- 229930195729 fatty acid Natural products 0.000 claims abstract description 9
- 150000004665 fatty acids Chemical class 0.000 claims abstract description 9
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims abstract description 9
- 229920000573 polyethylene Polymers 0.000 claims abstract description 9
- 239000002994 raw material Substances 0.000 claims abstract description 9
- 239000003795 chemical substances by application Substances 0.000 claims description 8
- 238000002347 injection Methods 0.000 claims description 8
- 239000007924 injection Substances 0.000 claims description 8
- 238000002360 preparation method Methods 0.000 claims description 8
- 238000009413 insulation Methods 0.000 claims description 6
- 239000012467 final product Substances 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 238000003756 stirring Methods 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 230000000845 anti-microbial effect Effects 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000036541 health Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 206010017533 Fungal infection Diseases 0.000 description 1
- 208000031888 Mycoses Diseases 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000000843 anti-fungal effect Effects 0.000 description 1
- 229940121375 antifungal agent Drugs 0.000 description 1
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- 239000012752 auxiliary agent Substances 0.000 description 1
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- 239000004615 ingredient Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/06—Polyethene
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
- H01B3/441—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from alkenes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/202—Applications use in electrical or conductive gadgets use in electrical wires or wirecoating
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Abstract
Description
性能指标 | 测试标准 | 指标值 | 实施例1 | 实施例2 |
拉伸强度Mpa | GB/T1040.3-2006 | 12.5 | 18.6 | 19.7 |
断裂伸长率% | GB/T1040.3-2006 | 400 | 573 | 569 |
耐环境应力开裂F0(h) | GB/T2951.41-2008 | 500 | 586 | 578 |
氧指数 | GB/T2406-1993 | 26 | 28 | 29 |
抗霉菌试验 | GB/T2403-1999 | 0级 | 0级 | 0级 |
Claims (2)
Priority Applications (1)
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CN201410696458.5A CN104327364B (zh) | 2014-11-27 | 2014-11-27 | 一种具备防霉防潮抗菌功能的电缆料 |
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CN201410696458.5A CN104327364B (zh) | 2014-11-27 | 2014-11-27 | 一种具备防霉防潮抗菌功能的电缆料 |
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CN104327364A CN104327364A (zh) | 2015-02-04 |
CN104327364B true CN104327364B (zh) | 2016-09-21 |
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Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN104844904B (zh) * | 2015-05-08 | 2018-04-10 | 芜湖航天特种电缆厂股份有限公司 | 耐高温防波套 |
CN107200906A (zh) * | 2017-06-07 | 2017-09-26 | 深圳众厉电力科技有限公司 | 一种具有防霉抗菌功能的电缆料 |
CN107936342A (zh) * | 2017-11-30 | 2018-04-20 | 钟永松 | 一种具有防霉抗菌功能的电缆料 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103524844A (zh) * | 2013-09-30 | 2014-01-22 | 芜湖航天特种电缆厂 | 一种电缆用耐高温护套料及其制备方法 |
CN103965575A (zh) * | 2014-05-15 | 2014-08-06 | 南通普力马弹性体技术有限公司 | 电动汽车用充电电线材料及其制备方法 |
CN104017330A (zh) * | 2014-05-16 | 2014-09-03 | 赵莎莎 | 计算机网络连接用双绞线绝缘材料 |
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JP2898859B2 (ja) * | 1993-09-29 | 1999-06-02 | 住友ベークライト株式会社 | 難燃性樹脂組成物 |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103524844A (zh) * | 2013-09-30 | 2014-01-22 | 芜湖航天特种电缆厂 | 一种电缆用耐高温护套料及其制备方法 |
CN103965575A (zh) * | 2014-05-15 | 2014-08-06 | 南通普力马弹性体技术有限公司 | 电动汽车用充电电线材料及其制备方法 |
CN104017330A (zh) * | 2014-05-16 | 2014-09-03 | 赵莎莎 | 计算机网络连接用双绞线绝缘材料 |
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Effective date of registration: 20170612 Address after: 226200 Nantong City, Qidong Province Economic Development Zone, No. triumph Road, No. 1 Patentee after: Qidong Green Green Engineering Co., Ltd. Address before: 100761 West Chang'an Avenue, Beijing, No. 86, No. Co-patentee before: Linyi Electric Power Company of Guo Wang Shandong Province Utilities Electric Co. Patentee before: State Grid Corporation of China Co-patentee before: Junan Power Supply Co.,Ltd. |